Fibre optic active components and devices - Package and interface standards - Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit

IEC 62148-22: 2023 defines the physical dimensions and interface specifications for directly modulated laser (DML) devices used in optical telecommunication and optical data transmission applications. The intent of this document is to adequately specify the physical requirements for DML devices so as to enable mechanical interchangeability of laser devices or transmitters complying with this document both at the printed circuit board and for any panel-mounting requirements.

Composants et dispositifs actifs fibroniques - Normes de boîtier et d'interface - Partie 22: Boîtiers pour laser à modulation 25 Gbit/s équipés d'une unité de régulation de température

IEC 62148-22: 2023 définit les dimensions physiques et les spécifications des interfaces pour les dispositifs laser à modulation directe (DML) utilisés dans les applications de télécommunications optiques et de transmission optique de données. L’objet du présent document est de spécifier de manière adéquate les exigences physiques des dispositifs DML de façon à permettre l’interchangeabilité mécanique des dispositifs laser ou des émetteurs conformes au présent document, tant au niveau de la carte de circuit imprimé que pour toute exigence de montage sur panneau.

General Information

Status
Published
Publication Date
14-Feb-2023
Current Stage
PPUB - Publication issued
Start Date
15-Feb-2023
Completion Date
24-Mar-2023

Overview

IEC 62148-22:2023 is an international standard published by the International Electrotechnical Commission (IEC) that defines the package and interface standards for 25 Gbit/s directly modulated laser (DML) packages equipped with temperature control units. This standard is part 22 of the IEC 62148 series, which addresses fibre optic active components and devices.

The primary purpose of IEC 62148-22:2023 is to specify the physical dimensions and interface specifications for DML devices used in optical telecommunication and optical data transmission systems. It ensures mechanical interchangeability of these laser devices or transmitters across different equipment, covering both printed circuit board (PCB) mounting and panel mounting requirements.

As high-speed optical communication evolves, standards like IEC 62148-22:2023 are crucial in promoting interoperability, consistent quality, and efficient integration of fibre optic laser components.

Key Topics

  • Physical Dimensions
    Defines detailed mechanical outlines for various DML package types including:

    • TO-can packages (with 5-pin, 7-pin, and 8-pin configurations)
    • TOSA (Transmitter Optical Sub-Assembly) module packages featuring LC optical connectors
    • Pigtail packages with fiber connectors
  • Interface Specifications
    Specifies the electrical and optical interfaces necessary to support reliable operation at 25 Gbit/s data rates, including:

    • Electrical pin assignments and functions for different pin configurations
    • Optical connector interface standards to facilitate easy integration
    • Temperature control unit integration in packages to enhance device stability and longevity
  • Mechanical Interchangeability
    Enables manufacturers and system integrators to replace or upgrade laser components without redesigning the system housing or interface circuitry, supporting modular design and maintenance.

  • Standard Compliance and References
    Lists normative references, ensuring alignment with other relevant IEC standards and industry practices for fiber optic components.

Applications

IEC 62148-22:2023 is highly relevant for various sectors and uses involving 25 Gbit/s optical transmission technologies, such as:

  • Telecommunication Networks
    Use in high-speed fiber optic transceivers for broadband internet, long-haul and metro networks.

  • Data Centers and Enterprise Networks
    Supports high-bandwidth connections in data center interconnects and server communications.

  • Optical Modules Manufacturing
    Assists device manufacturers in designing laser modules compatible with broad market standards, reducing development time and cost.

  • Test and Measurement Equipment
    Facilitates standardized interfaces in tools used for optical signal testing and diagnostics.

  • Panel and PCB Design
    Guides engineers on dimensions and pin assignments for mounting DML packages, ensuring compatibility with system boards and enclosures.

Related Standards

IEC 62148-22:2023 complements other standards in the IEC 62148 series, which cover various aspects of fiber optic active components, including:

  • IEC 62148-1 - General package and interface standards for fiber optic devices
  • IEC 62148-21 - Specifications for directly modulated laser packages without temperature control
  • IEC 60825 - Safety of laser products
  • IEC 61754 series - Optical connector standards ensuring interoperability

This standard also aligns with overarching telecommunication and fiber optic standards maintained by organizations such as the International Telecommunication Union (ITU) and Optical Internetworking Forum (OIF).


