IEC 61340-5-3:2010

Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices

IEC 61340-5-3:2010 defines the ESD protective packaging properties needed to protect electrostatic discharge sensitive devices (ESDS) through all phases of production, transport and storage. Test methods are referenced to evaluate packaging and packaging materials for these product and material properties. Performance limits are provided. This standard does not address protection from electromagnetic interference (EMI), radio frequency interference (RFI), electromagnetic pulsing (EMP) nor protection of volatile materials.

Electrostatique - Partie 5-3: Protection des dispositifs électroniques contre les phénomènes électrostatiques - Classification des propriétés et des exigences relatives à l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques

La CEI 61340-5-3:2010 définit les propriétés des emballages de protection contre les ESD nécessaires pour protéger les dispositifs sensibles aux décharges électrostatiques (ESDS) pendant toutes les phases de production, de transport et de stockage. Les méthodes d'essai sont référencées pour évaluer les emballages et les matériaux d'emballages concernant les propriétés de ces produits et matériaux. Des limites de performance sont données. La présente norme ne traite pas de la protection contre les interférence électromagnétiques (EMI), les interférence radioélectriques (RFI), les impulsions électromagnétiques (EMP) ou la protection des matériaux volatiles.

General Information

• Status: Published
• Publication Date: 15-Mar-2010
• ICS: 17.220.99 - Other standards related to electricity and magnetism
• ICS: 29.020 - Electrical engineering in general
• Technical Committee: TC 101 - Electrostatics
• Drafting Committee: MT 11 - TC 101/MT 11
• Current Stage: DELPUB - Deleted Publication
• Start Date: 16-Jul-2015
• Completion Date: 26-Oct-2025

Relations

• Revised: IEC 61340-5-3:2015 - Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
• Effective Date: 05-Sep-2023

IEC 61340-5-3:2010 Overview

IEC 61340-5-3:2010 is an international standard published by the International Electrotechnical Commission (IEC) that specifies the properties and classification requirements for packaging materials designed to protect electrostatic discharge sensitive (ESDS) devices. It addresses the risks associated with electrostatic discharge (ESD) during all stages of production, transportation, and storage of sensitive electronic components.

This standard highlights essential test methods and performance limits necessary to evaluate packaging materials, ensuring reliable protection of ESDS products. Note that it does not cover electromagnetic interference (EMI), radio frequency interference (RFI), electromagnetic pulsing (EMP), or protection requirements for volatile substances.

---

Key Topics Covered

• ESD Protective Packaging Properties
  Defines the physical and electrical characteristics (such as surface and volume resistance) required to mitigate electrostatic damage to sensitive devices.

• Classification of Packaging Materials
  Categorizes packaging into different types based on material resistance and shielding capabilities, including:

  • Conductive materials
  • Dissipative materials
  • Electrostatic field shielding materials
  • Insulative materials

• Packaging Application Requirements
  Distinguishes packaging needs inside and outside ESD Protected Areas (EPA), emphasizing:

  • Inside EPA: Use of dissipative or conductive materials for intimate contact packaging.
  • Outside EPA: Packaging must combine dissipative or conductive materials with shielding capabilities to protect devices fully.

• Standardized Test Methods and Performance Limits
  References test procedures such as IEC 61340-2-3 and ANSI/ESD STM 11.13 to measure resistance properties and shield effectiveness.

• Packaging Marking and Traceability
  Specifies requirements for labeling ESD protective packaging with classification symbols to ensure easy identification and quality control.

• Tailoring for Specific Applications
  Allows customization of the standard’s requirements based on actual operational needs through documented tailoring processes.

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Practical Applications

This IEC standard is critical for industries and sectors involving the handling of sensitive electronic components that can be prone to damage by ESD events. Typical applications include:

• Electronics Manufacturing: Protecting integrated circuits, semiconductors, and assembled electronic devices during manufacturing and internal transportation.

• Supply Chain and Logistics: Ensuring safe shipment of ESDS components through appropriate packaging design compliant with IEC 61340-5-3.

• Storage Facilities: Providing suitable packaging that guards against ESD risks during long-term storage in warehouses or distribution centers.

• Quality Assurance Programs: Establishing standardized testing and labeling protocols to verify and document packaging effectiveness in ESD control programs.

