IEC 62496-1:2008

Optical circuit boards - Part 1: General

IEC 62496-1:2008 applies to optical circuit boards possessing all of the following general features:
- transmit patterns with straight, cross, bending optical paths and input and output optical ports in plane;
- optical paths consisting of optical fibres and/or optical waveguides;
- controlled lengths of the optical paths, if required;
- may be combined with a printed electric circuit board, the functionality of which is outside the scope of this standard;
- to interconnect between optical components and the ability to mount components.

Cartes à circuits optiques - Partie 1: Généralités

La CEI 62496-1:2008 s'applique aux cartes à circuits optiques possédant toutes les caractéristiques générales suivantes:
- des motifs de transmission avec des chemins optiques droits, croisés, courbés et des ports d'entrées et de sorties optiques en plan;
- des chemins optiques consistant en des fibres optiques et/ou des guides d'ondes optiques;
- des longueurs de chemins optiques contrôlés, si nécessaire;
- pouvant être mélangé avec un circuit imprimé électrique, dont la fonctionnalité ne fait pas partie du domaine d'application de la présente norme;
- des fonctions permettant d'interconnecter les composants optiques et la possibilité de monter des composants.

General Information

• Status: Published
• Publication Date: 08-Dec-2008
• ICS: 31.180 - Printed circuits and boards
• ICS: 33.180.01 - Fibre optic systems in general
• Technical Committee: TC 86 - Fibre optics
• Drafting Committee: JWG 9 - TC 86/JWG 9
• Current Stage: PPUB - Publication issued
• Start Date: 09-Dec-2008
• Completion Date: 15-Dec-2008

Overview

IEC 62496-1:2008 is the international standard that defines general requirements for optical circuit boards (OCBs). Developed by the International Electrotechnical Commission (IEC), this standard applies to optical circuit boards that feature straight, crossing, and bending optical paths, equipped with input and output optical ports all in a planar configuration. These boards utilize optical fibers and/or optical waveguides to transmit signals and may feature controlled optical path lengths when required. The standard also addresses OCBs that can be combined with printed circuit boards (PCBs) for hybrid functionality, although electrical aspects remain outside its scope.

Optical circuit boards are essential in the integration and interconnection of optical components in systems requiring high-speed, low-loss optical signal transmission. IEC 62496-1:2008 sets the baseline for classification, design, construction, performance, documentation, and packaging, providing a comprehensive framework for manufacturers and engineers involved in optical board production and application.

Key Topics

• Scope and Features
  The standard covers optical circuit boards that:

  • Include various optical pathways such as straight, cross, and bending patterns within a planar layout
  • Utilize optical fibers and waveguides for signal transmission
  • Can have controlled optical path lengths to meet specific system requirements
  • May combine with printed electric circuit boards (functionality excluded)
  • Provide mounting and interconnection of optical components

• Classification and Types
  IEC 62496-1 introduces classifications by type, style, and variant of optical circuit boards, defining rigid, flexible, non-planar, and opto-electric composite boards. This classification facilitates standardization, communication, and interoperability among manufacturers and users.

• Documentation and Symbols
  Standardized documentation practices include the use of recognized graphical symbols, clear test procedures, measurement methods, and instructions for use. This ensures consistent representation, testing, and interpretation of optical circuit board data.

• Materials and Workmanship
  The standard outlines requirements for acceptable materials and workmanship to ensure board reliability and performance. Emphasis is placed on durable substrates and precise fabrication techniques to maintain optical path integrity.

• Performance and Marking
  Performance criteria address optical attenuation, mechanical stability, and environmental resistance. Identification and marking conventions facilitate inventory management, traceability, and system integration.

• Packaging and Storage
  Proper packaging and storage conditions are defined to protect optical circuit boards during transportation and inventory, preserving functionality and safety.

Applications

IEC 62496-1:2008 is applicable in industries and sectors where optical circuit boards are essential, including:

• Telecommunications
  High-speed optical networks rely on OCBs for efficient interconnection and signal routing within switches, routers, and multiplexers.

• Data Centers
  OCBs enable dense optical interconnect solutions critical for large-scale data processing and transfer.

• Fiber Optic Sensors
  Precision optical paths and component mounting capabilities supported by this standard benefit sensor systems requiring stable and reproducible optical connections.

