IEC 62150-6:2022

Fibre optic active components and devices - Test and measurement procedures - Part 6: Universal mezzanine boards for test and measurement of photonic devices

IEC 62150-6:2022 specifies a generic mezzanine board system to support test and measurement of devices based on micro-optical and micro-photonic technologies, including but not limited to photonic integrated circuit (PIC) devices.

Composants et dispositifs actifs fibroniques - Procédures d'essais et de mesures - Partie 6: Cartes mezzanines universelles pour les essais et les mesures des dispositifs photoniques

IEC 62150-6:2022 spécifie un système de carte mezzanine générique pour prendre en charge les essais et les mesures des dispositifs basés sur des technologies micro‑optiques et microphotoniques, incluant, entre autres, les dispositifs à circuit intégré photonique (PIC).

General Information

• Status: Published
• Publication Date: 27-Jan-2022
• ICS: 33.180.20 - Fibre optic interconnecting devices
• Technical Committee: SC 86C - Fibre optic systems and active devices
• Current Stage: PPUB - Publication issued
• Start Date: 08-Mar-2022
• Completion Date: 28-Jan-2022

Standards Content (Sample)

IEC 62150-6 ®
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
colour
inside
Fibre optic active components and devices – Test and measurement
procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic
devices
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Secretariat Tel.: [phone]
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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IEC 62150-6 ®
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
colour
inside
Fibre optic active components and devices – Test and measurement

procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic

devices
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 33.180.20 ISBN 978-2-8322-1074-9

– 2 – IEC 62150-6:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Mezzanine board requirements . 7
4.1 Functional description . 7
4.2 Critical dimensions . 9
4.3 Daughtercard and extended system . 11
4.4 Power and signal flows . 15
Annex A (informative)  International collaborative research and development . 18
A.1 Overview. 18
A.2 European FP7 PhoxTroT project . 19
A.3 European H2020 Nephele project . 19
A.4 European H2020 COSMICC project . 19
A.5 Benefit of universal test board. 20
Bibliography . 21

Figure 1 – Outlines of mezzanine test boards . 7
Figure 2 – Attachment of PDS onto M2 board . 8
Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 9
Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 10
Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power
and low speed signal connectors on bottom surfaces and mezzanine board origin . 10
Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard
with electrical edge connectors and cut-outs to accommodate optical backplane
connectors . 12
Figure 7 – Attachment of M2 boards onto daughtercard . 13
Figure 8 – Extended double Eurocard form factor daughtercard with two M2 boards
attached. 14
Figure 9 – Extended double Eurocard form factor daughtercard with four M1 boards
attached. 14
Figure 10 – Extended double Eurocard form factor daughtercard with two M1 boards
and one M2 board attached . 15
Figure 11 – Functional diagram showing power and low speed signal distribution
between PDS, M1/M2, daughtercard and backplane . 16
Figure 12 – Multiple daughtercards populated with M1/M2 and PDS in multiple slots
on a system backplane . 17
Figure A.1 – Example of cross-project deployment of mezzanine test card [3] . 18
Figure A.2 – Examples of M2 test boards developed on EU H2020 COSMICC project. 20

Table 1 – Critical relative dimensions . 11
Table 2 – Voltages and low-power signal designations . 16

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –

Part 6: Universal mezzanine boards for test and
measurement of photonic devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62150-6 has been prepared by subcommittee SC 86C: Fibre optic systems and active
devices of IEC technical committee 86: Fibre optics. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
86C/1721/CDV 86C/1752/RVC
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

– 4 – IEC 62150-6:2022 © IEC 2022
A list of all parts in the IEC 62150 series, published under the general title Fibre optic active
components and devices – Test and measurement procedures, can be found on the IEC
website.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates that it
contains colours which are considered to be useful for the correct understanding of its
contents. Users should therefore print this document using a colour printer.