By complying with IEC 61340-5-3, organizations reduce the risk of device failure due to electrostatic phenomena, improving product reliability and customer satisfaction.

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Related Standards

• IEC 61340 Series - Comprehensive guidance on electrostatics, covering methods for ESD control and handling sensitive devices.
• IEC 61340-2-3 - Specifies methods for testing resistance and resistivity of solid planar materials to prevent electrostatic accumulation.
• IEC 61340-4-8 - Standard test methods for discharge shielding bags.
• ANSI/ESD STM 11.13 - A two-point resistance measurement test relevant for ESD protective materials.
• IEC/TR 61340-5-2 - Technical report providing additional context for packaging and handling ESDS devices.
• ANSI/ESD S541-2003 - U.S. based ESD packaging standard, serving as a foundational reference for IEC 61340-5-3.

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Summary

IEC 61340-5-3:2010 offers a vital framework for protecting electrostatic discharge sensitive devices throughout their lifecycle by defining clear requirements for ESD protective packaging. Its practical value lies in standardizing packaging properties, test methodologies, and classification systems essential for minimizing ESD risks during manufacturing, transport, and storage. Organizations working with sensitive electronic components benefit from adhering to this standard to safeguard device integrity and ensure operational excellence.

Standards Content (Sample)

IEC 61340-5-3 ®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electrostatics –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices

Electrostatique –
Partie 5-3: Protection des dispositifs électroniques contre les phénomènes
électrostatiques – Classification des propriétés et des exigences relatives à
l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques

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IEC 61340-5-3 ®
Edition 1.0 2010-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Electrostatics –
Part 5-3: Protection of electronic devices from electrostatic phenomena –
Properties and requirements classification for packaging intended for
electrostatic discharge sensitive devices

Electrostatique –
Partie 5-3: Protection des dispositifs électroniques contre les phénomènes
électrostatiques – Classification des propriétés et des exigences relatives à
l'emballage destiné aux dispositifs sensibles aux décharges électrostatiques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
R
CODE PRIX
ICS 17.220.99; 29.020 ISBN 978-2-88910-507-6
– 2 – 61340-5-3 © IEC:2010
CONTENTS
FOREWORD.3

INTRODUCTION.5

1 Scope.6

2 Normative references .6

3 Terms and definitions .6

4 Tailoring .7

5 Packaging application requirement .7

5.1 General .7
5.2 Inside an EPA .7
5.3 Outside an EPA.8
6 Classification of ESD packaging material properties .8
6.1 General .8
6.2 Material resistance properties .8
6.2.1 Resistance of conductive materials.8
6.2.2 Resistance of electrostatic field shielding materials .8
6.2.3 Resistance of dissipative materials.9
6.2.4 Resistance of insulative materials.9
6.3 Material electrostatic shielding properties.9
6.3.1 Electrostatic discharge shielding .9
6.3.2 Electrostatic field shielding .9
7 Technical requirements for ESD protective packaging .9
7.1 Packaging and material properties .9
7.2 Packaging marking .9
7.2.1 Classification symbol .9
7.2.2 Packaging classification .9
7.2.3 Traceability.9
Annex A (informative) ESD packaging material guidance .13
Annex B (informative) Device damage .17
Bibliography.18

Figure 1 – Example of packaging label.10

Figure 2 – Examples of EPA configurations .12
Figure A.1 – Application of ESD protective packaging.15

Table 1 – Test methods for electrostatic protective packaging .10
Table 2 – Test methods and requirements for electrostatic discharge shielding
packaging .11
Table A.1 – Packaging characteristics for environmental consideration.13
Table A.2 – Examples for qualification and verification of packaging.16

61340-5-3 © IEC:2010 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
ELECTROSTATICS –
Part 5-3: Protection of electronic devices from electrostatic phenomena –

Properties and requirements classification for packaging intended for

electrostatic discharge sensitive devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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agreement between the two organizations.
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61340-5-3 has been prepared by IEC technical committee 101:
Electrostatics.
The text of this standard is based on the following documents:
FDIS Report on voting
101/295/FDIS 101/302/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 61340-5-3 © IEC:2010
This standard was written based on the ESD Association Standard ANSI/ESD S541-2003 [1]

with some modification in relation to IEC 61340-5-1:2007 [2] and IEC/TR 61340-5-2:2007 [3].

