Field Device Integration (FDI) - Part 103-1: Profiles - PROFIBUS

IEC 62769-103-1:2020 is available as IEC 62769-103-1:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62769-103-1:2020 specifies an FDI profile of IEC 62769 for IEC 61784 1_CP 3/1 (PROFIBUS DP) and IEC 61784 1_CP3/2 (PROFIBUS PA). This second edition cancels and replaces the first edition published in 2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) support for generic protocol extension for faster adoption of other technologies;
b) support for Package Developers to build EDDs targeted for today’s EDD bases system under a single development tool.

Intégration des appareils de terrain (FDI) - Partie 103-1: Profils - PROFIBUS

IEC 62769-103-1:2020 est disponible sous forme de IEC 62769-103-1:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
IEC 62769-103-1:2020 spécifie un profil FDI de l’IEC 62769 pour l’IEC 61784 1_CP 3/1 (PROFIBUS DP) et l’IEC 61784 1_CP 3/2 (PROFIBUS PA). Cette deuxième édition annule et remplace la première édition parue en 2015. Cette édition constitue une révision technique. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) prise en charge d’extensions de protocoles génériques, pour une adoption plus rapide d’autres technologies;
b) capacité offerte aux Développeurs de Paquetages d’élaborer des EDD ciblant les systèmes actuels de bases EDD, en exploitant un seul outil de développement.

General Information

Status
Published
Publication Date
27-Apr-2020
Current Stage
PPUB - Publication issued
Completion Date
28-Apr-2020
Ref Project

Buy Standard

Standard
IEC 62769-103-1:2020 - Field Device Integration (FDI) - Part 103-1: Profiles - PROFIBUS
English and French language
62 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (sample)

IEC 62769-103-1
Edition 2.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 103-1: Profiles – PROFIBUS
Intégration des appareils de terrain (FDI) –
Partie 103-1: Profils – PROFIBUS
IEC 62769-103-1:2020-04(en-fr)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2020 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC

copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite

ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie

et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des

questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez

les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC

The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes

International Standards for all electrical, electronic and related technologies.
About IEC publications

The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the

latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org

The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,

variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English

committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.

and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary

details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and

once a month by email. French extracted from the Terms and Definitions clause of

IEC publications issued since 2002. Some entries have been

IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and

If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC

La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des

Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC

Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la

plus récente, un corrigendum ou amendement peut avoir été publié.
Recherche de publications IEC - Electropedia - www.electropedia.org

webstore.iec.ch/advsearchform Le premier dictionnaire d'électrotechnologie en ligne au

La recherche avancée permet de trouver des publications IEC monde, avec plus de 22 000 articles terminologiques en

en utilisant différents critères (numéro de référence, texte, anglais et en français, ainsi que les termes équivalents dans

comité d’études,…). Elle donne aussi des informations sur les 16 langues additionnelles. Egalement appelé Vocabulaire

projets et les publications remplacées ou retirées. Electrotechnique International (IEV) en ligne.

IEC Just Published - webstore.iec.ch/justpublished Glossaire IEC - std.iec.ch/glossary

Restez informé sur les nouvelles publications IEC. Just 67 000 entrées terminologiques électrotechniques, en anglais

Published détaille les nouvelles publications parues. et en français, extraites des articles Termes et Définitions des

Disponible en ligne et une fois par mois par email. publications IEC parues depuis 2002. Plus certaines entrées

antérieures extraites des publications des CE 37, 77, 86 et
Service Clients - webstore.iec.ch/csc CISPR de l'IEC.
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
---------------------- Page: 2 ----------------------
IEC 62769-103-1
Edition 2.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 103-1: Profiles – PROFIBUS
Intégration des appareils de terrain (FDI) –
Partie 103-1: Profils – PROFIBUS
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-8114-7

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62769-103-1:2020 © IEC 2020
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms, definitions, abbreviated terms and conventions .................................................... 6

3.1 Terms and definitions .............................................................................................. 6

3.2 Abbreviated terms and acronyms ............................................................................ 7

3.3 Conventions ............................................................................................................ 7

3.3.1 EDDL syntax.................................................................................................... 7

3.3.2 XML syntax ...................................................................................................... 7

3.3.3 Capitalizations ................................................................................................. 7

4 Profile for PROFIBUS ...................................................................................................... 8

4.1 General ................................................................................................................... 8

4.2 Catalog profile ........................................................................................................ 8