Keywords: IEC 62148-22, directly modulated laser, DML packages, fiber optic laser standards, 25 Gbit/s optical transmission, temperature control, fiber optic components, TO-can package, TOSA module, optical telecommunication standards, optical data transmission, laser package dimensions, electrical and optical interface standards, IEC standards for fiber optics.

Standard

IEC 62148-22:2023 - Fibre optic active components and devices - Package and interface standards - Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit Released:2/15/2023

English and French language
44 pages
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Frequently Asked Questions

IEC 62148-22:2023 is a standard published by the International Electrotechnical Commission (IEC). Its full title is "Fibre optic active components and devices - Package and interface standards - Part 22: 25 Gbit/s directly modulated laser packages with temperature control unit". This standard covers: IEC 62148-22: 2023 defines the physical dimensions and interface specifications for directly modulated laser (DML) devices used in optical telecommunication and optical data transmission applications. The intent of this document is to adequately specify the physical requirements for DML devices so as to enable mechanical interchangeability of laser devices or transmitters complying with this document both at the printed circuit board and for any panel-mounting requirements.

IEC 62148-22: 2023 defines the physical dimensions and interface specifications for directly modulated laser (DML) devices used in optical telecommunication and optical data transmission applications. The intent of this document is to adequately specify the physical requirements for DML devices so as to enable mechanical interchangeability of laser devices or transmitters complying with this document both at the printed circuit board and for any panel-mounting requirements.

IEC 62148-22:2023 is classified under the following ICS (International Classification for Standards) categories: 33.180.20 - Fibre optic interconnecting devices. The ICS classification helps identify the subject area and facilitates finding related standards.

You can purchase IEC 62148-22:2023 directly from iTeh Standards. The document is available in PDF format and is delivered instantly after payment. Add the standard to your cart and complete the secure checkout process. iTeh Standards is an authorized distributor of IEC standards.

Standards Content (Sample)


IEC 62148-22 ®
Edition 1.0 2023-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –
Part 22: 25 Gbit/s directly modulated laser packages with temperature control
unit
Composants et dispositifs actifs fibroniques – Normes de boîtier et d’interface –
Partie 22: Boîtiers pour laser à modulation directe 25 Gbit/s équipés d’une unité
de régulation de température
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IEC 62148-22 ®
Edition 1.0 2023-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –

Part 22: 25 Gbit/s directly modulated laser packages with temperature control

unit
Composants et dispositifs actifs fibroniques – Normes de boîtier et d’interface –

Partie 22: Boîtiers pour laser à modulation directe 25 Gbit/s équipés d’une unité

de régulation de température
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 33.180.20 ISBN 978-2-8322-6528-4

– 2 – IEC 62148-22:2023 © IEC 2023
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms, definitions and abbreviated terms . 7
3.1 Terms and definitions . 8
3.2 Abbreviated terms . 8
4 Specification of the optical interface . 8
4.1 Optical connector interface . 8
4.2 Pigtail interface . 8
5 Specification of electrical interface . 8
5.1 General . 8
5.2 Electrical interface specifications for DML TO-can package . 9
5.2.1 5-pin . 9
5.2.2 7-pin . 9
5.2.3 8-pin . 10
5.3 Electrical interface specifications for DML TOSA module packages . 11
5.3.1 5-pin . 11
5.3.2 7-pin . 11
5.3.3 8-pin . 12
6 Outline. 12
6.1 General . 12
6.2 Outline of DML TO-can package . 12
6.2.1 Drawing of case outline . 12
6.2.2 Dimensions of DML TO-can packages . 14
6.3 Outline of DML TOSA module package with an LC connector . 15
6.3.1 Drawing of case outline . 15
6.3.2 Dimensions of DML TOSA module package with LC connector . 17
6.3.3 Dimensions of LC type optical receptacle . 18
6.4 Outlines of DML pigtail package . 18
6.4.1 Drawing of case outline . 18
6.4.2 Dimensions of DML pigtail package . 19
6.4.3 Optical connector. 21
Bibliography . 22

