IEC TS 62647-1:2012

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan

IEC/TS 62647-1:2012(E) defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that aerospace and defence electronic systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. Keywords: avionics, lead-free solder

General Information

• Status: Published
• Publication Date: 08-Aug-2012
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 1 - TC 107/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 09-Aug-2012
• Completion Date: 15-Sep-2012

Relations

• Replaces: IEC PAS 62647-1:2011 - Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
• Effective Date: 05-Sep-2023

Overview

IEC TS 62647-1:2012 - Process management for avionics: Aerospace and defence electronic systems containing lead-free solder - Part 1 provides requirements and objectives for documenting processes that demonstrate aerospace and defence (ADHP) electronic products meet performance, reliability, airworthiness, safety and certifiability requirements when Pb‑free materials or processes are used. The document defines how to prepare a lead‑free control plan (LFCP) that communicates risk management, configuration control and verification approaches without prescribing detailed process instructions.

Key Topics and Requirements

• Lead‑free control plan (LFCP): Structure and administrative requirements for documenting processes, responsibilities, references, plan acceptance and modifications.
• Reliability considerations: High‑level requirements for assessing Pb‑free solder performance (fatigue, thermal cycling, vibration) and for converting available data to applicable service conditions.
• Configuration control & product identification: Control of termination finishes, solder alloys, wiring/connectors, part/PN changes, and traceability to assure consistent product identity over product life.
• COTS assemblies and sub‑assemblies: Requirements and limitations when incorporating commercial‑off‑the‑shelf items built with Pb‑free materials.
• Tin whisker risks: Identification of deleterious effects from Pb‑free surface finishes (e.g., pure tin) and the need to address mitigation in the LFCP.
• Repair, rework, maintenance and support: Expectations for documenting allowable processes and sustaining product configurations throughout service life.
• Testing, data and environmental conditions: Guidance to capture test/analysis methods, environmental/operating conditions and data needed to justify Pb‑free use.
• Informative annexes: Includes a tailoring template, a requirements matrix and configuration control guidance to help Plan owners implement the LFCP.

Practical Applications

• Preparing and submitting a documented LFCP to customers, prime contractors and certification authorities to show Pb‑free risk management in avionics products.
• Guiding OEMs, suppliers and maintenance organizations through decisions on converting assemblies or accepting Pb‑free COTS items.
• Supporting engineering, quality and regulatory teams in assessing reliability tradeoffs, tin‑whisker mitigation and supply‑chain traceability when using lead‑free solder.

Who Should Use This Standard

• Avionics and defence OEMs and tier‑1 suppliers
• PCB and electronic assembly manufacturers working with Pb‑free solders
• Quality, reliability and configuration management personnel
• Certification and airworthiness authorities evaluating Pb‑free changes

Related Standards and Context

• Part of the IEC/TS 62647 series and based on GEIA‑STD‑0005‑1; complements regional legislation drivers such as RoHS/WEEE by addressing ADHP specific risks. Use IEC TS 62647-1:2012 when you need a structured, auditable LFCP for avionics systems involving lead‑free solder.

Standards Content (Sample)

IEC/TS 62647-1 ®
Edition 1.0 2012-08
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 1: Preparation for a lead-free control plan

IEC/TS 62647-1:2012(E)
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IEC/TS 62647-1 ®
Edition 1.0 2012-08
TECHNICAL
SPECIFICATION
colour
inside
Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –
Part 1: Preparation for a lead-free control plan

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
V
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-83220-298-2