A list of all parts in the IEC 61340 series, under the general title Electrostatics, can be found

on the IEC website
The committee has decided that the contents of this amendment and the base publication will

remain unchanged until the stability date indicated on the IEC web site under

"http://webstore.iec.ch" in the data related to the specific publication. At this date, the

publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
—————————
References in square brackets refer to the bibliography.

61340-5-3 © IEC:2010 – 5 –
INTRODUCTION
Packaging is necessary to protect electrostatic discharge sensitive devices (ESDS) from

physical and environmental damage during manufacture, transportation and storage.

Additionally, packaging for ESDS should also prevent damage from static electricity.

– 6 – 61340-5-3 © IEC:2010
ELECTROSTATICS –
Part 5-3: Protection of electronic devices from electrostatic phenomena –

Properties and requirements classification for packaging intended for

electrostatic discharge sensitive devices

1 Scope
This part of IEC 61340 defines the ESD protective packaging properties needed to protect
electrostatic discharge sensitive devices (ESDS) through all phases of production, transport
and storage. Test methods are referenced to evaluate packaging and packaging materials for
these product and material properties. Performance limits are provided.
This standard does not address protection from electromagnetic interference (EMI), radio
frequency interference (RFI), electromagnetic pulsing (EMP) nor protection of volatile
materials.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61340-2-3, Electrostatics – Part 2-3: Methods of test for determining the resistance and
resistivity of solid planar materials used to avoid electrostatic charge accumulation
IEC 61340-4-8, Electrostatics – Part 4-8: Standard test methods for specific applications –
Discharge shielding - Bags
ANSI/ESD STM 11.13, Two-point resistance measurement
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

3.1
electrostatic discharge
ESD
transfer of charge between bodies at different electrostatic potentials
3.2
electrostatic discharge sensitive device
ESDS
sensitive devices, integrated circuit or assembly that may be damaged by electrostatic fields
or electrostatic discharge
3.3
ESD protected area
EPA
area in which an ESDS can be handled with accepted risk of damage as a result of
electrostatic discharge or fields

61340-5-3 © IEC:2010 – 7 –
3.4
unprotected area
UPA
areas outside an EPA as shown in Figure 2

3.5
intimate packaging
material which makes contact with ESDS

3.6
proximity packaging
material not making contact with ESDS which is used to enclose one or more devices
3.7
secondary packaging
material used primarily to give additional physical protection to the outside of a proximity
package
3.8
volume resistance
Ω
ratio of a d.c. voltage (V) applied between two electrodes placed on two (opposite) surfaces of
a specimen and the current (A) between the electrodes
3.9
surface resistance
Ω
ratio of a d.c. voltage (V) applied between two electrodes on a surface of a specimen and the
current (A) between the electrodes
4 Tailoring
This standard, or portions thereof, may not apply to all applications. Tailoring is accomplished
by evaluating the applicability of each requirement for the specific application. Upon
completion of the evaluation, requirements may be added, modified or deleted.
Tailoring decisions, including rationale, shall be documented.
5 Packaging application requirement

5.1 General
Transportation of ESDS requires packaging that provides protection from electrostatic
hazards. Within an EPA in which all ESD risks are well controlled, ESD protective packaging
may not be necessary.
5.2 Inside an EPA
Packaging used within an EPA shall consist of dissipative or conductive materials for intimate
contact.
Items sensitive to <100 V human body model (HBM) may need additional protection
depending on application and program plan requirements.
NOTE Dissipative materials are preferred for intimate packaging in situations where charged device model (CDM)
damage is a concern.
– 8 – 61340-5-3 © IEC:2010
5.3 Outside an EPA
Transportation of sensitive products outside of an EPA shall require packaging that provides

both:
a) dissipative or conductive materials for intimate contact;

b) a structure that provides electrostatic discharge shielding.

NOTE 1 If electrostatic field shielding materials are used to provide discharge shielding, a material that provides

a barrier to current flow should be used in combination with the electrostatic field shielding material.