Figure 1 – Electrical terminal numbering assignments for 5-pin type TO-can packages
with temperature control unit . 9
Figure 2 – Electrical terminal numbering assignments for 7-pin type TO-can packages
with temperature control unit . 10
Figure 3 – Electrical terminal numbering assignments for 8-pin type TO-can packages
with temperature control unit . 10
Figure 4 – Electrical terminal numbering assignments for 5-pin TOSA module packages
with temperature control unit . 11
Figure 5 – Electrical terminal numbering assignments for 7-pin TOSA module packages
with temperature control unit . 12
Figure 6 – Electrical terminal numbering assignments for 8-pin TOSA module packages
with temperature control unit . 12

Figure 7 – Case outline of TO-can with spherical lens . 13
Figure 8 – Case outline of TO-can with aspherical lens . 13
Figure 9 – Pin configuration for 5-pin TO-can . 13
Figure 10 – Pin configuration for 7-pin TO-can . 14
Figure 11 – Pin configuration for 8-pin TO-can . 14
Figure 12 – Schematic diagram of DML TOSA module packages with LC connector . 17
Figure 13 – Schematic diagram and pin-out of DML pigtail package . 19

Table 1 – Pin function definitions for 5-pin type DML TO-can packages . 9
Table 2 – Pin function definitions for 7-pin type DML TO-can packages . 10
Table 3 – Pin function definitions for 8-pin type DML TO-can packages . 11
Table 4 – Dimensions of DML TO-can package . 15
Table 5 – Dimensions of DML TOSA module package with LC connector . 17
Table 6 – Pin out terminals of DML TOSA module packages with LC connector and
with flexible printed circuit board . 18
Table 7 – Dimensions of DML pigtail package . 20
Table 8 – Pin out terminals of DML pigtail package . 21

– 4 – IEC 62148-22:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 22: 25 Gbit/s directly modulated laser packages
with temperature control unit
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 62148-22 has been prepared by subcommittee 86C: Fibre optic systems and active devices,
of IEC technical committee 86: Fibre optics. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
86C/1851/FDIS 86C/1859/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts of the IEC 62148 series, published under the general title Fibre optic active
components and devices – Package and interface standards, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 62148-22:2023 © IEC 2023
INTRODUCTION
Fibre optic laser devices are used to convert electrical signals into optical signals. This
document covers the physical dimensions and interfaces for directly modulated laser (DML)
packages which are intended to be applied to 25 Gbit/s transceivers.

FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 22: 25 Gbit/s directly modulated laser packages
with temperature control unit
1 Scope
This part of IEC 62148 defines the physical dimensions and interface specifications for directly
modulated laser (DML) devices used in optical telecommunication and optical data transmission
applications.
The intent of this document is to adequately specify the physical requirements for DML devices
so as to enable mechanical interchangeability of laser devices or transmitters complying with
this document both at the printed circuit board and for any panel-mounting requirements.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60793-2-50, Optical fibres – Part 2-50: Product specifications – Sectional specification for
class B single-mode fibres
IEC 61753 (all parts), Fibre optic interconnecting devices and passive components –
Performance standard
IEC 61754 (all parts), Fibre optic interconnecting devices and passive components – Fibre optic
connector interfaces
IEC 61755 (all parts), Fibre optic interconnecting devices and passive components – Fibre optic
connector optical interfaces
IEC 61754-20, Fibre optic interconnecting devices and passive components – Fibre optic
connector interfaces – Part 20: Type LC connector family
IEC 62148-1, Fibre optic active components and devices – Package and interface standards –
Part 1: General and guidance
3 Terms, definitions and abbreviated terms
For the purposes of this document, the terms and definitions given in IEC 62148-1 and the
following apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp

– 8 – IEC 62148-22:2023 © IEC 2023
3.1 Terms and definitions
3.1.1
pigtail package
package type of photonic devices which has a length of fibre attachment for both optical input
and output ports
[SOURCE: IEC 62148-15:2021, 3.1.1]
3.1.2
TOSA module
optical module that converts electrical signals into optical signals and that is connected to an
optical fibre
[SOURCE: IEC 62148-18:2014 , 3.1.1]
3.2 Abbreviated terms
CAN airtight sealed metal container (see IEC 60747-1)
DML directly modulated laser
LD laser diode
MPD monitor photodiode
NC not connected
PD photodiode
RH heat resistor
RTH thermistor resistor
TEC thermo-electric cooler
TO transistor outline
TOSA transmitter optical subassembly
4 Specification of the optical interface
4.1 Optical connector interface
This document applies to the LC optical connector interfaces. Detailed dimensions of the optical
receptacle are specified in IEC 61754-20.
4.2 Pigtail interface
All single-mode optical fibres defined in IEC 60793-2-50 shall apply.
All optical connectors defined in the IEC 61753 series, IEC 61754 series, and IEC 61755 series
are applicable when a pigtail shall be terminated with an optical connector.
5 Specification of electrical interface
5.1 General
The specifications for the electrical interfaces of DML TO-can packages are described in 5.2.
The specifications for the electrical interfaces of DML for TOSA module and DML pigtail
packages are described in 5.3. The electrical interface specifications define only the basic
functionality of each pin.
5.2 Electrical interface specifications for DML TO-can package
5.2.1 5-pin
The electrical terminal numbering assignments for 5-pin type TO-can packages with
temperature control unit are shown in Figure 1. There are two different configurations.
Figure 1 a) shows the first configuration, where pin 1 is offset from the centre of the TO-can,
and Figure 1 b) shows the second configuration with a centred pin 1. The pin function definitions
for the two 5-pin TO-can packages are specified in Table 1.

a) With offset ground pin 1 b) With centred ground pin 1

Figure 1 – Electrical terminal numbering assignments for 5-pin type
TO-can packages with temperature control unit
Table 1 – Pin function definitions for 5-pin type DML TO-can packages
Function
Pin number Option 1 Option 2
1 Ground, MPD anode, and RH cathode Ground and RH cathode
2 LD anode LD anode
3 RH anode RH anode and MPD anode
4 MPD cathode MPD cathode
5 LD cathode LD cathode
5.2.2 7-pin
The electrical terminal numbering assignments for 7-pin type TO-can packages with
temperature control unit are shown in Figure 2. There are two different configurations.
Figure 2 a) shows the configuration with a centred pin 1, and Figure 2 b) shows the
configuration where pin 1 is offset from the centre. The pin function definitions for the two 7-pin
TO-can packages are specified in Table 2.

– 10 – IEC 62148-22:2023 © IEC 2023

a) With centred ground pin 1 b) With offset ground pin 1

Figure 2 – Electrical terminal numbering assignments for 7-pin type
TO-can packages with temperature control unit
Table 2 – Pin function definitions for 7-pin type DML TO-can packages
Function
Pin number
Option 1 Option 2 Option 3
Ground, RTH cathode, and Ground, RTH cathode, and
1 Ground
MPD cathode MPD anode
2 LD anode LD anode LD anode
3 RTH anode MPD cathode RTH anode
4 TEC anode TEC anode TEC cathode
5 TEC cathode TEC cathode TEC anode
6 MPD anode MPD anode MPD cathode
7 LD cathode LD cathode LD cathode

5.2.3 8-pin
The electrical terminal numbering assignments for 8-pin type TO-can packages with
temperature control unit are shown in Figure 3. The pin function definitions for 8-pin TO-can
packages are specified in Table 3.

Figure 3 – Electrical terminal numbering assignments for 8-pin type
TO-can packages with temperature control unit

Table 3 – Pin function definitions for 8-pin type DML TO-can packages
Function
Pin number
Option 1 Option 2 Option 3
Ground and RTH cathode Ground, RTH cathode, and Ground, RTH cathode, and
MPD anode MPD anode
2 RTH anode RTH anode RTH anode
3 MPD cathode MPD cathode MPD cathode
4 TEC cathode TEC cathode TEC cathode
5 TEC anode TEC anode TEC anode
MPD anode Ground, RTH cathode, and NC
MPD anode
7 LD cathode LD cathode LD cathode
8 LD anode LD anode LD anode
5.3 Electrical interface specifications for DML TOSA module packages
5.3.1 5-pin
The pin number assignments for 5-pin TOSA module packages are shown in Figure 4.
Figure 4 a) shows the configuration where pin 1 is offset from the centre, and Figure 4 b) shows
the configuration with pin 1 centred. The pin function definitions for DML TOSA module
packages are the same as specified in Table 1 for DML TO-can packages.

