IEC 62024-1:2024

High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor

IEC 62024-1:2024 specifies the electrical characteristics and measuring methods for the nanohenry range chip inductor that is normally used in the high frequency (over 100 kHz) range.
This edition includes the following significant technical changes with respect to the previous edition:
a) addition of S parameter measurement;
b) addition of the inductance, Q-factor and impedance of an inductor which are measured by the reflection coefficient method with a network analyzer;
c) addition of the resonance frequency of an inductor which is measured by a two-port network analyzer;
d) addition of the mounting method for a surface mounting inductor with Pb-free solder.
The content of the corrigendum 1 (2025-12) has been included in this copy.

Composants inductifs à haute fréquence - Caractéristiques électriques et méthodes de mesure - Partie 1: Bobine d'inductance pastille de l'ordre du nanohenry

L'IEC 62024-1:2024 spécifie les caractéristiques électriques et les méthodes de mesure pour l'inductance pastille de l'ordre du nanohenry qui est normalement utilisée dans la plage des hautes fréquences (supérieures à 100 kHz).
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) ajout du mesurage des paramètres S;
b) ajout des mesurages de l'inductance, du facteur Q et de l'impédance d'une bobine d'inductance par la méthode du facteur de réflexion au moyen d'un analyseur de réseau;
c) ajout du mesurage de la fréquence de résonance d'une bobine d'inductance par un analyseur de réseau à deux accès;
d) ajout de la méthode de montage d'une bobine d'inductance à montage en surface par brasage sans plomb.
Le contenu du corrigendum 1 (2025-12) a été pris en considération dans cet exemplaire.

General Information

• Status: Published
• Publication Date: 16-Jul-2024
• ICS: 29.100.10 - Magnetic components
• Technical Committee: TC 51 - Magnetic components, ferrite and magnetic powder materials
• Drafting Committee: WG 9 - TC 51/WG 9
• Current Stage: PPUB - Publication issued
• Start Date: 17-Jul-2024
• Completion Date: 02-Aug-2024

Relations

• Corrected By: IEC 62024-1:2024/COR1:2025 - Corrigendum 1 - High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
• Effective Date: 14-Nov-2025
• Revises: IEC 62024-1:2017 - High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor
• Effective Date: 05-Sep-2023

Overview

IEC 62024-1:2024 - Edition 4.0 - is the International Electrotechnical Commission standard that defines electrical characteristics and measurement methods for nanohenry range chip inductors used in the high‑frequency domain (over 100 kHz). This 2024 revision (with Corrigendum 1 included) modernizes test procedures to reflect network‑analyzer based measurements and surface‑mount assembly practices.

Key topics and requirements

The standard specifies standardized measurement methods, test setups and reporting for core electrical parameters of nanohenry chip inductors, including:

• Inductance, Q‑factor and impedance - defined measurement methods and calculation formulas for consistent results.
• S‑parameter measurement - addition of two‑port and one‑port S‑parameter procedures for accurate high‑frequency characterization.
• Reflection coefficient methods - procedures for deriving inductance, Q and impedance from reflection (one‑port) network analyzer data.
• Resonance measurements - including self‑resonance frequency and resonance measured with two‑port network analyzers.
• DC resistance - voltage‑drop and bridge methods for low‑frequency resistance measurement and temperature considerations.
• Test fixtures, calibration and de‑embedding - guidance on TRL calibration, fixture representation (ABCD matrices) and eliminating residual fixture effects to obtain DUT parameters.
• Mounting and soldering - normative annex covering surface‑mount inductor mounting methods with Pb‑free solder, PCB land design, cleaning and test conditions.
• Test documentation - ensuring repeatable setups, mounting details and measurement conditions are recorded for traceability.

Practical applications and users

This standard is essential for professionals concerned with high‑frequency inductive components where consistent electrical characterization is critical:

• Inductor manufacturers - to standardize internal QC and supply data sheets with industry‑accepted measurement results.
• Test and calibration laboratories - to implement validated S‑parameter and reflection methods, calibration sequences and de‑embedding techniques.
• RF/microwave and power electronics designers - to compare components and predict circuit behavior (resonance, impedance, Q) in filters, matching networks and EMI suppression.
• Procurement and compliance teams - to specify acceptance criteria and ensure interoperability across suppliers.
• Assembly engineers - to follow recommended Pb‑free mounting practices that affect high‑frequency performance.

Related standards

• Part of the IEC 62024 series (High frequency inductive components - electrical characteristics and measuring methods).
• Prepared by IEC Technical Committee 51 (Magnetic components). Users should consult other parts of IEC 62024 and relevant calibration and RF measurement standards for full test-system implementation.

Keywords: IEC 62024-1, nanohenry range chip inductor, high frequency inductive components, S‑parameter, reflection coefficient, network analyzer, Q‑factor, self‑resonance frequency, Pb‑free solder, measurement methods.

Standards Content (Sample)

IEC 62024-1 ®
Edition 4.0 2024-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Electrical characteristics and measuring
methods –
Part 1: Nanohenry range chip inductor

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IEC 62024-1 ®
Edition 4.0 2024-07
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Electrical characteristics and
measuring methods –
Part 1: Nanohenry range chip inductor
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.100.10 ISBN 978-2-8322-9414-7

– 2 – IEC 62024-1:2024 RLV © IEC 2024
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Inductance, Q-factor and impedance. 6
4.1 Inductance . 6
4.1.1 Measuring method . 6
4.1.2 Measuring circuit . 7
4.1.3 Mounting the inductor for the test . 9
4.1.4 Measuring method and calculation formula . 12
4.1.5 Notes on measurement . 13
4.2 Quality factor . 15
4.2.1 Measuring method . 15
4.2.2 Measuring circuit . 15
4.2.3 Mounting the inductor for test . 15
4.2.4 Measuring method and calculation formula . 15
4.2.5 Notes on measurement . 16
4.3 Impedance . 16
4.3.1 Measuring method . 16
4.3.2 Measuring circuit . 16
4.3.3 Mounting the inductor for test . 16
4.3.4 Measuring method and calculation . 16
4.3.5 Notes on measurement . 17
5 Resonance frequency . 17
5.1 Self-resonance frequency . 17
5.2 Minimum output method . 17
5.2.1 General . 17
5.2.2 Measuring circuit . 17
5.2.3 Mounting the inductor for test . 18
5.2.4 Measuring method and calculation formula . 19
5.2.5 Note on measurement . 20
5.3 Reflection method .
5.3 Measurement by analyzer . 23
5.3.1 Measurement by impedance analyzer and one-port network analyzer . 23
5.3.2 Measurement by two-port network analyzer . 23
6 DC resistance . 23
6.1 Voltage-drop method. 23
6.1.1 Measuring circuit . 23
6.1.2 Measuring method and calculation formula . 24
6.2 Bridge method . 25
6.2.1 Measuring circuit . 25
6.2.2 Measuring method and calculation formula . 25
6.3 Notes on measurement . 25
6.4 Measuring temperature . 26
7 S-parameter . 26
7.1 Measurement setup and procedure . 26