NOTE 2 Dissipative materials are preferred for intimate packaging in situations where charged device model
(CDM) damage is a concern.
6 Classification of ESD packaging material properties
6.1 General
Materials and packages that are useful in preventing damage to sensitive electronic devices
exhibit certain properties. These properties include:
a) resistance properties:
– conductive;
– dissipative;
b) Shielding properties:
– electrostatic discharge;
– electrostatic field.
6.2 Material resistance properties
Most standard packaging materials are electrically insulative and insulative materials retain
charge. Making the package less insulative provides a path for the charge to dissipate from
the package to a material at a lower potential.
Specific ranges of resistance are useful for different purposes. Packaging can be classified by
these resistance ranges of its construction.
6.2.1 Resistance of conductive materials
Conductive materials may be surface conductive, volume conductive or both. A surface
conductive material shall have a surface resistance of <1 × 10 Ω.
Volume conductive materials shall have a volume resistance <1 × 10 Ω.
6.2.2 Resistance of electrostatic field shielding materials
Within the conductive materials classification, electrostatic field shielding materials shall have
a homogeneous layer with a surface resistance of <1 × 10 Ω or a volume resistance of
<1 × 10 Ω.
Other methods may also define the electrostatic field shielding classification.
NOTE These resistance values do not necessarily imply RFI/EMI/EMP shielding.

61340-5-3 © IEC:2010 – 9 –
6.2.3 Resistance of dissipative materials

4 11
A static dissipative material shall have a surface resistance ≥1 × 10 Ω and <1 × 10 Ω, or a

4 11
volume resistance ≥1 × 10 Ω and <1 × 10 Ω.

6.2.4 Resistance of insulative materials

Electrostatic insulative materials have a surface resistance ≥1 × 10 Ω, or a volume
resistance ≥ 1 × 10 Ω.
6.3 Material electrostatic shielding properties

NOTE Electrostatic shielding materials protect packaged sensitive electronic items from the effects of
electrostatic discharges and fields that are external to the package.
6.3.1 Electrostatic discharge shielding
Electrostatic discharge shielding packaging is capable of attenuating an electrostatic
discharge. The calculated energy allowed inside a static discharge shielding bag shall be less
than 50 nJ when tested according to IEC 61340-4-8 or equivalent test method modified to
accommodate the product.
6.3.2 Electrostatic field shielding
Electrostatic field shielding packaging is capable of attenuating an electrostatic field.
NOTE Classified field-shielding materials may allow current flow through their volume.
7 Technical requirements for ESD protective packaging
7.1 Packaging and material properties
Table 1 and 2 provide test methods for determining material classifications for finished
packages and materials. When possible, testing should be performed on the finished
package.
7.2 Packaging marking
7.2.1 Classification symbol
ESD protective packaging shall be marked with the ESD classification symbol as shown in
Figure 1 or in accordance with customer contracts, purchase orders, drawings or other
documentation.
7.2.2 Packaging classification
The primary function code shall be marked below the ESD classification symbol as shown in
Figure 1:
S electrostatic discharge shielding;
F electrostatic field shielding;
C electrostatic conductive;
D electrostatic dissipative.
7.2.3 Traceability
Packaging should be marked with information that allows traceability to the packaging
manufacturer and to the manufacturer’s date/lot code information.

– 10 – 61340-5-3 © IEC:2010
The date/lot code should allow traceability to quality control information pertaining to the

manufacture of the specific lot of packaging.

IEC  455/10
* Primary function codes:
S electrostatic discharge shielding
F electrostatic field shielding
C electrostatic conductive
D electrostatic dissipative
Figure 1 – Example of packaging label
Table 1 – Test methods for electrostatic protective packaging
Material
c)
Test method Method description Limits
classification
Conductive
IEC 61340-2-3 R Surface resistance
S
a)
ANSI/ESD STM11.13 R Volume resistance <1 × 10 Ω
V
R Point-to-point resistance
p-p
Electrostatic
R Surface resistance
S
b)
field shielding
IEC 61340-2-3
R Volume resistance < 1 × 10 Ω
V
Dissipative
R Surface resistance
S
IEC 61340-2-3
4 11
R Volume resistance ≥1 × 10 to <1 × 10 Ω
V
a)
ANSI/ESD STM11.13
R Point-to-point resistance
p-p
Insulative
R Surface resistance
S
IEC 61340-2-3
R Volume resistance
≥1 × 10 Ω
V
a)
ANSI/ESD STM11.13
R Point-to-point resistance
p-p
a)
ANSI/ESD STM 11.13 describes the R point-to-point resistance measurement with a two point probe.
p-p
IEC 61340-2-3 describes all three test methods R , R and R .
S V p-p
b)
IEC 61340-2-3 describes test methods for the determination of the electrical resistance and resistivity of solid