• Optoelectronic Devices
  Integration of optical and electronic components on composite boards streamlines device miniaturization and performance.

• Medical Equipment
  Optical circuit boards are used in diagnostic and imaging devices where reliable optical signal transmission is critical.

Related Standards

Several IEC and ISO standards complement and support IEC 62496-1:2008, including:

• IEC 60027 – Letter symbols used in electrical technology
• IEC 60617 – Graphical symbols for diagrams relevant to optical circuits
• IEC 60695-11-5 – Fire hazard testing methods for materials used in optical boards
• IEC 60825-1 & IEC 60825-2 – Laser safety standards focusing on devices incorporating optical components
• IEC 61300 – Procedures for testing and measurement of fiber optic interconnecting devices
• IEC/TR 61930 & IEC/TR 61931 – Guidelines on fiber optic symbology and terminology
• ISO 129-1, ISO 286-1, ISO 1101, ISO 8601 – Standards covering technical drawings, tolerances, geometrical specifications, and data interchange formats

These related standards ensure cohesive implementation, safety, quality, and compliance across the optical and electronic technology sectors.

---

Keywords: IEC 62496-1, optical circuit boards, optical fibers, optical waveguides, optical paths, planar optical interconnects, fiber optic board standard, opto-electric circuit board, optical component mounting, optical transmission, IEC standards, fiber optics standardization, optical board classification, optical materials, optical board performance, optical packaging, optical safety standards.

Standards Content (Sample)

IEC 62496-1
Edition 1.0 2008-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Optical circuit boards –
Part 1: General
Cartes à circuits optiques –
Partie 1: Généralités
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by
any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or
IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.

IEC Central Office
3, rue de Varembé
CH-1211 Geneva 20
Switzerland
Email: [e-mail]
Web: www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
ƒ Catalogue of IEC publications: www.iec.ch/searchpub
The IEC on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee,…).
It also gives information on projects, withdrawn and replaced publications.
ƒ IEC Just Published: www.iec.ch/online_news/justpub
Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available
on-line and also by email.
ƒ Electropedia: www.electropedia.org
The world's leading online dictionary of electronic and electrical terms containing more than 20 000 terms and definitions
in English and French, with equivalent terms in additional languages. Also known as the International Electrotechnical
Vocabulary online.
ƒ Customer Service Centre: www.iec.ch/webstore/custserv
If you wish to give us your feedback on this publication or need further assistance, please visit the Customer Service
Centre FAQ or contact us:
Email: [e-mail]
Tel.: [phone]
Fax: [phone]
A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
ƒ Catalogue des publications de la CEI: www.iec.ch/searchpub/cur_fut-f.htm
Le Catalogue en-ligne de la CEI vous permet d’effectuer des recherches en utilisant différents critères (numéro de référence,
texte, comité d’études,…). Il donne aussi des informations sur les projets et les publications retirées ou remplacées.
ƒ Just Published CEI: www.iec.ch/online_news/justpub
Restez informé sur les nouvelles publications de la CEI. Just Published détaille deux fois par mois les nouvelles
publications parues. Disponible en-ligne et aussi par email.
ƒ Electropedia: www.electropedia.org
Le premier dictionnaire en ligne au monde de termes électroniques et électriques. Il contient plus de 20 000 termes et
définitions en anglais et en français, ainsi que les termes équivalents dans les langues additionnelles. Egalement appelé
Vocabulaire Electrotechnique International en ligne.
ƒ Service Clients: www.iec.ch/webstore/custserv/custserv_entry-f.htm
Si vous désirez nous donner des commentaires sur cette publication ou si vous avez des questions, visitez le FAQ du
Service clients ou contactez-nous:
Email: [e-mail]
Tél.: [phone]
Fax: [phone]
IEC 62496-1
Edition 1.0 2008-12
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Optical circuit boards –
Part 1: General
Cartes à circuits optiques –
Partie 1: Généralités
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
S
CODE PRIX
ICS 31.180; 33.180.01 ISBN 978-2-88910-739-1
– 2 – 62496-1 © IEC:2008
CONTENTS
FOREWORD.4
1 Scope.6
2 Normative references.6
3 Terms and definitions .7
4 Requirements .9
4.1 General .9
4.2 Classification.9
4.2.1 Introductory remark.9
4.2.2 Type .10
4.2.3 Style .10
4.2.4 Variant.14
4.2.5 Normative reference extension.15
4.3 Documentation .15
4.3.1 Symbols.15
4.3.2 Standard system .15
4.3.3 Drawings .17
4.3.4 Test and measurement .17
4.3.5 Instructions for use .18
4.4 Standardization system.18
4.4.1 Performance standards.18
4.4.2 Reliability standards.18
4.4.3 Interlinking.19
4.5 Design and construction .19
4.5.1 Materials.19
4.5.2 Workmanship .20
4.6 Performance.20
4.7 Identification and marking.20
4.7.1 Introductory remark.20
4.7.2 Variant identification number.20
4.7.3 Component marking.20
4.7.4 Package marking .20
4.8 Packaging .21
4.9 Storage conditions.21
4.10 Safety.21
Bibliography .22