7.1.1 General . 26
7.1.2 Two-port S-parameter . 27
7.1.3 Test fixture . 27
7.2 Calibrations and verification of test setup . 28
7.2.1 General . 28
7.2.2 Calibration . 29
7.2.3 De-embedding . 32
7.3 Indirect method of impedance . 32
7.4 Evaluation from the two-port S-parameter . 32
Annex A (normative) Mounting method for a surface mounting inductor . 35
A.1 Overview. 35
A.2 Mounting printed-circuit board and mounting land . 35
A.3 Solder . 35
A.4 Test condition . 35
A.5 Cleaning . 35
Annex B (normative) Elimination of residual parameter effects in test fixture . 37
B.1 Overview. 37
B.2 Test fixture represented by the ABCD matrix of a two-terminal pair network . 37
Bibliography . 39

Figure 1 – Example of circuit for vector voltage/current method . 8
Figure 2 – Example of circuit for reflection coefficient method . 9
Figure 3 – Fixture A . 9
Figure 4 – Fixture B . 11
Figure 5 – Fixture C . 12
Figure 6 – Short device shape . 14
Figure 7 – Example of test circuit for the minimum output method . 18
Figure 8 – Self-resonance frequency test board (minimum output method) . 19
Figure 9 – Suitable test fixture for measuring self-resonance frequency .
Figure 9 – Example of test circuit for voltage-drop method . 24
Figure 10 – Example of test circuit for bridge method . 25
Figure 11 – Schematic diagram of the two-port S-parameter measurement setup and
the network analyzer . 27
Figure 12 – S-parameter test fixture for two-terminal devices . 27
Figure 13 – Test fixture for a two-terminal device (shunt connection) . 28
Figure 14 – Test fixture for a two-terminal device (series connection) . 28
Figure 15 – Examples of the standards for TRL calibration . 30
Figure 16 – Examples of the standards for TRL calibration with microprobes . 31
Figure 17 – Examples of full two-port de-embedding with microprobes . 32
Figure 18 – Two-port measurement of a two-terminal device in shunt connection . 33
Figure 19 – Two-port measurement of a two-terminal device in series connection . 33
Figure B.1 – Test fixture represented by the ABCD matrix . 37

Table 1 – Dimensions of l and d . 10
Table 2 – Short device dimensions and inductances . 15

– 4 – IEC 62024-1:2024 RLV © IEC 2024
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 1: Nanohenry range chip inductor

FOREWORD
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shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 62024-1:2017. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
IEC 62024-1 has been prepared by IEC technical committee 51: Magnetic components, ferrite
and magnetic powder materials. It is an International Standard.
This fourth edition cancels and replaces the third edition published in 2017. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) addition of S parameter measurement;
b) addition of the inductance, Q-factor and impedance of an inductor which are measured by
the reflection coefficient method with a network analyzer;
c) addition of the resonance frequency of an inductor which is measured by a two-port network
analyzer;
d) addition of the mounting method for a surface mounting inductor with Pb-free solder.
The text of this International Standard is based on the following documents:
Draft Report on voting
51/1500/FDIS 51/1511/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts of the IEC 62024 series, published under the general title High frequency
inductive components – Electrical characteristics and measuring methods, can be found on the
IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

– 6 – IEC 62024-1:2024 RLV © IEC 2024
HIGH FREQUENCY INDUCTIVE COMPONENTS –
ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 1: Nanohenry range chip inductor

1 Scope
This part of IEC 62024 specifies the electrical characteristics and measuring methods for the
nanohenry range chip inductor that is normally used in the high frequency (over 100 kHz) range.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of defined
flammability (vertical burning test) copper-clad
IEC 62025-1, High frequency inductive components – Non-electrical characteristics and
measuring methods – Part 1: Fixed, surface mounted inductors for use in electronic and
telecommunication equipment
ISO 6353-3, Reagents for chemical analysis – Part 3: Specifications – Second series
ISO 9453, Soft solder alloys – Chemical compositions and forms
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
4 Inductance, Q-factor and impedance
4.1 Inductance
4.1.1 Measuring method
The inductance of an inductor is measured by either the vector voltage/current method
(impedance analyzer) or the reflection coefficient method (network analyzer).

4.1.2 Measuring circuit
An example of the circuit for the vector voltage/current method is shown in Figure 1 and an
example of the circuit for the reflection coefficient method is shown in Figure 2.

Ev
L
x
R
R
g
L
s
C
d
Ev
R
s
G
IEC
Key
R source resistance (50 Ω)
g
R resistor
L inductance of inductor under test
x
C distributed capacitance of inductor under test
d
L series inductance of inductor under test
s
R series resistance of inductor under test
s
phase reference signal
Ev , Ev vector voltmeter
1 2
G signal generator
– 8 – IEC 62024-1:2024 RLV © IEC 2024

Key
R source resistance (50 Ω)
g
R resistor
L inductor under test
L inductance of inductor under test
x
C parallel capacitance of inductor under test
d
L series inductance of inductor under test
s
R series resistance of inductor under test
s
Ev , Ev vector voltmeter
1 2
G signal generator
Figure 1 – Example of circuit for vector voltage/current method

Key
R source resistance (50 Ω)
g
R , R termination resistor (50 Ω)
t1 t2
L inductor under test
C parallel capacitance of inductor under test
d
L series inductance of inductor under test
s
R series resistance of inductor under test
s
Ev , Ev vector voltmeter
1 2
G signal generator
L 50 Ω micro-strip line or equivalent transmission line
Figure 2 – Example of circuit for reflection coefficient method
4.1.3 Mounting the inductor for the test
4.1.3.1 General
The inductor shall be measured mounted in a test fixture as specified in the relevant standard.
If no fixture is specified, one of the following test fixtures A, B or C shall be used. The fixture
used shall be reported.
4.1.3.2 Fixture A
The shape and dimensions of fixture A shall be as shown in Figure 3 and Table 1.

Figure 3 – Fixture A
– 10 – IEC 62024-1:2024 RLV © IEC 2024
Table 1 – Dimensions of l and d
a
l d
Size of inductor under test
mm mm
1608 1,6 0,95
1005 1,0 0,60
0603 0,6 0,36
0402 0,4 0,26
0201 0,2 0,12
a
The outline dimensions of the surface mounted inductor shall be indicated by a four-digit number based on
two significant figures for each dimension L and W (or H) (refer to IEC 62025-1).

