IEC 60679-1:2017

Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification

IEC 60679-1:2017 specifies general requirements for piezoelectric, dielectric and electrostatic oscillators, including Dielectric Resonator Oscillators (DRO) and oscillators using FBAR (hereinafter referred to as "Oscillator"), of assessed quality using either capability approval or qualification approval procedures.
NOTE Dielectric Resonator Oscillators (DRO) and oscillators using FBAR are under consideration.
This edition includes the following significant technical changes with respect to the previous edition:
a) the title has been changed;
b) additional matters related to oscillator using SAW or MEMS resonator in "Terms, definitions and general information" have been included;
c) measurement methods of IEC 60679-1:2007 have been removed (they will be moved to IEC 62884 series);
d) the content of Annex A has been extended;
e) a new term and definition DIXO (Digital interfaced Crystal Oscillator) has been added;
f) a new term and definition SSXO (Spread Spectrum Crystal Oscillator) has been added;
g) Annex D has been added.

Oscillateurs piézoélectriques, diélectriques et électrostatiques sous assurance de la qualité - Partie 1: Spécification générique

L’IEC 60679-1:2017 spécifie les exigences générales relatives aux oscillateurs piézoélectriques, diélectriques et électrostatiques, y compris les oscillateurs à résonateur diélectrique (DRO - Dielectric Resonator Oscillators) et les oscillateurs à résonateurs à ondes acoustiques de volume à couches (FBAR) (ci-après dénommés "Oscillateur"), sous assurance qualité par les procédures d’agrément de savoir-faire ou les procédures d’homologation.
NOTE Les oscillateurs DRO et FBAR sont à l’étude.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) le titre a été modifié;
b) des éléments supplémentaires relatifs aux oscillateurs utilisant un résonateur OAS ou MEMS ont été ajoutés dans "Termes, définitions et informations générales";
c) les méthodes de mesure de l’IEC 60679-1:2007 ont été supprimées (elles seront intégrées à la série IEC 62884);
d) le contenu de l’Annexe A a été enrichi;
e) un nouveau terme et sa définition, “DIXO” (digital interfaced crystal oscillator - oscillateur à quartz à interface numérique), ont été ajoutés;
f) un nouveau terme et sa définition, “SSXO” (spread spectrum crystal oscillator - oscillateur à quartz à spectre étalé), ont été ajoutés;
g) l’Annexe D a été ajoutée.

General Information

• Status: Published
• Publication Date: 25-Jul-2017
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: TC 49 - Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
• Drafting Committee: WG 7 - TC 49/WG 7
• Current Stage: PPUB - Publication issued
• Start Date: 18-Aug-2017
• Completion Date: 26-Jul-2017

Relations

• Revises: IEC 60679-1:2007 - Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification
• Effective Date: 05-Sep-2023

Overview

IEC 60679-1:2017 - "Piezoelectric, dielectric and electrostatic oscillators of assessed quality - Part 1: Generic specification" defines general requirements and quality‑assessment procedures for oscillators of assessed quality. It covers piezoelectric, dielectric and electrostatic oscillators (including Dielectric Resonator Oscillators (DRO) and FBAR-based oscillators under consideration) and applies to devices assessed using either capability approval or qualification approval routes.

This 2017 edition updates terminology (adds DIXO and SSXO), extends Annex A, adds Annex D (digital interface functions), includes SAW and MEMS resonator material in terms/definitions, and moves measurement methods into the IEC 62884 series.

Key topics and technical requirements

• Scope and definitions: expanded coverage for SAW, MEMS, DIXO (Digital Interfaced Crystal Oscillator) and SSXO (Spread Spectrum Crystal Oscillator).
• Quality‑assessment procedures: clear paths for capability approval and qualification approval, including eligibility, applications, granting, and validity of release.
• Manufacturing and supply control: requirements for primary manufacture, subcontracting, incorporated components, manufacturer approval and certified test records.
• Testing & screening: provisions for screening, test procedures, rework/repair rules, and quality conformance inspection.
• Electrical and performance characteristics: definitions and requirements for start‑up time, output waveform characteristics, clock period/phase/jitter metrics and frequency offset handling (figures and definitions included).
• Environmental and mechanical ratings: preferred values for climatic category, vibration, shock, bump severity and leak rates.
• Annexes (normative):
  • Annex A - Load circuits for logic drive (extended) covering TTL, CMOS, ECL, LVDS.
  • Annex B - Latch‑up test definitions and methods.
  • Annex C - Electrostatic discharge (ESD) sensitivity classification and test guidance.
  • Annex D - Functions of digital‑interfaced crystal oscillators (new).

Applications and practical value

IEC 60679-1 is essential where oscillator reliability and traceable quality assessment are required:

• Selection and procurement of oscillators for aerospace, defence, telecommunications, medical devices, and industrial timing systems.
• Supplier qualification and supplier audits for manufacturers and contract manufacturers.
• Design teams specifying oscillator performance (start‑up time, jitter, output drive, environmental ratings).
• Test laboratories and quality assurance teams implementing screening, ESD and latch‑up tests and maintaining certified test records.

Who should use this standard

• Oscillator and timing component manufacturers
• Electronic component quality and reliability engineers
• Procurement/specification engineers in regulated industries
• Test labs and certification bodies
• System integrators requiring assessed‑quality timing sources

Related standards

• IEC 62884 series - measurement methods (previously in IEC 60679-1)
• Other parts of the IEC 60679 series for component‑specific requirements

Keywords: IEC 60679-1, oscillator standard, piezoelectric oscillator, dielectric resonator oscillator, FBAR, SAW, MEMS, DIXO, SSXO, capability approval, qualification approval, oscillator testing, ESD, latch‑up, jitter.

Standards Content (Sample)

IEC 60679-1 ®
Edition 4.0 2017-07
INTERNATIONAL
STANDARD
Piezoelectric, dielectric and electrostatic oscillators of assessed quality –
Part 1: Generic specification
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IEC 60679-1 ®
Edition 4.0 2017-07
INTERNATIONAL
STANDARD
Piezoelectric, dielectric and electrostatic oscillators of assessed quality –

Part 1: Generic specification
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.140 ISBN 978-2-8322-4608-5

