Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan

IEC/TS 62647-1:2012(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and defence electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. Keywords: avionics, lead-free solder

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Status
Published
Publication Date
08-Aug-2012
Current Stage
PPUB - Publication issued
Start Date
09-Aug-2012
Completion Date
09-Aug-2012
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IEC TS 62647-1:2012 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
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IEC/TS 62647-1
Edition 1.0 2012-08
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 1: Preparation for a lead-free control plan
IEC/TS 62647-1:2012(E)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC/TS 62647-1
Edition 1.0 2012-08
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 1: Preparation for a lead-free control plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-83220-298-2

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – TS 62647-1 © IEC:2012(E)
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope ............................................................................................................................... 7

2 Normative references ....................................................................................................... 7

3 Terms and definitions ....................................................................................................... 8

4 Symbols and abbreviated terms ...................................................................................... 11

5 Objectives ...................................................................................................................... 11

5.1 General ................................................................................................................. 11

5.2 Reliability .............................................................................................................. 12

5.3 Configuration control and product identification ..................................................... 12

5.4 COTS assemblies and sub-assemblies .................................................................. 12

5.5 Deleterious effects of tin whiskers ......................................................................... 12

5.6 Repair, rework, maintenance, and support............................................................. 12

6 Technical requirements .................................................................................................. 12

6.1 General ................................................................................................................. 12

6.2 Reliability .............................................................................................................. 12

6.2.1 General ..................................................................................................... 12

6.2.2 Test and analysis methods ........................................................................ 13

6.2.3 Environmental and operating conditions .................................................... 13

6.2.4 Data .......................................................................................................... 13

6.2.5 Conversion of results from available data to applicable conditions ............. 14

6.3 Configuration control and product identification ..................................................... 14

6.3.1 General ..................................................................................................... 14

6.3.2 Termination materials and finishes ............................................................ 14

6.3.3 Solder alloys used in the assembly process ............................................... 15

6.3.4 Wiring and connector assemblies .............................................................. 15

6.3.5 Changes in solder alloys............................................................................ 15

6.3.6 Identification .............................................................................................. 16

6.3.7 Part number changes ................................................................................ 16

6.4 COTS assemblies and sub-assemblies .................................................................. 16

6.4.1 General ..................................................................................................... 16

6.4.2 COTS assembly and sub-assembly configuration control and product

identification .............................................................................................. 16

6.5 Deleterious effects of tin whiskers ......................................................................... 16

6.6 Repair, rework, maintenance, and support............................................................. 16

7 Plan administrative requirements .................................................................................... 17

7.1 Plan organization .................................................................................................. 17

7.2 Terms and definitions ............................................................................................ 17

7.3 Plan point of contact .............................................................................................. 17

7.4 References ............................................................................................................ 17

7.5 Requirements for suppliers and sub-contractors .................................................... 17

7.6 Plan acceptance .................................................................................................... 17

7.7 Plan modifications ................................................................................................. 17

Annex A (informative) Template for tailoring requirements of IEC/TS 62647-1 ..................... 18

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TS 62647-1 © IEC:2012(E) – 3 –

Annex B (informative) Requirements matrix for IEC/TS 62647-1 .......................................... 19

Annex C (informative) Guidance on configuration control and product identification ............ 23

Bibliography .......................................................................................................................... 31

Figure C.1 – Decision flow chart ........................................................................................... 25

Figure C.2 – Manufacturing, maintenance and reliability considerations ................................ 28

Figure C.3 – Tin whisker considerations ............................................................................... 29

Table A.1 – Template for tailoring requirements .................................................................... 18

Table B.1 – Requirement matrix ............................................................................................ 19

---------------------- Page: 5 ----------------------
– 4 – TS 62647-1 © IEC:2012(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –
Part 1: Preparation for a lead-free control plan
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

The main task of IEC technical committees is to prepare International Standards. In

exceptional circumstances, a technical committee may propose the publication of a technical

specification when

• the required support cannot be obtained for the publication of an International Standard,

despite repeated efforts, or

• the subject is still under technical development or where, for any other reason, there is the

future but no immediate possibility of an agreement on an International Standard.