The electrodes of the test fixture shall contact the electrodes of the inductor under test by
mechanical force provided by an appropriate method. This force shall be chosen so as to
provide satisfactory measurement stability without influencing the characteristics of the inductor.
The electrode mechanical force shall be specified. A characteristic impedance of the structure
between the measurement circuit and the test fixture shall maintain a characteristic impedance
as close as possible to 50 Ω.
4.1.3.3 Fixture B
The test fixture B as shown in Figure 4 shall be used.

External electrode
Inductor under test
Central electrode
d
Dielectric material
Structure of connection with
measurement circuit
IEC
Figure 4 – Fixture B
The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
test by mechanical force provided by an appropriate method. This force shall be chosen so as
to provide satisfactory measurement stability without influencing the characteristics of the
inductor. The electrode mechanical force shall be specified. A characteristic impedance of the
structure between the measurement circuit and the test fixture shall maintain a characteristic
impedance as close as possible to 50 Ω. Dimension d shall be specified between the parties
concerned.
– 12 – IEC 62024-1:2024 RLV © IEC 2024
4.1.3.4 Fixture C
The test fixture C as shown in Figure 5 shall be used.

Figure 5 – Fixture C
The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
test by mechanical force provided by an appropriate method. This force shall be chosen so as
to provide satisfactory measurement stability without influencing the characteristics of the
inductor. The mechanical force shall be specified. A characteristic impedance of the structure
between the measurement circuit and the test fixture shall maintain a characteristic impedance
as close as possible to 50 Ω. The dimensions of the patterns of the fixture and material of the
fixture shall be specified between the parties concerned.
4.1.4 Measuring method and calculation formula
Inductance L of the inductor L L is defined by the vector sum of the reactance caused by L
x x s
and C (see Figure 1 or Figure 2). The frequency f of the signal generator output signal shall
d
be set to a frequency as separately specified. The inductor under test shall be connected to the
measurement circuit by using the test fixture as described in 4.1.3.2 to 4.1.3.4. Vector voltages
E and E shall be measured by vector voltage meters Ev and Ev , respectively. The
1 2 1 2
inductance L shall be calculated by Formula (1) and Formula (2) for the vector voltage/current
x
method, or Formula (3) to Formula (5) for the reflection coefficient method:
 E 
lm R
 
E
 2 
L =
(1)
x
ω
where
L is the inductance of the inductor under test;
x
lm is the imaginary part of the complex value;
R is the resistance of the resistor;
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev ;
2 2
ω is the angular frequency: 2πf.

lm Z
[ ]
x
(1)
L =
x
ω
E
ZR=
(2)
x
E
where
is the inductance of the inductor under test;
L
x
lm is the imaginary part of the complex value;
Z is the impedance of the inductor under test;
x
R is the resistance of the resistor;
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev ;
2 2
ω is the angular frequency: 2πf.
lm Z
[ ]
x
(3)
L =
x
ω
E
ZR=
(4)
x
E
E
S =
(5)
E
where
is the inductance of the inductor under test;
L
x
lm is the imaginary part of the complex value;
Z is the impedance of the inductor under test;
x
R is the resistance of the resistor;
S is the reflection coefficient of the inductor under test;
Z is the system impedance of the measurement system (50 Ω);
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev ;
2 2
ω is the angular frequency: 2πf.
4.1.5 Notes on measurement
4.1.5.1 General
The electrical length of the test fixture shall be compensated by an appropriate method followed
by open-short compensation. If an electrical length that is not commonly accepted is used, it
shall be specified. Open-short compensation shall be calculated by the following formulae
Annex B.
– 14 – IEC 62024-1:2024 RLV © IEC 2024
Z − B
m c
Z = A (2)
x c
1− Z C
m c
A = 1 + j0 (3)
c
Z − (1− Y Z )Z − Z Y Z
sm om sm ss sm os ss
B = (4)
c
1− Y Z Y Z
om sm os ss
Y − (1− Y Z )Y − Y Y Z
om om sm os om os ss
C = (5)
c
1− Y Z Y Z
om sm os ss
where
Z is the impedance measurement value after compensation;
x
Z is the impedance measurement value before compensation;
m
Z is the impedance measurement value of the short device;
sm
Z is the short device inductance as defined in 4.1.5.2;
ss
Y is the admittance measurement value of the fixture with test device absent;
om
Y is the admittance measurement value of the test fixture as defined in 4.1.5.3.
os
4.1.5.2 Short compensation
For test fixture A, the applicable short device dimension and shape are as shown in Figure 6
and Table 2. The appropriate short device inductance shall be selected from Table 2 depending
on the dimension of the inductor under test. The inductance of the selected short device shall
be used as a compensation value.
d
Gold-plated copper or
gold-plated equivalent metal
Figure 6 – Short device shape
l
Table 2 – Short device dimensions and inductances
Size of inductor under test l d Inductance value
mm mm nH
1608 1,6 0,95 0,43
1005 1,0 0,60 0,27
0603 0,6 0,36 0,16
0402 0,4 0,26 0,11
0201 0,2 0,12 0,05
If an inductance value other than those defined in Table 2 and if a short device shape other
than that defined in Figure 6, such as rectangular shape, are used for test fixture A, the
employed value shall be specified. For test fixtures B and C, the short device dimension, shape
and inductance values shall be specified.
4.1.5.3 Open compensation
Open compensation for test fixture A shall be performed with test fixture electrodes at the same
distance from each other as with the inductor under test mounted in the fixture. The admittance
Y is defined as 0 S (zero Siemens) unless otherwise specified.
os
Open compensation for test fixtures B and C shall be performed without mounting the inductor.
The admittance Y is defined as 0 S (zero Siemens) unless otherwise specified.
os
4.2 Quality factor
4.2.1 Measuring method
The Q of the inductor shall be measured by either the vector voltage/current method or the
reflection coefficient method.
4.2.2 Measuring circuit
The measurement circuit is as shown in Figure 1 and Figure 2. The measurement equipment
shall be suitably calibrated.
4.2.3 Mounting the inductor for test
Mounting of the inductor is as described in 4.1.3.
4.2.4 Measuring method and calculation formula
The frequency of the signal generator (Figure 1 or Figure 2) output signal shall be set to a
frequency as separately specified. The inductor shall be connected to the measurement circuit
by using the test fixtures as described in 4.1.3.2 to 4.1.3.4. Vector voltages E and E shall be
1 2
measured by vector voltage meters Ev and Ev , respectively. The Q value shall be calculated
1 2
by the following formula:
Im[E / E ]
1 2
Q =
Re[E / E ]
1 2
– 16 – IEC 62024-1:2024 RLV © IEC 2024
lm Z
[ ]
x
Q =
(6)
Re Z
[ ]
x
where
Q is the Q of the inductor under test;
Re is the real part of the complex value;
lm is the imaginary part of the complex value;
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev .
2 2
Z is the impedance of the inductor under test as calculated in Formula (2) or Formula (4).
x
4.2.5 Notes on measurement
Refer to 4.1.5.
4.3 Impedance
4.3.1 Measuring method
The impedance of an inductor shall be measured either by the vector voltage/current method
or the reflection coefficient method. Those methods are as described in 4.3.2 to 4.3.5.
4.3.2 Measuring circuit
The measurement circuits are as shown in Figure 1 and Figure 2. The measurement equipment
shall be suitably calibrated.
4.3.3 Mounting the inductor for test
Mounting of the inductor is as described in 4.1.3.
4.3.4 Measuring method and calculation
The frequency of the signal generator output signal (Figure 1 or Figure 2) shall be set to a
frequency f as separately specified. The inductor shall be connected to the measurement circuit
by using the test fixture as described in 4.1.3.2 to 4.1.3.4. Vector voltages E and E shall be
1 2
measured by vector voltage meters Ev and Ev , respectively.
1 2
The impedance shall be calculated by the following formula:
E
Z = R
(7)
E
where
Z
is the absolute value of the impedance;
R is the resistance;
E is the absolute value of Ev ;
1 1
E is the absolute value of Ev
2 2.
The impedance shall be calculated by Formula (2) or Formula (4) in accordance with the method
used.
4.3.5 Notes on measurement
Refer to 4.1.5.
5 Resonance frequency
5.1 Self-resonance frequency
The self-resonance frequency of the inductor shall be measured by the minimum output method
in 5.2, by the reflection method in 5.3 or by the impedance analyser in 5.4 or by the impedance
analyzer or network analyzer in 4.1.
5.2 Minimum output method
5.2.1 General
The minimum output method is as described in 5.2.2 to 5.2.5.
5.2.2 Measuring circuit
The measuring circuit is as shown in Figure 7.