– 2 – IEC 60679-1:2017 © IEC 2017
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and general information . 7
3.1 General . 7
3.2 Terms and definitions . 7
3.3 Preferred values for ratings and characteristics . 21
3.3.1 General . 21
3.3.2 Climatic category (40/85/56) . 22
3.3.3 Bump severity . 22
3.3.4 Vibration severity . 22
3.3.5 Shock severity . 22
3.3.6 Leak rate . 22
3.4 Marking . 23
3.4.1 General . 23
3.4.2 Packaging. 23
4 Quality assessment procedures . 23
4.1 General . 23
4.2 Primary stage of manufacture . 23
4.3 Structurally similar components . 23
4.4 Subcontracting . 23
4.5 Incorporated components . 24
4.6 Manufacturer’s approval . 24
4.7 Approval procedures . 24
4.7.1 General . 24
4.7.2 Capability approval . 24
4.7.3 Qualification approval . 24
4.8 Procedures for capability approval . 25
4.8.1 General . 25
4.8.2 Eligibility for capability approval . 25
4.8.3 Application for capability approval . 25
4.8.4 Granting of capability approval . 25
4.8.5 Capability manual . 25
4.9 Procedures for qualification approval . 25
4.9.1 General . 25
4.9.2 Eligibility for qualification approval . 25
4.9.3 Application for qualification approval . 25
4.9.4 Granting of qualification approval . 25
4.9.5 Quality conformance inspection . 26
4.10 Test procedures . 26
4.11 Screening requirements . 26
4.12 Rework and repair work . 26
4.12.1 Rework . 26
4.12.2 Repair work . 26
4.13 Certified test records. 26
4.14 Validity of release . 26
4.15 Release for delivery . 26

4.16 Unchecked parameters . 27
Annex A (normative) Load circuit for logic drive . 28
A.1 TTL and Schottky . 28
A.2 CMOS . 30
A.3 ECL . 30
A.4 LVDS . 31
Annex B (normative) Latch-up test . 32
B.1 Definition . 32
B.1.1 Latch-up . 32
B.1.2 Test procedure . 32
B.2 Test method . 32
Annex C (normative) Electrostatic discharge sensitivity classification . 33
C.1 Definition . 33
C.1.1 Electrostatic discharge (ESD) . 33
C.1.2 Test procedure . 33
C.2 Test methods . 33
C.2.1 General . 33
C.2.2 Leaded oscillator . 33
C.2.3 SMD oscillator . 33
C.2.4 The impact of ESD on Oscillator in steady-state . 33
Annex D (normative) Digital interfaced crystal oscillator’s function . 34
Bibliography . 35

Figure 1 – Basic configurations of SAW resonators . 9
Figure 2 – Example of the use of frequency offset. 11
Figure 3 – Linearity of frequency modulation deviation . 16
Figure 4 – Characteristics of an output waveform . 18
Figure 5 – Definition of start-up time . 19
Figure 6 – Clock signal with period jitter. 19
Figure 7 – Phase jitter measures . 20
Figure 8 – Gaussian distribution of jitter . 20
Figure 9 – Jitter amplitude and period of jitter frequency . 20
Figure 10 – Jitter tolerance according to ITU-T G.825, ATIS-0900101, Telcordia GR-
253 and ETSI EN 300 462 . 21
Figure A.1 – Circuit for TTL . 28
Figure A.2 – Circuit for Schottky logic . 29
Figure A.3 – Circuit for PECL . 30
Figure A.4 – Circuit for LVDS . 31

Table A.1 – Values to be used when calculating R and R . 30
1 2
Table A.2 – Operating condition . 31
Table A.3 – DC Electrical characteristics output load = 50 Ω to Vcc-2V . 31
Table D.1 – Function of the digital interface . 34

– 4 – IEC 60679-1:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC
OSCILLATORS OF ASSESSED QUALITY –

Part 1: Generic specification
FOREWORD
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60679-1 has been prepared by IEC technical committee TC 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
This fourth edition cancels and replaces the third edition published in 2007. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) the title has been changed;
b) additional matters related to oscillator using SAW or MEMS resonator in "Terms,
definitions and general information" have been included;
c) measurement methods of IEC 60679-1:2007 have been removed (they will be moved to
IEC 62884 series);
d) the content of Annex A has been extended;
e) a new term and definition DIXO (Digital interfaced Crystal Oscillator) has been added;
f) a new term and definition SSXO (Spread Spectrum Crystal Oscillator) has been added;
g) Annex D has been added.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1229/FDIS 49/1233/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 60679 series, published under the general title piezoelectric,
dielectric and electrostatic oscillators of assessed quality can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.

– 6 – IEC 60679-1:2017 © IEC 2017
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC
OSCILLATORS OF ASSESSED QUALITY –

Part 1: Generic specification
1 Scope
This part of IEC 60679 specifies general requirements for piezoelectric, dielectric and
electrostatic oscillators, including Dielectric Resonator Oscillators (DRO) and oscillators using
FBAR (hereinafter referred to as "Oscillator"), of assessed quality using either capability
approval or qualification approval procedures.
NOTE Dielectric Resonator Oscillators (DRO) and oscillators using FBAR are under consideration.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050-561, International electrotecnical vocabulary – Part 561: Piezoelectric, dielectric
and electrostatic devices and associated materials for frequency control, selection and
detection. Available at www.electropedia.org
IEC 60469, Transitions, pulses and related waveforms – Terms, definitions and algorithms
IEC 60617, Graphical symbols for diagrams. Available at http://std.iec.ch/iec60617
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60749-26, Semiconductor devices – Mechanical and climatic test methods – Part 26:
Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)
IEC 60749-27, Semiconductor devices – Mechanical and climatic test methods – Part 27:
Electrostatic discharge (ESD) sensitivity testing – Machine model (MM)
IEC TR 61000-4-1, Electromagnetic compatibility (EMC) – Part 4-1: Testing and measurement
techniques – Overview of the IEC 61000-4 series
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 62884-1:2017, Measurement techniques of piezoelectric, dielectric, and electrostatic
oscillators – Part 1: Basic methods for the measurement
ISO 80000-1, Quantities and units – Part 1: General
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
• detail specification;
• sectional specification;
• generic specification;
• any other international documents (for example of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
3 Terms, definitions and general information
3.1 General
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following standards:
• IEC 60027;
• IEC 60050-561;
• IEC 60469;
• IEC 60617;
• ISO 80000-1.
3.2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2.1
simple packaged crystal oscillator
SPXO
crystal controlled oscillator having no means of temperature control or compensation,
exhibiting a frequency/temperature characteristic determined substantially by the quartz
crystal resonator employed
[SOURCE: IEC 60050-561:2014, 561-03-30]
3.2.2
overtone crystal controlled oscillator
oscillator designed to operate with the controlling piezoelectric resonator functioning in a
specified mechanical overtone order of vibration
[SOURCE: IEC 60050-561:2014, 561-03-20, modified – The word "functioning" has been
added.]
3.2.3
crystal cut
orientation of the crystal element with respect to the crystallographic axes of the crystal
Note 1 to entry: It can be desirable to specify the cut (and hence the general form of the frequency/temperature
performance) of a crystal unit used in an oscillator application. The choice of the crystal cut will imply certain
attributes of the oscillator which may not otherwise appear in the detail specification.
[SOURCE: IEC 60050-561:2014, 561-03-04]