Technical specifications are subject to review within three years of publication to decide

whether they can be transformed into International Standards.

IEC/TS 62647-1, which is a technical specification, has been prepared by IEC technical

committee 107: Process management for avionics.
---------------------- Page: 6 ----------------------
TS 62647-1 © IEC:2012(E) – 5 –

This technical specification cancels and replaces IEC/PAS 62647-1 published in 2011. This

edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to:

a) the addition of requirements for the use of Pb-free solder alloys,
b) the addition of requirements for the use of COTS,
c) the update of Annex B.

The text of this technical specification is originally based on the following document:

GEIA-STD-0005-1 Revision A.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/159/DTS 107/180/RVC

Full information on the voting for the approval of this technical specification can be found in

the report on voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC/TS 62647 series, published under the general title Process

management for avionics, can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 7 ----------------------
– 6 – TS 62647-1 © IEC:2012(E)
INTRODUCTION

The European Union (EU) enacted two directives; 2002/95/EC Restriction of Hazardous

Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that

restrict or eliminate the use of various substances in a variety of products that are put on the

market after July 2006. Other countries have also enacted similar legislation. One of the key

materials restricted is lead (Pb), which is widely used in electronic solder and electronic piece

part terminations. These regional regulations affect the global market place. However, due to

the reduced market share of the Aerospace, Defence and High Performance (ADHP)

industries, many of the lower tier suppliers to those industries will change their products to

serve their primary, non-ADHP markets. Additionally, several United States (US) states have

enacted similar “green” laws and many Asian electronics manufacturers have recently

announced completely green product lines. Since ADHP is one of the few major industrial

sectors that still repair circuit card assemblies (CCAs) and the Pb-free materials and

processes are relatively immature and not fully understood, an aerospace-wide approach to

their application is desired.

The products of ADHP companies developing and/or managing Pb-free electronics fall into

one of the five categories below.

1) Products that have been designed and qualified with traditional tin-lead (SnPb)

electronic piece parts, materials, and assembly processes, and that will need to be

maintained in the SnPb configuration.

2) Products that have been designed and qualified with traditional SnPb electronic piece

parts, materials and assembly processes, and that have incorporated Pb-free
electronic piece parts.

3) Products that have been designed and qualified with SnPb materials, and are re-

designed and re-qualified with Pb-free materials.

4) Products that have been designed and qualified with Pb-free electronic piece parts,

materials, and assembly processes, and that will need to be maintained in the Pb-free

configuration.
5) Commercial-off-the-shelf (COTS) assemblies built with Pb-free materials.
The risks with Pb-free technology include:
1) for some service conditions, use of Pb-free solder may compromise electronic

interconnection performance due to potential differences in fatigue characteristics

under thermal cycling and vibration relative to traditional solders;

2) the use of Pb-free surface finishes such as pure tin can lead to the formation of tin

whiskers which in turn can result in various levels of product and system failure; and

3) the use of lead-free technology can result in higher processing temperatures
associated with lead-free solders.
---------------------- Page: 8 ----------------------
TS 62647-1 © IEC:2012(E) – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –
Part 1: Preparation for a lead-free control plan
1 Scope

This part of the IEC/TS 62647 series defines the objectives of, and requirements for,

documenting processes that assure customers and regulatory agencies that ADHP electronic

systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable

requirements for performance, reliability, airworthiness, safety, and certifiability throughout

the specified life of performance.

This specification aims to communicate requirements for a lead-free control plan (LFCP),

hereinafter referred to as the Plan, and to assist the Plan owners in the development of their

own Plans. The Plan documents the Plan owner’s processes to assure their customers and all

other stakeholders that the Plan owner’s products will continue to meet their requirements,

given the risks stated in the Introduction.

This specification does not contain detailed descriptions of the processes to be documented

but lists high-level requirements for such processes, and areas of concern to the ADHP

industries that need to be addressed by the processes.

Pb-free risk management should be accomplished through specific requirements added to the

Plan owner’s existing infrastructure of product management and control.
This specification applies to the ADHP electronics system supply chain.