– 2 – TS 62647-1 © IEC:2012(E)
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
4 Symbols and abbreviated terms . 11
5 Objectives . 11
5.1 General . 11
5.2 Reliability . 12
5.3 Configuration control and product identification . 12
5.4 COTS assemblies and sub-assemblies . 12
5.5 Deleterious effects of tin whiskers . 12
5.6 Repair, rework, maintenance, and support. 12
6 Technical requirements . 12
6.1 General . 12
6.2 Reliability . 12
6.2.1 General . 12
6.2.2 Test and analysis methods . 13
6.2.3 Environmental and operating conditions . 13
6.2.4 Data . 13
6.2.5 Conversion of results from available data to applicable conditions . 14
6.3 Configuration control and product identification . 14
6.3.1 General . 14
6.3.2 Termination materials and finishes . 14
6.3.3 Solder alloys used in the assembly process . 15
6.3.4 Wiring and connector assemblies . 15
6.3.5 Changes in solder alloys. 15
6.3.6 Identification . 16
6.3.7 Part number changes . 16
6.4 COTS assemblies and sub-assemblies . 16
6.4.1 General . 16
6.4.2 COTS assembly and sub-assembly configuration control and product
identification . 16
6.5 Deleterious effects of tin whiskers . 16
6.6 Repair, rework, maintenance, and support. 16
7 Plan administrative requirements . 17
7.1 Plan organization . 17
7.2 Terms and definitions . 17
7.3 Plan point of contact . 17
7.4 References . 17
7.5 Requirements for suppliers and sub-contractors . 17
7.6 Plan acceptance . 17
7.7 Plan modifications . 17
Annex A (informative) Template for tailoring requirements of IEC/TS 62647-1 . 18

TS 62647-1 © IEC:2012(E) – 3 –
Annex B (informative) Requirements matrix for IEC/TS 62647-1 . 19
Annex C (informative) Guidance on configuration control and product identification . 23
Bibliography . 31

Figure C.1 – Decision flow chart . 25
Figure C.2 – Manufacturing, maintenance and reliability considerations . 28
Figure C.3 – Tin whisker considerations . 29

Table A.1 – Template for tailoring requirements . 18
Table B.1 – Requirement matrix . 19

– 4 – TS 62647-1 © IEC:2012(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 1: Preparation for a lead-free control plan

FOREWORD
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The main task of IEC technical committees is to prepare International Standards. In
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• the required support cannot be obtained for the publication of an International Standard,
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• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC/TS 62647-1, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.

TS 62647-1 © IEC:2012(E) – 5 –
This technical specification cancels and replaces IEC/PAS 62647-1 published in 2011. This
edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to:
a) the addition of requirements for the use of Pb-free solder alloys,
b) the addition of requirements for the use of COTS,
c) the update of Annex B.
The text of this technical specification is originally based on the following document:
GEIA-STD-0005-1 Revision A.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/159/DTS 107/180/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC/TS 62647 series, published under the general title Process
management for avionics, can be found on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – TS 62647-1 © IEC:2012(E)
INTRODUCTION
The European Union (EU) enacted two directives; 2002/95/EC Restriction of Hazardous
Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that
restrict or eliminate the use of various substances in a variety of products that are put on the
market after July 2006. Other countries have also enacted similar legislation. One of the key
materials restricted is lead (Pb), which is widely used in electronic solder and electronic piece
part terminations. These regional regulations affect the global market place. However, due to
the reduced market share of the Aerospace, Defence and High Performance (ADHP)
industries, many of the lower tier suppliers to those industries will change their products to
serve their primary, non-ADHP markets. Additionally, several United States (US) states have
enacted similar “green” laws and many Asian electronics manufacturers have recently
announced completely green product lines. Since ADHP is one of the few major industrial
sectors that still repair circuit card assemblies (CCAs) and the Pb-free materials and
processes are relatively immature and not fully understood, an aerospace-wide approach to
their application is desired.
The products of ADHP companies developing and/or managing Pb-free electronics fall into
one of the five categories below.
1) Products that have been designed and qualified with traditional tin-lead (SnPb)
electronic piece parts, materials, and assembly processes, and that will need to be
maintained in the SnPb configuration.
2) Products that have been designed and qualified with traditional SnPb electronic piece
parts, materials and assembly processes, and that have incorporated Pb-free
electronic piece parts.
3) Products that have been designed and qualified with SnPb materials, and are re-
designed and re-qualified with Pb-free materials.
4) Products that have been designed and qualified with Pb-free electronic piece parts,
materials, and assembly processes, and that will need to be maintained in the Pb-free
configuration.
5) Commercial-off-the-shelf (COTS) assemblies built with Pb-free materials.
The risks with Pb-free technology include:
1) for some service conditions, use of Pb-free solder may compromise electronic
interconnection performance due to potential differences in fatigue characteristics
under thermal cycling and vibration relative to traditional solders;
2) the use of Pb-free surface finishes such as pure tin can lead to the formation of tin
whiskers which in turn can result in various levels of product and system failure; and
3) the use of lead-free technology can result in higher processing temperatures
associated with lead-free solders.