– 8 – IEC 60679-1:2017 © IEC 2017
3.2.4
voltage controlled crystal oscillator
VCXO
crystal controlled oscillator, the frequency of which can be deviated or modulated according to
a specific relation, through application of a control voltage
[SOURCE: IEC 60050-561:2014, 561-03-41]
3.2.5
temperature compensated crystal oscillator
TCXO
crystal controlled oscillator whose frequency deviation due to temperature is reduced by
means of a compensation system, incorporated in the device
[SOURCE: IEC 60050-561:2014, 561-03-36]
3.2.6
oven controlled crystal oscillator
OCXO
crystal controlled oscillator in which at least the piezoelectric resonator is temperature
controlled
Note 1 to entry: This mode of operation ensures that the oscillator frequency will remain sensibly constant over
the operating temperature range of the OCXO, therefore independent of the frequency/temperature characteristic
of the crystal unit.
[SOURCE: IEC 60050-561:2014, 561-03-19, modified – The note to entry has been added.]
3.2.7
surface acoustic wave
SAW
acoustic wave, propagating along the surface of an elastic substrate, the amplitude of which
decays exponentially with substrate depth
[SOURCE: IEC 60050-561:2014, 561-01-86]
3.2.8
SAWR
surface acoustic wave resonator
SAW resonator
resonator using multiple reflections of surface acoustic waves
[SOURCE: IEC 60050-561:2014, 561-01-87, modified – The term "SAW resonator" has been
added.]
3.2.9
one-port SAW resonator
SAW resonator having a pair of terminals
SEE: Figure 1a.
[SOURCE: IEC 60050-561:2014, 561-01-57, modified – The figure reference has been
changed.]
3.2.10
two-port SAW resonator
SAW resonator having input and output ports
SEE: Figure 1b
[SOURCE: IEC 60050-561:2014, 561-01-94, modified – The figure reference has been
changed.]
IEC
a) One-port resonator with opened array
IEC
b) Two-port resonator with shorted arrays
Figure 1 – Basic configurations of SAW resonators
3.2.11
SAW oscillator
oscillator that uses a SAW resonator as the main frequency controlling element
3.2.12
simple packaged SAW oscillator
SPSO
SAW oscillator having no means of temperature control or compensation, exhibiting a
frequency/temperature characteristic determined substantially by SAW resonator employed
[SOURCE: IEC 60050-561:2014, 561-03-30, modified – change from crystal oscillator to SAW
oscillator and from crystal resonator to SAW resonator.]
3.2.13
voltage controlled SAW oscillator
VCSO
SAW oscillator, the frequency of which can be deviated or modulated according to a specific
relation, through application of a control voltage
[SOURCE: IEC 60050-561:2014, 561-03-41, modified – change from crystal resonator to SAW
oscillator.]
– 10 – IEC 60679-1:2017 © IEC 2017
3.2.14
temperature compensated SAW oscillator
TCSO
SAW oscillator whose frequency deviation due to temperature is reduced by means of a
compensation system incorporated in the device
[SOURCE: IEC 60050-561:2014, 561-03-36, modified – change from crystal resonator to SAW
oscillator.]
3.2.15
electrostatic micro electro mechanical system oscillator
electrostatic MEMS oscillator
oscillator that uses a MEMS device as the main frequency controlling element
3.2.16
voltage controlled electrostatic MEMS oscillator
electrostatic MEMS oscillator, the frequency of which can be deviated or modulated according
to a specified relation, by application of a control voltage
[SOURCE: IEC 60050-561:2014, 561-03-41, modified – change from crystal to MEMS
oscillator.]
3.2.17
digital interfaced crystal oscillator
DIXO
crystal oscillator, the frequency and the functions of which can be controlled, by application of
an external digital signal
Note 1 to entry: It will be combined as DI-TCXO in TCXO and as DI-OCXO in OCXO.
3.2.18
spread spectrum crystal oscillator
SSXO
crystal oscillator that reduces the peak of frequency spectrum by modulating the oscillation
frequency
3.2.19
nominal frequency
frequency given by the manufacturer or the specification to identify the oscillator
[SOURCE: IEC 60050-561:2014, 561-02-31, modified – The word "filter" has been replaced
by" oscillator".]
3.2.20
frequency tolerance
maximum permissible deviation of a specified characteristic frequency from the specified
value due to a specific cause, or a combination of causes
Note 1 to entry: Frequency tolerances are often assigned separately to specified ambient effects, namely
electrical, mechanical and environmental. When this approach is used, it is necessary to define the values of other
operating parameters as well as the range of the specified variable, that is to say:
– deviation from the frequency at the specified reference temperature due to operation over the specified
temperature range, other conditions remaining constant;
– deviation from the frequency at the specified supply voltage due to supply voltage changes over the specified
range, other conditions remaining constant;
– deviation from the initial frequency due to ageing, other conditions remaining constant;
– deviation from the frequency with specified load conditions due to changes in load impedance over the
specified range, other conditions remaining constant.

In some cases, an overall frequency tolerance may be specified, due to any/all combinations of operating
parameters, during a specified lifetime.
[SOURCE: IEC 60050-561:2014, 561-01-33, modified – Note 1 to entry has been added.]
3.2.21
frequency offset
frequency difference, positive or negative, which should be added to the specified nominal
frequency of Oscillator, when adjusting the Oscillator frequency under a particular set of
operating conditions in order to minimize its deviation from nominal frequency over the
specified range of operating conditions
Note 1 to entry: In order to minimize the frequency deviation from nominal over the entire temperature range, a
frequency offset may be specified for adjustment at the reference temperature (see Figure 2).
F(T) with offset =ΔF at 25 °C
ΔF
Nominal Frequency
F(T) with zero offset
Adjustment temperature
–20 °C 70 °C
25 °C
ΔF
-ΔF
–20°C
25°C
70°C
Operating temperature during adjustment
IEC
Figure 2 – Example of the use of frequency offset
[SOURCE: IEC 60050-561:2014, 561-03-09]
3.2.22
adjustment frequency
frequency to which an oscillator must be adjusted, under a particular combination of operating
conditions, in order to meet the frequency tolerance specification over the specified range of
operating conditions
Note 1 to entry: Adjustment frequency corresponds to nominal frequency plus frequency offset.
Frequency offset
Frequency
– 12 – IEC 60679-1:2017 © IEC 2017
[SOURCE: IEC 60050-561:2014, 561-03-01]
3.2.23
frequency adjustment range
range over which oscillator frequency may be varied by means of some variable element, for
the purpose of
a) setting the frequency to a particular value, or
b) to correct oscillator frequency to a prescribed value after deviation due to ageing, or other
changed conditions
Note 1 to entry: For test procedures – see 4.5.11 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-04-1003-07, modified – Note 1 to entry has been added.]
3.2.24
storage temperature range
minimum and maximum temperatures as measured on the enclosure at which an oscillator
may be stored without deterioration or damage to its performance
[SOURCE: IEC 60050-561:2014, 561-02-67, modified – The word "the device" has been
replaced by "an oscillator".]
3.2.25
operating temperature range,
range of temperatures over which the oscillator will function, maintaining frequency and other
output signal characteristics within specified tolerances
[SOURCE: IEC 60050-561:2014, 561-03-18]
3.2.26
operable temperature range
range of temperatures over which the oscillator will continue to provide an output signal,
though not necessarily within the specified tolerances of frequency, level, waveform, etc.
[SOURCE: IEC 60050-561:2014, 561-01-58, modified – Some elements and specifications
have been changed from resonator to Oscillator.]
3.2.27
reference temperature
temperature at which certain Oscillator performance parameters are measured
Note 1 to entry: The reference temperature is normally 25 °C ± 2 °C.
[SOURCE: IEC 60050-561:2014, 561-03-25]
3.2.28
reference point temperature
temperature measured at a specific reference point relative to an oscillator
[SOURCE: IEC 60050-561:2014, 561-03-24]
3.2.29
thermal transient frequency stability
oscillator frequency time response when ambient temperature is changed from one specified
temperature to another with a specific rate
[SOURCE: IEC 60050-561:2014, 561-03-37]