The control of the Pb-free activities will be accomplished by the Plan owner addressing the

requirements of their Customer. These activities include, but are not limited to, those

performed by the system integrator, the original equipment manufacturer (OEM), and their

respective supply chains, to the lowest level possible. This should be done with the

knowledge that, at the component level, the aerospace industry may not have a great

influence over those suppliers. In such cases, the Plan owner assumes responsibility.

Some applications may have unique requirements that exceed the scope of this specification.

The extended scope should be covered separately.

The requirements of this specification may be tailored to address unique/specific program

needs. If tailoring is performed, the user will obtain documented customer concurrence. Annex

A provides a tailoring template that may be used.

This document may be used by other high-performance and high-reliability industries, at their

discretion.
2 Normative references

The following documents, in whole or in part, are normatively referenced in this document and

are indispensable for its application. For dated references, only the edition cited applies. For

undated references, the latest edition of the referenced document (including any
amendments) applies.
---------------------- Page: 9 ----------------------
– 8 – TS 62647-1 © IEC:2012(E)

IEC/PAS 62647-2 , Process management for avionics – Aerospace and defence electronic

systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin

IEC/TS 62647-2 , Process management for avionics – Aerospace and defence electronic

systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin

IEC/PAS 62647-22 , Process management for avionics – Aerospace and defence electronic

systems containing lead-free solder – Part 22: Technical guidelines

IEC/PAS 62647-23 , Process management for avionics – Aerospace and defence electronic

systems containing lead-free solder – Part 23: Rework and repair guidance to address the

implications of lead-free electronics and mixed assemblies
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply
3.1
assemblies

electronic items that require electrical attachments, including soldering of wires or component

terminations
EXAMPLE Circuit cards and wire harnesses.
3.2
critical

state of an item or function, which if defective, will result in the system’s inability to retain

operational capability, meet primary objective, or affect safety
3.3
COTS
commercial-off-the-shelf

item whose design and configuration is controlled by the manufacture and on which the user

has no control as to design and configuration

Note 1 to entry: An item may be a component, a subassembly, an assembly, a system.

3.4
COTS assembly or sub-assembly

assembly or sub-assembly developed by a supplier for multiple customers, whose design and

configuration are managed by the suppliers or an industry specification
3.5
customer

entity or organization that (a) integrates a piece part, soldered assembly, unit, or system into

a higher level system, (b) operates the higher level system, or (c) certifies the system for use

EXAMPLE This may include unit (SRU/LRU/system) users, integrators, regulatory agencies, operators, original

equipment manufacturers (OEMs), and subcontractors.
___________

This is equivalent to GEIA-STD-0005-2.This will be superseded by IEC/TS 62647-2.

To be published. This will supersede IEC/PAS 62647-2.

This is equivalent to GEIA-HB-0005-2. It is the intention of the technical committee to supersede this by a

future IEC/TS 62647-22.

This is equivalent to GEIA-HB-0005-3. It is the intention of the technical committee to supersede this by a

future IEC/TS 62647-23.
---------------------- Page: 10 ----------------------
TS 62647-1 © IEC:2012(E) – 9 –
3.6
FFF
form, fit and function

description of an item's identifying characteristics which is commonly used to determine if a

proposed change to a part will be “minor” (no impact on form, fitness and function) or “major”

(no impact on form, fitness and function)
3.7
high performance

continued performance or performance on demand where an application (product, equipment,

electronics, system, program) down time cannot be tolerated in an end-use environment

which can be uncommonly harsh, and the application must function when required

EXAMPLE: Examples of high performance applications are life support or other critical systems.

