Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications

IEC 63244-1:2021 provides general requirements and specifications of the semiconductor devices for the performance and reliability evaluations of wireless power transfer and charging systems. For the performance evaluations, this part covers various characterization parameters and symbols, general system diagrams, and test setups and test conditions.
This document also describes classifications of the wireless power transfer technologies.

Dispositifs à semiconducteurs - Dispositifs à semiconducteurs pour le transfert de puissance et la charge sans fil - Partie 1: Exigences et spécifications générales

L’IEC 63244-1:2021 fournit des exigences et des spécifications générales des dispositifs à semiconducteurs pour les évaluations de fonctionnement et de fiabilité des systèmes de transfert de puissance et de charge sans fil. Dans le cas des évaluations de fonctionnement, la présente partie couvre différents paramètres et symboles de caractérisation, différents schémas de réseaux généraux, ainsi que différents montages et conditions d’essai.
Le présent document décrit également des classifications des techniques de transfert de puissance sans fil.

General Information

Status
Published
Publication Date
13-Sep-2021
Technical Committee
Current Stage
PPUB - Publication issued
Completion Date
14-Sep-2021
Ref Project

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IEC 63244-1
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor devices for wireless power transfer
and charging –
Part 1: General requirements and specifications
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert
de puissance et la charge sans fil –
Partie 1: Exigences et spécifications générales
IEC 63244-1:2021-09(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 63244-1
Edition 1.0 2021-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices – Semiconductor devices for wireless power transfer
and charging –
Part 1: General requirements and specifications
Dispositifs à semiconducteurs – Dispositifs à semiconducteurs pour le transfert
de puissance et la charge sans fil –
Partie 1: Exigences et spécifications générales
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.99 ISBN 978-2-8322-1023-2

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® Registered trademark of the International Electrotechnical Commission
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---------------------- Page: 3 ----------------------
– 2 – IEC 63244-1:2021 © IEC 2021
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and symbols........................................................................................ 8

3.1 Terms and definitions .............................................................................................. 8

3.1.1 General terminology ........................................................................................ 8

3.1.2 Terminology for near-field based wireless power transfer ................................ 9

3.1.3 Terminology for far-field based wireless power transfer ................................. 10

3.2 Symbols and abbreviated terms ............................................................................ 11

4 Classification ................................................................................................................. 12

5 Test items for reliability ................................................................................................. 14

5.1 General ................................................................................................................. 14

5.2 IP rating ................................................................................................................ 14

5.3 Temperature test .................................................................................................. 15

5.4 Humidity test ......................................................................................................... 15

5.5 Mechanical impact and vibration test .................................................................... 15

5.6 EMC test ............................................................................................................... 15

5.6.1 General ......................................................................................................... 15

5.6.2 Electromagnetic immunity .............................................................................. 15

5.6.3 Electromagnetic emission .............................................................................. 15

6 Performance evaluation items ........................................................................................ 16

6.1 Efficiency .............................................................................................................. 16

6.1.1 General ......................................................................................................... 16

6.1.2 Block diagram for efficiency analysis ............................................................. 16

6.1.3 Component-level efficiency ............................................................................ 17

6.1.4 Module-level efficiency .................................................................................. 20

6.1.5 System-level power transfer efficiency ........................................................... 22

6.2 Evaluation components in PTx and PRx ................................................................ 23

6.2.1 General ......................................................................................................... 23

6.2.2 Rectifier and ripple smoothing circuit ............................................................. 23

6.2.3 DC to DC converter ....................................................................................... 26

6.2.4 Inverter .......................................................................................................... 27

6.2.5 Variable gain amplifier (VGA) ........................................................................ 29

Annex A (informative) Field regions for electromagnetically short antenna ........................... 32

Bibliography .......................................................................................................................... 33

Figure 1 – Classification of WET technologies ...................................................................... 13

Figure 2 – Example of reliability test conditions and items .................................................... 14