Figure 1 – Schematic views of waveguide circuit boards .8
Figure 2 – Configuration A.11
Figure 3 – Configuration B.12
Figure 4 – Configuration C-1 .13
Figure 5 – Configuration C-2 .13
Figure 6 – Configuration D-1 .14
Figure 7 – Configuration D-2 .14

Table 1 – Example of a typical optical circuit board classification .10

62496-1 © IEC:2008 – 3 –
Table 2 – IEC standard structure .16
Table 3 – Standards interlink matrix .19

– 4 – 62496-1 © IEC:2008
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
OPTICAL CIRCUIT BOARDS –
Part 1: General
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with an IEC Publication.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62496-1 has been prepared by IEC technical committee 86: Fibre
optics.
The text of this standard is based on the following documents:
FDIS Report on voting
86/307/FDIS 86/312/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62496 series, under the general title Optical circuit boards, can
be found on the IEC website.
62496-1 © IEC:2008 – 5 –
The committee has decided that the contents of this publication will remain unchanged until the
maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – 62496-1 © IEC:2008
OPTICAL CIRCUIT BOARDS –
Part 1: General
1 Scope
IEC 62496-1 applies to optical circuit boards possessing all of the following general features:
– transmit patterns with straight, cross, bending optical paths and input and output optical
ports in plane;
– optical paths consisting of optical fibres and/or optical waveguides;
– controlled lengths of the optical paths, if required;
– may be combined with a printed electric circuit board, the functionality of which is outside
the scope of this standard;
– functions to interconnect between optical components and the ability to mount components.
The purpose of this standard is to specify optical circuit board requirements as they relate to
− classification,
− IEC standard system,
− documentation,
− materials,
− workmanship,
− performance,
− identification
− packaging.
2 Normative references
The following referenced documents are indispensable for the application of this document. For
dated references, only the edition cited applies. For undated references, the latest edition of
the referenced document (including any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050-731, International Electrotechnical Vocabulary – Chapter 731: Optical fibre
communication
IEC 60617 (all parts), Graphical symbols for diagrams
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method –
Apparatus, confirmatory test arrangement and guidance
IEC 60825-1, Safety of laser products – Part 1: Equipment classification and requirements
IEC 60825-2, Safety of laser products – Part 2: Safety of optical fibre communication systems
(OFCS)
62496-1 © IEC:2008 – 7 –
IEC 61300 (all parts), Fibre optic interconnecting devices and passive components – Basic test
and measurement procedures
IEC/TR 61930, Fibre optic graphical symbology
IEC/TR 61931, Fibre optics – Terminology
ISO 129-1, Technical drawings – Indication of dimensions and tolerances – Part 1: General
principles
ISO 286-1, ISO system of limits and fits – Part 1: Bases of tolerances, deviations and fits
ISO 1101, Geometrical Product Specifications (GPS) – Geometrical tolerancing – Tolerances of