4.2.1 Protocol support file ......................................................................................... 8

4.2.2 CommunicationProfile definition ....................................................................... 8

4.2.3 Profile device ................................................................................................... 9

4.2.4 Protocol version information ............................................................................ 9

4.3 Associating a Package with a device ..................................................................... 10

4.3.1 Device type identification mapping ................................................................. 10

4.3.2 Device type revision mapping ........................................................................ 11

4.4 Information Model mapping ................................................................................... 12

4.4.1 ProtocolType definition .................................................................................. 12

4.4.2 DeviceType mapping ..................................................................................... 13

4.4.3 FunctionalGroup identification definition ........................................................ 13

4.5 Topology elements ................................................................................................ 13

4.5.1 ConnectionPoint definition ............................................................................. 13

4.5.2 Communication Device definition ................................................................... 15

4.5.3 Communication service provider definition ..................................................... 16

4.5.4 Network definition .......................................................................................... 17

4.6 Methods ................................................................................................................ 17

4.6.1 Methods for FDI Communication Servers ....................................................... 17

4.6.2 Methods for Gateways ................................................................................... 20

Annex A (normative) Topology Scan result schema ............................................................. 26

A.1 General ................................................................................................................. 26

A.2 Network ................................................................................................................ 26

A.3 ProfibusNetworkT ................................................................................................. 26

A.4 ProfibusConnectionPointT ..................................................................................... 26

A.5 ProfibusIdentificationT .......................................................................................... 27

A.6 ProfibusAddressT ................................................................................................. 28

Annex B (normative) Transfer service parameters ................................................................ 29

B.1 General ................................................................................................................. 29

B.2 sendData .............................................................................................................. 29

B.3 xsreceiveData ....................................................................................................... 29

B.4 xsTransferSendDataT ........................................................................................... 29

B.5 TransferResultDataT ............................................................................................. 30

B.6 OperationT ............................................................................................................ 30

---------------------- Page: 4 ----------------------
IEC 62769-103-1:2020 © IEC 2020 – 3 –

Bibliography .......................................................................................................................... 31

Figure 1 – Version mapping problem ..................................................................................... 11

Table 1 – ProtocolSupportFile for FDI Device Packages ......................................................... 8

Table 2 – ProtocolSupportFile for FDI Communication Packages ............................................ 8

Table 3 – PROFIBUS CommunicationProfile definition schema ............................................... 9

Table 4 – Catalog values for profile devices ............................................................................ 9

Table 5 – Version mapping examples ...................................................................................... 9

Table 6 – Device identification information mapping .............................................................. 11

Table 7 – Protocol type Profibus_DP .................................................................................... 12

Table 8 – Protocol type Profibus_PA ..................................................................................... 12

Table 9 – DeviceType property mapping ............................................................................... 13

Table 10 – PROFIBUS Device Types identification attributes ................................................ 13

Table 11 – ConnectionPoint type for Profibus_DP ................................................................. 14

Table 12 – ConnectionPoint type for Profibus_PA ................................................................. 15

Table 13 – Method Connect arguments ................................................................................. 18

Table 14 – Method Disconnect arguments ............................................................................ 18

Table 15 – Method Transfer arguments ................................................................................. 19

Table 16 – Method SetAddress arguments ............................................................................ 20

Table 17 – Connect service arguments ................................................................................. 21

Table 18 – Method Transfer arguments ................................................................................. 22

Table 19 – Method SetAddress arguments ............................................................................ 24

Table A.1 – Elements of ProfibusNetworkT ........................................................................... 26

Table A.2 – Attributes of ProfibusConnectionPointT .............................................................. 27

Table A.3 – Elements of ProfibusConnectionPointT .............................................................. 27

Table A.4 – Attributes of ProfibusIdentificationT .................................................................... 28

Table B.1 – Attributes of TransferSendDataT ........................................................................ 30

Table B.2 – Attributes of TransferResultDataT ...................................................................... 30

---------------------- Page: 5 ----------------------
– 4 – IEC 62769-103-1:2020 © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIELD DEVICE INTEGRATION (FDI) –
Part 103-1: Profiles – PROFIBUS
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence

between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62769-103-1 has been prepared by subcommittee 65E: Devices

and integration in enterprise systems, of IEC technical committee 65: Industrial-process

measurement, control and automation.

