IEC 61131-9:2013
(Main)Programmable controllers - Part 9: Single-drop digital communication interface for small sensors and actuators (SDCI)
Programmable controllers - Part 9: Single-drop digital communication interface for small sensors and actuators (SDCI)
IEC 61131-9:2013 specifies a single-drop digital communication interface technology for small sensors and actuators SDCI (commonly known as IO-Link), which extends the traditional digital input and digital output interfaces as defined in IEC 61131-2 towards a point-to-point communication link. This technology enables the transfer of parameters to Devices and the delivery of diagnostic information from the Devices to the automation system.
Automates programmables - Partie 9: Interface de communication numérique point à point pour les petits capteurs et actionneurs (SDCI)
La CEI 61131-9:2013 spécifie une technologie d'interface de communication numérique point à point pour petits capteurs et actionneurs - SDCI - (généralement connue sous l'appellation IO-Lin); elle permet d'étendre les interfaces classiques d'entrées et de sorties numériques (telles que définies dans la CEI 61131-2) en une liaison de communication point à point. Cette technologie permet de transférer des paramètres aux Dispositifs et de fournir au système d'automatisation des informations de diagnostic depuis les Dispositifs.
General Information
Relations
Standards Content (Sample)
IEC 61131-9 ®
Edition 1.0 2013-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Programmable controllers –
Part 9: Single-drop digital communication interface for small sensors and
actuators (SDCI)
Automates programmables –
Partie 9: Interface de communication numérique point à point pour petits
capteurs et actionneurs (SDCI)
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester.
If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication,
please contact the address below or your local IEC member National Committee for further information.
Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite ni
utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie et les
microfilms, sans l'accord écrit de la CEI ou du Comité national de la CEI du pays du demandeur.
Si vous avez des questions sur le copyright de la CEI ou si vous désirez obtenir des droits supplémentaires sur cette
publication, utilisez les coordonnées ci-après ou contactez le Comité national de la CEI de votre pays de résidence.
IEC Central Office Tel.: +41 22 919 02 11
3, rue de Varembé Fax: +41 22 919 03 00
CH-1211 Geneva 20 info@iec.ch
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.
Useful links:
IEC publications search - www.iec.ch/searchpub Electropedia - www.electropedia.org
The advanced search enables you to find IEC publications The world's leading online dictionary of electronic and
by a variety of criteria (reference number, text, technical electrical terms containing more than 30 000 terms and
committee,…). definitions in English and French, with equivalent terms in
It also gives information on projects, replaced and additional languages. Also known as the International
withdrawn publications. Electrotechnical Vocabulary (IEV) on-line.
IEC Just Published - webstore.iec.ch/justpublished Customer Service Centre - webstore.iec.ch/csc
Stay up to date on all new IEC publications. Just Published If you wish to give us your feedback on this publication
details all new publications released. Available on-line and or need further assistance, please contact the
also once a month by email. Customer Service Centre: csc@iec.ch.
A propos de la CEI
La Commission Electrotechnique Internationale (CEI) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.
A propos des publications CEI
Le contenu technique des publications de la CEI est constamment revu. Veuillez vous assurer que vous possédez
l’édition la plus récente, un corrigendum ou amendement peut avoir été publié.
Liens utiles:
Recherche de publications CEI - www.iec.ch/searchpub Electropedia - www.electropedia.org
La recherche avancée vous permet de trouver des Le premier dictionnaire en ligne au monde de termes
publications CEI en utilisant différents critères (numéro de électroniques et électriques. Il contient plus de 30 000
référence, texte, comité d’études,…). termes et définitions en anglais et en français, ainsi que
Elle donne aussi des informations sur les projets et les les termes équivalents dans les langues additionnelles.
publications remplacées ou retirées. Egalement appelé Vocabulaire Electrotechnique
International (VEI) en ligne.
Just Published CEI - webstore.iec.ch/justpublished
Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications de la CEI.
Just Published détaille les nouvelles publications parues. Si vous désirez nous donner des commentaires sur
Disponible en ligne et aussi une fois par mois par email. cette publication ou si vous avez des questions
contactez-nous: csc@iec.ch.