TS 62647-1 © IEC:2012(E) – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 1: Preparation for a lead-free control plan

1 Scope
This part of the IEC/TS 62647 series defines the objectives of, and requirements for,
documenting processes that assure customers and regulatory agencies that ADHP electronic
systems containing Pb-free solder, piece parts, and PWBs will satisfy the applicable
requirements for performance, reliability, airworthiness, safety, and certifiability throughout
the specified life of performance.
This specification aims to communicate requirements for a lead-free control plan (LFCP),
hereinafter referred to as the Plan, and to assist the Plan owners in the development of their
own Plans. The Plan documents the Plan owner’s processes to assure their customers and all
other stakeholders that the Plan owner’s products will continue to meet their requirements,
given the risks stated in the Introduction.
This specification does not contain detailed descriptions of the processes to be documented
but lists high-level requirements for such processes, and areas of concern to the ADHP
industries that need to be addressed by the processes.
Pb-free risk management should be accomplished through specific requirements added to the
Plan owner’s existing infrastructure of product management and control.
This specification applies to the ADHP electronics system supply chain.
The control of the Pb-free activities will be accomplished by the Plan owner addressing the
requirements of their Customer. These activities include, but are not limited to, those
performed by the system integrator, the original equipment manufacturer (OEM), and their
respective supply chains, to the lowest level possible. This should be done with the
knowledge that, at the component level, the aerospace industry may not have a great
influence over those suppliers. In such cases, the Plan owner assumes responsibility.
Some applications may have unique requirements that exceed the scope of this specification.
The extended scope should be covered separately.
The requirements of this specification may be tailored to address unique/specific program
needs. If tailoring is performed, the user will obtain documented customer concurrence. Annex
A provides a tailoring template that may be used.
This document may be used by other high-performance and high-reliability industries, at their
discretion.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
– 8 – TS 62647-1 © IEC:2012(E)
IEC/PAS 62647-2 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
IEC/TS 62647-2 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 2: Mitigation of deleterious effects of tin
IEC/PAS 62647-22 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 22: Technical guidelines
IEC/PAS 62647-23 , Process management for avionics – Aerospace and defence electronic
systems containing lead-free solder – Part 23: Rework and repair guidance to address the
implications of lead-free electronics and mixed assemblies
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply
3.1
assemblies
electronic items that require electrical attachments, including soldering of wires or component
terminations
EXAMPLE Circuit cards and wire harnesses.
3.2
critical
state of an item or function, which if defective, will result in the system’s inability to retain
operational capability, meet primary objective, or affect safety
3.3
COTS
commercial-off-the-shelf
item whose design and configuration is controlled by the manufacture and on which the user
has no control as to design and configuration
Note 1 to entry: An item may be a component, a subassembly, an assembly, a system.
3.4
COTS assembly or sub-assembly
assembly or sub-assembly developed by a supplier for multiple customers, whose design and
configuration are managed by the suppliers or an industry specification
3.5
customer
entity or organization that (a) integrates a piece part, soldered assembly, unit, or system into
a higher level system, (b) operates the higher level system, or (c) certifies the system for use
EXAMPLE This may include unit (SRU/LRU/system) users, integrators, regulatory agencies, operators, original
equipment manufacturers (OEMs), and subcontractors.
___________
This is equivalent to GEIA-STD-0005-2.This will be superseded by IEC/TS 62647-2.
To be published. This will supersede IEC/PAS 62647-2.
This is equivalent to GEIA-HB-0005-2. It is the intention of the technical committee to supersede this by a
future IEC/TS 62647-22.
This is equivalent to GEIA-HB-0005-3. It is the intention of the technical committee to supersede this by a
future IEC/TS 62647-23.
TS 62647-1 © IEC:2012(E) – 9 –
3.6
FFF
form, fit and function
description of an item's identifying characteristics which is commonly used to determine if a
proposed change to a part will be “minor” (no impact on form, fitness and function) or “major”
(no impact on form, fitness and function)
3.7
high performance
continued performance or performance on demand where an application (product, equipment,
electronics, system, program) down time cannot be tolerated in an end-use environment
which can be uncommonly harsh, and the application must function when required
EXAMPLE: Examples of high performance applications are life support or other critical systems.
3.8
Pb-free
less than 0,1 % by weight of Pb in accordance with reduction of hazardous substances
(RoHS) guidelines
3.9
Pb-free control plan
(LFCP)
aerospace or military system supplier’s document that defines the processes that assure the
Plan owners, their customers and all other stakeholders that aerospace, defence and high
performance high-reliability electronics systems containing Pb-free solder and Pb-free piece
part and PWB finishes will continue to be reliable, safe, producible, affordable, and
supportable
3.10
may
indicates a course of action that is permissible within the limits of this specification, but not
required
3.11
Pb-free tin
tin or any tin alloy with < 3 % lead (Pb) content by weight
Note 1 to entry: Some Pb-free finishes other than Pb-free tin, such as tin-bismuth and tin-copper, are considered
to be “tin” for the purposes of this specification. Many of these alloys have not been assessed for whiskering
behavior.
3.12
Pb-free tin finish
final finishes or under-plates either external or internal to a device, PWB or other hardware,
including all leads and surfaces, even those coated, encapsulated, or otherwise not exposed
Note 1 to entry: It may include finishes on electrical piece parts, mechanical piece parts, and PWBs. It does not
include Pb-free bulk solders, assembly materials, solder balls, or those devices where the Pb-free tin finish has
been completely replaced.
3.13
PCN
part change notice
document used to record a change in a part
3.14
piece part
electronic piece part that is not normally disassembled without destruction and is normally
attached to a PWB to perform an electrical function