3.2.30
stabilization time
duration, measured from the initial application of power, required for an oscillator to stabilize
its operation within specified limits
Note 1 to entry: For test procedures – see 4.5.10 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-33, modified – Note 1 to entry has been added.]
3.2.31
frequency/temperature characteristics
deviation from the frequency at the specified reference temperature due to operation over the
specified temperature range, other conditions remaining constant
Note 1 to entry: For test procedures – see 4.5.5 of IEC 62884-1:2017.
3.2.32
frequency/temperature stability
maximum permissible deviation of the oscillator frequency, with no reference implied, due to
operation over the specified temperature range at nominal supply and load conditions,
other conditions constant
( f − f )
max min
f − T = ±
stability
( f + f )
max min
where
f is the maximum frequency measured during the temperature run,
max
f is the minimum frequency measured during the temperature run
min
Note 1 to entry: For test procedures – see 4.5.5 of IEC 62884-1:2017 .
[SOURCE: MIL-PRF-55310E w/Amendment 2:2014]
3.2.33
frequency/voltage coefficient
fractional change in output frequency resulting from an incremental change in supply voltage,
other parameters remaining unchanged
Note 1 to entry: In the case of OCXOs, a considerable time may elapse before the full effect of a supply voltage
change is observed, as the temperature of the oven may drift gradually to a new value following the voltage
perturbation.
Note 2 to entry: For test procedures – see 4.5.7 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-11, modified – Note 2 to entry has been added.]
3.2.34
frequency/load coefficient
fractional change in output frequency resulting from an incremental change in electrical load
impedance, other parameters remaining unchanged
Note 1 to entry: For test procedures – see 4.5.6 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-08, modified – Note 1 to entry has been added.]
3.2.35
long-term frequency stability
frequency ageing
relationship between oscillator frequency and time

– 14 – IEC 60679-1:2017 © IEC 2017
Note 1 to entry: This long-term frequency drift that is caused by secular changes in the crystal unit and/or other
elements of the oscillator circuit, and should be expressed as fractional change in mean frequency per specified
time interval.
[SOURCE: IEC 60050-561:2014, 561-03-16]
3.2.36
short-term frequency stability
random fluctuations of the frequency of Oscillator over short periods of time
[SOURCE: IEC 60050-561:2014, 561-03-29]
3.2.37
Allan variance AVAR of fractional frequency fluctuation
AVAR of fractional frequency fluctuation
unbiased estimate of the preferred definition in the time domain of the short-term stability
characteristic of Oscillator output frequency:
M −1
2 2
σ (τ ) ≅ (Y − Y )
y ∑ k +1 k
2(M −1)
k =1
where
Y are the average fractional frequency fluctuations obtained sequentially, with no
k
systematic dead time between measurements;
τ is the sample time over which measurements are averaged;
M is the number of measurements.
Note 1 to entry: The confidence of the estimate improves as M increases.
[SOURCE: IEC 60050-561:2014/AMD1:2016, 561-03-02, modified – The second preferred
term has been added.]
3.2.38
Allan deviation of fractional frequency fluctuation
ADEV of fractional frequency fluctuation
measure in the time domain of the short-term frequency stability of Oscillator, based on the
statistical properties of a number of frequency measurements, each representing an average
of the frequency over the specified sampling interval τ
Note 1 to entry: The preferred measure of fractional frequency fluctuation is:
M −1 2
 
σ (τ ) ≅  (Y − Y ) 
y k+1 k
∑
2(M − 1)
 
k=1
 
3.2.39
phase noise
frequency-domain measure of the short-term frequency stability of Oscillator
Note 1 to entry: This phase noise is normally expressed as the power spectral density of the phase fluctuations,
S (f), where the phase fluctuation function φ(t) is expressed as;
ϕ
1 dφ(t)
= F(t) − F
2π dt
The spectral density of phase fluctuation can be directly related to the spectral density of
frequency fluctuation by
 F 
 