IEC 61131-9 ®
Edition 1.0 2013-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Programmable controllers –
Part 9: Single-drop digital communication interface for small sensors and
actuators (SDCI)
Automates programmables –
Partie 9: Interface de communication numérique point à point pour petits
capteurs et actionneurs (SDCI)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XH
ICS 25.040.40; 35.240.50 ISBN 978-2-8322-1076-5
– 2 – 61131-9 © IEC:2013
CONTENTS
FOREWORD . 14
INTRODUCTION . 16
1 Scope . 18
2 Normative references . 18
3 Terms, definitions, symbols, abbreviated terms and conventions . 19
3.1 Terms and definitions . 19
3.2 Symbols and abbreviated terms. 23
3.3 Conventions . 25
3.3.1 General . 25
3.3.2 Service parameters . 25
3.3.3 Service procedures . 26
3.3.4 Service attributes . 26
3.3.5 Figures . 26
3.3.6 Transmission octet order . 26
3.3.7 Behavioral descriptions . 27
TM
4 Overview of SDCI (IO-Link ) . 27
4.1 Purpose of technology . 27
4.2 Positioning within the automation hierarchy . 28
4.3 Wiring, connectors and power . 29
4.4 Communication features of SDCI . 29
4.5 Role of a Master . 31
4.6 SDCI configuration . 32
4.7 Mapping to fieldbuses . 32
4.8 Standard structure . 32
5 Physical Layer (PL) . 33
5.1 General . 33
5.1.1 Basics . 33
5.1.2 Topology . 33
5.2 Physical layer services . 34
5.2.1 Overview . 34
5.2.2 PL services . 35
5.3 Transmitter/Receiver . 37
5.3.1 Description method . 37
5.3.2 Electrical requirements . 37
5.3.3 Timing requirements . 41
5.4 Power supply . 44
5.4.1 Power supply options . 44
5.4.2 Power-on requirements. 45
5.5 Medium . 45
5.5.1 Connectors . 45
5.5.2 Cable. 47
6 Standard Input and Output (SIO) . 48
7 Data link layer (DL) . 48
7.1 General . 48
7.2 Data link layer services . 50
7.2.1 DL-B services . 50
61131-9 © IEC:2013 – 3 –
7.2.2 DL-A services . 61
7.3 Data link layer protocol . 66
7.3.1 Overview . 66
7.3.2 DL-mode handler . 67
7.3.3 Message handler . 75
7.3.4 Process Data handler . 82
7.3.5 On-request Data handler . 85
7.3.6 ISDU handler . 88
7.3.7 Command handler . 92
7.3.8 Event handler . 95
8 Application layer (AL) . 98
8.1 General . 98
8.2 Application layer services . 99
8.2.1 AL services within Master and Device . 99
8.2.2 AL Services . 100
8.3 Application layer protocol . 108
8.3.1 Overview . 108
8.3.2 On-request Data transfer . 108
8.3.3 Event processing . 114
8.3.4 Process Data cycles . 117
9 System management (SM) . 118
9.1 General . 118
9.2 System management of the Master . 118
9.2.1 Overview . 118
9.2.2 SM Master services . 120
9.2.3 SM Master protocol . 125
9.3 System management of the Device . 133
9.3.1 Overview . 133
9.3.2 SM Device services . 135
9.3.3 SM Device protocol . 141
10 Device . 148
10.1 Overview . 148
10.2 Process Data Exchange (PDE) . 149
10.3 Parameter Manager (PM) . 149
10.3.1 General . 149
10.3.2 Parameter manager state machine . 149
10.3.3 Dynamic parameter . 151
10.3.4 Single parameter . 152
10.3.5 Block parameter . 153
10.3.6 Concurrent parameterization access . 155
10.3.7 Command handling . 155
10.4 Data Storage (DS) . 155
10.4.1 General . 155
10.4.2 Data Storage state machine . 155
10.4.3 DS configuration . 157
10.4.4 DS memory space . 157
10.4.5 DS Index_List . 158
10.4.6 DS parameter availability . 158
10.4.7 DS without ISDU . 158
– 4 – 61131-9 © IEC:2013
10.4.8 DS parameter change indication . 158
10.5 Event Dispatcher (ED) . 158
10.6 Device features . 158
10.6.1 General . 158
10.6.2 Device backward compatibility . 159
10.6.3 Protocol revision compatibility . 159
10.6.4 Factory settings . 159
10.6.5 Application reset . 159
10.6.6 Device reset . 159
10.6.7 Visual SDCI indication . 159
10.6.8 Parameter access locking . 160
10.6.9 Data Storage locking . 160
10.6.10 Device parameter locking . 160