a) With offset ground pin 1 b) With centred ground pin 1

Figure 4 – Electrical terminal numbering assignments for 5-pin
TOSA module packages with temperature control unit
5.3.2 7-pin
The pin number assignments for 7-pin TOSA module packages are shown in Figure 5.
Figure 5 a) shows the configuration with pin 1 centred, and Figure 5 b) shows the configuration
with pin 1 offset from the centre. The pin function definitions for DML TOSA module packages
are the same as specified in Table 2 for DML TO-can packages.

– 12 – IEC 62148-22:2023 © IEC 2023

a) With centred ground pin 1 b) With offset ground pin 1

Figure 5 – Electrical terminal numbering assignments for 7-pin
TOSA module packages with temperature control unit
5.3.3 8-pin
The pin number assignments for 8-pin TOSA module packages are shown in Figure 6. The pin
function definitions for DML TOSA module packages are the same as specified in Table 3 for
DML TO-can packages.
Figure 6 – Electrical terminal numbering assignments for 8-pin
TOSA module packages with temperature control unit
6 Outline
6.1 General
The outline dimensions and electrical interface dimensions for DML TO-can packages are
specified in 6.2, those for DML TOSA module packages with LC connector are specified in 6.3,
and those for DML pigtail package are specified in 6.4.
6.2 Outline of DML TO-can package
6.2.1 Drawing of case outline
Figure 7 shows the case outline for DML TO-can packages with spherical lens, whereas
Figure 8 shows the case outline for DML TO-can packages with aspherical lens.

Figure 7 – Case outline of TO-can with spherical lens

Figure 8 – Case outline of TO-can with aspherical lens
Figure 9 a) and b) show the pin configuration for DML TO-can packages with 5 pins, Figure 10
a) and b) show the pin configuration for DML TO-can packages with 7 pins, and Figure 11 shows
the pin configuration for DML TO-can packages with 8 pins.

a) With offset ground pin 1 b) With centred ground pin 1

Figure 9 – Pin configuration for 5-pin TO-can

– 14 – IEC 62148-22:2023 © IEC 2023

a) With centred ground pin 1 b) With offset ground pin 1

Figure 10 – Pin configuration for 7-pin TO-can

Figure 11 – Pin configuration for 8-pin TO-can
6.2.2 Dimensions of DML TO-can packages
The dimensions of the various DML TO-can packages are specified in Table 4.

Table 4 – Dimensions of DML TO-can package
Dimensions
Reference Remarks
Minimum Maximum
5,5 mm 5,7 mm For TO-56
φD
5,92 mm 6,05 mm For TO-60
3,50 mm 3,62 mm For spherical lens
φD
4,8 mm 5,2 mm For aspherical lens
A 6,26 mm 6,46 mm —
K 0,05 mm 0,25 mm —
A 3,77 mm 4,99 mm Only for spherical lens
A 4,36 mm 5,73 mm
φb 0,25 mm 0,35 mm —
L 7,0 mm 10,5 mm —
φc 0,65 mm 0,75 mm Only for 5-pin type
φa 2,39 mm 2,69 mm Only for 5-pin type
β 40° 60° Only for 5-pin type
n 1,15 mm 1,50 mm Only for 7-pin type
p 1,1 mm 1,5 mm Only for 7-pin type
q 0,55 mm 0,75 mm Only for 7-pin type
B 0 mm 0,08 mm Only for 5-pin type
B 0 mm 0,08 mm Only for 7-pin type
x 0,03 mm 0,13 mm Only for 7-pin type
y 0,95 mm 1,15 mm Only for 7-pin type
z 1,65 mm 1,95 mm Only for 7-pin type
Φc 0,2 mm 0,3 mm Only for 8-pin type
Φb 0,25 mm 0,35 mm Only for 8-pin type
Φa 0,3 mm 0,4 mm Only for 8-pin type
n 1,605 mm 1,625 mm Only for 8-pin type
p 0,9 mm 1,1 mm Only for 8-pin type
q 0,74 mm 0,94 mm Only for 8-pin type
m 0,05 mm 0,25 mm Only for 8-pin type
v 1,3 mm 1,5 mm Only for 8-pin type
u 1,72 mm 1,92 mm Only for 8-pin type
r 0,50 mm 0,55 mm Only for 8-pin type