– 18 – IEC 62024-1:2024 RLV © IEC 2024
LL
L
x
R
g
C
d
R
E L L E V
L
1 G 1 2 2
Earth
Test board
IEC
Key
G signal generator
R source resistance of the signal generator (50 Ω)
g
L inductance of inductor under test
x
C distributed parallel capacitance of inductor under test
d
L inductance of inductor under test
L L 50 Ω micro-strip line or equivalent transmission line
1, 2
V RF voltmeter
R input resistance of RF voltmeter (50 Ω)
L
E is the value indicated on vector voltmeter Ev
1 1
E is the value indicated on vector voltmeter Ev
2 2
A suitably calibrated network analyzer may be used for the minimum output method in place of the signal generator
and RF voltmeter
Figure 7 – Example of test circuit for the minimum output method
5.2.3 Mounting the inductor for test
The inductor shall be mounted on the self-resonance frequency test board specified in the
individual standard for the particular inductor by the method specified in Annex A. If there is no
individual standard, the self-resonance frequency test board shall be as shown in Figure 8.
The dimensions of the patterns of the fixture and material of the fixture shall be specified
between parties concerned.
Dimensions in millimetres
50 Ω micro-strip line
l
l
19,3
Earth plane covering whole bottom area
IEC
Key
Board material 96 % alumina ceramic board (ε ≅ 9,4)
Conductive material paste-printed or plated Cu, Ag-Pd to a total thickness of (15 to 30) µm
W 0,62 mm (reference value)
Solder joint field dimensions: hatched area
W same width as 50 Ω micro-strip line
l 1/2 length of the inductor under test
l length of the inductor under test + 0,4 mm
Figure 8 – Self-resonance frequency test board (minimum output method)
5.2.4 Measuring method and calculation formula
Using a circuit of the kind shown in Figure 7, keeping E fixed, the oscillating frequency of the
signal generator should be gradually increased until resonance is obtained as indicated by E
assuming its minimum value, which is then taken as the self-resonant value.
W
t = 0,635
5,0
– 20 – IEC 62024-1:2024 RLV © IEC 2024
However, if the range of frequencies where E is minimal is wide, and the frequency of the
minimal value is not easily determined, the two frequencies f and f at which E is greater than
1 2 2
the minimum by A (dB) (A ≤ 3) shall be measured, and the self-resonance frequency shall be
obtained using the following formula:
ff+
SRF = (7)
where
SRF is the self-resonance frequency;
5.2.5 Note on measurement
The width W of the micro-strip line shall be such that the characteristic impedance is as close
as possible to 50 Ω. The E value of the micro-strip line selected shall also allow easy
identification of the minimum value of E .
5.3 Reflection method
5.3.1 General
The reflection method is as described in 5.3.2 to 5.3.5.
5.3.2 Measuring circuit
The measurement circuit is as shown in Figure 7. The network analyser circuit used for
measurement shall be configured as shown in Figure 7, or shall have equivalent circuit functions.
In single port (S ) reflection measurement mode, phase measurement shall be possible and
the analyser shall be suitably calibrated.

L
Phase adj.
x
C
d
Phase
L
L
Power splitter
Directional
G coupler
Earth
RF network analyser Test board
IEC
Key
G signal generator
L inductance of inductor under test
x
C distributed capacitance of inductor under test
d
L inductance of inductor under test
L 50 Ω micro-strip line
Figure 7 – Example of test circuit for the reflection method
5.3.3 Mounting the inductor for test
The inductor shall be mounted on the self-resonance frequency test board specified in the
individual standard for the particular inductor by the method specified in Annex A. If there is no
individual standard, the self-resonance frequency test board shall be as in Figure 8.