10.6.11 Device user interface locking . 160
10.6.12 Offset time . 160
10.6.13 Data Storage concept . 161
10.6.14 Block Parameter . 161
10.7 Device design rules and constraints . 161
10.7.1 General . 161
10.7.2 Process Data . 161
10.7.3 Communication loss . 161
10.7.4 Direct Parameter . 161
10.7.5 ISDU communication channel . 162
10.7.6 DeviceID rules related to Device variants . 162
10.7.7 Protocol constants . 162
10.8 IO Device description (IODD) . 163
10.9 Device diagnosis . 163
10.9.1 Concepts . 163
10.9.2 Events . 164
10.9.3 Visual indicators . 165
10.10 Device connectivity . 166
11 Master . 166
11.1 Overview . 166
11.1.1 Generic model for the system integration of a Master . 166
11.1.2 Structure and services of a Master . 166
11.2 Configuration Manager (CM) . 169
11.2.1 General . 169
11.2.2 Configuration parameter . 171
11.2.3 State machine of the Configuration Manager . 173
11.3 Data Storage (DS) . 175
11.3.1 Overview . 175
11.3.2 DS data object . 175
11.3.3 DS state machine . 175
11.3.4 Parameter selection for Data Storage . 181
11.4 On-Request Data exchange (ODE) . 181
11.5 Diagnosis Unit (DU) . 182
11.6 PD Exchange (PDE) . 183
11.6.1 General . 183
11.6.2 Process Data mapping. 183
61131-9 © IEC:2013 – 5 –
11.6.3 Process Data invalid/valid qualifier status . 184
11.7 Port and Device configuration tool (PDCT) . 185
11.7.1 General . 185
11.7.2 Basic layout examples . 185
11.8 Gateway application . 186
11.8.1 General . 186
11.8.2 Changing Device configuration including Data Storage . 186
11.8.3 Parameter server and recipe control . 186
11.8.4 Anonymous parameters . 186
11.8.5 Virtual port mode DIwithSDCI . 187
Annex A (normative) Codings, timing constraints, and errors . 190
Annex B (normative) Parameter and commands . 211
Annex C (normative) ErrorTypes (ISDU errors) . 228
Annex D (normative) EventCodes (diagnosis information) . 233
Annex E (normative) Data types . 236
Annex F (normative) Structure of the Data Storage data object . 247
Annex G (normative) Master and Device conformity . 248
Annex H (informative) Residual error probabilities . 254
Annex I (informative) Example sequence of an ISDU transmission . 256
Annex J (informative) Recommended methods for detecting parameter changes . 258
Bibliography . 259
Figure 1 – Example of a confirmed service . 26
Figure 2 – Memory storage and transmission order for WORD based data types . 27
Figure 3 – SDCI compatibility with IEC 61131-2 . 27
Figure 4 – Domain of the SDCI technology within the automation hierarchy . 28
Figure 5 – Generic Device model for SDCI (Master's view) . 29
Figure 6 – Relationship between nature of data and transmission types . 30
Figure 7 – Object transfer at the application layer level (AL) . 31
Figure 8 – Logical structure of Master and Device. 32
Figure 9 – Three wire connection system . 33
Figure 10 – Topology of SDCI . 34
Figure 11 – Physical layer (Master) . 34
Figure 12 – Physical layer (Device) . 35
Figure 13 – Line driver reference schematics . 37
Figure 14 – Receiver reference schematics . 37
Figure 15 – Reference schematics for SDCI 3-wire connection system . 38
Figure 16 – Voltage level definitions . 38
Figure 17 – Switching thresholds . 39
Figure 18 – Format of an SDCI UART frame . 41
Figure 19 – Eye diagram for the 'H' and 'L' detection . 42
Figure 20 – Eye diagram for the correct detection of a UART frame . 42
Figure 21 – Wake-up request . 44
Figure 22 – Power-on timing for Power1 . 45
– 6 – 61131-9 © IEC:2013
Figure 23 – Pin layout front view . 46
Figure 24 – Class A and B port definitions . 47
Figure 25 – Reference schematic for effective line capacitance and loop resistance . 47
Figure 26 – Structure and services of the data link layer (Master) . 49