form, orientation, location and run-out
ISO 8601, Data elements and interchange formats – Information interchange – Representation
of dates and times
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60050-731 and
IEC/TR 61931, as well as the following terms and definitions, apply.
3.1
optical circuit board
OCB
assembling device having arbitrary optical transmit patterns with straight/cross/bending optical
paths which consist of optical fibres and/or optical waveguides with input/output optical ports in
plane
NOTE The lengths of optical paths are controlled, if required.
3.2
flexible optical circuit board
optical circuit board that is made of a flexible substrate
3.3
rigid optical circuit board
optical circuit board made of a rigid substrate
3.4
non-planar shape optical circuit board
optical circuit board that re-configures multiple optical fibre ribbons to create a cross-connect
3.5
opto-electric circuit board
composite circuit board composed of optical circuit board and printed circuit board
3.6
input/output optical ports
end of an optical fibre/waveguide where optical signals enter or leave an OCB
3.7
waveguide circuit board
transparent and planar lightguide consisting of a core and a cladding material to transmit light

– 8 – 62496-1 © IEC:2008
NOTE There are several types of waveguides such as slab waveguide, channel waveguide (embedded type) or
channel waveguide (ridge type) as shown in Figure 1.

Core
Cladding
Substrate
IEC  2073/08
Figure 1a – Example of slab waveguide circuit board

Core
Cladding
cladding
Substrate
IEC  2074/08
Figure 1b – Example of channel waveguide circuit board – Embedded type

Core Cladding
Substrate
IEC  2075/08
Figure 1c – Example of channel waveguide circuit board – Ridge type
Figure 1 – Schematic views of waveguide circuit boards
3.8
optical fibre circuit board
optical circuit board consisting of fibres to transmit light
NOTE There are two types of fibre circuit boards, embedded and exposed.
3.9
crossing point of optical fibre
position where an optical fibre crosses over the underlying optical fibre in the OCB
3.10
attenuation
a
ij
reduction in optical power between an input and an output port of an optical path expressed in
decibels and defined as follows:
a = –10 log (P /P )
ij j i
where
P is the input optical power introduced into the ith input port;

i
62496-1 © IEC:2008 – 9 –
P is the output optical power attained at the jth output port (the insertion loss depends on
j
the state of the optical circuit board);
i and j are the input and output port numbers, respectively.
3.11
return loss
reflection loss
RL
i
fraction of input power returned from the input port of an optical path defined as follows:
RL = –10 log (R /P )
i i i
where
P is the input optical power introduced into the ith input port;

i
R is the optical power received back from the same port;

i
i is the input port number.
The return loss depends on the state of the optical circuit board.
3.12
isolation
I
ij
ratio of optical power exiting from the output port corresponding to a given input port, suitably
powered, to the optical power exiting from another output port, defined as follows:
I = –10 log (P /P )
ij j i
where
P is the optical power exiting the output port corresponding to a given input port, suitably
i
powered;
P is the optical power exiting from another output port.
j
4 Requirements
4.1 General
The requirements for an optical circuit board covered by this clause are used to classify the board.
4.2 Classification
4.2.1 Introductory remark
Optical circuit boards shall be classified as follows:
– type;
– style;
– variant;
– normative reference extensions.
Table 1 is an example of an optical circuit board classification.

– 10 – 62496-1 © IEC:2008
Table 1 – Example of a typical optical circuit board classification
Type: – Construction: flexible optical circuit board
– Transmission medium: optical fibre (embedded type)
– Complexity: optical circuit board without printed circuit board
Style: – Configuration A
Variants: – Fibre category: Category B
Normative reference extensions: .

4.2.2 Type
Types for optical circuit boards shall be defined by three elements: construction, transmission
medium and complexity.
Examples of construction:
– flexible optical circuit board;
– rigid optical circuit board;
– non-planar shape optical circuit board.
Examples of transmission medium:
– optical fibre circuit board (embedded type);
– optical fibre circuit board (exposed type);
– slab waveguide circuit board;
– channel waveguide circuit board (embedded type);
– channel waveguide circuit board (ridge type).
Examples of complexity:
– optical circuit board with printed circuit board (opto-electric circuit board);
– optical circuit board without printed circuit board.
4.2.3 Style
Optical circuit boards may be classified into styles based on types of input and output ports,
vertical end type, arbitrary angled mirror type, and dimensions and configuration.
Configuration
The configuration of the optical circuit board ports is classified as follows:
Configuration A
An optical circuit board containing fibres whose ends are outside of the board. A schematic
view of Configuration A is shown in Figure 2.