4 12
materials in the range from 10 Ω to 10 Ω. When using the concentric ring probe according to IEC 61340-2-3 for
surface and volume resistance, the probe shall be able to measure values lower than 10 Ω. The test voltage
may also need to be lowered in this case.
c)
For product qualification of packaging materials, the environmental conditions for preconditioning and testing
shall be 23 °C ± 2 °C and 12 % ± 3 % relative humidity. The preconditioning before the measurement shall be
≥48 h.
61340-5-3 © IEC:2010 – 11 –
Table 2 – Test methods and requirements for electrostatic discharge
shielding packaging
Packaging system
Shielding bags Other ESD shielding packaging
design
Test method IEC 61340-4-8 User defined

Requirement Energy < 50 nJ – intimate packaging shall be
dissipative or conductive
– a barrier layer or a defined air
gap attenuating ESD energy
a)
shall be included
a)
No component of the packaging system shall cause ESD risk when taken within EPA.

– 12 – 61340-5-3 © IEC:2010
ESD protected area
Workstation Room Building
Print Pick and Place Reflow Packing
EPA
Storage
Storage
Manual assembly
IEC  456/10
Figure 2 – Examples of EPA configurations

61340-5-3 © IEC:2010 – 13 –
Annex A
(informative)
ESD packaging material guidance

A.1 Environment and device sensitivity

A.1.1 General
Environment and device sensitivity are two primary considerations for selecting ESD
packaging materials.
A.1.2 Environment
Since the threat to a sensitive item is usually undetermined when the item is outside an ESD
protected area (EPA), electrostatic sensitive devices (ESDS) should be placed in ESD
protective packaging whenever the item is in an unprotected area (UPA) – see Table A.1.
Table A.1 – Packaging characteristics for environmental consideration
EPA UPA
Item to be
packed
Intimate Proximity Intimate Proximity
Electrostatic Electrostatic As for inside EPA and Electrostatic discharge
conductive conductive or electrostatic shielding
ESDS
or dissipative dissipative discharge shielding
(see NOTE 1) (see NOTE 2)
NOTE 1 For battery operated ESDS, the selection of the material or the design of the packaging should ensure
that the battery does not become discharged.
NOTE 2 Electrostatic discharge shielding property is only needed when proximity packaging is not electrostatic
discharge shielding.
A.1.3 Device sensitivity
If the sensitivity of the ESDS is unknown and the device is being shipped outside of the EPA,
it should be packaged using an electrostatic discharge shielding structure that also provides
protection against electrostatic fields.
However, if the sensitivity of the ESDS is known and the ESD threat environment is well

understood, the protection level of the packaging may be reduced.
A.2 Equipotential bonding
While not always recognized as being a packaging consideration, equipotential bonding, or
the shunting of leads, can be an effective method to mitigate damage. By placing a
conductive shunt across device leads or card connectors, the various parts of the item share
the same electrical potential. While not necessarily at ground potential, the fact that parts of
the item share the same potential means that damaging current will not flow between them.
Shunting has limitations. Energy from direct discharge and electric fields may impact the item
in a manner that does not allow the energy to equalize through the shunt, but instead through
the device. ESD protective packaging that offers other protective properties is usually used in
conjunction with shunting devices.

– 14 – 61340-5-3 © IEC:2010
A.3 Dissipative material for intimate contact

To avoid rapid discharge of ESDS due to contact with conductive surfaces, dissipative

materials are preferred.
A.4 Packaging from incoming material to the point of use

Figure A.1 shows a simplified layout of a generic electronic packaging application. Each area

has the recommended ESD packaging material properties noted. As discussed in A.1.3, if the

item sensitivity and threats are documented, the level of protective packaging can be reduced

after confirming packaging functionality.
NOTE This layout shows an “islands of protection” approach to ESD safeguards. Many manufacturing processes
employ a “total factory” approach, where the entire factory is a safeguarded area – see Figure 2.