– 22 – IEC 62024-1:2024 RLV © IEC 2024
Dimensions in millimetres
50 Ω micro-strip line
l
l
19,3
Earth plane covering whole bottom area
IEC
Key
Board material: 96 % alumina ceramic board (ε ≅ 9,4)
Conductive material: paste-printed or plated Cu, Ag-Pd to a total thickness of (15 to 30) µm
W 0,62 mm (reference value)
Solder joint field dimensions: hatched area
W same width as 50 Ω micro-strip line
l 1/2 length of the inductor under test
l length of the inductor under test + 0,4 mm
Figure 8 – Self-resonance frequency test board (reflection method)
5.3.4 Measuring method
The test board (on which the inductor has not yet been mounted) shall be connected to a
suitably calibrated network analyser, and the phase adjuster shall be adjusted so that within
the range of oscillating frequencies of the scanning signal generator, the output of the phase
comparator shows the minimum phase difference (absolute value) between the incident and
reflected waves.
The inductor for test shall then be mounted on the test board, and the oscillating frequency of
the scanning signal generator shall gradually be swept from the low end to the high end.
The oscillating frequency of the scanning signal generator when the output of the phase
comparator shows the minimum phase difference (absolute value) between the incident and
reflected waves shall be taken as the self-resonance frequency.
5.3.5 Notes on measurement
The width W of the micro-strip line shall be such that the characteristics impedance is as close
as possible to 50 Ω. The output of the scanning signal generator shall be set within a range that
ensures stable operation of the phase comparator.
W
t = 0,635 5,0
5.3 Measurement by analyzer
5.3.1 Measurement by impedance analyzer and one-port network analyzer
Self-resonance frequency can be measured by measuring the frequency characteristic of the
impedance of the inductor using the impedance analyzer. A one-port network analyzer may be
used to substitute the impedance analyzer as described in 4.1.2. When measuring self-
resonance frequency, after compensating for the unwanted capacitance (refer to 4.1.5.3), the
inductor for test shall be connected to the test fixture.
The exact value of the self-resonance frequency shall be the frequency where the first imaginary
part value of impedance equals zero, when sweeping the frequency of the impedance analyzer
from the lower value to the higher value.
The test fixture for the measurement of the self-resonance frequency shall be the same as that
of the inductance.
5.3.2 Measurement by two-port network analyzer
The self-resonance frequency of the inductor can be measured by the power attenuation method
using the network analyzer. During the measurement of the self-resonance frequency, care
shall be taken to avoid the influence of electromagnetic interference from other electronic
equipment shall be avoided. The sweeping frequency range of the network analyzer shall
include the self-resonance frequency of the inductor.
The self-resonance frequency of the inductor shall be the frequency where the power
attenuation becomes a maximum. It shall be confirmed that the measured self-resonance
frequency is not the resonance of the test fixture.
An example of a test fixture for measurement of self-resonance frequency by the power
attenuation method is described in Figure 9 5.2.3.
Placement force
Micro-strip line
Receptacles to be adjusted
to measuring equipment
Inductor
under test
l
Earth plane covering whole
bottom area
Glass epoxy:
FR4 (ε = 4,3 to 4,5)
2,25 mm
l: 1/2 length of the inductor under test
IEC
Figure 9 – Suitable test fixture for measuring self-resonance frequency
6 DC resistance
6.1 Voltage-drop method
6.1.1 Measuring circuit
An example of measuring circuit for DC resistance is shown in Figure 9.
1,6 mm
– 24 – IEC 62024-1:2024 RLV © IEC 2024
6.1.2 Measuring method and calculation formula
Use the circuit as shown in Figure 9.
Calculate DC resistance R of the coil inductor from the following formula:
x
V
R = (8)
x
I
where
V is the value indicated on V;
I is the value indicated on A.
L
x
V
R
v
E
E
A
IEC
Key
L inductance of inductor under test
x
L inductor under test
E DC power supply
V DC voltmeter
A DC ammeter
R DC resistance of inductor under test
x
R internal resistance of DC voltmeter: R >> R
v v x
Figure 9 – Example of test circuit for voltage-drop method

6.2 Bridge method
6.2.1 Measuring circuit
An example of the measuring circuit for DC resistance is shown in Figure 10.
6.2.2 Measuring method and calculation formula
Use the circuit as shown in Figure 10, balance the bridge by adjusting the proportional arm
and R and standard variable resistor R , and calculate DC resistance R of the coil
resistors R
1 2 3 x
inductor from the following formula:
R
RR×
(9)
x3
R
R
R
D
E
R
L
x
IEC
Key
R , R resistance of proportional arm resistors R , R
1 2 1 2
R resistance of standard variable resistor R
3 3
inductance of inductor under test
L
x
L inductor under test
E DC power supply
D detector
Figure 10 – Example of test circuit for bridge method
6.3 Notes on measurement
The precautio
...

IEC 62024-1 ®
Edition 4.0 2024-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Electrical characteristics and measuring
methods –
Part 1: Nanohenry range chip inductor

Composants inductifs à haute fréquence – Caractéristiques électriques et
méthodes de mesure –
Partie 1: Bobine d'inductance pastille de l'ordre du nanohenry
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IEC 62024-1 ®
Edition 4.0 2024-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Electrical characteristics and measuring

methods –
Part 1: Nanohenry range chip inductor

Composants inductifs à haute fréquence – Caractéristiques électriques et

méthodes de mesure –
Partie 1: Bobine d'inductance pastille de l'ordre du nanohenry

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.100.10  ISBN 978-2-8322-9301-0

– 2 – IEC 62024-1:2024 © IEC 2024
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Inductance, Q-factor and impedance. 6
4.1 Inductance . 6
4.1.1 Measuring method . 6
4.1.2 Measuring circuit . 7
4.1.3 Mounting the inductor for the test . 8
4.1.4 Measuring method and calculation formula . 10
4.1.5 Notes on measurement . 11
4.2 Quality factor . 12
4.2.1 Measuring method . 12
4.2.2 Measuring circuit . 12
4.2.3 Mounting the inductor for test . 12
4.2.4 Measuring method and calculation formula . 12
4.2.5 Notes on measurement . 13
4.3 Impedance . 13
4.3.1 Measuring method . 13
4.3.2 Measuring circuit . 13
4.3.3 Mounting the inductor for test . 13
4.3.4 Measuring method and calculation . 13
4.3.5 Notes on measurement . 13
5 Resonance frequency . 13
5.1 Self-resonance frequency . 13
5.2 Minimum output method . 13
5.2.1 General . 13
5.2.2 Measuring circuit . 13
5.2.3 Mounting the inductor for test . 14
5.2.4 Measuring method and calculation formula . 15
5.2.5 Note on measurement . 15
5.3 Measurement by analyzer . 15
5.3.1 Measurement by impedance analyzer and one-port network analyzer . 15
5.3.2 Measurement by two-port network analyzer . 16
6 DC resistance . 16
6.1 Voltage-drop method. 16
6.1.1 Measuring circuit . 16
6.1.2 Measuring method and calculation formula . 16
6.2 Bridge method . 17
6.2.1 Measuring circuit . 17
6.2.2 Measuring method and calculation formula . 17
6.3 Notes on measurement . 18
6.4 Measuring temperature . 18
7 S-parameter . 18
7.1 Measurement setup and procedure . 18
7.1.1 General . 18

7.1.2 Two-port S-parameter . 19
7.1.3 Test fixture . 19
7.2 Calibrations and verification of test setup . 20
7.2.1 General . 20
7.2.2 Calibration . 21
7.2.3 De-embedding . 24
7.3 Indirect method of impedance . 24
7.4 Evaluation from the two-port S-parameter . 24
Annex A (normative) Mounting method for a surface mounting inductor . 27
A.1 Overview. 27
A.2 Mounting printed-circuit board and mounting land . 27
A.3 Solder . 27
A.4 Test condition . 27
A.5 Cleaning . 28
Annex B (normative) Elimination of residual parameter effects in test fixture . 29
B.1 Overview. 29
B.2 Test fixture represented by the ABCD matrix of a two-terminal pair network . 29
Bibliography . 31

