Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

IEC TR 61189-5-506:2019(E) is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

General Information

Status
Published
Publication Date
25-Jun-2019
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
18-Jul-2019
Completion Date
26-Jun-2019
Ref Project

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IEC TR 61189-5-506:2019 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
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IEC TR 61189-5-506
®

Edition 1.0 2019-06
TECHNICAL
REPORT

colour
inside


Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-506: General test methods for materials and assemblies – An
intercomparison evaluation to implement the use of fine-pitch test structures for
surface insulation resistance (SIR) testing of solder fluxes in accordance with
IEC 61189-5-501

IEC TR 61189-5-506:2019-06(en)

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IEC TR 61189-5-506

®


Edition 1.0 2019-06




TECHNICAL



REPORT








colour

inside










Test methods for electrical materials, printed boards and other interconnection

structures and assemblies –

Part 5-506: General test methods for materials and assemblies – An


intercomparison evaluation to implement the use of fine-pitch test structures for

surface insulation resistance (SIR) testing of solder fluxes in accordance with

IEC 61189-5-501






















INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.180 ISBN 978-2-8322-7083-7




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® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC TR 61189-5-506:2019 © IEC 2019
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 Test board concept for intercomparison . 7
4.1 The need for a fine-pitch SIR pattern . 7
4.2 Test board design . 8
4.3 Test b
...

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