62496-1 © IEC:2008 – 11 –
Optical circuit board
a
a
a-a cross section
Fibre
IEC  2076/08
Figure 2 – Configuration A
Configuration B
An optical circuit board containing optical paths with flat ends. A schematic view of
Configuration B is shown in Figure 3. Positions of the flat ends are at the board edge. This is
made of optical fibre (embedded type), optical fibre (exposed type), channel waveguide
(embedded type) and channel waveguide (ridge type).

– 12 – 62496-1 © IEC:2008
Optical circuit board
a
a
a-a cross section
IEC  2077/08
Figure 3 – Configuration B
Configuration C
An optical circuit board containing optical paths with angled end faces.
There exist two types of Configuration C:
– Configuration C-1: this configuration is made of channel waveguide (embedded type) or
channel waveguide (ridge type). A schematic view of configuration C-1 is shown in Figure 4.

62496-1 © IEC:2008 – 13 –
Optical circuit board
Mirror/grating
Mirror/grating
a a
Channel waveguide
Channel waveguide
Mirror/grating
a-a cross section
b
Detail of b
IEC  2078/08
Figure 4 – Configuration C-1
– Configuration C-2: this configuration is made of slab waveguide. A schematic view of
Configuration C-2 is shown in Figure 5.

Optical circuit board
a
a
Mirror
Mirror
Detail of b
b
Slab waveguide
a-a cross section
IEC  2079/08
Figure 5 – Configuration C-2
Configuration D
An optical circuit board containing groove and/or via-hole.
There exist two types of Configuration D:
– D-1: this configuration is an optical circuit board in which open grooves or via-holes are
formed to insert the connectors into the board for deflection of light to vertical direction. A
schematic view of Configuration D-1 is shown in Figure 6.

– 14 – 62496-1 © IEC:2008
Optical circuit board
Open groove
Fibre/waveguide
or via-hole
a
a
Fibre/waveguide
a-a cross section
IEC  2080/08
Figure 6 – Configuration D-1
– D-2: this configuration is an optical circuit board on which closed grooves are formed to
place the connectors on the board for deflection of light to vertical direction. A schematic
view of Configuration D-2 is shown in Figure 7.

Optical circuit board
Closed groove
Fibre/waveguide
a
a
Fibre/waveguide
a-a cross section
IEC  2081/08
Figure 7 – Configuration D-2
Configuration E
This configuration comprises an optical circuit board containing combinations of the interfacing
features of the above mentioned configurations.
4.2.4 Variant
The optical circuit board variant identifies the features which encompass structurally similar
components.
Examples of the features which define a variant include but are not limited to
– fibre category (category A, B etc.),
– fibre parameter (core and clad diameter, etc.),
– waveguide parameter (core and clad sizes, etc.).

62496-1 © IEC:2008 – 15 –
4.2.5 Normative reference extension
Normative reference extensions are used to identify integrated independent standards or other
reference documents into blank detail specifications.
Unless any specified exception is noted, additional requirements imposed by an extension are
mandatory. Usage is primarily intended to merge associated components to form hybrid
devices, or integrated functional application requirements that are dependent on technical
expertise other than fibre optics.
Published reference documents produced by the ITU, consistent with the scope of the relevant
IEC standard series may be used as extensions of this standard. Published documents
produced by other regional standardization bodies such as TIA, ETSI, JIS, etc. may be
referenced in a bibliography attached to the main standard as informative references.
Some spatial optical circuit board configurations require special qualification provisions which
shall not be imposed universally. This accommodates individual component design
configurations, specialized field tooling or specific application processes. In this case,
requirements are necessary to assure repeatable performance or adequate safety and provide
additional guidance for a complete product standard and they shall be defined in the relevant
standard. These extensions are mandatory whenever they are used to prepare, assemble or
install a spatial optical circuit board either for field application usage or preparation of
qualification test specimens. The relevant standard shall clarify all stipulations. Design and
style-dependent extensions shall not be imposed universally, however.
In the event of conflicting requirements, precedence, in descending order, shall be given to
IEC 62496-1, this general standard, over any mandatory extension, blank detail, or detail
specification or application-specific extension.
Examples of optical connector extensions are given as follows:
– IEC 61754-13 and IEC 60869-1 to partially define a future IEC 61753 standard for an
integrated type "FC" preset attenuated optical connector;
– IEC 61754-4 and IEC 61073-1 to partially define a future IEC 61753 standard for a
performance standard of fibre optical connector incorporating integral mechanical splices.
Other examples of requirements for normative extensions are as follows.
– Some commercial or residential building applications may require direct reference to
specific safety codes and regulations or incorporate other specific material flammability or
toxicity requirements for specialized locations.
– Specialized field tooling may require an extension to implement specific ocular safety,
electrical shock, burn hazard avoidance requirements or to require isolation procedures to
prevent potential ignition of combustible gases.
4.3 Documentation
4.3.1 Symbols
Graphical and letter symbols specified in IEC 60027, IEC 60617 and IEC/TR 61930 shall be
used whenever possible.
4.3.2 Standard system
4.3.2.1 Introductory remark
This standard is a part of the IEC standard system. Subsidiary standards shall consist of blank
detail specifications and detail specifications. This system is shown in Table 2. There is no
sectional standard for optical circuit boards.

