IEC 60747-18-2:2020
(Main)Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
Semiconductor devices - Part 18-2: Semiconductor bio sensors - Evaluation process of lens-free CMOS photonic array sensor package modules
IEC 60747-18-2:2020(E) specifies the evaluation process of lens-free CMOS photonic array sensor package modules. This document includes the measurement environment of each process, statistical analysis of test data, middle layer effect under various user light, evaluation of calibrated lens-free CMOS photonic array sensor package modules, and test report.
General Information
Standards Content (Sample)
IEC 60747-18-2 ®
Edition 1.0 2020-02
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 18-2: Semiconductor bio sensors – Evaluation process of lens-free
CMOS photonic array sensor package modules
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary
(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.
need further assistance, please contact the Customer Service
Centre: sales@iec.ch.
IEC 60747-18-2 ®
Edition 1.0 2020-02
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices –
Part 18-2: Semiconductor bio sensors – Evaluation process of lens-free
CMOS photonic array sensor package modules
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01 ISBN 978-2-8322-7803-1
– 2 – IEC 60747-18-2:2020 © IEC 2020
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Measurement setup . 7
4.1 General . 7
4.2 Measurement system . 7
5 Measurement . 9
5.1 General . 9
5.2 Measurement in the standard condition . 11
5.2.1 General . 11
5.2.2 A: Sensor characteristics . 11
5.2.3 B: Spatial uniformity of user light . 12
5.2.4 C: Middle layer effect under collimated light . 13
5.2.5 D: Middle layer effect under user light . 14
5.2.6 E: Middle layer effect under first and second user light . 15
5.3 Measurement in general condition . 16
5.3.1 D1: First user light condition . 16
5.3.2 E1: First and second user light condition . 17
5.4 Reference for establishing the representative output value in the effective
area . 17
5.5 Various wavelengths(λ) of light . 17
6 Test report . 17
Bibliography . 18
Figure 1 – Example of lens-free CMOS photonic array sensor package modules . 7
Figure 2 – Example of measurement system with incident parallel light . 8
Figure 3 – Example of photoelectric measurement schematics . 9
Figure 4 – Test and calibration flow diagram . 10
Figure 5 – Test and calibration flow schematics . 10
Figure 6 – Example of measurement for sensor characteristics . 12
Figure 7 – Example of measurement for spatial uniformity of user light . 13
Figure 8 – Example of measurement for middle layer effect under collimated light . 14
Figure 9 – Example of measurement for middle layer effect under user light . 15
Figure 10 – Example of measurement for middle layer effect under first and second
user light . 16
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 18-2: Semiconductor bio sensors – Evaluation process of lens-free
CMOS photonic array sensor package modules
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-18-2 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/689/FDIS 47E/694/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
– 4 – IEC 60747-18-2:2020 © IEC 2020
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
INTRODUCTION
The IEC 60747-18 series on semiconductor bio sensors is composed of the following parts:
• IEC 60747-18-1 defines the test method and data analysis for calibration of lens-free
CMOS photonic array sensors
• IEC 60747-18-2 defines the evaluation process of lens-free CMOS photonic array sensor
package modules
• IEC 60747-18-3 defines the fluid flow characteristics of lens-free CMOS photonic array
sensor package modules with fluidic system
The IEC 60747-18 series includes subjects such as noise analysis, long-term reliability tests,
test methods for lens-free CMOS photonic array sensor package modules under patchable
environments, test methods under implantable environments, etc.
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of patents given in several
subclauses as indicated in the table below. These patents are held by their respective
inventors under license to SOL Inc.:
The method of calibration of packaged photonic
KR1020150187389 [SOL] Subclause 5.2.1, 5.2.2
sensor pixel array by evaluating its characteristic
PCT/KR2016/006109 [SOL]
METHOD FOR CORRECTING OPTICAL
Subclause 5.2.3, 5.2.4,
SENSOR ARRAY MODULE THROUGH
US15/577586 [SOL]
5.2.5
CHARACTERISTIC EVALUATION
JP2017562062 [SOL]
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences
under reasonable and non-discriminatory terms and conditions with applicants throughout the
world. In this respect, the statement of the holder of this patent right is registered with IEC.
Information may be obtained from:
SOL Inc.
H Business Park
C1010, 26, Beobwon-ro 9-gil, SongPa-Gu
Seoul 05838
Republic of Korea
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consul
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.