– 10 – TS 62647-1 © IEC:2012(E)
3.15
PN
part number
number assigned to a part for tracking and identification purposes
3.16
rework
action taken to return a unit (SRU/LRU/system) to a state meeting all requirements of the
engineering drawing, including both functionality and physical configuration by making repairs
Note 1 to entry: Also used to define the act of reprocessing non-complying articles, through the use of original or
equivalent processing in a manner that assures full compliance of the article with applicable drawings or
specifications.
3.17
repair
act of restoring the functional capability of a defective article in a manner that precludes
compliance of the article with applicable drawings or specifications
3.18
shall
indicates a mandatory requirement to be followed in order to comply with this specification
3.19
should
indicates that, among several possibilities, one is recommended as particularly suitable,
without mentioning or excluding others; or that a certain course of action is preferred but not
necessarily required; or that (in the negative form) a certain course of action is discouraged
but not prohibited
3.20
solder ball technology
family of components that employ solder balls or bumps to make mechanical and electrical
connections between components and PWBs
EXAMPLE Ball grid arrays (BGAs), flip chips, and chip scale interconnections.
3.21
soldered assembly
assembly of two or more basic parts interconnected by a solder alloy
Note 1 to entry: A (Pb)-based soldered assembly is one in which the solder alloys are solely (Pb)-based. A (Pb)-
free soldered assembly is one in which the solder alloys are solely (Pb)-free.
3.22
sub-contractor
organization, within the given high-reliability industry, that supplies, maintains, repairs, or
supports electronic systems, and is not the direct supplier to the customer or user of those
systems
3.23
supplier
entity or organization that designs, manufactures, repairs, reworks, or maintains a piece part,
unit, or system
Note 1 to entry: This includes original equipment manufacturers (OEMs), repair and rework facilities,
subcontractors, and piece part manufacturers.
3.24
system
one or more units that perform electrical function(s)