– 16 – 62496-1 © IEC:2008
Table 2 – IEC standard structure
Standard level Examples of information to be included Applicable to
Inspection rules
Optical measurement methods
Environmental test methods
Sampling plans
Identification rules
Two or more component families
Basics Marking standards
or sub-families
Dimensional standards
Terminology
Symbol standards
Preferred number series
SI units
Specific terminology
Specific symbols
Specific units
General Component family
Preferred values
Marking
Selection of tests
Inspection requirements
Blank detail
Groups of types
a
specification
Information common to a number of types
Individual values
Detail specification Individual type
Specific information
a
Blank detail specifications are not a standard level by themselves. They are associated with the general
standard.
4.3.2.2 Blank detail specification
Each blank detail specification shall contain:
– the minimum mandatory performance requirements;
– the preferred format for stating the required information in the detail specification;
– any additional appropriate entry fields to show the normative reference document,
document title and issue date in case of hybrid components, including connectors.
4.3.2.3 Detail specification
A specific optical circuit board is described by a corresponding detail specification which is
prepared by filling in the blank detail specification. Within the constraints imposed by this
general standard, the blank detail specification may be filled in by any national committee of
the IEC, thereby defining a particular optical circuit board design as an official IEC standard.
Detail specifications shall specify the following, as applicable:
– type (see 4.2.2);
– style (see 4.2.3);
– variant(s) (see 4.2.4);
– part identification number for each variant (see 4.7.2);

62496-1 © IEC:2008 – 17 –
– drawings and dimensions required (see 4.3.3);
– performance requirements (see 4.6).
4.3.3 Drawings
4.3.3.1 Introductory remark
The drawings and dimensions given in a detail specification shall not restrict themselves to
details of construction, nor shall they be used as manufacturing drawings.
4.3.3.2 Projection system
Either first-angle or third-angle projection shall be used for the drawing in a document covered
by this standard. All drawings within a document shall use the same projection system and the
drawings shall state which system is used.
4.3.3.3 Dimensional system
All dimensions shall be given in accordance with ISO 129-1, ISO 286-1 and ISO 1101.
The metric system shall be used in all standards.
Dimensions shall not contain more than five significant digits.
4.3.4 Test and measurement
4.3.4.1 Test and measurement procedures
The test and measurement procedures for optical, mechanical and environmental
characteristics of optical circuit boards shall be defined and selected preferably from the
IEC 61300 series.
The size measurement method shall be specified in the relevant specification for dimensions
which are specified within a total tolerance zone of 0,01 mm or better.
Calibration of test equipment being used for quantitative measurements shall be in accordance
with ISO/IEC 17025.
4.3.4.2 Reference component
Reference components for measurement purposes, if required, shall be specified in the
relevant specification.
4.3.4.3 Gauge
Gauges, if required, shall be specified in the relevant specification.
4.3.4.4 Test report
The test report shall be prepared for each test conducted, as required by a relevant
specification.
The report shall include the following information as a minimum:
– title of test and date;
– specimen description including the variant identification number (see 4.7.2);
– test equipment used and date of latest calibration;