This second edition cancels and replaces the first edition published in 2015. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:

a) support for generic protocol extension for faster adoption of other technologies;

b) support for Package Developers to build EDDs targeted for today’s EDD bases system

under a single development tool.
---------------------- Page: 6 ----------------------
IEC 62769-103-1:2020 © IEC 2020 – 5 –
The text of this International Standard is based on the following documents:
CDV Report on voting
65E/685A/RVC
65E/622/CDV
65E/685/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62769 series, published under the general title Field Device

Integration (FDI), can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 7 ----------------------
– 6 – IEC 62769-103-1:2020 © IEC 2020
FIELD DEVICE INTEGRATION (FDI) –
Part 103-1: Profiles – PROFIBUS
1 Scope

This part of IEC 62769 specifies an FDI profile of IEC 62769 for IEC 61784-1_CP 3/1

(PROFIBUS DP) and IEC 61784-1_CP3/2 (PROFIBUS PA) .
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 61804 (all parts), Function blocks (FB) for process control and Electronic Device

Description Language (EDDL)
IEC 62541-100:2015, OPC Unified Architecture - Part 100: Device Interface
IEC 62769-2 , Field Device Integration (FDI) - Part 2: FDI Client
IEC 62769-4 , Field Device Integration (FDI) – Part 4: FDI Packages
IEC 62769-5 , Field Device Integration (FDI) – Part 5: FDI Information Model
IEC 62769-7 , Field Device Integration (FDI) – Part 7: FDI Communication Devices

PI Order No.: 2.122:2008, Specification for PROFIBUS – Device Description and Device

Integration – Volume 1: GSD, V5.1, July 2008: GSD; available at

[viewed 2018-11-23]
3 Terms, definitions, abbreviated terms and conventions
3.1 Terms and definitions

For the purposes of this document, the terms and definitions given in IEC 61784-1, IEC 61804

(all parts), IEC 62541-100, IEC 62769-4, IEC 62769-5, IEC 62769-7 and PI Order No.:

2.122:2008 apply.
___________

PROFIBUS is the trade name of the non-profit consortium PROFIBUS & PROFINET International. This

information is given for the convenience of users of this document and does not constitute an endorsement by

IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of

the trade name requires permission of the trade name holder.
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-2:2020.
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-4:2020.
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-5:2020.
Under preparation. Stage at the time of publication: IEC/RFDIS 62769-7:2020.
---------------------- Page: 8 ----------------------
IEC 62769-103-1:2020 © IEC 2020 – 7 –

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2 Abbreviated terms and acronyms
For the purposes of this document, the following abbreviations apply:
EDD Electronic Device Description
EDDL Electronic Device Description Language (see IEC 61804)
GSD General station description (see PI Order No.: 2.122:2008)
I&M Identification and maintenance function
UUID Universally unique identifier (see ISO/IEC 11578)
XML Extensible markup language (see REC-xml-20081126)
3.3 Conventions
3.3.1 EDDL syntax

This document specifies content for the EDD component that is part of FDI Communication

Packages. The specification content using EDDL syntax uses the font Courier New. The

EDDL syntax is used for method signature, variable, data structure and component
declarations.
3.3.2 XML syntax
XML syntax examples use font Courier New. The XML syntax is used to describe XML
document schema.
Example:
3.3.3 Capitalizations

IEC 62769 (all parts) use capitalized terms to emphasize that these terms have a FDI specific

meaning.
Some of these terms using an acronym as a prefix, for example:
• FDI Client, or
• FDI Server.
Some of these terms are compound terms such as:
• Communication Servers, or
• Profile Package.

Parameter names or attributes are concatenated to a single term, where the original terms

start in this term with a capital letter such as:
• ProtocolSupportFile, or
• ProtocolType.

Parameter names or attributes can also be constructed by using an underscore character to

concatenate two or more terms such as:
• PROFILE_ID, or
---------------------- Page: 9 ----------------------
– 8 – IEC 62769-103-1:2020 © IEC 2020
• Profibus_PA_Network.
4 Profile for PROFIBUS
4.1 General

This profile document to the FDI specification in IEC 62769 specifies the protocol specifics

needed for FDI Packages describing Communication Servers, Gateways and Devices.