S ( f ) = S ( f ) [rad /Hz]
φ y
 
f
 
Where
F(t) is the instantaneous oscillator frequency
F is the average oscillator frequency
f is the Fourier frequency
Note 2 to entry: For test procedures – see 4.5.25 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-22 modified – Note 1 to entry has been modified and
Note 2 to entry has been added.]
3.2.40
spectral purity
measure of frequency stability in the frequency domain
Note 1 to entry: This spectral purity is usually represented as the signal side noise power spectrum expressed in
decibels relative to total signal power, per hertz bandwidth. This spectral purity includes non-deterministic noise
power, harmonic distortion components and spurious single frequency interferences.
Note 2 to entry: For test procedures – see 4.5.29 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-31, modified – Note 2 to entry has been added.]
3.2.41
incidental frequency modulation
optional measure of frequency stability in the frequency domain
Note 1 to entry: Incidental frequency modulation is best described in terms of the spectrum of the resultant base-
band signal obtained by applying Oscillator signal to an ideal discriminator circuit of specified characteristics. lf the
detection bandwidth is adequately specified, the incidental frequency modulation may be expressed as a fractional
–8
proportion of the output frequency (for example 2×10 r.m.s. in a 10 kHz band).
Note 2 to entry: For test procedures – see 4.5.30 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-13, modified – The existing Note 1 and Note 2 have
been merged into Note 1 and a new Note 2 to entry has been added.]
3.2.42
amplitude modulation distortion
frequency distortion
amplitude distortion
amplitude/frequency distortion
non-linear distortion in which the relative magnitudes of the spectral components of the
modulating signal waveform are modified
Note 1 to entry: For test procedures – see 4.5.22.3 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-03, modified – Note 1 to entry has been added.]
3.2.43
linearity of frequency modulation deviation
measure of the transfer characteristic of a modulation system as compared to an ideal
(straight line) function, usually expressed as an allowable non-linearity in per cent of the
specified full range deviation
Note 1 to entry: Modulation linearity can also be expressed in terms of the permissible distortion of base-band
signals produced by the modulation device (for example, intermodulation and harmonic distortion products shall not
exceed –40 dB relative to the total modulating signal power) . For test procedures – see 4.5.23.1 of IEC 62884-
1:2017.
– 16 – IEC 60679-1:2017 © IEC 2017
Note 2 to entry: Figure 3 is a plot of the output frequency of a typical modulated oscillator specified to have a
modulation characteristic of 133,3 Hz/V over a range of ±3 V, with an allowed non-linearity of ±5 %. Curve D is the
actual characteristic compared with the ideal (curve A) and the limits (curves B and C).
D
Centre frequency
C
A
-200
B
-400
–3 –2 –1 0 1 2 3
Voltage, V
IEC
Figure 3 – Linearity of frequency modulation deviation
[SOURCE: IEC 60050-561:2014, 561-03-15, modified – The figure has been modified.]
3.2.44
harmonic distortion
non-linear distortion characterized by the generation of undesired spectral components
harmonically related to the desired signal frequency
Note 1 to entry: Each harmonic component is usually expressed as a power ratio (in decibels) relative to the
output power of the desired signal.
Note 2 to entry: For test procedures – see 4.5.15 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-12, modified – Note 2 to entry has been added.]
3.2.45
spurious oscillations
discrete frequency spectral components, non-harmonically related to the desired output
frequency, appearing at the output terminal of an oscillator
Note 1 to entry: These components can appear as symmetrical sidebands or as signal spectral components,
depending upon the mode of generation. Spurious components in the output spectrum are usually expressed as a
power ratio (in decibels) with respect to the output signal power.
[SOURCE: IEC 60050-561:2014, 561-03-32]
3.2.46
pulse duration
duration between pulse start time and pulse stop time
SEE: Figure 4.
Frequency deviation, Hz
Note 1 to entry: For test procedures – see 4.5.16.3 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-23, modified – Note 1 to entry has been added.]
3.2.47
rise time
time interval required for the leading edge of a waveform to change between two defined
levels
Note 1 to entry: These levels may be two logic levels V and V or 10 % to 90 % of its maximum amplitude
OL OH
(V – V ), or any other ratio defined in the detail specification (see Figure 4)
HI LO
where
V is the low level output voltage;
OL
V is the high level output voltage;
OH
V is the upper flat voltage of the pulse waveform;
HI
V is the low flat voltage of the pulse waveform.
LO
Note 2 to entry: For test procedures – see 4.5.16.2 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-27, modified – Note 2 to entry has been added.]
3.2.48
decay time
fall time
time interval required for the trailing edge of a waveform to change between two defined
levels
Note 1 to entry: These levels may be two logic levels V and V or 90 % to 10 % of its maximum amplitude
OH OL
(V – V ), or any other ratio as defined in the detail specification (see Figure 4).
HI LO
Note 2 to entry: For test procedures – see 4.5.16.2 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-05, modified – The end of the definition has been
moved to Note 1 to entry and Note 2 to entry has been added.]
3.2.49
3-state output
output stage which may be enabled or disabled by the application of an input control signal
Note 1 to entry: In the disable mode, the output impedance of the gate is set to a high level permitting the
application of test signals to following stages.
Note 2 to entry: For test procedures – see 4.5.21 of IEC 62884-1:2017.
3.2.50
symmetry
mark/space ratio
duty cycle
ratio between the time (t ), in which the output voltage is above a specified level, and the time
(t ), in which the output voltage is below the specified level
Note 1 to entry: The symmetry is expressed in percent of the duration of the full s
...

IEC 60679-1 ®
Edition 4.0 2017-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Piezoelectric, dielectric and electrostatic oscillators of assessed quality –
Part 1: Generic specification
Oscillateurs piézoélectriques, diélectriques et électrostatiques sous assurance
de la qualité –
Partie 1: Spécification générique

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IEC 60679-1 ®
Edition 4.0 2017-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Piezoelectric, dielectric and electrostatic oscillators of assessed quality –

Part 1: Generic specification
Oscillateurs piézoélectriques, diélectriques et électrostatiques sous assurance

de la qualité –
Partie 1: Spécification générique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-7178-0

– 2 – IEC 60679-1:2017 © IEC 2017
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions and general information . 7
3.1 General . 7
3.2 Terms and definitions . 7
3.3 Preferred values for ratings and characteristics . 22
3.3.1 General . 22
3.3.2 Climatic category (40/85/56) . 22
3.3.3 Bump severity . 22
3.3.4 Vibration severity . 22
3.3.5 Shock severity . 23
3.3.6 Leak rate . 23
3.4 Marking . 23
3.4.1 General . 23
3.4.2 Packaging. 23
4 Quality assessment procedures . 23
4.1 General . 23
4.2 Primary stage of manufacture . 24
4.3 Structurally similar components . 24
4.4 Subcontracting . 24
4.5 Incorporated components . 24
4.6 Manufacturer’s approval . 24
4.7 Approval procedures . 24
4.7.1 General . 24
4.7.2 Capability approval . 24
4.7.3 Qualification approval . 25
4.8 Procedures for capability approval . 25
4.8.1 General . 25
4.8.2 Eligibility for capability approval . 25
4.8.3 Application for capability approval . 25
4.8.4 Granting of capability approval . 25
4.8.5 Capability manual . 25
4.9 Procedures for qualification approval . 26
4.9.1 General . 26
4.9.2 Eligibility for qualification approval . 26
4.9.3 Application for qualification approval . 26
4.9.4 Granting of qualification approval . 26
4.9.5 Quality conformance inspection . 26
4.10 Test procedures . 26
4.11 Screening requirements . 26
4.12 Rework and repair work . 26
4.12.1 Rework . 26
4.12.2 Repair work . 26
4.13 Certified test records. 27
4.14 Validity of release . 27
4.15 Release for delivery . 27

4.16 Unchecked parameters . 27
Annex A (normative) Load circuit for logic drive . 28
A.1 TTL and Schottky . 28
A.2 CMOS . 30
A.3 ECL . 30
A.4 LVDS . 31
Annex B (normative) Latch-up test . 32
B.1 Definition . 32
B.1.1 Latch-up . 32
B.1.2 Test procedure . 32
B.2 Test method . 32
Annex C (normative) Electrostatic discharge sensitivity classification . 33
C.1 Definition . 33
C.1.1 Electrostatic discharge (ESD) . 33
C.1.2 Test procedure . 33
C.2 Test methods . 33
C.2.1 General . 33
C.2.2 Leaded oscillator . 33
C.2.3 SMD oscillator . 33
C.2.4 The impact of ESD on Oscillator in steady-state . 33
Annex D (normative) Digital interfaced crystal oscillator’s function . 34
Bibliography . 35