Figure 3 – Block diagram for efficiency analysis of MF WPT system ..................................... 16

Figure 4 – Block diagram for efficiency analysis of EMW WPT system .................................. 16

Figure 5 – Measurement setup for AC to DC converting efficiency or rectifying

efficiency .............................................................................................................................. 18

Figure 6 – Measurement setup for DC to DC converting efficiency ........................................ 19

Figure 7 – Measurement setup for DC to AC converting efficiency ........................................ 20

---------------------- Page: 4 ----------------------
IEC 63244-1:2021 © IEC 2021 – 3 –
Figure 8 – Measurement setup for coupling efficiency between transmitting and

receiving coils ....................................................................................................................... 21

Figure 9 – Measurement setup for power transfer efficiency between power

transmitting and receiving antennas ...................................................................................... 22

Figure 10 – Semiconductor components in PTx and PRx ...................................................... 23

Figure 11 – Half-wave rectifier and input/output waveform .................................................... 25

Figure 12 – Full-wave rectifier and input/output waveform ..................................................... 26

Figure 13 – Diode- bridge rectifier and RC smoothing circuits ............................................... 26

Figure 14 – Example of step down converter (Buck converter) and step up converter

(Boost converter) .................................................................................................................. 27

Figure 15 – Example of equivalent circuit and square AC output signal ................................. 28

Figure 16 – Block diagram of VGA ........................................................................................ 29

Figure 17 – 3 dB bandwidth .................................................................................................. 30

Figure 18 – P1dB, MDS and dynamic input range of a variable gain amplifier ....................... 30

Figure A.1 – Field regions for electromagnetically short antenna .......................................... 32

Table 1 – Letter symbols and abbreviated terms ................................................................... 12

Table 2 – Example of blank specifications: classification of wireless power transfer

methods and distance according to products and power consumption ................................... 13

Table 3 – Example of blank specifications of a rectifier diode................................................ 24

Table 4 – Example of blank specifications of a step- down DC-to-DC converter .................... 27

Table 5 – Example of blank specifications of an inverter used for MF WPT ........................... 28

---------------------- Page: 5 ----------------------
– 4 – IEC 63244-1:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR DEVICES FOR WIRELESS
POWER TRANSFER AND CHARGING –
Part 1: General requirements and specifications
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international

co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and

in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,

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Standardization (ISO) in accordance with conditions determined by agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent

rights. IEC shall not be held responsible for identifying any or all such patent rights.

IEC 63244-1 has been prepared by IEC technical committee 47: Semiconductor devices. It is

an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
47/2706/FDIS 47/2723/RVD

Full information on the voting for its approval can be found in the report on voting indicated in

the above table.
The language used for the development of this International Standard is English.
---------------------- Page: 6 ----------------------
IEC 63244-1:2021 © IEC 2021 – 5 –

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in

accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available

at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are

described in greater detail at www.iec.ch/standardsdev/publications.

A list of all the parts in the IEC 63244 series, published under the general title Semiconductor

devices – Semiconductor devices for wireless power transfer and charging, can be found on

the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct understanding

of its contents. Users should therefore print this document using a colour printer.

---------------------- Page: 7 ----------------------
– 6 – IEC 63244-1:2021 © IEC 2021
INTRODUCTION
The IEC 63244 series is planned to comprise the following parts:

• IEC 63244-1: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 1: General requirements and specifications

• IEC 63244-2: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 2: Far-field based wireless power transfer – Electromagnetic-wave

based wireless power transfer

• IEC 63244-3-1: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 3-1: Near-field based wireless power transfer – Magnetic-field based

wireless power transfer

• IEC 63244-3-2: Semiconductor devices – Semiconductor devices for wireless power transfer

and charging – Part 3-2: Near-field based wireless power transfer – Electric-field based

wireless power transfer

The standardization bodies for wireless power transfer and charging technologies is as follow:

1) Wireless power consortium (WPC): Wireless power consortium covers MF WPT technology

such as inductive WPT and magnetic resonance WPT. WPC has Qi certification process to

ensure the safety and quality.

