Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.

Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres structures d’interconnexion et ensembles - Partie 5-601: Méthodes d’essai générales pour les matériaux et les assemblages - Essai d’aptitude au brasage par refusion pour un joint brasé, et essai de résistance à la chaleur de refusion pour les cartes imprimées

L'IEC 61189-5-601:2021 spécifie la méthode d’essai d’aptitude au brasage par refusion pour les composants montés sur les cartes imprimées rigides organiques, la méthode d’essai de résistance à la chaleur de refusion pour les cartes imprimées rigides organiques, et la méthode d’essai d’aptitude au brasage par refusion pour les pastilles de cartes imprimées rigides organiques dans les applications utilisant des alliages de brasure, qui sont des alliages étain-plomb (Pb) eutectiques ou quasi eutectiques, ou des alliages sans plomb.
Les matériaux de ces cartes imprimées rigides organiques sont des feuilles stratifiées renforcées en tissu de verre de type E époxyde, spécifiées dans l'IEC 61249-2 (toutes les parties).
Le but du présent document est de garantir l’aptitude au brasage du joint brasé et des pastilles des cartes imprimées. De plus, des méthodes d’essai sont présentées afin d’assurer que les cartes imprimées peuvent résister à la charge de chaleur à laquelle elles sont exposées durant le brasage.

General Information

Status
Published
Publication Date
02-Feb-2021
Current Stage
PPUB - Publication issued
Completion Date
03-Feb-2021
Ref Project

Buy Standard

Standard
IEC 61189-5-601:2021 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
English and French language
80 pages
sale 15% off
Preview
sale 15% off
Preview

Standards Content (sample)

IEC 61189-5-601
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-601: General test methods for materials and assemblies – Reflow

soldering ability test for solder joint, and reflow heat resistance test for printed

boards
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 5-601: Méthodes d’essai générales pour les matériaux et
les assemblages – Essai d’aptitude au brasage par refusion pour un joint brasé,
et essai de résistance à la chaleur de refusion pour les cartes imprimées
IEC 61189-5-601:2021-02(en-fr)
---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2021 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC

copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

your local IEC member National Committee for further information.

Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite

ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie

et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des

questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez

les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC

The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes

International Standards for all electrical, electronic and related technologies.
About IEC publications

The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the

latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch

The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the

variety of criteria (reference number, text, technical publications previews. With a subscription you will always

committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.

and withdrawn publications.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
The world's leading online dictionary on electrotechnology,
Stay up to date on all new IEC publications. Just Published
containing more than 22 000 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Customer Service Centre - webstore.iec.ch/csc
If you wish to give us your feedback on this publication or
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
A propos de l'IEC

La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des

Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC

Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la

plus récente, un corrigendum ou amendement peut avoir été publié.
Recherche de publications IEC - IEC online collection - oc.iec.ch

webstore.iec.ch/advsearchform Découvrez notre puissant moteur de recherche et consultez

La recherche avancée permet de trouver des publications IEC gratuitement tous les aperçus des publications. Avec un

en utilisant différents critères (numéro de référence, texte, abonnement, vous aurez toujours accès à un contenu à jour

comité d’études, …). Elle donne aussi des informations sur adapté à vos besoins.
les projets et les publications remplacées ou retirées.
Electropedia - www.electropedia.org
IEC Just Published - webstore.iec.ch/justpublished
Le premier dictionnaire d'électrotechnologie en ligne au
Restez informé sur les nouvelles publications IEC. Just
monde, avec plus de 22 000 articles terminologiques en
Published détaille les nouvelles publications parues.
anglais et en français, ainsi que les termes équivalents dans
Disponible en ligne et une fois par mois par email.
16 langues additionnelles. Egalement appelé Vocabulaire
Electrotechnique International (IEV) en ligne.
Service Clients - webstore.iec.ch/csc
Si vous désirez nous donner des commentaires sur cette
publication ou si vous avez des questions contactez-nous:
sales@iec.ch.
---------------------- Page: 2 ----------------------
IEC 61189-5-601
Edition 1.0 2021-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Test methods for electrical materials, printed boards and other interconnection
structures and assemblies –
Part 5-601: General test methods for materials and assemblies – Reflow

soldering ability test for solder joint, and reflow heat resistance test for printed

boards
Méthodes d’essai pour les matériaux électriques, les cartes imprimées et autres
structures d’interconnexion et ensembles –
Partie 5-601: Méthodes d’essai générales pour les matériaux et
les assemblages – Essai d’aptitude au brasage par refusion pour un joint brasé,
et essai de résistance à la chaleur de refusion pour les cartes imprimées
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-9293-8

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 61189-5-601:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 6

1 Scope .............................................................................................................................. 8

2 Normative references ...................................................................................................... 8

3 Terms and definitions ...................................................................................................... 9

4 Grouping of soldering processes and related test severities .......................................... 10

5 Specimens ..................................................................................................................... 11

5.1 Devices ................................................................................................................. 11

