IEC 62148-21:2019

Fibre optic active components and devices - Package and interface standards - Part 21: Design guide of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

IEC 62148-21:2019 covers the design guide of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is informative. The purpose of this document is to specify adequately the electrical interface of PIC packages composed of optical transmitters and receivers that enable mechanical and electrical interchangeability of PIC packages.
Keywords: electrical interface of photonic integrated circuit (PIC) packages

Composants et dispositifs actifs fibroniques - Normes de boîtier et d’interface - Partie 21: Guide de conception de l’interface électrique des boîtiers PIC utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA)

IEC 62148-21: 2019 traite du guide de conception de l'interface électrique destinée aux boîtiers de circuits intégrés photoniques (PIC) utilisant des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FLGA). Dans le présent document, l'interface électrique destinée au boîtier S-FBGA est présentée à titre informatif. L'objet du présent document est de spécifier de manière adéquate l'interface électrique des boîtiers PIC composés d'émetteurs et de récepteurs optiques qui permettent l'interchangeabilité électrique et mécanique des boîtiers PIC.
Mots clés: l'interface électrique destinée aux boîtiers de circuits intégrés photoniques (PIC)

General Information

• Status: Published
• Publication Date: 10-Mar-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.120 - Electronic display devices
• ICS: 33.180.20 - Fibre optic interconnecting devices
• Technical Committee: SC 86C - Fibre optic systems and active devices
• Current Stage: DELPUB - Deleted Publication
• Start Date: 17-Apr-2020
• Completion Date: 22-Apr-2021

Relations

• Revised: IEC 62148-21:2021 - Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62148-21 ®
Edition 1.0 2019-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –
Part 21: Design guide of electrical interface of PIC packages using silicon fine-
pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Composants et dispositifs actifs fibroniques – Normes de boîtier et d'interface –
Partie 21: Guide de conception de l'interface électrique des boîtiers PIC utilisant
des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers
matriciels à zone de contact plate et à pas fins en silicium (S-FLGA)

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IEC 62148-21 ®
Edition 1.0 2019-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Fibre optic active components and devices – Package and interface standards –

Part 21: Design guide of electrical interface of PIC packages using silicon fine-

pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)

Composants et dispositifs actifs fibroniques – Normes de boîtier et d'interface –

Partie 21: Guide de conception de l'interface électrique des boîtiers PIC utilisant

des boîtiers matriciels à billes et à pas fins en silicium (S-FBGA) et des boîtiers

matriciels à zone de contact plate et à pas fins en silicium (S-FLGA)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 33.180.20 ISBN 978-2-8322-6636-6

– 2 – IEC 62148-21:2019 © IEC 2019
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Terminal position numbering . 6
5 Code of package nominal dimensions . 6
6 Symbols and drawings . 6
7 Dimensions and tolerances . 8
Bibliography . 13

Figure 1 – S-FBGA and S-FLGA outline . 7
Figure 2 – Mechanical gauge drawing . 8
Figure 3 – Array of terminal-existence areas . 8

Table 1 – Dimensions and tolerances . 9
Table 2 – Combination list of D, E, M , and M for e = 0,30 mm pitch S-FBGA
D E
(informative) . 11
Table 3 – Combination list of D, E, M , and M for e = 0,25 mm pitch S-FLGA . 12
D E
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guide of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

FOREWORD
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rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62148-21 has been prepared by subcommittee 86C: Fibre optic
systems and active devices, of IEC technical committee 86: Fibre optics.
The text of this International Standard is based on the following documents:
FDIS Report on voting
86C/1571/FDIS 86C/1577/RVD
Full information on the voting for the approval of this International Standard can be found in the
report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – IEC 62148-21:2019 © IEC 2019
A list of all parts in the IEC 62148 series, published under the general title Fibre optic active
components and devices – Package and interface standards, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES –
PACKAGE AND INTERFACE STANDARDS –

Part 21: Design guide of electrical interface of PIC
packages using silicon fine-pitch ball grid array (S-FBGA)
and silicon fine-pitch land grid array (S-FLGA)

1 Scope
This part of IEC 62148 covers the design guide of the electrical interface for photonic integrated
circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch
land grid array (S-FLGA). In this document, the electrical interface for the S-FBGA package is
informative.
The purpose of this document is to specify adequately the electrical interface of PIC packages
composed of optical transmitters and receivers that enable mechanical and electrical
interchangeability of PIC packages.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60050-731, International Electrotechnical Vocabulary – Chapter 731: Optical fib
...