IEC 62951-7:2019

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

IEC 62951-7:2019 specifies evaluation conditions and gives a method of measurement as well as a test set-up for the measurement of barrier performance for thin-film layer with ultra‑low permeation rate under both flat and bending conditions. This document also includes the preparation of specimen, electrical contacts, sensor films and calculation procedures. For these purposes, this document provides terms, definitions, symbols, configurations, and test methods including test conditions such as temperature, relative humidity, testing time.

Dispositifs à semiconducteurs - Dispositifs à semiconducteurs souples et extensibles - Partie 7: Méthode d’essai pour caractériser la performance des barrières en couches minces utilisées pour l’encapsulation des semiconducteurs organiques souples

L’IEC 62951-7:2019 spécifie des conditions d’évaluation et fournit une méthode de mesure ainsi qu’un montage d’essai pour la mesure de performance des barrières en couches minces à vitesse de perméation ultra faible, à la fois à plat et en conditions de flexion. Le présent document comprend également la préparation de l’éprouvette, les contacts électriques, les couches de détecteur et les modes opératoires de calcul. A cet effet, le présent document fournit des termes, des définitions, des symboles, des configurations et des méthodes d’essai, y compris des conditions d’essai telles que la température, l’humidité relative et la durée d’essai.

General Information

• Status: Published
• Publication Date: 26-Feb-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 6 - TC 47/WG 6
• Current Stage: PPUB - Publication issued
• Start Date: 29-Mar-2019
• Completion Date: 27-Feb-2019

Standards Content (Sample)

IEC 62951-7 ®
Edition 1.0 2019-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Flexible and stretchable semiconductor devices –
Part 7: Test method for characterizing the barrier performance of thin film
encapsulation for flexible organic semiconductor

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples et
extensibles –
Partie 7: Méthode d’essai pour caractériser la performance des barrières en
couches minces utilisées pour l’encapsulation des semiconducteurs
organiques souples
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IEC 62951-7 ®
Edition 1.0 2019-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Flexible and stretchable semiconductor devices –

Part 7: Test method for characterizing the barrier performance of thin film

encapsulation for flexible organic semiconductor

Dispositifs à semiconducteurs – Dispositifs à semiconducteurs souples et

extensibles –
Partie 7: Méthode d’essai pour caractériser la performance des barrières en

couches minces utilisées pour l’encapsulation des semiconducteurs

organiques souples
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-6612-0

– 2 – IEC 62951-7:2019 © IEC 2019
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test method . 6
4.1 General . 6
4.2 Experimental apparatus . 6
4.3 WVTR calculation . 7
4.4 Measurement of Ca resistance . 7
4.5 Application to flexible organic semiconductor devices . 8
4.6 Measurement of barrier performance under the bending condition . 9
5 Test report . 10
Annex A (informative) Sample preparation and data . 12
A.1 Sample preparation . 12
A.2 Measurement data . 12
Bibliography . 14

Figure 1 – Experimental set-up for measuring resistance by the four-wire resistance
measurement method . 6
Figure 2 – Four-wire resistance measurement method for measuring resistance change . 8
Figure 3 – Experimental set-up for measuring resistance by the four-wire resistance
measurement method for flexible substrate . 9
Figure 4 – Experimental set-up for measurement of barrier performance under the
bending condition. 10
Figure A.1 – Example of Ca sensor and its deposition procedures . 12
Figure A.2 – Normalized conductance change as a function of time with linear fit . 13

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES –

Part 7: Test method for characterizing the barrier performance of
thin film encapsulation for flexible organic semiconductor

FOREWORD
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International Standard IEC 62951-7 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2533/FDIS 47/2542/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62951-7:2019 © IEC 2019
A list of all parts in the IEC 62951 series, published under the general title Semiconductor
devices – Flexible and stretchable semiconductor devices, can be found on the IEC website.
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SEMICONDUCTOR DEVICES –
FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES –

Part 7: Test method for characterizing the barrier performance of
thin film encapsulation for flexible organic semiconductor

1 Scope
This part of IEC 62951 specifies evaluation conditions and gives
...