Figure 1 – Example of circuit for vector voltage/current method . 7
Figure 2 – Example of circuit for reflection coefficient method . 8
Figure 3 – Fixture A . 8
Figure 4 – Fixture B . 9
Figure 5 – Fixture C . 10
Figure 6 – Short device shape . 11
Figure 7 – Example of test circuit for the minimum output method . 14
Figure 8 – Self-resonance frequency test board (minimum output method) . 15
Figure 9 – Example of test circuit for voltage-drop method . 17
Figure 10 – Example of test circuit for bridge method . 18
Figure 11 – Schematic diagram of the two-port S-parameter measurement setup and
the network analyzer . 19
Figure 12 – S-parameter test fixture for two-terminal devices . 19
Figure 13 – Test fixture for a two-terminal device (shunt connection) . 20
Figure 14 – Test fixture for a two-terminal device (series connection) . 20
Figure 15 – Examples of the standards for TRL calibration . 22
Figure 16 – Examples of the standards for TRL calibration with microprobes . 23
Figure 17 – Examples of full two-port de-embedding with microprobes . 24
Figure 18 – Two-port measurement of a two-terminal device in shunt connection . 25
Figure 19 – Two-port measurement of a two-terminal device in series connection . 25
Figure B.1 – Test fixture represented by the ABCD matrix . 29

Table 1 – Dimensions of l and d . 9
Table 2 – Short device dimensions and inductances . 12

– 4 – IEC 62024-1:2024 © IEC 2024
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 1: Nanohenry range chip inductor

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had not received notice of (a) patent(s), which
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the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
IEC 62024-1 has been prepared by IEC technical committee 51: Magnetic components, ferrite
and magnetic powder materials. It is an International Standard.
This fourth edition cancels and replaces the third edition published in 2017. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) addition of S parameter measurement;
b) addition of the inductance, Q-factor and impedance of an inductor which are measured by
the reflection coefficient method with a network analyzer;

c) addition of the resonance frequency of an inductor which is measured by a two-port network
analyzer;
d) addition of the mounting method for a surface mounting inductor with Pb-free solder.
The text of this International Standard is based on the following documents:
Draft Report on voting
51/1500/FDIS 51/1511/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts of the IEC 62024 series, published under the general title High frequency
inductive components – Electrical characteristics and measuring methods, can be found on the
IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
IMPORTANT – The "colour inside" logo on the cover page of this document indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.

– 6 – IEC 62024-1:2024 © IEC 2024
HIGH FREQUENCY INDUCTIVE COMPONENTS –
ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 1: Nanohenry range chip inductor

1 Scope
This part of IEC 62024 specifies the electrical characteristics and measuring methods for the
nanohenry range chip inductor that is normally used in the high frequency (over 100 kHz) range.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
IEC 61249-2-7, Materials for printed boards and other interconnecting structures – Part 2-7:
Reinforced base materials clad and unclad – Epoxide woven E-glass laminated sheet of defined
flammability (vertical burning test) copper-clad
IEC 62025-1, High frequency inductive components – Non-electrical characteristics and
measuring methods – Part 1: Fixed, surface mounted inductors for use in electronic and
telecommunication equipment
ISO 6353-3, Reagents for chemical analysis – Part 3: Specifications – Second series
ISO 9453, Soft solder alloys – Chemical compositions and forms
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
4 Inductance, Q-factor and impedance
4.1 Inductance
4.1.1 Measuring method
The inductance of an inductor is measured by either the vector voltage/current method
(impedance analyzer) or the reflection coefficient method (network analyzer).

4.1.2 Measuring circuit
An example of the circuit for the vector voltage/current method is shown in Figure 1 and an
example of the circuit for the reflection coefficient method is shown in Figure 2.

Key
R source resistance (50 Ω)
g
R resistor
L inductor under test
L inductance of inductor under test
x
C parallel capacitance of inductor under test
d
L series inductance of inductor under test
s
R series resistance of inductor under test
s
Ev , Ev vector voltmeter
1 2
G signal generator
Figure 1 – Example of circuit for vector voltage/current method

– 8 – IEC 62024-1:2024 © IEC 2024

Key
R source resistance (50 Ω)
g
R , R termination resistor (50 Ω)
t1 t2
L inductor under test
C parallel capacitance of inductor under test
d
L series inductance of inductor under test
s
R series resistance of inductor under test
s
Ev , Ev vector voltmeter
1 2
G signal generator
L 50 Ω micro-strip line or equivalent transmission line
Figure 2 – Example of circuit for reflection coefficient method
4.1.3 Mounting the inductor for the test
4.1.3.1 General
The inductor shall be mounted in a test fixture as specified in the relevant standard. If no fixture
is specified, one of the following test fixtures A, B or C shall be used. The fixture used shall be
reported.
4.1.3.2 Fixture A
The shape and dimensions of fixture A shall be as shown in Figure 3 and Table 1.

Figure 3 – Fixture A
Table 1 – Dimensions of l and d
a
l d
Size of inductor under test
mm mm
1608 1,6 0,95
1005 1,0 0,60
0603 0,6 0,36
0402 0,4 0,26
0201 0,2 0,12
a
The outline dimensions of the surface mounted inductor shall be indicated by a four-digit number based on
two significant figures for each dimension L and W (or H) (refer to IEC 62025-1).

The electrodes of the test fixture shall contact the electrodes of the inductor under test by
mechanical force provided by an appropriate method. This force shall be chosen so as to
provide satisfactory measurement stability without influencing the characteristics of the inductor.
The mechanical force shall be specified. A characteristic impedance of the structure between
the measurement circuit and the test fixture shall maintain a characteristic impedance as close
as possible to 50 Ω.
4.1.3.3 Fixture B
The test fixture B as shown in Figure 4 shall be used.

Figure 4 – Fixture B
The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
test by mechanical force provided by an appropriate method. This force shall be chosen so as
to provide satisfactory measurement stability without influencing the characteristics of the
inductor. The mechanical force shall be specified. A characteristic impedance of the structure
between the measurement circuit and the test fixture shall maintain a characteristic impedance
as close as possible to 50 Ω. Dimension d shall be specified between the parties concerned.
4.1.3.4 Fixture C
The test fixture C as shown in Figure 5 shall be used.