6.3 Outline of DML TOSA module package with an LC connector
6.3.1 Drawing of case outline
Figure 12 a), b), c) and d) show the case outline for DML TOSA module packages with LC
connector.
– 16 – IEC 62148-22:2023 © IEC 2023

a) Case outline of TOSA module packages with LC connector

b) Outline of flexible printed circuit board for 5-pin type with offset and centred ground pins

c) Outline of flexible printed circuit board for 7-pin type with centred and offset ground pins

d) Outline of flexible printed circuit board for 8-pin type
Figure 12 – Schematic diagram of DML TOSA module packages with LC connector
6.3.2 Dimensions of DML TOSA module package with LC connector
The dimensions of DML TOSA module packages with LC connector are specified in Table 5.
The pad terminals of the flexible printed circuit board used for these packages are specified in
Table 6.
Table 5 – Dimensions of DML TOSA module package with LC connector
Dimensions
Reference Remarks
Minimum Maximum
a 4,85 mm 4,95 mm —
b 5,07 mm 5,23 mm —
c 4,0 mm 4,1 mm —
d 9,6 mm 12,0 mm —
h
2,85 mm 2,95 mm —
g 2,97 mm 3,01 mm —
f 0,06 mm 0,20 mm —
y
0 ,4 mm 0 , 7 mm

L 9,0 mm 16,1 mm —
i
0,80 mm 1,25 mm —
i 0,5 mm 0,9 mm

j
0,25 mm 0,45 mm —
k 3,0 mm 5,7 mm —
S 0,65 mm 1,50 mm —
t
0,55 mm 0,70 mm —
S 1,0 mm 3,0 mm

φ 0,65 mm 0,75 mm Only for 5-pin type
c
φ 2,39 mm 2,69 mm Only for 5-pin type
a
β 40° 60° Only for 5-pin type
n 1,15 mm 1,50 mm Only for 7-pin type
p 1,1 mm 1,5 mm Only for 7-pin type
q 0,55 mm 0,75 mm Only for 7-pin type
B 0 mm 0,08 mm Only for 5-pin type
B 0 mm 0,08 mm Only for 7-pin type
x 0,03 mm 0,13 mm Only for 7-pin type
y 0,95 mm 1,15 mm Only for 7-pin type

– 18 – IEC 62148-22:2023 © IEC 2023
Dimensions
Reference Remarks
Minimum Maximum
z
1,65 mm 1,95 mm Only for 7-pin type
Φc 0,2 mm 0,3 mm Only for 8-pin type
Φb
0,25 mm 0,35 mm Only for 8-pin type
Φa 0,3 mm 0,4 mm Only for 8-pin type
n 1,605 mm 1,625 mm Only for 8-pin type
p 0,9 mm 1,1 mm Only for 8-pin type
q
0,74 mm 0,94 mm Only for 8-pin type
m 0,05 mm 0,25 mm Only for 8-pin type
v 1,3 mm 1,5 mm Only for 8-pin type
u 1,72 mm 1,92 mm Only for 8-pin type
r 0,50 mm 0,55 mm Only for 8-pin type

Table 6 – Pin out terminals of DML TOSA module packages
with LC connector and with flexible printed circuit board
Function
Pin
number
5 pin 7 pin option 1 7 pin option 2 8 pin
1 Ground TEC anode TEC anode Ground
2 MPD cathode TEC cathode TEC cathode RTH anode
Ground,RTH cathode
3 Ground and RH cathode Ground and MPD anode PD cathode
and MPD anode
4 LD cathode LD cathode LD cathode Ground
5 LD anode LD anode LD anode LD anode
Ground,RTH cathode
6 Ground Ground and MPD anode LD cathode
and MPD anode
MPD anode and RH
7 MPD cathode MPD cathode Ground
anode
8 Ground and RH cathode RTH anode Ground and MPD anode TEC anode
9 — — — TEC cathode
10 — — — Ground
6.3.3 Dimensions of LC type optical receptacle
IEC 61754-20 shall apply.
6.4 Outlines of DML pigtail package
6.4.1 Drawing of case outline
Figure 13 shows the case outline of a DML pigtail package.