INTRODUCTION
This document defines a generic electro-optic mezzanine board for the test and measurement
of micro-optical and micro-photonic devices, including a wide diversity of photonic integrated
circuit (PIC) technologies including, but not limited to, transceivers, switches, sensors,
neuromorphic networks, LiDAR and quantum integrated circuits. The board size and shape
would allow two mezzanine boards to be mounted, side-by-side, on a larger Eurocard form
factor daughtercard, which itself can be docked into and powered from a backplane system.
Alternatively, each mezzanine board can be operated alone, for example on a lab bench
powered from a bench supply.
The purpose of this generic mezzanine board concept is to allow like-for-like comparative
characterisation of devices under test (DUTs) with respect to one another and to measure the
performance of DUTs within larger test environments, relevant to their targeted application,
such as data centre systems, high performance computers, automotive or 5G cabinets. The
mezzanine board PCB will be designed to accommodate very high-speed electronic signals and
a high-speed electronic signal interface to allow external test equipment such as test pattern
generators, bit error rate testers and communication signal analysers to drive the device under
test
...

IEC 62150-6 ®
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Fibre optic active components and devices – Test and measurement
procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic
devices
Composants et dispositifs actifs fibroniques – Procédures d'essais et de
mesures –
Partie 6: Cartes mezzanines universelles pour les essais et les mesures des
dispositifs photoniques
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

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a month by email.
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(IEV) online.
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IEC 62150-6 ®
Edition 1.0 2022-01
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Fibre optic active components and devices – Test and measurement

procedures –
Part 6: Universal mezzanine boards for test and measurement of photonic

devices
Composants et dispositifs actifs fibroniques – Procédures d'essais et de

mesures –
Partie 6: Cartes mezzanines universelles pour les essais et les mesures des

dispositifs photoniques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 33.180.20 ISBN 978-2-8322-0112-1

– 2 – IEC 62150-6:2022 © IEC 2022
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Mezzanine board requirements . 7
4.1 Functional description . 7
4.2 Critical dimensions . 9
4.3 Daughtercard and extended system . 11
4.4 Power and signal flows . 15
Annex A (informative)  International collaborative research and development . 18
A.1 Overview. 18
A.2 European FP7 PhoxTroT project . 19
A.3 European H2020 Nephele project . 19
A.4 European H2020 COSMICC project . 19
A.5 Benefit of universal test board. 20
Bibliography . 21

Figure 1 – Outlines of mezzanine test boards . 7
Figure 2 – Attachment of PDS onto M2 board . 8
Figure 3 – Mezzanine board 1 (M1) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 9
Figure 4 – Mezzanine board 2 (M2) – Relative positions of power and low speed signal
connectors on top and bottom surfaces and mezzanine board origin . 10
Figure 5 – Power distribution and sensor board (PDS) – Relative positions of power
and low speed signal connectors on bottom surfaces and mezzanine board origin . 10
Figure 6 – Outline dimensions of extended double Eurocard form factor daughtercard
with electrical edge connectors and cut-outs to accommodate optical backplane
connectors . 12
Figure 7 – Attachment of M2 boards onto daughtercard . 13
Figure 8 – Extended double Eurocard form factor daughtercard with two M2 boards
attached. 14
Figure 9 – Extended double Eurocard form factor daughtercard with four M1 boards
attached. 14
Figure 10 – Extended double Eurocard form factor daughtercard with two M1 boards
and one M2 board attached . 15
Figure 11 – Functional diagram showing power and low speed signal distribution
between PDS, M1/M2, daughtercard and backplane . 16
Figure 12 – Multiple daughtercards populated with M1/M2 and PDS in multiple slots
on a system backplane . 17
Figure A.1 – Example of cross-project deployment of mezzanine test card [3] . 18
Figure A.2 – Examples of M2 test boards developed on EU H2020 COSMICC project. 20

Table 1 – Critical relative dimensions . 11
Table 2 – Voltages and low-power signal designations . 16

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
TEST AND MEASUREMENT PROCEDURES –

Part 6: Universal mezzanine boards for test and
measurement of photonic devices

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their
preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with
may participate in this preparatory work. International, governmental and non-governmental organizations liaising
with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for
Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62150-6 has been prepared by subcommittee SC 86C: Fibre optic systems and active
devices of IEC technical committee 86: Fibre optics. It is an International Standard.
The text of
...