2) AirFuel alliance: AirFuel alliance covers NF WPT technology such as resonant mode of

magnetic-field based wireless power transfer. And also, AirFuel alliance is working on FF

WPT technology such as electromagnetic-wave based wireless power transfer. AirFuel

alliance has Rezence certification process for resonant mode of MF WPT to ensure the

safety and quality. AirFuel alliance was formed by the merge of Alliance for Wireless Power

(A4WP) and Power Matters Alliance (PMA) in 2015.
---------------------- Page: 8 ----------------------
IEC 63244-1:2021 © IEC 2021 – 7 –
SEMICONDUCTOR DEVICES –
SEMICONDUCTOR DEVICES FOR WIRELESS
POWER TRANSFER AND CHARGING –
Part 1: General requirements and specifications
1 Scope

This part of IEC 63244 provides general requirements and specifications of the semiconductor

devices for the performance and reliability evaluations of wireless power transfer and charging

systems. For the performance evaluations, this part covers various characterization parameters

and symbols, general system diagrams, and test setups and test conditions.

This document also describes classifications of the wireless power transfer technologies.

2 Normative references

The following documents are referred to in the text in such a way that some or all of their content

constitutes requirements of this document. For dated references, only the edition cited applies.

For undated references, the latest edition of the referenced document (including any

amendments) applies.
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat

IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature

IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic

(12 + 12 h cycle)
IEC 60529, Degrees of protection provided by enclosures (IP Code)

IEC 60749-10, Semiconductor devices – Mechanical and climatic test methods – Part 10:

Mechanical shock

IEC 61967-2, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to

1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell method

IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions – Part 4:

Measurement of conducted emissions – 1 Ω /150 Ω direct coupling method

IEC 61967-8, Integrated circuits – Measurement of electromagnetic emissions – Part 8:

Measurement of radiated emissions – IC stripline method

IEC 62132-2, Integrated circuits – Measurement of electromagnetic immunity – Part 2:

Measurement of radiated immunity – TEM cell and wideband TEM cell method

IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to 1 GHz

– Part 4: Direct RF power injection method
---------------------- Page: 9 ----------------------
– 8 – IEC 63244-1:2021 © IEC 2021

IEC 62132-8, Integrated circuits – Measurement of electromagnetic immunity – Part 8:

Measurement of radiated immunity – IC stripline method

IEC 62262, Degrees of protection provided by enclosures for electrical equipment against

external mechanical impacts (IK code)

IEC 62969-2:2018, Semiconductor devices – Semiconductor interface for automotive vehicles

– Part 2: Efficiency evaluation methods of wireless power transmission using resonance for

automotive vehicles sensors

IEC CISPR 11, Industrial, scientific and medical equipment – Radio-frequency disturbance

characteristics – Limits and methods of measurement
3 Terms, definitions and symbols
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

NOTE The following terms and definitions are classified into general terminology, terminology for near-field based

wireless power transfer, and terminology for far-field based wireless power transfer.

3.1 Terms and definitions
3.1.1 General terminology
3.1.1.1
wireless energy transfer
WET

transfer of electrical, optical, acoustic and other type of energies from a source to an electrical

load via electric and/or magnetic fields, electromagnetic waves, acoustic waves, etc.

3.1.1.2
wireless power transfer
WPT

transfer of electrical energy from a power source to an electrical load via electric and/or

magnetic fields or electromagnetic waves

Note 1 to entry: The alternative term “wireless power transmission” is also often used in technical documents.