Figure 1 – Basic configurations of SAW resonators . 9
Figure 2 – Example of the use of frequency offset. 11
Figure 3 – Linearity of frequency modulation deviation . 16
Figure 4 – Characteristics of an output waveform . 18
Figure 5 – Definition of start-up time . 19
Figure 6 – Clock signal with period jitter. 19
Figure 7 – Phase jitter measures . 20
Figure 8 – Gaussian distribution of jitter . 20
Figure 9 – Jitter amplitude and period of jitter frequency . 21
Figure 10 – Jitter tolerance according to ITU-T G.825, ATIS-0900101, Telcordia GR-
253 and ETSI EN 300 462 . 21
Figure A.1 – Circuit for TTL . 28
Figure A.2 – Circuit for Schottky logic . 29
Figure A.3 – Circuit for PECL . 30
Figure A.4 – Circuit for LVDS . 31

Table A.1 – Values to be used when calculating R and R . 30
1 2
Table A.2 – Operating condition . 31
Table A.3 – DC Electrical characteristics output load = 50 Ω to Vcc-2V . 31
Table D.1 – Function of the digital interface . 34

– 4 – IEC 60679-1:2017 © IEC 2017
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC
OSCILLATORS OF ASSESSED QUALITY –

Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
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transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60679-1 has been prepared by IEC technical committee TC 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
This bilingual version (2019-07) corresponds to the monolingual English version, published in
2017-07.
This fourth edition cancels and replaces the third edition published in 2007. This edition
constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous
edition:
a) the title has been changed;
b) additional matters related to oscillator using SAW or MEMS resonator in "Terms,
definitions and general information" have been included;
c) measurement methods of IEC 60679-1:2007 have been removed (they will be moved to
IEC 62884 series);
d) the content of Annex A has been extended;
e) a new term and definition DIXO (Digital interfaced Crystal Oscillator) has been added;
f) a new term and definition SSXO (Spread Spectrum Crystal Oscillator) has been added;
g) Annex D has been added.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1229/FDIS 49/1233/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
The French version of this standard has not been voted upon.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 60679 series, published under the general title piezoelectric,
dielectric and electrostatic oscillators of assessed quality can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 60679-1:2017 © IEC 2017
PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC
OSCILLATORS OF ASSESSED QUALITY –

Part 1: Generic specification
1 Scope
This part of IEC 60679 specifies general requirements for piezoelectric, dielectric and
electrostatic oscillators, including Dielectric Resonator Oscillators (DRO) and oscillators using
FBAR (hereinafter referred to as "Oscillator"), of assessed quality using either capability
approval or qualification approval procedures.
NOTE Dielectric Resonator Oscillators (DRO) and oscillators using FBAR are under consideration.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050-561, International electrotecnical vocabulary – Part 561: Piezoelectric, dielectric
and electrostatic devices and associated materials for frequency control, selection and
detection. Available at www.electropedia.org
IEC 60469, Transitions, pulses and related waveforms – Terms, definitions and algorithms
IEC 60617, Graphical symbols for diagrams. Available at http://std.iec.ch/iec60617
IEC 60748-2, Semiconductor devices – Integrated circuits – Part 2: Digital integrated circuits
IEC 60749-26, Semiconductor devices – Mechanical and climatic test methods – Part 26:
Electrostatic discharge (ESD) sensitivity testing – Human body model (HBM)
IEC 60749-27, Semiconductor devices – Mechanical and climatic test methods – Part 27:
Electrostatic discharge (ESD) sensitivity testing – Machine model (MM)
IEC TR 61000-4-1, Electromagnetic compatibility (EMC) – Part 4-1: Testing and measurement
techniques – Overview of the IEC 61000-4 series
IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirements
IEC 62884-1:2017, Measurement techniques of piezoelectric, dielectric, and electrostatic
oscillators – Part 1: Basic methods for the measurement
ISO 80000-1, Quantities and units – Part 1: General
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
• detail specification;
• sectional specification;
• generic specification;
• any other international documents (for example of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
3 Terms, definitions and general information
3.1 General
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following standards:
• IEC 60027;
• IEC 60050-561;
• IEC 60469;
• IEC 60617;
• ISO 80000-1.
3.2 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.2.1
simple packaged crystal oscillator
SPXO
crystal controlled oscillator having no means of temperature control or compensation,
exhibiting a frequency/temperature characteristic determined substantially by the quartz
crystal resonator employed
[SOURCE: IEC 60050-561:2014, 561-03-30]
3.2.2
overtone crystal controlled oscillator
oscillator designed to operate with the controlling piezoelectric resonator functioning in a
specified mechanical overtone order of vibration
[SOURCE: IEC 60050-561:2014, 561-03-20, modified – The word "functioning" has been
added.]
3.2.3
crystal cut
orientation of the crystal element with respect to the crystallographic axes of the crystal
Note 1 to entry: It can be desirable to specify the cut (and hence the general form of the frequency/temperature
performance) of a crystal unit used in an oscillator application. The choice of the crystal cut will imply certain
attributes of the oscillator which may not otherwise appear in the detail specification.
[SOURCE: IEC 60050-561:2014, 561-03-04]

– 8 – IEC 60679-1:2017 © IEC 2017
3.2.4
voltage controlled crystal oscillator
VCXO
crystal controlled oscillator, the frequency of which can be deviated or modulated according to
a specific relation, through application of a control voltage
[SOURCE: IEC 60050-561:2014, 561-03-41]
3.2.5
temperature compensated crystal oscillator
TCXO
crystal controlled oscillator whose frequency deviation due to temperature is reduced by
means of a compensation system, incorporated in the device
[SOURCE: IEC 60050-561:2014, 561-03-36]
3.2.6
oven controlled crystal oscillator
OCXO
crystal controlled oscillator in which at least the piezoelectric resonator is temperature
controlled
Note 1 to entry: This mode of operation ensures that the oscillator frequency will remain sensibly constant over
the operating temperature range of the OCXO, therefore independent of the frequency/temperature characteristic
of the crystal unit.
[SOURCE: IEC 60050-561:2014, 561-03-19, modified – The note to entry has been added.]
3.2.7
surface acoustic wave
SAW
acoustic wave, propagating along the surface of an elastic substrate, the amplitude of which
decays exponentially with substrate depth
[SOURCE: IEC 60050-561:2014, 561-01-86]
3.2.8
SAWR
surface acoustic wave resonator
SAW resonator
resonator using multiple reflections of surface acoustic waves
[SOURCE: IEC 60050-561:2014, 561-01-87, modified – The term "SAW resonator" has been
added.]
3.2.9
one-port SAW resonator
SAW resonator having a pair of terminals
SEE: Figure 1a.
[SOURCE: IEC 60050-561:2014, 561-01-57, modified – The figure reference has been changed.]
3.2.10
two-port SAW resonator
SAW resonator having input and output ports
SEE: Figure 1b
[SOURCE: IEC 60050-561:2014, 561-01-94, modified – The figure reference has been changed.]