– 10 – IEC 62024-1:2024 © IEC 2024

Figure 5 – Fixture C
The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
test by mechanical force provided by an appropriate method. This force shall be chosen so as
to provide satisfactory measurement stability without influencing the characteristics of the
inductor. The mechanical force shall be specified. A characteristic impedance of the structure
between the measurement circuit and the test fixture shall maintain a characteristic impedance
as close as possible to 50 Ω. The dimensions of the patterns of the fixture and material of the
fixture shall be specified between the parties concerned.
4.1.4 Measuring method and calculation formula
Inductance L of the inductor L is defined by the vector sum of the reactance caused by L and
x s
C (see Figure 1 or Figure 2). The frequency f of the signal generator output signal shall be set
d
to a frequency as separately specified. The inductor under test shall be connected to the
measurement circuit by using the test fixture as described in 4.1.3.2 to 4.1.3.4. Vector voltages
E and E shall be measured by vector voltage meters Ev and Ev , respectively. The
1 2 1 2
inductance L shall be calculated by Formula (1) and Formula (2) for the vector voltage/current
x
method, or Formula (3) to Formula (5) for the reflection coefficient method:
lm Z
[ ]
x
L = (1)
x
ω
E
ZR=
(2)
x
E
where
L is the inductance of the inductor under test;
x
lm is the imaginary part of the complex value;
Z is the impedance of the inductor under test;
x
R is the resistance of the resistor;
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev ;
2 2
ω is the angular frequency: 2πf.

lm Z
[ ]
x
(3)
L =
x
ω
E
ZR=
(4)
x
E
E
S =
(5)
E
where
L is the inductance of the inductor under test;
x
lm is the imaginary part of the complex value;
Z is the impedance of the inductor under test;
x
R is the resistance of the resistor;
S is the reflection coefficient of the inductor under test;
Z is the system impedance of the measurement system (50 Ω);
E is the value indicated on vector voltmeter Ev ;
1 1
E is the value indicated on vector voltmeter Ev ;
2 2
ω is the angular frequency: 2πf.
4.1.5 Notes on measurement
4.1.5.1 General
The electrical length of the test fixture shall be compensated by an appropriate method followed
by open-short compensation. If an electrical length that is not commonly accepted is used, it
shall be specified. Open-short compensation shall be calculated by Annex B.
4.1.5.2 Short compensation
For test fixture A, the applicable short device dimension and shape are as shown in Figure 6
and Table 2. The appropriate short device inductance shall be selected from Table 2 depending
on the dimension of the inductor under test. The inductance of the selected short device shall
be used as a compensation value.

Figure 6 – Short device shape
– 12 – IEC 62024-1:2024 © IEC 2024
Table 2 – Short device dimensions and inductances
Size of inductor under test l d Inductance value
mm mm nH
1608 1,6 0,95 0,43
1005 1,0 0,60 0,27
0603 0,6 0,36 0,16
0402 0,4 0,26 0,11
0201 0,2 0,12 0,05
If an inductance value other than those defined in Table 2 and if a short device shape other
than that defined in Figure 6, such as rectangular shape, are used for test fixture A, the
employed value shall be specified. For test fixtures B and C, the short device dimension, shape
and inductance values shall be specified.
4.1.5.3 Open compensation
Open compensation for test fixture A shall be performed with test fixture electrodes at the same
distance from each other as with the inductor under test mounted in the fixture. The admittance
Y is defined as 0 S (zero Siemens) unless otherwise specified.
os
Open compensation for test fixtures B and C shall be performed without mounting the inductor.
The admittance Y is defined as 0 S (zero Siemens) unless otherwise specified.
os
4.2 Quality factor
4.2.1 Measuring method
The Q of the inductor shall be measured by either the vector voltage/current method or the
reflection coefficient method.
4.2.2 Measuring circuit
The measurement circuit is as shown in Figure 1 and Figure 2. The measurement equipment
shall be suitably calibrated.
4.2.3 Mounting the inductor for test
Mounting of the inductor is as described in 4.1.3.
4.2.4 Measuring method and calculation formula
The frequency of the signal generator (Figure 1 or Figure 2) output signal shall be set to a
frequency as separately specified. The inductor shall be connected to the measurement circuit
by using the test fixtures as described in 4.1.3.2 to 4.1.3.4. Vector voltages E and E shall be
1 2
measured by vector voltage meters Ev and Ev , respectively. The Q value shall be calculated
1 2
by the following formula:
lm[Z ]
x
Q=
(6)
Re Z
[ ]
x
where
Q is the Q of the inductor under test;
Re is the real part of the complex value;
lm is the imaginary part of the complex value;
Z is the impedance of the inductor under test as calculated in Formula (2) or Formula (4).
x
4.2.5 Notes on measurement
Refer to 4.1.5.
4.3 Impedance
4.3.1 Measuring method
The impedance of an inductor shall be measured either by the vector voltage/current method
or the reflection coefficient method. Those methods are as described in 4.3.2 to 4.3.5.
4.3.2 Measuring circuit
The measurement circuits are as shown in Figure 1 and Figure 2. The measurement equipment
shall be suitably calibrated.
4.3.3 Mounting the inductor for test
Mounting of the inductor is as described in 4.1.3.
4.3.4 Measuring method and calculation
The frequency of the signal generator output signal (Figure 1 or Figure 2) shall be set to a
frequency f as separately specified. The inductor shall be connected to the measurement circuit
by using the test fixture as described in 4.1.3.2 to 4.1.3.4. Vector voltages E and E shall be
1 2
measured by vector voltage meters Ev and Ev , respectively.
1 2
The impedance shall be calculated by Formula (2) or Formula (4) in accordance with the method
used.
4.3.5 Notes on measurement
Refer to 4.1.5.
5 Resonance frequency
5.1 Self-resonance frequency
The self-resonance frequency of the inductor shall be measured by the minimum output method
in 5.2, or by the impedance analyzer or network analyzer in 4.1.
5.2 Minimum output method
5.2.1 General
The minimum output method is as described in 5.2.2 to 5.2.5.
5.2.2 Measuring circuit
The measuring circuit is as shown in Figure 7.

– 14 – IEC 62024-1:2024 © IEC 2024

Key
G signal generator
R source resistance of the signal generator (50 Ω)
g
L inductance of inductor under test
x
C parallel capacitance of inductor under test
d
L inductor under test
L L 50 Ω micro-strip line or equivalent transmission line
1, 2
V RF voltmeter
R input resistance of RF voltmeter (50 Ω)
L
E is the value indicated on vector voltmeter Ev
1 1
E is the value indicated on vector voltmeter Ev
2 2
A suitably calibrated network analyzer may be used for the minimum output method in place of the signal generator
and RF voltmeter
Figure 7 – Example of test circuit for the minimum output method
5.2.3 Mounting the inductor for test
The inductor shall be mounted on the self-resonance frequency test board specified in the
individual standard for the particular inductor by the method specified in Annex A. If there is no
individual standard, the self-resonance frequency test board shall be as shown in Figure 8.
The dimensions of the patterns of the fixture and material of the fixture shall be specified
between parties concerned.
Figure 8 – Self-resonance frequency test board (minimum output method)
5.2.4 Measuring method and calculation formula
Using a circuit of the kind shown in Figure 7, keeping E fixed, the oscillating frequency of the
signal generator should be gradually increased until resonance is obtained as indicated by E
assuming its minimum value, which is then taken as the self-resonant value.
However, if the range of frequencies where E is minimal is wide, and the frequency of the
minimal value is not easily determined, the two frequencies f and f at which E is greater than
1 2 2
the minimum by A (dB) (A ≤ 3) shall be measured, and the self-resonance frequency shall be
obtained using the following formula:
ff+
SRF= (7)
where
SRF is the self-resonance frequency;
5.2.5 Note on measurement
The width W of the micro-strip line shall be such that the characteristic impedance is as close
as possible to 50 Ω. The E value of the micro-strip line selected shall also allow easy
identification of the minimum value of E .
5.3 Measurement by analyzer
5.3.1 Measurement by impedance analyzer and one-port network analyzer
Self-resonance frequency can be measured by measuring the frequency characteristic of the
impedance of the inductor using the impedance analyzer. A one-port network analyzer may be
used to substitute the impedance analyzer as described in 4.1.2. When measuring self-
resonance frequency, after compensating for the unwanted capacitance (refer to 4.1.5.3), the
inductor for test shall be connected to the test fixture.
The exact value of the self-resonance frequency shall be the frequency where the first imaginary
part value of impedance equals zero, when sweeping the frequency of the impedance analyzer
from the lower value to the higher value.