TS 62647-1 © IEC:2012(E) – 11 –
3.25
system design authority
entity responsible for producing and/or maintaining the design of the system
3.26
tin whisker
spontaneous crystal growth that emanates from a tin (Sn) surface and which may be
cylindrical, kinked, or twisted
Note 1 to entry: Typically tin whiskers have an aspect ratio (length/width) greater than two, with shorter growths
referred to as nodules or odd-shaped eruptions (OSEs).
3.27
unit
one or more assemblies within a chassis or higher level system to perform electrical
function(s)
4 Symbols and abbreviated terms
ADHP Aerospace, Defence and High Performance
BGA Ball Grid Array
CCA Circuit Card Assembly
COTS Commercial-Off-The-Shelf
FFF Form, Fit and Function
GEIA Government Engineering and Information Technology Association
GIDEP Government Industry Data Exchange Program
IPC member-driven organization and leading source for industry standards
LFCP Pb-free Control Plan
LRU Line Replaceable Unit
OEM Original Equipment Manufacturer
Pb lead
PCN Part Change Notice
PN Part Number
PWB Printed Wiring Board
SAC tin silver copper (SnAgCu)
Sn tin
SRU Shop Replaceable Unit
JCAA/JG-PP Joint Council on Aging Aircraft Joint Group on Pollution Prevention
5 Objectives
5.1 General
This document describes a Pb-free Control Plan (LFCP) that records the processes used to
ensure that ADHP electronic systems are produced, supplied, reworked, repaired, or
maintained by the Plan owner, and that the Pb-free solder, piece parts, or PWBs they contain
will satisfy the applicable requirements for performance, reliability, safety, and certifiability
throughout the specified life of performance of the system. 5.2 through 5.6 list the specific
objectives to be accomplished.

– 12 – TS 62647-1 © IEC:2012(E)
5.2 Reliability
Demonstrate that the processes and materials using Pb-free solder and finishes are capable
of producing reliable products. Identify methods for the mitigation and control of risks
associated with Pb-free tin surfaces finishes. Identify methods for demonstrating the reliability
of Pb-free solders or mixed solder alloy interconnects.
5.3 Configuration control and product identification
Demonstrate that the configurations of all systems, equipment, assemblies, sub-assemblies,
and piece parts are identified and controlled.
5.4 COTS assemblies and sub-assemblies
Assure that COTS assemblies and sub-assemblies are identified, marked and controlled, and
reliability objectives are met.
5.5 Deleterious effects of tin whiskers
Mitigate the deleterious effects of tin whiskers.
5.6 Repair, rework, maintenance, and support
Assure that repair, rework, maintenance, and support activities are specified, documented and
controlled in a manner that controls the effects of Pb-free solder materials and processes.
6 Technical requirements
6.1 General
This clause defines the technical requirements for the LFCP.
The ADHP system Plan owner shall have a Plan that states clearly, concisely, and
unambiguously:
• how the Plan owner intends to accomplish each of the objectives;
• the process by which compliance to the Plan is demonstrated;
• the evidence that shows the objectives have been accomplished.
Plan owners shall include within their LFCP a table or matrix (see sample in Annex B)
showing compliance to all technical requirements.
Depending on program or product line requirements, the Plan owner may, with appropriate
justification, amend the objectives of Clause 5 by adding to or deleting them. If this is done,
then the Plan will be assessed according to the amended list of requirements, as stated in the
Plan. Tailoring the requirements shall be concurred upon between Plan owner and customer.
Annex A provides a tailoring template that can be used in this regard.
6.2 Reliability
6.2.1 General
The Plan shall document processes that are capable of assuring the reliability of the
equipment when using substrate metallization finish materials, termination solder materials
and finishes, assembly solder alloys, fluxes, cleaning agents, PWB materials, piece parts, and
soldering processes in the given application.