IEC
a) One-port resonator with opened array
IEC
b) Two-port resonator with shorted arrays
Figure 1 – Basic configurations of SAW resonators
3.2.11
SAW oscillator
oscillator that uses a SAW resonator as the main frequency controlling element
3.2.12
simple packaged SAW oscillator
SPSO
SAW oscillator having no means of temperature control or compensation, exhibiting a
frequency/temperature characteristic determined substantially by SAW resonator employed
[SOURCE: IEC 60050-561:2014, 561-03-30, modified – change from crystal oscillator to SAW
oscillator and from crystal resonator to SAW resonator.]
3.2.13
voltage controlled SAW oscillator
VCSO
SAW oscillator, the frequency of which can be deviated or modulated according to a specific
relation, through application of a control voltage
[SOURCE: IEC 60050-561:2014, 561-03-41, modified – change from crystal resonator to SAW
oscillator.]
– 10 – IEC 60679-1:2017 © IEC 2017
3.2.14
temperature compensated SAW oscillator
TCSO
SAW oscillator whose frequency deviation due to temperature is reduced by means of a
compensation system incorporated in the device
[SOURCE: IEC 60050-561:2014, 561-03-36, modified – change from crystal resonator to SAW
oscillator.]
3.2.15
electrostatic micro electro mechanical system oscillator
electrostatic MEMS oscillator
oscillator that uses a MEMS device as the main frequency controlling element
3.2.16
voltage controlled electrostatic MEMS oscillator
electrostatic MEMS oscillator, the frequency of which can be deviated or modulated according
to a specified relation, by application of a control voltage
[SOURCE: IEC 60050-561:2014, 561-03-41, modified – change from crystal to MEMS oscillator.]
3.2.17
digital interfaced crystal oscillator
DIXO
crystal oscillator, the frequency and the functions of which can be controlled, by application of
an external digital signal
Note 1 to entry: It will be combined as DI-TCXO in TCXO and as DI-OCXO in OCXO.
3.2.18
spread spectrum crystal oscillator
SSXO
crystal oscillator that reduces the peak of frequency spectrum by modulating the oscillation
frequency
3.2.19
nominal frequency
frequency given by the manufacturer or the specification to identify the oscillator
[SOURCE: IEC 60050-561:2014, 561-02-31, modified – The word "filter" has been replaced
by" oscillator".]
3.2.20
frequency tolerance
maximum permissible deviation of a specified characteristic frequency from the specified
value due to a specific cause, or a combination of causes
Note 1 to entry: Frequency tolerances are often assigned separately to specified ambient effects, namely
electrical, mechanical and environmental. When this approach is used, it is necessary to define the values of other
operating parameters as well as the range of the specified variable, that is to say:
– deviation from the frequency at the specified reference temperature due to operation over the specified
temperature range, other conditions remaining constant;
– deviation from the frequency at the specified supply voltage due to supply voltage changes over the specified
range, other conditions remaining constant;
– deviation from the initial frequency due to ageing, other conditions remaining constant;
– deviation from the frequency with specified load conditions due to changes in load impedance over the
specified range, other conditions remaining constant.
In some cases, an overall frequency tolerance may be specified, due to any/all combinations of operating
parameters, during a specified lifetime.

[SOURCE: IEC 60050-561:2014, 561-01-33, modified – Note 1 to entry has been added.]
3.2.21
frequency offset
frequency difference, positive or negative, which should be added to the specified nominal
frequency of Oscillator, when adjusting the Oscillator frequency under a particular set of
operating conditions in order to minimize its deviation from nominal frequency over the
specified range of operating conditions
Note 1 to entry: In order to minimize the frequency deviation from nominal over the entire temperature range, a
frequency offset may be specified for adjustment at the reference temperature (see Figure 2).
F(T) with offset =ΔF at 25 °C
ΔF
Nominal Frequency
F(T) with zero offset
Adjustment temperature
–20 °C 70 °C
25 °C
ΔF
-ΔF
–20°C
25°C
70°C
Operating temperature during adjustment
IEC
Figure 2 – Example of the use of frequency offset
[SOURCE: IEC 60050-561:2014, 561-03-09]
3.2.22
adjustment frequency
frequency to which an oscillator must be adjusted, under a particular combination of operating
conditions, in order to meet the frequency tolerance specification over the specified range of
operating conditions
Note 1 to entry: Adjustment frequency corresponds to nominal frequency plus frequency offset.
[SOURCE: IEC 60050-561:2014, 561-03-01]
Frequency offset
Frequency
– 12 – IEC 60679-1:2017 © IEC 2017
3.2.23
frequency adjustment range
range over which oscillator frequency may be varied by means of some variable element, for
the purpose of
a) setting the frequency to a particular value, or
b) to correct oscillator frequency to a prescribed value after deviation due to ageing, or other
changed conditions
Note 1 to entry: For test procedures – see 4.5.11 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-04-1003-07, modified – Note 1 to entry has been added.]
3.2.24
storage temperature range
minimum and maximum temperatures as measured on the enclosure at which an oscillator
may be stored without deterioration or damage to its performance
[SOURCE: IEC 60050-561:2014, 561-02-67, modified – The word "the device" has been
replaced by "an oscillator".]
3.2.25
operating temperature range,
range of temperatures over which the oscillator will function, maintaining frequency and other
output signal characteristics within specified tolerances
[SOURCE: IEC 60050-561:2014, 561-03-18]
3.2.26
operable temperature range
range of temperatures over which the oscillator will continue to provide an output signal,
though not necessarily within the specified tolerances of frequency, level, waveform, etc.
[SOURCE: IEC 60050-561:2014, 561-01-58, modified – Some elements and specifications
have been changed from resonator to Oscillator.]
3.2.27
reference temperature
temperature at which certain Oscillator performance parameters are measured
Note 1 to entry: The reference temperature is normally 25 °C ± 2 °C.
[SOURCE: IEC 60050-561:2014, 561-03-25]
3.2.28
reference point temperature
temperature measured at a specific reference point relative to an oscillator
[SOURCE: IEC 60050-561:2014, 561-03-24]
3.2.29
thermal transient frequency stability
oscillator frequency time response when ambient temperature is changed from one specified
temperature to another with a specific rate
[SOURCE: IEC 60050-561:2014, 561-03-37]