3.8
Pb-free

less than 0,1 % by weight of Pb in accordance with reduction of hazardous substances

(RoHS) guidelines
3.9
Pb-free control plan
(LFCP)

aerospace or military system supplier’s document that defines the processes that assure the

Plan owners, their customers and all other stakeholders that aerospace, defence and high

performance high-reliability electronics systems containing Pb-free solder and Pb-free piece

part and PWB finishes will continue to be reliable, safe, producible, affordable, and

supportable
3.10
may

indicates a course of action that is permissible within the limits of this specification, but not

required
3.11
Pb-free tin
tin or any tin alloy with < 3 % lead (Pb) content by weight

Note 1 to entry: Some Pb-free finishes other than Pb-free tin, such as tin-bismuth and tin-copper, are considered

to be “tin” for the purposes of this specification. Many of these alloys have not been assessed for whiskering

behavior.
3.12
Pb-free tin finish

final finishes or under-plates either external or internal to a device, PWB or other hardware,

including all leads and surfaces, even those coated, encapsulated, or otherwise not exposed

Note 1 to entry: It may include finishes on electrical piece parts, mechanical piece parts, and PWBs. It does not

include Pb-free bulk solders, assembly materials, solder balls, or those devices where the Pb-free tin finish has

been completely replaced.
3.13
PCN
part change notice
document used to record a change in a part
3.14
piece part

electronic piece part that is not normally disassembled without destruction and is normally

attached to a PWB to perform an electrical function
---------------------- Page: 11 ----------------------
– 10 – TS 62647-1 © IEC:2012(E)
3.15
part number
number assigned to a part for tracking and identification purposes
3.16
rework

action taken to return a unit (SRU/LRU/system) to a state meeting all requirements of the

engineering drawing, including both functionality and physical configuration by making repairs

Note 1 to entry: Also used to define the act of reprocessing non-complying articles, through the use of original or

equivalent processing in a manner that assures full compliance of the article with applicable drawings or

specifications.
3.17
repair

act of restoring the functional capability of a defective article in a manner that precludes

compliance of the article with applicable drawings or specifications
3.18
shall

indicates a mandatory requirement to be followed in order to comply with this specification

3.19
should

indicates that, among several possibilities, one is recommended as particularly suitable,

without mentioning or excluding others; or that a certain course of action is preferred but not

necessarily required; or that (in the negative form) a certain course of action is discouraged

but not prohibited
3.20
solder ball technology

family of components that employ solder balls or bumps to make mechanical and electrical

connections between components and PWBs
EXAMPLE Ball grid arrays (BGAs), flip chips, and chip scale interconnections.
3.21
soldered assembly
assembly of two or more basic parts interconnected by a solder alloy

Note 1 to entry: A (Pb)-based soldered assembly is one in which the solder alloys are solely (Pb)-based. A (Pb)-

free soldered assembly is one in which the solder alloys are solely (Pb)-free.
3.22
sub-contractor

organization, within the given high-reliability industry, that supplies, maintains, repairs, or

supports electronic systems, and is not the direct supplier to the customer or user of those

systems
3.23
supplier

entity or organization that designs, manufactures, repairs, reworks, or maintains a piece part,

unit, or system

Note 1 to entry: This includes original equipment manufacturers (OEMs), repair and rework facilities,

subcontractors, and piece part manufacturers.
3.24
system
one or more units that perform electrical function(s)
---------------------- Page: 12 ----------------------
TS 62647-1 © IEC:2012(E) – 11 –
3.25
system design authority
entity responsible for producing and/or maintaining the design of the system
3.26
tin whisker

spontaneous crystal growth that emanates from a tin (Sn) surface and which may be

cylindrical, kinked, or twisted

Note 1 to entry: Typically tin whiskers have an aspect ratio (length/width) greater than two, with shorter growths

referred to as nodules or odd-shaped eruptions (OSEs).
3.27
unit

one or more assemblies within a chassis or higher level system to perform electrical

function(s)
4 Symbols and abbreviated terms
ADHP Aerospace, Defence and High Performance
BGA Ball Grid Array
CCA Circuit Card Assembly
COTS Commercial-Off-The-Shelf
FFF Form, Fit and Function
GEIA Government Engineering and Information Technology Association
GIDEP Government Industry Data Exchange Program
IPC member-driven organization and leading source for industry standards
LFCP Pb-free Control Plan
LRU Line Replaceable Unit
OEM Original Equipment Manufacturer
Pb lead
PCN Part Change Notice
PN Part Number
PWB Printed Wiring Board
SAC tin silver copper (SnAgCu)
Sn tin
SRU Shop Replaceable Unit
...

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