3.1.1.3
power receiver
PRx

device receiving electrical power from a transmitting device or transmitting devices

Note 1 to entry: The alternative term “power receiving unit (PRU)” is also often used in technical documents. And

also, “secondary device” is used in CISPR 11.
3.1.1.4
power transmitter
PTx
device sending electrical power to a receiving device or receiving devices

Note 1 to entry: The alternative term “power transmitting unit (PTU)” is also often used in technical documents. And

also, “primary device” is used in CISPR 11.
---------------------- Page: 10 ----------------------
IEC 63244-1:2021 © IEC 2021 – 9 –
3.1.2 Terminology for near-field based wireless power transfer
3.1.2.1
power receiving coil

power receiving coiled inductor that is induced by a time-varying magnetic field from a power

transmitting coil(s)

Note 1 to entry: The alternative term “the secondary coil” is also often used in technical documents. And also, the

alternative term “receiving resonator coil” is also used in IEC 62969-2.
3.1.2.2
power transmitting coil

power transmitting coiled inductor that induces a voltage across a power receiving coil(s)

Note 1 to entry: The alternative term “the primary coil” is also often used in technical documents. And also, the

alternative term “transmitting resonator coil” is also used in IEC 62969-2.
3.1.2.3
near-field based wireless power transfer
NF WPT

wireless electrical power transfer from a power transmitter(s) to a power receiver(s) that is(are)

located within an induced magnetic or electric field
3.1.2.4
magnetic-field based wireless power transfer
MF WPT

wireless electrical power transfer from a power transmitter(s) to a power receiver(s) that is(are)

located within an induced magnetic field
3.1.2.5
non-resonant mode of magnetic-field based wireless power transfer

wireless electrical power transfer between power transmitting coiled inductor(s) and power

receiving coiled inductor(s) using an induced magnetic field without a resonance

Note 1 to entry: The alternative term “inductive wireless power transfer” is also often used in technical documents.

3.1.2.6
resonant mode of magnetic-field based wireless power transfer

wireless electrical power transfer between power transmitting coiled inductor(s) and power

receiving coiled inductor(s) using an induced magnetic-field with a resonance

Note 1 to entry: Four coiled inductors system has one source coiled inductor, two resonated coiled inductors and

one load coiled inductor. Two coiled inductors system has only two resonated coiled inductors.

Note 2 to entry: The alternative term “magnetic resonance wireless power transfer” is also often used in technical

documents.
3.1.2.7
electric-field based wireless power transfer
EF WPT

wireless electrical power transfer from a power transmitter(s) to a power receiver(s) that is(are)

located within an induced electric field

Note 1 to entry: The alternative term “capacitive coupling wireless power transfer” is also often used in technical

documents.
---------------------- Page: 11 ----------------------
– 10 – IEC 63244-1:2021 © IEC 2021
3.1.2.8
resonant frequency

specific resonated frequency determined by inductance of the coiled inductor and capacitance

of matching capacitor in the resonant mode of magnetic-field based wireless power transfer

Note 1 to entry: AirFuel uses 6,78 MHz ± 15 kHz as a resonant frequency.
3.1.2.9
coupling coefficient
coefficient that indicates the degree of magnetic coupling between two coils

Note 1 to entry: The alternative term “coupling factor” is also often used in technical documents and the coupling

coefficient is greater or equal to 0 and less than 1.
3.1.2.10
critically coupled distance

optimum distance between a power transmitting coil(s) and a power receiving coil(s) where

maximum wireless power transfer is obtained
3.1.2.11
loosely coupled distance

distance longer than the critically coupled distance where less magnetic coupling is obtained

because a magnetic flux from a power transmitting coil(s) is not fully reached to a receiving

coil(s)
3.1.2.12
over coupled distance

distance closer than the critically coupled distance where less magnetic coupling is obtained

because a formation of magnetic flux is hindered by the effect of anti-resonance
3.1.2.13
tightly coupled system

MF WPT system having a coupling coefficient of about 1 by using a magnetic core inside the

power transmitting and receiving coils
3.1.2.14
proximity range of magnetic-field based wireless power transfer

wireless power transfer range of MF WPT that has the distance of less than 10 mm between a

power transmitter(s) and a power receiver(s)
3.1.2.15
effective range of magnetic-field based wireless power transfer
wireless power transfer range of MF WPT that h
...

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