3.2.30
stabilization time
duration, measured from the initial application of power, required for an oscillator to stabilize
its operation within specified limits
Note 1 to entry: For test procedures – see 4.5.10 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-33, modified – Note 1 to entry has been added.]
3.2.31
frequency/temperature characteristics
deviation from the frequency at the specified reference temperature due to operation over the
specified temperature range, other conditions remaining constant
Note 1 to entry: For test procedures – see 4.5.5 of IEC 62884-1:2017.
3.2.32
frequency/temperature stability
maximum permissible deviation of the oscillator frequency, with no reference implied, due to
operation over the specified temperature range at nominal supply and load conditions,
other conditions constant
( f − f )
max min
f − T = ±
stability
( f + f )
max min
where
f is the maximum frequency measured during the temperature run,
max
f is the minimum frequency measured during the temperature run
min
Note 1 to entry: For test procedures – see 4.5.5 of IEC 62884-1:2017 .
[SOURCE: MIL-PRF-55310E w/Amendment 2:2014]
3.2.33
frequency/voltage coefficient
fractional change in output frequency resulting from an incremental change in supply voltage,
other parameters remaining unchanged
Note 1 to entry: In the case of OCXOs, a considerable time may elapse before the full effect of a supply voltage
change is observed, as the temperature of the oven may drift gradually to a new value following the voltage
perturbation.
Note 2 to entry: For test procedures – see 4.5.7 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-11, modified – Note 2 to entry has been added.]
3.2.34
frequency/load coefficient
fractional change in output frequency resulting from an incremental change in electrical load
impedance, other parameters remaining unchanged
Note 1 to entry: For test procedures – see 4.5.6 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-08, modified – Note 1 to entry has been added.]

– 14 – IEC 60679-1:2017 © IEC 2017
3.2.35
long-term frequency stability
frequency ageing
relationship between oscillator frequency and time
Note 1 to entry: This long-term frequency drift that is caused by secular changes in the crystal unit and/or other
elements of the oscillator circuit, and should be expressed as fractional change in mean frequency per specified
time interval.
[SOURCE: IEC 60050-561:2014, 561-03-16]
3.2.36
short-term frequency stability
random fluctuations of the frequency of Oscillator over short periods of time
[SOURCE: IEC 60050-561:2014, 561-03-29]
3.2.37
Allan variance AVAR of fractional frequency fluctuation
AVAR of fractional frequency fluctuation
unbiased estimate of the preferred definition in the time domain of the short-term stability
characteristic of Oscillator output frequency:
M −1
2 2
σ (τ ) ≅ (Y − Y )
y ∑ k +1 k
2(M −1)
k =1
where
Y are the average fractional frequency fluctuations obtained sequentially, with no
k
systematic dead time between measurements;
τ is the sample time over which measurements are averaged;
M is the number of measurements.
Note 1 to entry: The confidence of the estimate improves as M increases.
[SOURCE: IEC 60050-561:2014/AMD1:2016, 561-03-02, modified – The second preferred
term has been added.]
3.2.38
Allan deviation of fractional frequency fluctuation
ADEV of fractional frequency fluctuation
measure in the time domain of the short-term frequency stability of Oscillator, based on the
statistical properties of a number of frequency measurements, each representing an average
of the frequency over the specified sampling interval τ
Note 1 to entry: The preferred measure of fractional frequency fluctuation is:
M −1 2
 
σ (τ ) ≅  (Y − Y ) 
y k+1 k
∑
2(M − 1)
 
k=1
 
3.2.39
phase noise
frequency-domain measure of the short-term frequency stability of Oscillator
Note 1 to entry: This phase noise is normally expressed as the power spectral density of the phase fluctuations,
S (f), where the phase fluctuation function φ(t) is expressed as;
ϕ
1 dφ(t)
= F(t) − F
2π dt
The spectral density of phase fluctuation can be directly related to the spectral density of
frequency fluctuation by
 F 
 
S ( f ) = S ( f ) [rad /Hz]
φ y
 
f
 
Where
F(t) is the instantaneous oscillator frequency
F is the average oscillator frequency
f is the Fourier frequency
Note 2 to entry: For test procedures – see 4.5.25 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-22 modified – Note 1 to entry has been modified and
Note 2 to entry has been added.]
3.2.40
spectral purity
measure of frequency stability in the frequency domain
Note 1 to entry: This spectral purity is usually represented as the signal side noise power spectrum expressed in
decibels relative to total signal power, per hertz bandwidth. This spectral purity includes non-deterministic noise
power, harmonic distortion components and spurious single frequency interferences.
Note 2 to entry: For test procedures – see 4.5.29 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-31, modified – Note 2 to entry has been added.]
3.2.41
incidental frequency modulation
optional measure of frequency stability in the frequency domain
Note 1 to entry: Incidental frequency modulation is best described in terms of the spectrum of the resultant base-
band signal obtained by applying Oscillator signal to an ideal discriminator circuit of specified characteristics. lf the
detection bandwidth is adequately specified, the incidental frequency modulation may be expressed as a fractional
–8
proportion of the output frequency (for example 2×10 r.m.s. in a 10 kHz band).
Note 2 to entry: For test procedures – see 4.5.30 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-13, modified – The existing Note 1 and Note 2 have
been merged into Note 1 and a new Note 2 to entry has been added.]
3.2.42
amplitude modulation distortion
frequency distortion
amplitude distortion
amplitude/frequency distortion
non-linear distortion in which the relative magnitudes of the spectral components of the
modulating signal waveform are modified
Note 1 to entry: For test procedures – see 4.5.22.3 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-03, modified – Note 1 to entry has been added.]

– 16 – IEC 60679-1:2017 © IEC 2017
3.2.43
linearity of frequency modulation deviation
measure of the transfer characteristic of a modulation system as compared to an ideal
(straight line) function, usually expressed as an allowable non-linearity in per cent of the
specified full range deviation
Note 1 to entry: Modulation linearity can also be expressed in terms of the permissible distortion of base-band
signals produced by the modulation device (for example, intermodulation and harmonic distortion products shall not
exceed –40 dB relative to the total modulating signal power) . For test procedures – see 4.5.23.1 of IEC 62884-
1:2017.
Note 2 to entry: Figure 3 is a plot of the output frequency of a typical modulated oscillator specified to have a
modulation characteristic of 133,3 Hz/V over a range of ±3 V, with an allowed non-linearity of ±5 %. Curve D is the
actual characteristic compared with the ideal (curve A) and the limits (curves B and C).
D
Centre frequency
C
A
-200
B
-400
–3 –2 –1 0 1 2 3
Voltage, V
IEC
Figure 3 – Linearity of frequency modulation deviation
[SOURCE: IEC 60050-561:2014, 561-03-15, modified – The figure has been modified.]
3.2.44
harmonic distortion
non-linear distortion characterized by the generation of undesired spectral components
harmonically related to the desired signal frequency
Note 1 to entry: Each harmonic component is usually expressed as a power ratio (in decibels) relative to the
output power of the desired signal.
Note 2 to entry: For test procedures – see 4.5.15 of IEC 62884-1:2017.
[SOURCE: IEC 60050-561:2014, 561-03-12, modified – Note 2 to entry has been added.]
3.2.45
spurious oscillations
discrete frequency spectral components, non
...