IEC 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

IEC 61191-3:2017 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e.. surface mount, chip mounting, terminal mounting).
This edition includes the following significant technical changes with respect to the previous edition:
a) The requirements have been updated to be compliant wit the acceptance criteria in IPC-A-610F.

Ensembles de cartes imprimées - Partie 3: Spécification intermédiaire - Exigences relatives à l'assemblage par brasage de trous traversants

L’IEC 61191-3:2017 décrit les exigences relatives aux ensembles de composants à trous traversants (broches et trous) montés par brasage. Les exigences s’appliquent aux ensembles utilisant totalement une technique de montage par trous traversants (THT) ou aux portions THT d’ensembles incluant d’autres techniques associées (par exemple montage en surface, montage à puce, montage à borne).
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) mise à jour des exigences pour qu’elles soient conformes aux critères d’acceptation de l’IPC‑A-610F.

General Information

• Status: Published
• Publication Date: 29-May-2017
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 2 - TC 91/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 26-Jun-2017
• Completion Date: 30-May-2017

Relations

• Revises: IEC 61191-3:1998 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61191-3 ®
Edition 2.0 2017-05
INTERNATIONAL
STANDARD
Printed board assemblies –
Part 3: Sectional specification – Requirements for through-hole mount soldered
assemblies
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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International Standards for all electrical, electronic and related technologies.

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IEC 61191-3 ®
Edition 2.0 2017-05
INTERNATIONAL
STANDARD
Printed board assemblies –
Part 3: Sectional specification – Requirements for through-hole mount soldered

assemblies
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.240 ISBN 978-2-8322-4397-8

– 2 – IEC 61191-3:2017 © IEC 2017

CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 Through-hole mounting of components . 7
5.1 General . 7
5.2 Placement accuracy . 7
5.3 Through-hole component requirements . 7
5.3.1 Lead preforming . 7
5.3.2 Tempered leads . 7
5.3.3 Lead forming requirements . 7
5.3.4 Stress relief requirements . 8
5.3.5 Lead termination requirements . 8
6 Acceptance requirements . 10
6.1 General . 10
6.2 Control and corrective actions . 10
6.2.1 General . 10
6.2.2 Interfacial connections (vias) . 10
6.3 Through-hole component lead soldering . 11
6.3.1 General . 11
6.3.2 Clinched leads . 12
6.3.3 Exposed basis metal . 13
7 Rework of unsatisfactory solder connections . 13
Annex A (normative) Placement requirements for through-hole mount devices . 14
A.1 General . 14
A.2 Horizontal mounting, free-standing . 14
A.3 Axial lead components . 14
A.4 Radial lead components . 14
A.5 Perpendicular mounting, free-standing . 14
A.5.1 General . 14
A.5.2 Mounting of components . 14
A.5.3 Radial lead components . 15
A.6 Side- and end-mounting . 15
A.7 Supported component mounting . 16
A.7.1 General . 16
A.7.2 Stand-off positioning . 16
A.7.3 Non-resilient footed stand-offs . 17
A.8 Stress relief lead configuration . 17
A.9 Flat pack lead configuration . 17
Bibliography . 19

Figure 1 – Lead bends . 8
Figure 2 – Hole obstruction . 10
Figure 3 – Through-hole component lead soldering . 11

Figure 4 – Lead-to-land fillet requirements for clinched leads and wires in non-plated
through-holes . 11
Figure 5 – Lead-to-land fillet requirements for clinched leads and wires in plated
through-holes . 12
Figure A.1 – Mounting of free-standing components . 14
Figure A.2 – Typical configuration of components with dual non-axial leads . 15
Figure A.3 – Mounting of components with dual non-axial leads . 15
Figure A.4 – Side mounting . 15
Figure A.5 – End mounting. 16
Figure A.6 – Mounting with footed stand-offs . 16
Figure A.7 – Non-resilient footed stand-offs . 17
Figure A.8 – Acceptable lead configurations . 17
Figure A.9 – Configuration of ribbon leads for through-hole mounting . 18

Table 1 – Plated through-holes with component leads, minimum acceptable
1)
conditions . 12
Table 2 – Through-hole solder joint defects . 13

– 4 – IEC 61191-3:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 3: Sectional specification – Requirements
for through-hole mount soldered assemblies

FOREWORD
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all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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International Standard IEC 61191-3 has been prepared by WG 2: Requirements for electronics
assemblies, of IEC technical committee 91: Electronics assembly technology.
This second edition cancels and replaces the first edition published in 1998. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) The requirements have been updated to be compliant with the acceptance criteria in
IPC
...