For Communication Servers, this document defines also protocol specifics as these need to

be considered in the Communication Servers hosted Information Model.
4.2 Catalog profile
4.2.1 Protocol support file
4.2.1.1 FDI Device Package
Protocol specific attachments are mentioned in the Package Catalog as defined in

IEC 62769-5. A communication feature list (GSD) file according to PI Order No.: 2.122:2008 is

a mandatory attachment for FDI Device Packages representing PROFIBUS DP and

PROFIBUS PA devices. Table 1 specifies the parameters of the ProtocolSupportFile in the

FDI Device Package.
Table 1 – ProtocolSupportFile for FDI Device Packages
Parameter Description
Content Type text/plain
Root Namespace empty

Source Relationship http://fdi-cooperation.com/2010/relationship/attachment-protocol

Filename According to PI Order No.: 2.122:2008
4.2.1.2 FDI Communication Packages

A GSD file as specified in PI Order No.: 2.122:2008 is an optional attachment for FDI

Communication Packages representing PROFIBUS DP and PROFIBUS PA devices. Table 2
specifies the parameters of ProtocolSupportFile for FDI Communication Packages.
Table 2 – ProtocolSupportFile for FDI Communication Packages
Parameter Description
Content Type: text/plain
Root Namespace: empty

Source Relationship: http://fdi-cooperation.com/2010/relationship/attachment-protocol

Filename: According to PI Order No.: 2.122:2008
4.2.2 CommunicationProfile definition

IEC 62769-4 defines a CommunicationProfileT string for the Catalog XML schema. Table 3

defines the PROFIBUS specific values for this string.
---------------------- Page: 10 ----------------------
IEC 62769-103-1:2020 © IEC 2020 – 9 –
Table 3 – PROFIBUS CommunicationProfile definition schema
Profile Identifier Protocol
"profibus_dp" PROFIBUS DP/V0; PROFIBUS DP/V1; PROFIBUS DP/V2
“profibus_pa” PROFIBUS PA
4.2.3 Profile device

A Profile Package shall provide the catalog values for profile devices, enabling the FDI Server

to leverage a generic device description, if a specific one is not available. The definitions in

Table 4 focus on catalog content that is vendor independent.
Table 4 – Catalog values for profile devices
Element Attribute Content
PackageType — Profile
Manufacturer — Empty
The allowed profile identifier values (PROFILE_ID) are provided by
DeviceModel —
PROFIBUS & PROFINET International (PI). PI provides and maintains an
XML file (Profile_ID_Table) containing the assignment of PROFILE_ID to
profiles.
It is available at
The file can be downloaded by any engineering or service tool whenever it
is connected to the Internet.
NOTE More information is provided in PI Order No.: 3.502 (I&M Profile)
and related profile definitions are referred therein.
The string format shall be hexadecimal starting with 0x, e.g. ‘0x3D00’.
4.2.4 Protocol version information

IEC 62769-4 defines an element type named InterfaceT for the Catalog XML schema. The

element type InterfaceT contains an element named Version which is supposed to provide

version information about the applied communication protocol profile. The value has to follow

the IEC 62769-4 defined version information schema defined in the element type VersionT.

Table 5 describes how to apply the currently known protocol versions defined by the non-profit

consortium PROFIBUS & PROFINET International. The general rule is to apply the value “0” for

parts of the version information according to IEC 62769-4 that are not used in currently known

protocol versions.
Table 5 – Version mapping examples
Protocol / Version InterfaceT Version value
PROFIBUS DP/V0 0.0.0
PROFIBUS DP/V1 1.0.0
PROFIBUS DP/V2 2.0.0
PROFIBUS PA 3.02 3.2.0

The protocols PROFIBUS DP/V0, PROFIBUS DP/V1 and PROFIBUS DP/V2 contain a single number. This

number is considered to be the major version. The minor and built numbers are set to “0”.

The currently known PROFIBUS PA profile number is considered to provide major and minor version

information. Leading zeros are not considered in version value evaluation since only the actual decimal

values are relevant.
___________

The given table can be considered to be an example only since this document cannot foresee how future

protocol versions will be defined.
---------------------- Page: 11 ----------------------
– 10 – IEC 62769-103-1:2020 © IEC 2020
4.3 Associating a Package with a device
4.3.1 Device type identification mapping

The purpose of device type identification mapping is to enable FDI host systems to compare

the scan result against the topology representation in the Information Model. FDI host

systems shall also be enabled to determine the FDI Device Package that fits for a device

entry contained in the scan result. This will enable the user of an FDI host system to

synchronize the Information Model with the actual installation.

The Communication Server implemented scan service (defined in 4.6.1.7) provides the

...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.