– 18 – 62496-1 © IEC:2008
– all applicable test details;
– all measurement values and observations.
4.3.5 Instructions for use
The instruction for use, when required, shall be given by the manufacturer and shall include
– assembly and connection instruction,
– cleaning method,
– safety aspects,
– additional information, as necessary.
4.4 Standardization system
4.4.1 Performance standards
Performance standards contain a series of tests and measurements (which may or may not be
grouped into a specified schedule depending on the requirements of the specific standard) with
clearly defined conditions, severities and pass/fail criteria. The tests are intended to be run on
a "once-off" basis to prove any product's ability to satisfy the "performance standards"
requirement. Each performance standard has a different set of tests, and/or severities (and/or
groupings) which represents the requirements of a market sector, user group or system
location.
A product that has been proved to meet all the requirements of a performance standard can be
declared as complying with a performance standard.
It is possible to define a key feature of the test and measurement standard for their application
(particularly with regard to attenuation and return loss) in conjunction with the interface
standards of inter-product compatibility. Conformance on each individual product to this
standard will be ensured.
4.4.2 Reliability standards
Reliability standards are intended to ensure that a component can meet performance standards
under stated conditions for a stated time period.
For each type of component, the following shall be identified and be stated in the standard:
– failure modes (observable, general mechanical or optical effects of failure);
– failure mechanisms (general causes of failure, common to several components);
– failure effects (detailed causes of failure, specific to the component).
These are all related to environmental and material aspects.
There is an "infant mortality phase" immediately after component manufacture during which
many components may fail when they were deployed in the field. To avoid early field failure, all
components shall be subjected to a screening process in the factory, involving environmental
stresses that may be mechanically, thermally or humidity related. This is to induce known
failure mechanisms, in a controlled environmental situation, to occur earlier than would
normally be seen in the unscreened components. For those components that survive (and are
then sold), there is a reduced failure rate since these mechanisms are already removed.
Screening is an option in the manufacturing process, but not a test method. It will not affect the
"useful life" of a component, defined as the period during which it performs according to
standards. Other failure mechanisms may appear eventually and the failure rate increases

62496-1 © IEC:2008 – 19 –
beyond some defined level. The useful life ends at this point. The "wear-out stage" begins and
the component shall be replaced.
Performance testing on sample components may be made by the supplier at the beginning of
the useful life by the manufacturer or by a third party. This is to ensure that the component
meets performance standards over the intended environments at this initial time. Reliability
testing, on the other hand, is applied to ensure that the component meets performance
standards for at least a specified minimum useful life time or a specified maximum failure rate.
These tests are usually carried out by performance testing, but with increased duration and
severity to accelerate the failure mechanisms.
A reliability theory is useful in analysing the result of a reliability test in relation to component
parameters, and to life time or failure rate under testing. The theory may then be used to obtain
life time or failure rate under less severe service conditions. The reliability standards include
values of the parameters needed to guarantee the specified minimum lifetime or maximum
failure rate in service.
4.4.3 Interlinking
In regard to performance and reliability standards, once both types of standards are in place,
the matrix given in Table 3 demonstrates some of the other options available for product
standardization.
Product A is fully IEC standardized, meeting defined performance standards and reliability
standards.
Product B is a product which complies with an IEC performance standard but does not meet a
reliability standard.
Product C is a product which complies with an IEC reliability standard but does not meet a
performance standard.
Obviously, the matrix is more complex than is shown, since there are a number of performance
and reliability standards which are able to be cross-related.
Table 3 – Standards interlink matrix
Performance standard Reliability standard
Product A Yes Yes
Product B Yes No
Product C No Yes
4.5 Design and construction
4.5.1 Materials
4.5.1.1 Corrosion resistance
All materials used in the construction of optical circuit boards shall be corrosion-resistant or
suitably surface finished, meeting the requirements of the relevant specification.
4.5.1.2 Non-flammable materials
When non-flammable materials are required, the requirement shall be specified in the relevant
specification and reference made to IEC 60695-11-5.