5.2 Test substrate ....................................................................................................... 13

5.3 Solder paste ......................................................................................................... 13

5.4 Solder ball ............................................................................................................ 14

6 Apparatus and equipment .............................................................................................. 14

6.1 Constant temperature and humidity testing equipment .......................................... 14

6.2 Device-mounting equipment .................................................................................. 15

6.3 X-ray transmission equipment ............................................................................... 15

6.4 Electrical resistance recorder ................................................................................ 15

6.5 Warpage measurement equipment ........................................................................ 15

6.6 Temperature cycling chamber ............................................................................... 16

6.7 Pull strength test equipment .................................................................................. 16

7 Tg Solder joint initial quality after reflow ...................................................................... 16

7.1 General ................................................................................................................. 16

7.2 Specimen preparation ........................................................................................... 16

7.3 Pre-process .......................................................................................................... 16

7.3.1 Pre-conditioning ............................................................................................ 16

7.3.2 Initial measurement ....................................................................................... 16

7.3.3 Moistening process (1) .................................................................................. 17

7.3.4 Baking and warp correction ........................................................................... 17

7.3.5 Pre-reflow heating ......................................................................................... 17

7.3.6 Moistening process (2) .................................................................................. 17

7.4 Assembly process ................................................................................................. 17

7.4.1 Solder paste printing ...................................................................................... 17

7.4.2 Device mounting ............................................................................................ 18

7.4.3 Reflow heating ............................................................................................... 21

7.5 Recovery .............................................................................................................. 22

7.6 Final measurement ............................................................................................... 22

8 Tg warpage of component and printed boards in reflow process .................................. 22

8.1 General ................................................................................................................. 22

8.2 Specimen preparation ........................................................................................... 22

8.3 Assembly process ................................................................................................. 23

8.3.1 Initial measurement ....................................................................................... 23

8.3.2 Baking and warp correction ........................................................................... 23

8.3.3 Pre-reflow heating ......................................................................................... 23

8.4 Final measurement ............................................................................................... 23

8.4.1 Warpage measurement .................................................................................. 23

8.4.2 Measurement area ......................................................................................... 23

8.4.3 Gap measurement ......................................................................................... 23

---------------------- Page: 4 ----------------------
IEC 61189-5-601:2021 © IEC 2021 – 3 –

9 Tg Resistance to soldering heat of printed boards ....................................................... 25

9.1 General ................................................................................................................. 25

9.2 Specimen preparation ........................................................................................... 26

9.3 Pre-process .......................................................................................................... 26

9.3.1 Pre-conditioning ............................................................................................ 26

9.3.2 Initial measurement ....................................................................................... 26

9.3.3 Moistening process (1) .................................................................................. 26

9.3.4 Baking and warp correction ........................................................................... 26

9.4 Reflow heating ...................................................................................................... 26

9.5 Final measurement ............................................................................................... 27

10 Tg Wetting and dewetting of a printed-board land ........................................................ 27

10.1 General ................................................................................................................. 27

10.2 Specimen preparation ........................................................................................... 27

10.3 Pre-process .......................................................................................................... 27

10.3.1 Pre-conditioning ............................................................................................ 27

10.3.2 Initial measurement ....................................................................................... 28

10.3.3 Moistening process (1) .................................................................................. 28

10.3.4 Pre-baking ..................................................................................................... 28

10.3.5 Pre-reflow heating ......................................................................................... 28

10.3.6 Moistening process (2) .................................................................................. 28

10.4 Assembly process ................................................................................................. 28

10.4.1 Solder paste printing ...................................................................................... 28

10.4.2 Reflow heating ............................................................................................... 28

10.5 Final measurement ............................................................................................... 29

10.5.1 Measurement ................................................................................................. 29

10.5.2 Flux removal .................................................................................................. 30

11 Tg Resistance to dissolution of a printed-board land .................................................... 30

11.1 General ................................................................................................................. 30

11.2 Specimen preparation ........................................................................................... 31

11.3 Pre-process .......................................................................................................... 31

11.3.1 Pre-conditioning ............................................................................................ 31

11.3.2 Initial measurement ....................................................................................... 31

11.4 Assembly process ................................................................................................. 31

11.4.1 Solder paste printing ...................................................................................... 31

11.4.2 Reflow heating ............................................................................................... 31

11.5 Final measurement ............................................................................................... 31

11.5.1 Observation ................................................................................................... 31

11.5.2 Observation method ...................................................................................... 32

11.5.3 Measurement ................................................................................................. 32

11.5.4 Example of influence upon occurrence of dissolution ..................................... 33

12 Tg Pull strength of the test substrate land .................................................................... 33

12.1 General ................................................................................................................. 33

12.2 Specimen preparation ........................................................................................... 34

12.3 Pre-process .......................................................................................................... 34

12.3.1 Pre-conditioning ............................................................................................ 34

12.3.2 Initial measurement ....................................................................................... 34

12.3.3 Pre-baking ..................................................................................................... 34