IEC 61191-3 ®
Edition 2.0 2017-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 3: Sectional specification – Requirements for through-hole mount soldered
assemblies
Ensembles de cartes imprimées –
Partie 3: Spécification intermédiaire – Exigences relatives à l’assemblage par
brasage de trous traversants
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
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The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

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IEC 61191-3 ®
Edition 2.0 2017-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Printed board assemblies –
Part 3: Sectional specification – Requirements for through-hole mount soldered

assemblies
Ensembles de cartes imprimées –

Partie 3: Spécification intermédiaire – Exigences relatives à l’assemblage par

brasage de trous traversants
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.240 ISBN 978-2-8322-7389-0

– 2 – IEC 61191-3:2017 © IEC 2017

CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 General requirements . 6
5 Through-hole mounting of components . 7
5.1 General . 7
5.2 Placement accuracy . 7
5.3 Through-hole component requirements . 7
5.3.1 Lead preforming . 7
5.3.2 Tempered leads . 7
5.3.3 Lead forming requirements . 7
5.3.4 Stress relief requirements . 8
5.3.5 Lead termination requirements . 8
6 Acceptance requirements . 10
6.1 General . 10
6.2 Control and corrective actions . 10
6.2.1 General . 10
6.2.2 Interfacial connections (vias) . 10
6.3 Through-hole component lead soldering . 11
6.3.1 General . 11
6.3.2 Clinched leads . 12
6.3.3 Exposed basis metal . 13
7 Rework of unsatisfactory solder connections . 13
(normative) Placement requirements for through-hole mount devices . 14
A.1 General . 14
A.2 Horizontal mounting, free-standing . 14
A.3 Axial lead components . 14
A.4 Radial lead components . 14
A.5 Perpendicular mounting, free-standing . 14
A.5.1 General . 14
A.5.2 Mounting of components . 15
A.5.3 Radial lead components . 15
A.6 Side- and end-mounting . 15
A.7 Supported component mounting . 16
A.7.1 General . 16
A.7.2 Stand-off positioning . 17
A.7.3 Non-resilient footed stand-offs . 17
A.8 Stress relief lead configuration . 17
A.9 Flat pack lead configuration . 18
Bibliography . 19

Figure 1 – Lead bends . 8
Figure 2 – Hole obstruction . 10
Figure 3 – Through-hole component lead soldering . 11

Figure 4 – Lead-to-land fillet requirements for clinched leads and wires in non-plated
through-holes . 11
Figure 5 – Lead-to-land fillet requirements for clinched leads and wires in plated

through-holes . 12
Figure A.1 – Mounting of free-standing components . 14
Figure A.2 – Typical configuration of components with dual non-axial leads . 15
Figure A.3 – Mounting of components with dual non-axial leads . 15
Figure A.4 – Side mounting . 16
Figure A.5 – End mounting. 16
Figure A.6 – Mounting with footed stand-offs . 17
Figure A.7 – Non-resilient footed stand-offs . 17
Figure A.8 – Acceptable lead configurations . 18
Figure A.9 – Configuration of ribbon leads for through-hole mounting . 18

Table 1 – Plated through-holes with component leads, minimum acceptable
1)
conditions . 12
Table 2 – Through-hole solder joint defects . 13

– 4 – IEC 61191-3:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED BOARD ASSEMBLIES –
Part 3: Sectional specification – Requirements
for through-hole mount soldered assemblies

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical ma
...