NOTE The optical connector includes LC connectors as well as other optical connectors.
Figure 13 – Schematic diagram and pin-out of DML pigtail package
6.4.2 Dimensions of DML pigtail package
The dimensions of the DML pigtail package are specified in Table 7. The pinout terminals of the
DML pigtail package are specified in Table 8.

– 20 – IEC 62148-22:2023 © IEC 2023
Table 7 – Dimensions of DML pigtail package
Dimensions
mm
Reference
Min. Max.
a 9,9 10,9
b 5,1 5,2
d 19,5 21,5
h 2,97 3,01
g 2,85 2,95
f 4,85 4,95
L 15,1 16,1
k 5,5 5,7
S 0,65 1,25
S 2,4 2,6
i 1,00 1,25
i 0,5 0,9
j 0,35 0,45
t 0,6 0,7
φD 5,5 5,7
y 0,4 0,7
e 0,06 0,20
Φc 0,2 0,3
Φb
0,25 0,35
Φa 0,3 0,4
n 1,605 1,625
p 0,9 1,1
q
0,74 0,94
m 0,05 0,25
v 1,3 1,5
u 1,72 1,92
r 0,50 0,55
Table 8 – Pin out terminals of DML pigtail package
Pin number Function
1 Ground
2 RTH anode
3 PD cathode
4 Ground
5 LD anode
6 LD cathode
7 Ground
8 TEC anode
9 TEC cathode
10 Ground
6.4.3 Optical connector
Any type of optical connector may be used, including miniature duplex optical connectors, such
1 2
as SAC (see IEC 61754-36 ) and MDC (see IEC 61754-37 ).

___________
Under preparation. Stage at the time of publication: IEC/AFDIS 61754-36:2022.
Under preparation. Stage at the time of publication: IEC/AFDIS 61754-37:2022.

– 22 – IEC 62148-22:2023 © IEC 2023
Bibliography
IEC 60191 (all parts), Mechanical standardization of semiconductor devices
IEC 60603 (all parts), Connectors for electronic equipment
IEC 60747-1, Semiconductor devices – Part 1: General
IEC 60794 (all parts), Optical fibre cables
IEC 60825 (all parts), Safety of laser products
IEC 61076 (all parts), Connectors for electronic equipment – Product requirements
IEC 61280 (all parts), Fibre optic communication subsystem test procedures
IEC 61281-1, Fibre optic communication subsystems – Part 1: Generic specification
IEC 61754-36, Fibre optic interconnecting devices and passive components – Fibre optic
connector interfaces – Part 36: Type SAC connector family
IEC 61754-37, Fibre optic interconnecting devices and passive components – Fibre optic
connector interfaces – Part 37: Type MDC connector family
IEC 62007-1, Semiconductor optoelectronic devices for fibre optic system applications – Part 1:
Specification template for essential ratings and characteristics
IEC 62007-2, Semiconductor optoelectronic devices for fibre optic system applications – Part 2:
Measuring methods
IEC 62148-15:2021, Fibre optic active components and devices – Package and interface
standards – Part 15: Discrete vertical cavity surface emitting laser packages
IEC 62148-18:2014, Fibre optic active components and devices – Package and interface
standards – Part 18: 40-Gbit/s serial transmitter and receiver components for use with the LC
connector interface
IEC 62149-2, Fibre optic active components and devices – Performance standards – Part 2:
850 nm discrete vertical cavity surface emitting laser devices
ISO 1101, Geometrical product specifications (GPS) – Geometrical tolerancing – Tolerances of
form, orientation, location and run-out

___________
___________
Under preparation. Stage at the time of publication: IEC/AFDIS 61754-36:2022.
Under preparation. Stage at the time of publication: IEC/AFDIS 61754-37:2022.