– 20 – 62496-1 © IEC:2008
4.5.2 Workmanship
Components and associated hardware shall be manufactured to a uniform quality and shall be
free of sharp edges, burrs or other mechanical defects that would affect life, service ability or
appearance. Particular attention shall be given to neatness and thoroughness of marking,
plating, soldering, bonding, etc.
4.6 Performance
Optical circuit boards shall meet the performance requirements specified in the relevant
standard.
4.7 Identification and marking
4.7.1 Introductory remark
Components, associated hardware and shipping packages shall be permanently and legibly
identified and marked when required by the detail specification.
4.7.2 Variant identification number
A variant identification number shall be assigned to each variant in a detail specification. The
number shall consist of the number assigned to the component in the relevant detail
specification followed by a four-digit dash number. The first digit of the dashed number shall be
sequentially assigned to each component type covered by the detail specification. The last
three digits shall be sequentially assigned to each variant of the component.
EXAMPLE  US0001 -1 001
Detail specification number
Component type
Variant
4.7.3 Component marking
Component marking, if required, shall be specified in the relevant specification. The preferred
order of marking is as follows:
a) port identification;
b) manufacturer's part number (including serial number, if applicable);
c) manufacturer's identification mark or logo;
d) manufacturing date;
e) variant identification number;
f) any additional marking required by the relevant specification.
If space does not allow for all the required marking on the component, each unit shall be
individually packaged with a data sheet containing all of the required information which is not
marked.
4.7.4 Package marking
Package marking, if required, shall be specified in the relevant specification. The preferred
order of marking is as follows:

62496-1 © IEC:2008 – 21 –
a) manufacturer's identification mark or logo;
b) manufacturer's part numbers;
c) manufacturing date codes (year/week; see ISO 8601);
d) variant identification number(s) (see 4.7.2);
e) type designations (see 4.2.2);
f) style designations (see 4.2.3);
g) any additional marking required by the relevant specification.
When applicable, an individual unit package (within the sealed package) shall be marked with
the reference number of the certified record of the released lots, the manufacturer's factory
identity code and the component identification.
4.8 Packaging
Packages shall include instructions for use when required by the relevant specification.
4.9 Storage conditions
Where short-term degradable materials such as adhesives are supplied with the package, the
manufacturer shall mark them with the expiration date (year and week numbers, see ISO 8601)
together with any requirement or precaution concerning safety hazard or environmental
condition for storage.
4.10 Safety
Optical circuit boards, when used on an optical fibre transmission system and/or equipment,
may emit potentially hazardous radiation from an uncapped or unterminated output port or
fibre/waveguide termination.
Manufacturers of optical circuit boards shall make available sufficient information to alert
system designers and users about the potential hazard and shall indicate the required
precautions and working practices.
Each detail specification shall include the following in addition to the above mentioned
information:
WARNING
Care should be taken when handling small diameter fibre to prevent puncturing the skin,
especially in the eye area. Direct viewing of the end of an optical fibre, when it is propagating
energy, is not recommended unless prior assurance has been obtained as to the safety energy
output level.
Optical safety requirements shall conform to IEC 60825-1 and IEC 60825-2.

– 22 – 62496-1 © IEC:2008
Bibliography
IEC 60068 (all parts), Environmental testing
IEC 60410, Sampling plans and procedures for inspection by attributes
IEC 60793-1-1: 2002, Optical fibres – Part 1-1: Measurement methods and test procedures –
General and guidance
IEC 60869-1, Fibre optic attenuators – Part 1: Generic specification
IEC 60874 (all parts), Connectors for optical fibres and cables
IEC 61073-1, Mechanical splices and fusion splice protectors for optical fibres and cables –
Part 1: Generic specification
IEC 61753 (all parts), Fibre optic interconnecting devices and passive components
performance standard
IEC 61754-2:1996, Fibre optic connector interfaces – Part 2: Type BFOC/2,5 connector family
IEC 61754-4:1997, Fibre optic connector interfaces – Part 4: Type SC connector family
IEC 61754-13:1999, Fibre optic connector interfaces – Part 13: Type FC-PC connector
IEC 62005 (all parts), Reliability of fibre optic interconnecting devices and passive components

___________
– 24 – 62496-1 © CEI:2008
SOMMAIRE
AVANT-PROPOS .26
1 Domaine d’application.28
2 Références normatives .28
3 Termes et définitions .29
4 Exigences.31
4.1 Générali
...