12.3.4 Pre-reflow heating ......................................................................................... 34

---------------------- Page: 5 ----------------------
– 4 – IEC 61189-5-601:2021 © IEC 2021

12.4 Assembly process ................................................................................................. 34

12.4.1 Solder paste printing ...................................................................................... 34

12.4.2 Solder ball placement .................................................................................... 34

12.4.3 Reflow heating process ................................................................................. 35

12.5 Final measurement ............................................................................................... 35

12.5.1 Pull strength measurement ............................................................................ 35

12.5.2 Pull strength measuring method A – Probe heat bond method ....................... 35

12.5.3 Pull strength measuring method B – Ball pinch method .................................. 35

12.5.4 Pull strength measuring method C – Pin pull down method ............................ 36

12.5.5 Pull strength measuring method D – Lead pull method .................................. 36

12.5.6 Final observation ........................................................................................... 36

Annex A (informative) Test process items and meaning of processing contents and

condition ............................................................................................................................... 38

A.1 General ................................................................................................................. 38

A.2 Meaning of processing contents and condition ...................................................... 38

A.3 Test process items ................................................................................................ 38

Bibliography .......................................................................................................................... 40

Figure 1 – Example of a test circuit for the electrical continuity test of a solder joint ............. 12

Figure 2 – Example of area array type packages .................................................................. 12

Figure 3 – Example of leaded type devices ........................................................................... 12

Figure 4 – Example of leadless termination type devices ...................................................... 12

Figure 5 – Example of connector for card type devices ......................................................... 13

Figure 6 – Example of shielding metal components ............................................................... 13

Figure 7 – Recommended solder ball shape.......................................................................... 14

Figure 8 – Test procedure for Tg ......................................................................................... 16

Figure 9 – Example of printed conditions of solder paste ...................................................... 18

Figure 10 – Typical reflow soldering profile for Sn63Pb37 solder alloy .................................. 18

Figure 11 – Typical reflow soldering profile for Sn96,5Ag3Cu,5 solder alloy .......................... 19

Figure 12 – Reflow temperature profile for soldering ability ................................................... 20

Figure 13 – Temperature measurement of the package device using thermocouples ............ 21

Figure 14 – Temperature measurement of other specimen using thermocouples ................... 21

Figure 15 – Test procedure for Tg ....................................................................................... 22

Figure 16 – Contact point ...................................................................................................... 24

Figure 17 – Maximum gap ..................................................................................................... 25

Figure 18 – Test procedure for Tg ....................................................................................... 26

Figure 19 – Test procedure for Tg ....................................................................................... 27

Figure 20 – State of solder wetting........................................................................................ 30

Figure 21 – Solder contact angle .......................................................................................... 30

Figure 22 – Test procedure for Tg ....................................................................................... 31

Figure 23 – Evaluation of resistance to dissolution of land .................................................... 32

Figure 24 – Cross-section observation .................................................................................. 33

Figure 25 – Test procedure for Tg ....................................................................................... 34

Figure 26 – Measuring methods for pull strength ................................................................... 35

---------------------- Page: 6 ----------------------
IEC 61189-5-601:2021 © IEC 2021 – 5 –

Figure 27 – Breaking modes in pull strength test ................................................................... 37

Table 1 – Test items defined in this standard .......................................................................... 8

Table 2 – Grouping of soldering processes and typical test severities – Overview ................. 11

Table 3 – Stencil design standard for devices ....................................................................... 15

Table 4 – Maximum reflow heating conditions ....................................................................... 20

Table 5 – Minimum reflow heating conditions ........................................................................ 21

Table 6 – Wetting level ......................................................................................................... 29

Table A.1 – Meaning of processing contents and condition ................................................... 38

Table A.2 – Test process items and clauses ......................................................................... 39

---------------------- Page: 7 ----------------------
– 6 – IEC 61189-5-601:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5-601: General test methods for materials and assemblies –
Reflow soldering ability test for solder joint, and reflow heat
resistance test for printed boards
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their

preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with

may participate in this preparatory work. International, governmental and non-governmental organizations liaising

with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for

Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC

Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any

misinterpretation by any end user.

4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

transparently to the maximum extent possible in their national and regional publications. Any divergence between

any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and

members of its technical committees and IEC National Committees for any personal injury, property damage or

other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and

expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 61189-5-601 has been prepared by IEC technical committee 91: Electronics assembly

technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1601/CDV 91/1674/RVC

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
---------------------- Page: 8 ----------------------
IEC 61189-5-601:2021 © IEC 2021 – 7 –

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all parts in the IEC 61189 series, published under the general title Test methods for

electrical materials, printed boards and other interconnection structures and assemblies, can

be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
---------------------- Page: 9 ----------------------
– 8 – IEC 61189-5-601:2021 © IEC 2021
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS
AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES –
Part 5-601: General test methods for mate
...

Questions, Comments and Discussion

Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.