IEC PAS 61340-5-6:2022
(Main)Electrostatics - Part 5-6 : Protection of electronic devices from electrostatic phenomena - Process assessment techniques
Electrostatics - Part 5-6 : Protection of electronic devices from electrostatic phenomena - Process assessment techniques
IEC PAS 61340-5-6:2022 describe a set of methodologies, techniques, and tools that can be used to characterize a process where ESD sensitive (ESDS) items are handled. The process assessment covers risks by charged personnel, ungrounded conductors, charged ESDS items, and ESDS items in an electrostatic field. This document applies to activities that manufacture, process, assemble, install, package, label, service, test, inspect, transport, or otherwise handle electrical or electronic parts, assemblies, and equipment susceptible to damage by electrostatic discharges. This document does not apply to electrically initiated explosive items, flammable liquids, or powders. The document does not address program management, compliance verification, troubleshooting, or program manager/coordinator certification. In this version of the document, risks due to electromagnetic sources that produce AC fields are not considered.
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IEC PAS 61340-5-6 ®
Edition 1.0 2022-06
PUBLICLY AVAILABLE
SPECIFICATION
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Electrostatics –
Part 5-6: Protection of electronic devices from electrostatic phenomena –
Process assessment techniques
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IEC PAS 61340-5-6 ®
Edition 1.0 2022-06
PUBLICLY AVAILABLE
SPECIFICATION
colour
inside
Electrostatics –
Part 5-6: Protection of electronic devices from electrostatic phenomena –
Process assessment techniques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 17.220.99; 29.020 ISBN 978-2-8322-3943-8
– 2 – IEC PAS 61340-5-6:2022 © IEC 2022
CONTENTS
FOREWORD . 4
1.0 PURPOSE, SCOPE, LIMITATION, and EXPERIENCE LEVEL REQUIRED . 9
1.1 Purpose . 9
1.2 Scope . 9
1.3 Limitation . 9
1.4 Experience Level Required . 9
2.0 ReferenceD PUBLICATIONS . 9
3.0 DEFINITIONS . 10
4.0 Personnel Safety . 10
5.0 Measurement Techniques FOR ESd Risk Assessment . 10
6.0 ESD Robustness of ESDS ITEMS used in Processes . 12
6.1 ESD Withstand Currents of Single Devices (Components) . 13
6.1.1 Human Body Model . 13
6.1.2 Discharge of Charged Conductors . 13
6.1.3 Charged Device Model . 14
6.2 ESD Withstand Currents of Electronic Assemblies . 14
6.2.1 Discharge of Charged Personnel . 14
6.2.2 Discharge of Charged Conductors . 14
6.2.3 Discharge of Boards/Systems . 15
7.0 Process Assessment Flow . 15
7.1 General Considerations . 15
7.2 Manual Handling Steps . 16
7.2.1 Introduction . 16
7.2.2 Parameter Limits for ESD Process Assessment in Manual Handling Steps . 16
7.2.3 Detailed ESD Risk Assessment Flow . 17
7.3 Conductors . 18
7.3.1 Introduction . 18
7.3.2 Parameter Limits for Process Assessment of Conductors . 19
7.3.3 Detailed ESD Risk Assessment Flow . 19
7.4 Charged ESDS Items . 20
7.4.1 Introduction . 20
7.4.2 Parameter Limits for Process Assessment of Charged ESDS Items . 20
7.4.3 Detailed ESD Risk Assessment Flow . 21
7.5 Risks Due to Process-Required Insulators . 23
7.5.1 Introduction . 23
7.5.2 Parameter Limits for Process Assessment of Process-Required Insulators . 23
7.5.3 Detailed ESD Risk Assessment Flow . 24
7.6 Process Assessment by ESD Event Detection . 25
7.6.1 Introduction . 25
7.6.2 General Procedure . 26
7.6.3 Detailed ESD Risk Assessment Flow . 26
ANNEX A (INFORMATIVE): Measurement TECHNIQUES And EQuipment . 28
A.1 General Considerations . 28
A.2 Measurements of Grounding . 28
A.3 Measurements of Electrostatic Fields . 31
A.4 Measurements of Charges . 32
A.5 Measurements of Electrostatic Voltages . 33
A.6 Measurements of Discharge Events . 37
A.7 Measurements of Discharge Currents . 39
ANNEX B (INFORMATIVE) – PREPARATION: WHAT IS NECESSARY TO .
PREPARE AN EFFECTIVE PROCESS EVALUATION? . 45
B.1 Measurement of Temperature, Humidity, and Basic Electrostatic Conditions . 45
B.2 Further Hints for Preparation . 45
ANNEX C (INFORMATIVE) – Risk Assessment and Mitigation . 46
ANNEX D (INFORMATIVE) – ExampleS for defining limits in process assessment for .
Risks Due to Charged Personnel . 47
ANNEX E (INFORMATIVE) – Example for CDM risk assessment in a .
semiconductor manufacturing line . 49
ANNEX F (INFORMATIVE) – Bibliography . 53
ANNEX g (INFORMATIVE) – revision History for ANSI/ESD Sp17.1 . 54
Table 1 – Overview of Possible Measurement Equipment Used for Different Scenarios .
to Assess ESD Risk . 11
Table 2 – Peak Current Ranges of CDM Discharges of Small and Large Verification Modules for
Oscilloscopes with a Bandwidth of 1 GHz and 6 GHz According to ANSI/ESDA/JEDEC JS-002 . 44
Table 3 – Recommended Measurement Locations During Process Assessment in Assembly .
(Pre-Assembly) of Devices . 49
Table 4 – Recommended Measurement Locations During Process Assessment in Device Testing . 50
Figure 1 – Direct (Best Correlation) and Indirect (Least Correlation) Measurements .
to Assess an ESD Risk . 12
Figure 2 – Flow to Assess ESD Risk Induced by Personnel . 18
Figure 3 – Flow to Assess the ESD Risk Induced by Conductors . 20
Figure 4 – Flow to Assess the ESD Risk Induced by Charged ESDS Items . 22
Figure 5 – Flow to Assess the ESD Risk Induced by Process-Required Insulators . 25
Figure 6 – Flow to Assess the ESD Risk by Detecting the Electromagnetic Radiation .
Using ESD Event Detectors or Antennas and Oscilloscopes . 27
Figure 7 – Examples of Current Probes . 40
Figure 8 – Example of a 4-GHz Pellegrini Target . 42
Figure 9 – Commercially Available CDM Test Head Used for Discharge Current Measurements . 43
Figure 10 – Discharge Current Measured in the Field and During Device Qualification [8] . 47
Figure 11 – Examples of Measurements During Semiconductor Assembly and Testing . 50
Figure 12 – Schematic of Possible CDM-Like Scenarios During Device Testing . 52
– 4 – IEC PAS 61340-5-6:2022 © IEC 2022
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTROSTATICS –
Part 5-6: Protection of electronic devices from electrostatic phenomena –
Process assessment techniques
FOREWORD
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