– 16 – IEC 62024-1:2024 © IEC 2024
The test fixture for the measurement of the self-resonance frequency shall be the same as that
of the inductance.
5.3.2 Measurement by two-port network analyzer
The self-resonance frequency of the inductor can be measured by the power attenuation method
using the network analyzer. During the measurement of the self-resonance frequency, the
influence of electromagnetic interference from other electronic equipment shall be avoided. The
sweeping frequency range of the network analyzer shall include the self-resonance frequency
of the inductor.
The self-resonance frequency of the inductor shall be the frequency where the power
attenuation becomes a maximum. It shall be confirmed that the measured self-resonance
frequency is not the resonance of the test fixture.
An example of a test fixture for measurement of self-resonance frequency by the power
attenuation method is described in 5.2.3.
6 DC resistance
6.1 Voltage-drop method
6.1.1 Measuring circuit
An example of measuring circuit for DC resistance is shown in Figure 9.
6.1.2 Measuring method and calculation formula
Use the circuit as shown in Figure 9.
Calculate DC resistance R of the inductor from the following formula:
x
V
(8)
R =
x
I
where
V is the value indicated on V;
I is the value indicated on A.

Key
L inductor under test
E DC power supply
V DC voltmeter
A DC ammeter
R DC resistance of inductor under test
x
R internal resistance of DC voltmeter: R >> R
v v x
Figure 9 – Example of test circuit for voltage-drop method
6.2 Bridge method
6.2.1 Measuring circuit
An example of the measuring circuit for DC resistance is shown in Figure 10.
6.2.2 Measuring method and calculation formula
Use the circuit as shown in Figure 10, balance the bridge by adjusting the proportional arm
and R and standard variable resistor R , and calculate DC resistance R of the
resistors R
1 2 3 x
inductor from the following formula:
R
RR×
(9)
x3
R
=
– 18 – IEC 62024-1:2024 © IEC 2024

Key
R , R resistance of proportional arm resistors R , R
1 2 1 2
R resistance of standard variable resistor R
3 3
L inductor under test
E DC power supply
D detector
Figure 10 – Example of test circuit for bridge method
6.3 Notes on measurement
The precautions for measurements are as follows:
– measurement of resistance shall be made by using a direct voltage of a small magnitude for
as short a time as practicable, in order that the temperature of the resistance element does
not rise appreciably during measurement;
– measuring voltage: ≤ 0,5 V;
– measurement uncertainty ±0,5 % of measured value;
– the temperature of the specimen should coincide with the ambient temperature;
– keep the current passed through the specimen within a range so that the resistance of the
inductor will not change greatly;
– use of a double bridge is recommended for adequate accuracy when high measurement
accuracy is required for DC resistance of 0,1 Ω or less.
6.4 Measuring temperature
Measurement temperature is specified in IEC 62674-1.
7 S-parameter
7.1 Measurement setup and procedure
7.1.1 General
A network analyzer (50 Ω system) is used for measuring the S-parameters of a device under
test (DUT). A vector network analyzer is an instrument with a function for determining
S-parameters directly from measurement of the amplitudes and phases of the incident, reflected,
and transmitted waves; this is achieved by combining a directional coupler and a sophisticated
calibration mechanism with the tracking generator and measuring receiver. Below is the
measurement setup for a two-port measurement.
S-parameters should be measured by inserting the DUT into the test fixture and by sweeping
the measurement frequency with the network analyzer. The relationship between the
S-parameters and the frequency should be recorded within the required frequency range.

The electrodes of the test fixture shall be in contact with the electrodes of the inductor under
test by either soldering or mechanical force provided by an appropriate method. The mechanical
force shall be specified. This force shall be chosen to provide satisfactory measurement stability
without influencing the characteristics of the inductor. Figure 11 shows a schematic diagram of
the two-port S-parameter measurement setup and the network analyzer.

Figure 11 – Schematic diagram of the two-port S-parameter
measurement setup and the network analyzer
7.1.2 Two-port S-parameter
The characteristics of inductors can be evaluated in terms of the two-port S-parameters using
a test fixture shown in Figure 12.
There are two possible configurations for connecting the two-terminal devices and fixture: one
with a shunt connection and one with a series connection. One of these configurations should
be chosen according to their impedance. The used configuration shall be specified.

a) Shunt connection b) Series connection
Figure 12 – S-parameter test fixture for two-terminal devices
7.1.3 Test fixture
7.1.3.1 Shunt connection
Figure 13 shows a test fixture for measuring the S-parameters of a two-terminal device in a
shunt connection. Maximum applicable frequency is around 60 GHz.

– 20 – IEC 62024-1:2024 © IEC 2024

a) Fixture only b) Two-terminal device mounted
Key
Board: low-dielectric resin-based board (ε:3 to 5)
Conductive material: Cu
Figure 13 – Test fixture for a two-terminal device (shunt connection)
7.1.3.2 Series connection
Figure 14 shows a test fixture for measuring the S-parameters of a two-terminal device in a
series connection. Maximum applicable frequency is around 60 GHz.

a) Fixture only b) Two-terminal device mounted
Key
Board: low-dielectric resin-based board (ε:3 to 5)
Conductive material: Cu
Figure 14 – Test fixture for a two-terminal device (series connection)
7.2 Calibrations and verification of test setup
7.2.1 General
The calibration of the vector network analyzer (VNA) removes effects from the internal circuitry
of the instrument (directional couplers, transmission lines, discontinuities from physical signal
transitions) and establishes measurement reference planes.
De-embedding is a second-tier calibration that removes imperfections of the test fixtures or
other interconnects between the coaxial/microprobes reference plane and the measurement
reference
...