IEC 60749-30:2020

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

IEC 60749-30:2020 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.
The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation.
These SMDs are subjected to the appropriate preconditioning sequence described in this document prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This edition includes the following significant technical changes with respect to the previous edition:
- inclusion of new Clause 3;
- expansion of 6.7 on solder reflow;
- inclusion of explanatory notes and clarifications.

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 30: Préconditionnement des composants pour montage en surface non hermétiques avant les essais de fiabilité

L’IEC 60749-30:2020 établit une procédure normalisée de détermination du préconditionnement pour les composants pour montage en surface (CMS) non hermétiques avant les essais de fiabilité. Cette méthode d’essai définit une refusion de préconditionnement pour les CMS à l’état solide non hermétiques représentative d’une opération de refusion de soudure multiple industrielle type. Les CMS sont soumis à la séquence de préconditionnement appropriée décrite dans le présent document avant d’être soumis aux essais de fiabilité sur place spécifiques (qualification et/ou surveillance de la fiabilité) pour évaluer la fiabilité à long terme (qui pourrait être affectée par la refusion de soudure). Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- ajout du nouvel Article 3;
- extension de 6.7 concernant la refusion de soudure;
- inclusion de notes explicatives et de clarifications.

General Information

• Status: Published
• Publication Date: 16-Aug-2020
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 21-Aug-2020
• Completion Date: 17-Aug-2020

Relations

• Revises: IEC 60749-30:2005 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 05-Sep-2023
• Revises: IEC 60749-30:2005/AMD1:2011 - Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 60749-30 ®
Edition 2.0 2020-08
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –
Part 30: Preconditioning of non-hermetic surface mount devices prior to
reliability testing
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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IEC 60749-30 ®
Edition 2.0 2020-08
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Mechanical and climatic test methods –

Part 30: Preconditioning of non-hermetic surface mount devices prior to

reliability testing
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-8777-4

– 2 – IEC 60749-30:2020 RLV © IEC 2020
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 General description . 7
5 Test apparatus and materials . 7
5.1 General . 7
5.2 Moisture chamber . 8
5.3 Solder equipment . 8
5.4 Optical microscope . 8
5.5 Electrical test equipment . 8
5.6 Drying (bake) oven. 8
5.7 Temperature cycle chamber (optional) . 8
6 Procedure . 8
6.1 General . 8
6.2 Initial measurements . 9
6.2.1 Electrical test . 9
6.2.2 Visual inspection . 9
6.3 Temperature cycling (optional) . 9
6.4 Drying (bake out) . 9
6.5 Soak conditions for dry-packed SMDs . 9
6.5.1 General . 9
6.5.2 Method A for dry-packed SMDs in accordance with IEC 60749-20 . 9
6.5.3 Method B for dry-packed SMDs in accordance with IEC 60749‑20 . 10
6.6 Method C for Soak conditions for non-dry-packed SMDs in accordance with
IEC 60749-20 . 11
6.7 Solder reflow. 11
6.7.1 Solder reflow procedure . 11
6.7.2 Solder attachment after reflow . 11
6.8 Flux application simulation (optional) . 12
6.8.1 Flux application . 12
6.8.2 Cleaning and drying after flux application . 12
6.9 Final measurements . 12
6.9.1 Electrical test . 12
6.9.2 Visual inspection . 12
6.10 Applicable reliability tests. 13
7 Summary . 13

Table 1 – Moisture soak conditions for dry-packed SMDs (method A) .
Table 2 – Required soak times in hours for method B, conditions B2–B6
(MSL levels 3–6) .
Table 3 – Moisture soak conditions for non-dry-packed SMDs .
Table 4 – Preconditioning sequence flows .
Table 4a 1 – Preconditioning sequence flow for – Method A (conditions A1/ A2) in
accordance with IEC 60749-20 (dry-packed devices) . 13

Table 4b 2 – Preconditioning sequence flow for – Method B (conditions B1–B5 B2 to
B6) in accordance with IEC 60749-20 (dry-packed devices) . 14
Table 4c 3 – Preconditioning sequence flow for – Conditions C and D A1 and B1 in
accordance with IEC 60749-20 (non dry-packed devices) . 15

– 4 – IEC 60749-30:2020 RLV © IEC 2020
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 30: Preconditioning of non-hermetic surface
mount devices prior to reliability testing

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition. A vertical bar appears in the margin wherever a change
has been made. Additions are in green text, deletions are in strikethrough red text.

International Standard IEC 60749-30 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2005 and
Amendment 1:2011. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) inclusion of new Clause 3;
b) expansion of 6.7 on solder reflow;
c) inclusion of explanatory notes and clarifications.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2633/FDIS 47/2644/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
– 6 – IEC 60749-30:2020 RLV © IEC 2020
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 30: Precondi
...

IEC 60749-30 ®
Edition 2.0 2020-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –
Part 30: Preconditioning of non-hermetic surface mount devices prior to
reliability testing
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 30: Préconditionnement des composants pour montage en surface non
hermétiques avant les essais de fiabilité

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
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Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
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once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
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IEC 60749-30 ®
Edition 2.0 2020-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices – Mechanical and climatic test methods –

Part 30: Preconditioning of non-hermetic surface mount devices prior to

reliability testing
Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 30: Préconditionnement des composants pour montage en surface non

hermétiques avant les essais de fiabilité

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01 ISBN 978-2-8322-8669-2

– 2 – IEC 60749-30:2020 © IEC 2020
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 6
4 General description . 6
5 Test apparatus and materials . 6
5.1 General . 6
5.2 Moisture chamber . 7
5.3 Solder equipment . 7
5.4 Optical microscope . 7
5.5 Electrical test equipment . 7
5.6 Drying (bake) oven. 7
5.7 Temperature cycle chamber (optional) . 7
6 Procedure . 7
6.1 General . 7
6.2 Initial measurements . 8
6.2.1 Electrical test . 8
6.2.2 Visual inspection . 8
6.3 Temperature cycling (optional) . 8
6.4 Drying (bake out) . 8
6.5 Soak conditions for dry-packed SMDs . 8
6.5.1 General . 8
6.5.2 Method A for dry-packed SMDs in accordance with IEC 60749-20 . 8
6.5.3 Method B for dry-packed SMDs in accordance with IEC 60749‑20 . 8
6.6 Soak conditions for non-dry-packed SMDs in accordance with IEC 60749‑20 . 8
6.7 Solder reflow. 9
6.7.1 Solder reflow procedure . 9
6.7.2 Solder attachment after reflow . 9
6.8 Flux application simulation (optional) . 10
6.8.1 Flux application . 10
6.8.2 Cleaning and drying after flux application . 10
6.9 Final measurements . 10
6.9.1 Electrical test . 10
6.9.2 Visual inspection . 10
6.10 Applicable reliability tests. 10
7 Summary . 10

Table 1 – Preconditioning sequence flow – Method A (condition A2) in accordance with
IEC 60749-20 (dry-packed devices) . 11
Table 2 – Preconditioning sequence flow – Method B (conditions B2 to B6) in
accordance with IEC 60749-20 (dry-packed devices) . 11
Table 3 – Preconditioning sequence flow – Conditions A1 and B1 in accordance with
IEC 60749-20 (non dry-packed devices) . 12

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 30: Preconditioning of non-hermetic surface
mount devices prior to reliability testing

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for ident
...