61340-5-3 © IEC:2010 – 15 –
Storage/kitting
Print /pick and place/
reflow/packing
Assembly
Quality control
testing
Rework/assembly
Point of use
IEC  457/10
Figure A.1 – Application of ESD protective packaging
A.5 Periodic verification
The static control properties of some packaging materials can deteriorate with time and use.
Periodic verification of static control properties should be considered.

– 16 – 61340-5-3 © IEC:2010
A.6 Examples of measurement procedures for qualification and verification of

packaging
Table A.2 – Examples for qualification and verification of packaging

Product qualification
Packaging item Test method Compliance verification

(see NOTE 1)
Bags IEC 61340-2-3 R
R
S S
Inside and outside layers Inside and outside layers

R
V
Inside layers to metal
plate
Energy bag test
IEC 61340-4-8
(see NOTE 2)
Tote boxes IEC 61340-2-3 R R
S p-p
Inside and outside Inside and outside surfaces
surfaces
R
V
Inside surface to metal
plate
Foams IEC 61340-2-3 R R
S p-p
Top and bottom surface Top and bottom surfaces
R
V
Top surface to metal
plate
Carrier tapes ANSI/ESD STM11.13 R R

p-p p-p
Inside cavities Inside cavities
Cavity to cavity
R
V
Cavity to metal plate
Thermoformed and ANSI/ESD STM11.13 R R

p-p p-p
injection molded trays
Inside cavities Inside cavities
Cavity to cavity
R
V
Cavity to metal plate
Corrugated cardboard IEC 61340-2-3 R R
S S
Inside and outside layers Inside and outside layers
R
V
Inside layers to metal
plate
NOTE 1 For product qualification, the environmental conditions for testing should be 23 °C ± 2 °C and
12 % ± 3 % relative humidity.
NOTE 2 Only relevant if an ESD discharge shielding bag needs to be qualified.

The compliance verification plan according to IEC 61340-5-1 [2] should document the method
used to verify the limits according to the material classification in Table 1.

61340-5-3 © IEC:2010 – 17 –
Annex B
(informative)
Device damage
B.1 Damage from ESD
Damage to devices usually occurs in one of two situations:

 electrostatic discharge to a device;
 electrostatic discharge from a charged device.
This distinction is important for packaging considerations because different properties are
required to manage each situation. Consider the source of the static electricity and then the
path of charge travels to damage the device.
B.2 Discharge to a device
B.2.1 Human body (HBM) and machine model (MM)
Common items that discharge to packaged devices include the human body and conductive
objects used to handle packages like conveyors, carts and vehicles. Triboelectrification is
usually the charge source.
Since the discharge passes through the package to reach the device, the package can be
used to protect the device from an ESD event external to the package.
B.2.2 Retained charge
The package can gain charge from ESD or triboelectrification. Where the package exterior is
isolated from the package interior and therefore the device, it is possible for charge on the
package to discharge to the device as it is removed from the package
B.3 Discharge from a device
B.3.1 Charged device model (CDM)
If a device is momentarily grounded in the presence of an electric field emanating from an

electrostatically charged item, a discharge occurs and the device retains a charge of opposite
polarity. When the device contacts an object with a different potential, like a grounded hand
removing the device from a package, an electrostatic discharge occurs. Since the electric field
passes through the package, the package can be used to protect the device from a field that
is external to the package. The package may also isolate the device from ground.
B.3.2 Tribo-electrification
As a device and package move in relation to each other, charge can accumulate on the
package and on the device. When the charged device contacts an object with a different
potential, an electrostatic discharge occurs.

– 18 – 61340-5-3 © IEC:2010
Bibliography
[1] ANSI/ESD S541:2003, Packaging materials for ESD sensitive items

[2] IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from
electrostatic phenomena – General requirements

[3] IEC/TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from

electrostatic phenomena – User guide

[4] IEC 61340-3-1, Electrostatics – Part 3-1: Methods for simulation of electrostatic effects
– Human body model (HBM) electrostatic discharge test waveforms
[5] IEC 61340-3-2, Electrostatics – Part 3-2: Methods for simulation of electrostatic effects
– Machine model (MM) electrostatic discharge test waveforms