TS 62647-1 © IEC:2012(E) – 13 –
This requirement also applies to mixed solder alloys or combinations of substrate
metallization finish materials, termination solder materials and finishes, and assembly solder
alloys used in the given application.
This requirement applies to original production, repair, rework and maintenance of systems.
Users of this specification should address unique reliability requirements such as long life,
rugged operating environments, high consequences of failure, etc.
NOTE 1 Materials and assembly processes can be qualified prior to use in the product.
NOTE 2 This specification addresses issues that are unique to ADHP products. In the case of COTS assemblies,
information related to materials and assembly processes possibly will not be available or verifiable. Therefore, new
or modified verification/qualification processes can be necessary to assure reliability of the products which
integrate such COTS assemblies.
NOTE 3 COTS assemblies that meet reliability objectives in non-ADHP applications can be verified as acceptable
for ADHP applications.
6.2.2 Test and analysis methods
The Plan shall document methods to test assemblies made with the Pb-free alloys and
finishes, and combinations thereof, to provide data to assess their reliability in the given
application.
The test methods should impose conditions and durations to evaluate major potential failure
mechanisms for the materials and construction of the assembly. For solder joints this should
include crack propagation caused by accumulated fatigue damage, and the formation of brittle
intermetallic phases or voids. Guidelines and examples for planning and conducting tests, and
for analyzing and using results there-from, are included in IEC/PAS 62647-22
(GEIA-HB-0005-2). Failure analysis by metallographic examination and/or composition
analysis is critical to interpreting results from these tests.
Analysis methods may be used in lieu of testing, provided the analysis methods have been
verified by testing.
6.2.3 Environmental and operating conditions
The life cycle environmental and operating conditions for the given application (for the
individual assembly) shall be known, and used in assessing the reliability of the given
materials and assembly processes for the given application. This information should be
agreed upon by the Plan owner and the customer.
In cases where a given Pb-free solder alloy or finish in a comparable application has been
shown to be reliable for a given set of environmental conditions and service life, it may be
considered reliable in other, less severe, environmental conditions and service lives.
A given Pb-free solder alloy or finish in a given application may be considered reliable if its
reliability is shown to be equal to or better than a Sn-Pb alloy or finish in parallel testing in
comparable environmental conditions, provided that the Sn-Pb alloy or finish satisfies the
reliability requirements. The test conditions should be shown to correlate to actual life cycle
environmental and operating use conditions and should consider test acceleration factors
appropriate for the specific solder alloy or finish utilized.
6.2.4 Data
The Plan shall document methods to include the use of archived and retrievable reliability
data from at least one of the following: (a) in-service data from similar systems in comparable
applications and environmental conditions; or (b) test data from studies conducted on the
solder or finish compositions used in the given system design, or a comparable one, under

– 14 – TS 62647-1 © IEC:2012(E)
comparable conditions. The data shall be representative of parts and materials processed by
assembly, rework or repair processes comparable to the construction being assessed.
NOTE 1 Example sources of test data include:
– University-led consortia including the Computer-Aided Life Cycle Engineering Electronics Packaging and
Systems Center, University of Maryland and the Center for Advanced Vehicle Electronics, Auburn
UniversityIndustrial consortia including Universal Instruments Corporation’s Area Array Consortium
– IPC – Association Connecting Electronics Industries
– JEDEC – Global Standards for the Microelectronics Industry
– Japan Engineering and Information Technology Association (JEITA)
– Joint Council on Aging Aircraft Joint Group on Pollution Prevention (JCAA/JG-PP)
– NASA/DOD Pb-free Electronics Project
NOTE 2 Guidelines for planning and conducting tests and for analyzing and using results thereof, are included in
IEC/PAS 62647-3 (GEIA-STD-0005-3).
6.2.5 Conversion of results from available data to applicable conditions
The Plan shall document processes and methods to determine and quantify the relevant
environmental use conditions and reliability requirements for specific products. In the event
that the above data are obtained from service or test environmental conditions that are
different from those expected for the use conditions of a given system, the documented
processes and methods shall convert results to equivalent use conditions for the given
system, using appropriate identified acceleration factors.
NOTE The purpose of this requirement is to ensure that the actual use conditions of the given product are
considered in the application of data.
6.3 Configuration control and product identification
6.3.1 General
6.3 defines the configuration control and product identification requirements for the Plan. A
Plan meeting the requirements of this subclause will ensure that users and maintainers of
ADHP systems will have all the information needed to assure the appropriate traceability of
the ADHP system throughout the specified life of performance. Design and change authority
shall be defined in the Plan.
Annex C provides guidance to the Plan owner for meeting the configuration control and
product identification requirements of this subclause. The guidance in Annex C is focused on
helping the Plan owner to consistently manage configuration control and product identification
of components and soldered assemblies during the transition to Pb-free technology.
Meeting the requirements in 6.3 may not be possible for certain types of COTS assemblies
that use Pb-free materials and do not disclose this information. There are many Pb-free solder
alloys and materials and it is anticipated that new ones will continue to be introduced into the
market. Therefore, if the materials (solder alloy, printed wiring board, etc.) and assembly
processes need to be known in order to meet requirements, then these COTS assemblies
may not be acceptable for the intended application(s).
6.3.2 Termination materials and finishes
Using appropriate controlled documents that ensure configuration identification and control,
the Plan shall document processes to identify all termination materials and finishes (PCB,
piece parts) for which reliability, compatibility, processing, or other issues, may exist.
NOTE 1 Examples of finishes that could be problematic are: solder alloys with high melting temperatures (e.g.
> 250 °C); piece parts supplied with solder ball technology, solder alloys containing bismuth, piece parts with Pb-
free tin termination materials or finishes; and PCB finishes. This list is not all inclusive and may change with time
and further accumulated knowledge.

