IEC 61189-5:2006
(Main)Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 5: Méthodes d'essai des assemblages de cartes à circuit imprimé
La CEI 61189-5:2006 est un catalogue de méthodes d'essai représentant les méthodologies et modes opératoires applicables aux assemblages de cartes à circuit imprimé.
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INTERNATIONAL IEC
STANDARD 61189-5
First edition
2006-08
Test methods for electrical materials,
interconnection structures and assemblies –
Part 5:
Test methods for printed board assemblies
Reference number
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60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1.
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INTERNATIONAL IEC
STANDARD 61189-5
First edition
2006-08
Test methods for electrical materials,
interconnection structures and assemblies –
Part 5:
Test methods for printed board assemblies
IEC 2006 Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XB
International Electrotechnical Commission
МеждународнаяЭлектротехническаяКомиссия
For price, see current catalogue
– 2 – 61189-5 IEC:2006(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Accuracy, precision and resolution .8
3.1 Accuracy .8
3.2 Precision .8
3.3 Resolution .9
3.4 Report .9
3.5 Student’s t distribution.10
3.6 Suggested uncertainty limits.10
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods.11
5.1 Test 5P01: Test-board design guideline.11
5.2 Test 5P02: Standard mounting process for CSP/BGA packages .11
6 V: Visual test methods.11
7 D: Dimensional test methods .11
8 C: Chemical test methods.11
8.1 Test 5C01: Corrosion, flux.11
9 M: Mechanical test methods .14
9.1 Test 5M01: Peel test method for test-board land .14
10 E: Electrical test methods .14
10.1 Test 5E01: Changes of the surface insulation resistance caused by fluxes .14
10.2 Test 5E02: Surface insulation resistance, assemblies .21
11 N Environmental test methods .30
11.1 Test 5N01: Reflow solderability test for soldering joint.30
11.2 Test 5N02: Resistance to reflow solderability of test board.30
11.3 Test 5N03: Solderability test for test-board land .30
12 X Miscellaneous test methods .30
12.1 Test 5X01: Liquid flux activity, wetting balance method .30
12.2 Test 5X02: Paste flux viscosity – T-Bar spindle method.34
12.3 Test 5X03: Spread test, liquid or extracted solder flux, solder paste and
extracted cored wires or preforms .34
12.4 Test 5X04: Solder paste viscosity – T-Bar spin spindle method (applicable to
300 Pa·s to 1,600 Pa·s) .37
12.5 Test 5X05: Solder paste viscosity – T-Bar spindle method (applicable to 300
Pa·s) .40
12.6 Test 5X06: Solder paste viscosity – Spiral pump method (applicable to
300 Pa·s to 1,600 Pa·s) .42
12.7 Test 5X07: Solder paste viscosity – Spiral pump method (applicable to 300
Pa·s) .44
12.8 Test 5X08: Solder paste − Slump test.47
12.9 Test 5X09: Solder paste − Solder ball test.51
12.10 Test 5X10: Solder paste − Tack test .53
12.11 Test 5X11: Solder paste − Wetting test.55
61189-5 IEC:2006(E) – 3 –
12.12 Test 5X12: Flux residues – Tackiness after drying.56
12.13 Test 5X13: Spitting of flux-cored wire solder.58
12.14 Test 5X14: Solder pool test .60
Bibliography.62
Figure 1 – Surface insulation resistance pattern .14
Figure 2 – Connector arrangement.17
Figure 3 – Specimen orientation in test chamber.18
Figure 4 – Test method 5E02.23
Figure 5 – Resistor verification coupon .24
Figure 6 – Resistor verification board with protective cover.25
Figure 7 – Test specimen location with respect to chamber air flow .25
Figure 8 – Wetting balance apparatus.32
Figure 9 – Wetting balance curve.33
Figure 10 – Slump test stencil thickness, 0,20 mm.48
Figure 11 – Slump test stencil thickness, 0,10 mm.49
Figure 12 – Solder ball test evaluation .52
Figure 13 – Solder wetting examples .56
Figure 14 – Test apparatus for spitting test .59
Table 1 – Student’s t distribution.10
Table 2 – Coupons for surface insulation resistance (SIR) testing.16
Table 3 – Qualification test report .21
Table 4 – Suggested test conditions .27
Table 5 – Typical spread areas defined in mm .35
Table 6 – Example of a test report on solder paste .39
Table 7 – Example of a test report on solder paste .41
Table 8 – Example of a test report on solder paste .43
Table 9 – Example of a test report on solder paste .46
Table 10 – Example of a test report – Stencil thickness, 0,2 mm.50
Table 11 – Example of a test report – Stencil thickness, 0,1 mm.50
– 4 – 61189-5 IEC:2006(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5: Test methods for printed board assemblies
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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...