___________
– 20 – 61340-5-3 © CEI:2010
SOMMAIRE
AVANT-PROPOS.21

INTRODUCTION.23

1 Domaine d'application .24

2 Références normatives.24

3 Termes et définitions .24

4 Personnalisation.25

5 Exigence d’application de l’emballage .25

5.1 Généralités.25
5.2 A l’intérieur d’une EPA .26
5.3 A l’extérieur d’une EPA .26
6 Classification des propriétés des matériaux d’emballage contre les ESD .26
6.1 Généralités.26
6.2 Propriétés des matériaux liées à la résistance.26
6.2.1 Résistance des matériaux conducteurs.26
6.2.2 Résistance des matériaux de blindage contre le champ
électrostatique.27
6.2.3 Résistance des matériaux dissipatifs .27
6.2.4 Résistance des matériaux isolants.27
6.3 Propriété du blindage électrostatique .27
6.3.1 Blindage contre les décharges électrostatiques .27
6.3.2 Blindage contre le champ électrostatique .27
7 Exigences techniques pour l’emballage de protection contre les ESD.27
7.1 Propriétés de l’emballage et des matériaux .27
7.2 Marquage de l’emballage .27
7.2.1 Symbole de classification .27
7.2.2 Classification d’emballage .28
7.2.3 Traçabilité .28
Annexe A (informative) Lignes directrices relatives aux matériaux d’emballage contre
les ESD .31
Annexe B (informative) Dommages subis par les dispositifs.35
Bibliographie.37

Figure 1 – Exemple d’étiquette d’emballage.28
Figure 2 – Exemples de configurations d’EPA.30
Figure A.1 – Application des emballages de protection contre les ESD .33

Tableau 1 – Méthodes d’essai pour l’emballage de protection électrostatique.29
Tableau 2 – Méthodes et exigences d’essai relatives à l’emballage pour le blindage
contre les décharges électrostatiques .29
Tableau A.1 – Caractéristiques d’emballage pour les considérations liées à

l’environnement .31
Tableau A.2 – Exemples pour la qualification et la vérification des emballages.34

61340-5-3 © CEI:2010 – 21 –
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE

____________
ELECTROSTATIQUE –
Partie 5-3: Protection des dispositifs électroniques

contre les phénomènes électrostatiques –

Classification des propriétés et des exigences relatives à l'emballage

destiné aux dispositifs sensibles aux décharges électrostatiques

AVANT-PROPOS
1) La Commission Electrotechnique Internationale (CEI) est une organisation mondiale de normalisation
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pour objet de favoriser la coopération internationale pour toutes les questions de normalisation dans les
domaines de l'électricité et de l'électronique. A cet effet, la CEI – entre autres activités – publie des Normes
internationales, des Spécifications techniques, des Rapports techniques, des Spécifications accessibles au
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également aux travaux. La CEI collabore étroitement avec l'Organisation Internationale de Normalisation (ISO),
selon des conditions fixées par accord entre les deux organisations.
2) Les décisions ou accords officiels de la CEI concernant les questions techniques représentent, dans la mesure
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5) La CEI elle-même ne fournit aucune attestation de conformité. Des organismes de certification indépendants
fournissent des services d'évaluation de conformité et, dans certains secteurs, accèdent aux marques de
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toute autre Publication de la CEI, ou au crédit qui lui est accordé.

8) L'attention est attirée sur les références normatives citées dans cette publication. L'utilisation de publications
référencées est obligatoire pour une application correcte de la présente publication.
9) L’attention est attirée sur le fait que certains des éléments de la présente Publication de la CEI peuvent faire
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responsable de ne pas avoir identifié de tels droits de propriété et de ne pas avoir signalé leur existence.
La Norme internationale CEI 61340-5-3 a été établie par le comité d'études 101 de la CEI:
Electrostatique.
Le texte de cette norme est issu des documents suivants:
FDIS Rapport de vote
101/295/FDIS 101/302/RVD
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cette norme.

– 22 – 61340-5-3 © CEI:2010
Cette publication a été rédigée selon les Directives ISO/CEI, Partie 2.

La présente norme est fondée sur la norme de l’Association ESD ANSI/ESD S541-2003 [1]

avec quelques modifications liées à la CEI 61340-5-1:2007 [2] et à la CEI/TR 61340-5-2:2007

[3].
Une l
...