TS 62647-1 © IEC:2012(E) – 15 –
NOTE 2 To accomplish this, the Plan owner can contact piece part manufacturers and suppliers, consult data
sheets, or use external resources including databases (e.g. Q-STAR, Part Miner). At the time of publication of this
specification, it is not clear whether or not this will be adequate, or whether additional testing or analysis of the
piece parts will be required.
NOTE 3 One purpose of this requirement is to ensure that the information necessary for reliable repair and rework
of the equipment is available to the repair and rework facilities, so that the repair and rework materials and
processes can be appropriate for the given piece part termination or finish alloy.
It is recommended that Plan owners subscribe to a part change notice (PCN) service, (e.g.
PCN Alert, Part Miner, Total Parts Plus, Arrow Risk Manager, Avnet Pomiere, Gidep, Etc.), in
addition to maintaining an active interface with piece part manufacturers, manufacturers’
representatives, and piece part distributors. Changes in termination finish will require re-
evaluation of the piece part and its compatibility with other materials and assembly processes.
6.3.3 Solder alloys used in the assembly process
6.3.3.1 General
The Plan shall document processes that identify and record in a controlled manner, the solder
alloys, fluxes, cleaning agents, and soldering processes used in the assembly process, both
by in-house and contract manufacturers. This applies to both original and repaired hardware.
NOTE IPC/JEDEC J-STD-609 provides information that can assist in this.
6.3.3.2 Assemblies containing a single solder alloy
Solder alloys, fluxes, cleaning agents, and assembly processes (including time-temperature
reflow profiles) shall be documented in the appropriate controlled document system. This
information may be identified on a label or included in the maintenance manual, or other
similar means. Assemblies assembled with Pb-free solders should be identified per industry
standards such as the IPC/JEDEC J-STD-609 or other identification specified by the
customer.
6.3.3.3 Assemblies containing more than one solder alloy
Solder alloys, fluxes, cleaning agents, and assembly processes (including time-temperature
reflow profiles) shall be documented in the appropriate controlled document system.
A description or pictorial layout of the CCA, identifying the locations of each solder alloy, shall
be included in the appropriate controlled document system. A parts list for the CCA identifying
finishes and solders along with an assembly specification identifying as-required materials
(e.g. solder wire, solder paste or bulk solder from wave-soldering or solder fountain
processes) may satisfy this requirement.
This information may be identified on a label or included in the maintenance manual, or by
other similar means. The practice of using more than one solder alloy on an assembly should
be discouraged.
6.3.4 Wiring and connector assemblies
When applicable, the processes described above shall be documented in the Plan for wiring
and similar applications.
6.3.5 Changes in solder alloys
The Plan shall document processes to assure that no changes to the solder alloys or finishes
are made without prior written authorization and approval by the Plan owner.

– 16 – TS 62647-1 © IEC:2012(E)
6.3.6 Identification
Where required by contract, all Pb-free sub-assemblies, assemblies, and equipment shall be
identified appropriately.
NOTE An industry standard that contains marking requirements is the IPC/JEDEC J-STD-609.
6.3.7 Part number changes
Part number changes related to changes in solders and finishes shall be determined by the
requirements of the specific program. Examples of changes to be considered are contained
in Annex C.
6.4 COTS assemblies and sub-assemblies
6.4.1 General
All of the technical requirements and associated objectives of this specification shall apply to
COTS assemblies and sub-assemblies containing Pb-free materials when selected for use in
ADHP electronic systems. During the selection of COTS assemblies and sub-assemblies it
shall be assumed that COTS assemblies and sub-assemblies contain some Pb-free content.
COTS assemblies are "rea
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