– 24 – IEC 62148-22:2023 © IEC 2023
SOMMAIRE
AVANT-PROPOS . 26
INTRODUCTION . 28
1 Domaine d’application . 29
2 Références normatives . 29
3 Termes, définitions et abréviations . 30
3.1 Termes et définitions . 30
3.2 Abréviations . 30
4 Spécification de l’interface optique . 30
4.1 Interface de connecteur optique . 30
4.2 Interface de fibre amorce . 30
5 Spécification de l’interface électrique . 31
5.1 Généralités . 31
5.2 Spécifications d’interface électrique pour les boîtiers DML TO-can . 31
5.2.1 5 broches . 31
5.2.2 7 broches . 31
5.2.3 8 broches . 32
5.3 Spécifications d’interface électrique pour les boîtiers DML pour module
TOSA . 33
5.3.1 5 broches . 33
5.3.2 7 broches . 33
5.3.3 8 broches . 34
6 Encombrement . 34
6.1 Généralités . 34
6.2 Encombrement des boîtiers DML TO-can . 34
6.2.1 Schéma d’encombrement du boîtier . 34
6.2.2 Cotes des boîtiers DML TO-can . 36
6.3 Encombrement des boîtiers DML pour module TOSA avec un connecteur LC . 37
6.3.1 Schéma d’encombrement du boîtier . 37
6.3.2 Cotes des boîtiers DML pour module TOSA avec connecteur LC . 39
6.3.3 Cotes de l’embase optique de type LC . 40
6.4 Encombrement des boîtiers DML à fibres amorces. 40
6.4.1 Schéma d’encombrement du boîtier . 40
6.4.2 Cotes des boîtiers DML à fibres amorces. 41
6.4.3 Connecteur optique . 43
Bibliographie . 44

Figure 1 – Affectation de la numérotation des bornes électriques pour les boîtiers TO-
can de type à 5 broches avec unité de régulation de température . 31
Figure 2 – Affectation de la numérotation des bornes électriques pour les boîtiers TO-
can de type à 7 broches avec unité de régulation de température . 32
Figure 3 – Affectation de la numérotation des bornes électriques pour les boîtiers TO-
can de type à 8 broches avec unité de régulation de température . 32
Figure 4 – Affectation de la numérotation des bornes électriques pour les boîtiers pour
module TOSA à 5 broches avec unité de régulation de température . 33
Figure 5 – Affectation de la numérotation des bornes électriques pour les boîtiers pour
module TOSA à 7 broches avec unité de régulation de température . 34

Figure 6 – Affectation de la numérotation des bornes électriques pour les boîtiers pour
module TOSA à 8 broches avec unité de régulation de température . 34
Figure 7 – Encombrement des boîtiers TO-can avec lentille sphérique . 35
Figure 8 – Encombrement des boîtiers TO-can avec lentille asphérique . 35
Figure 9 – Disposition des broches pour les boîtiers TO-can à 5 broches . 35
Figure 10 – Disposition des broches pour les boîtiers TO-can à 7 broches. 36
Figure 11 – Disposition des broches pour les boîtiers TO-can à 8 broches. 36
Figure 12 – Représentation schématique des boîtiers DML pour module TOSA avec
connecteur LC . 39
Figure 13 – Représentation schématique et brochage des boîtiers DML à fibres
amorces . 41

Tableau 1 – Définitions de la fonction des broches des boîtiers DML TO-can de type à
5 broches . 31
Tableau 2 – Définitions de la fonction des broches des boîtiers DML TO-can de type à

7 broches . 32
Tableau 3 – Définitions de la fonction des broches des boîtiers DML de type TO-can à
8 broches . 33
Tableau 4 – Cotes des boîtiers DML TO-can . 37
Tableau 5 – Cotes des boîtiers DML pour module TOSA avec connecteur LC . 39
Tableau 6 – Terminaisons par broche des boîtiers DML à module TOSA avec
connecteur LC et avec carte de circuit imprimé souple . 40
Tableau 7 – Cotes des boîtiers DML à fibres amorces .
...

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