IEC 61189-5
Edition 1.0 2006-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, interconnection structures and
assemblies –
Part 5: Test methods for printed board assemblies
Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion
et les ensembles –
Partie 5: Méthodes d'essai des assemblages de cartes à circuit imprimé
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IEC 61189-5
Edition 1.0 2006-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, interconnection structures and
assemblies –
Part 5: Test methods for printed board assemblies
Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion
et les ensembles –
Partie 5: Méthodes d'essai des assemblages de cartes à circuit imprimé
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
XB
CODE PRIX
ICS 31.180 ISBN 2-8318-9830-7
– 2 – 61189-5 © IEC:2006
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Accuracy, precision and resolution .8
3.1 Accuracy .8
3.2 Precision .8
3.3 Resolution .9
3.4 Report .9
3.5 Student’s t distribution.10
3.6 Suggested uncertainty limits.10
4 Catalogue of approved test methods .11
5 P: Preparation/conditioning test methods.11
5.1 Test 5P01: Test-board design guideline.11
5.2 Test 5P02: Standard mounting process for CSP/BGA packages .11
6 V: Visual test methods.11
7 D: Dimensional test methods .11
8 C: Chemical test methods.11
8.1 Test 5C01: Corrosion, flux.11
9 M: Mechanical test methods .14
9.1 Test 5M01: Peel test method for test-board land .14
10 E: Electrical test methods .14
10.1 Test 5E01: Changes of the surface insulation resistance caused by fluxes .14
10.2 Test 5E02: Surface insulation resistance, assemblies .21
11 N: Environmental test methods.29
11.1 Test 5N01: Reflow solderability test for soldering joint.29
11.2 Test 5N02: Resistance to reflow solderability of test board.30
11.3 Test 5N03: Solderability test for test board land .30
12 X Miscellaneous test methods .30
12.1 Test 5X01: Liquid flux activity, wetting balance method .30
12.2 Test 5X02: Paste flux viscosity – T-Bar spindle method .34
12.3 Test 5X03: Spread test, liquid or extracted solder flux, solder paste and
extracted cored wires or preforms.34
12.4 Test 5X04: Solder paste viscosity – T-Bar spin spindle method (applicable
to 300 Pa·s to 1 600 Pa·s) .37
12.5 Test 5X05: Solder paste viscosity – T-Bar spindle method (applicable to
300 Pa·s).39
12.6 Test 5X06: Solder paste viscosity – Spiral pump method (applicable to
300 Pa·s to 1 600 Pa·s) .41
12.7 Test 5X07: Solder paste viscosity – Spiral pump method (applicable to 300
Pa·s).43
12.8 Test 5X08: Solder paste – Slump test .45
12.9 Test 5X09: Solder paste − Solder ball test .48
12.10 Test 5X10: Solder paste − Tack test .50
12.11 Test 5X11: Solder paste − Wetting test .52
12.12 Test 5X12: Flux residues – Tackiness after drying .54
61189-5 © IEC:2006 – 3 –
12.13 Test 5X13: Spitting of flux-cored wire solder.55
12.14 Test 5X14: Solder pool test.58
Bibliography.60
Figure 1 – Surface insulation resistance pattern .15
Figure 2 – Connector arrangement.17
Figure 3 – Specimen orientation in test chamber.18
Figure 4 – Test method 5E02.23
Figure 5 – Resistor verification coupon .24
Figure 6 – Resistor verification board with protective cover.25
Figure 7 – Test specimen location with respect to chamber air flow .25
Figure 8 – Wetting balance apparatus.32
Figure 9 – Wetting balance curve.33
Figure 10 – Slump test stencil thickness, 0,20 mm.46
Figure 11 – Slump test stencil thickness, 0,10 mm.47
Figure 12 – Solder-ball test evaluation.50
Figure 13 – Solder wetting examples .53
Figure 14 – Test apparatus for spitting test .57
Table 1 – Student’s t distribution.10
Table 2 – Coupons for surface insulation resistance (SIR) testing.16
Table 3 – Qualification test report .21
Table 4 – Suggested test conditions .27
Table 5 – Typical spread areas defined in mm .35
Table 6 – Example of a test report on solder paste .39
Table 7 – Example of a test report on solder paste .41
Table 8 – Example of test report on solder paste .43
Table 9 – Example of test report on solder paste .45
Table 10 – Example of a test report – Stencil thickness, 0,2 mm.48
Table 11 – Example of a test report – Stencil thickness, 0,1 mm.48
– 4 – 61189-5 © IEC:2006
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
TEST METHODS FOR ELECTRICAL MATERIALS,
INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5: Test methods for printed board assemblies
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International St
...
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