Figure 27 – Structure and services of the data link layer (Device) . 49
Figure 28 – State machines of the data link layer . 67
Figure 29 – Example of an attempt to establish communication . 67
Figure 30 – Failed attempt to establish communication . 68
Figure 31 – Retry strategy to establish communication . 68
Figure 32 – Fallback procedure . 69
Figure 33 – State machine of the Master DL-mode handler . 70
Figure 34 – Submachine 1 to establish communication . 71
Figure 35 – State machine of the Device DL-mode handler . 73
Figure 36 – SDCI message sequences . 75
Figure 37 – Overview of M-sequence types . 76
Figure 38 – State machine of the Master message handler . 77
Figure 39 – Submachine "Response 3" of the message handler . 78
Figure 40 – Submachine "Response 8" of the message handler . 78
Figure 41 – Submachine "Response 15" of the message handler . 78
Figure 42 – State machine of the Device message handler . 81
Figure 43 – Interleave mode for the segmented transmission of Process Data . 83
Figure 44 – State machine of the Master Process Data handler . 83
Figure 45 – State machine of the Device Process Data handler . 85
Figure 46 – State machine of the Master On-request Data handler . 86
Figure 47 – State machine of the Device On-request Data handler . 87
Figure 48 – Structure of the ISDU . 88
Figure 49 – State machine of the Master ISDU handler . 90
Figure 50 – State machine of the Device ISDU handler . 91
Figure 51 – State machine of the Master command handler . 93
Figure 52 – State machine of the Device command handler . 94
Figure 53 – State machine of the Master Event handler . 96
Figure 54 – State machine of the Device Event handler . 97
Figure 55 – Structure and services of the application layer (Master) . 98
Figure 56 – Structure and services of the application layer (Device) . 99
Figure 57 – OD state machine of the Master AL . 109
Figure 58 – OD state machine of the Device AL . 110
Figure 59 – Sequence diagram for the transmission of On-request Data . 112
Figure 60 – Sequence diagram for On-request Data in case of errors . 113
Figure 61 – Sequence diagram for On-request Data in case of timeout . 113
Figure 62 – Event state machine of the Master AL . 114
Figure 63 – Event state machine of the Device AL . 115
Figure 64 – Single Event scheduling . 116
Figure 65 – Sequence diagram for output Process Data. 117
61131-9 © IEC:2013 – 7 –
Figure 66 – Sequence diagram for input Process Data . 118
Figure 67 – Structure and services of the Master system management . 119
Figure 68 – Sequence chart of the use case "port x setup" . 120
Figure 69 – Main state machine of the Master system management . 126
Figure 70 – SM Master submachine CheckCompatibility_1 . 128
Figure 71 – Activity for state "CheckVxy" . 130
Figure 72 – Activity for state "CheckCompV10" . 130
Figure 73 – Activity for state "CheckComp" . 131
Figure 74 – Activity (write parameter) in state "RestartDevice" . 131
Figure 75 – SM Master submachine CheckSerNum_3 . 132
Figure 76 – Activity (check SerialNumber) for state CheckSerNum_3 . 133
Figure 77 – Structure and services of the system management (Device) . 134
Figure 78 – Sequence chart of the use case "INACTIVE – SIO – SDCI – SIO" . 135
Figure 79 – State machine of the Device system management . 142
Figure 80 – Sequence chart of a regular Device startup . 145
Figure 81 – Sequence chart of a Device startup in compatibility mode . 146
Figure 82 – Sequence chart of a Device startup when compatibility fails . 147
Figure 83 – Structure and services of a Device . 148
Figure 84 – The Parameter Manager (PM) state machine . 150
Figure 85 – Positive and negative parameter checking result . 152
Figure 86 – Positive block parameter download with Data Storage request . 153
Figure 87 – Negative block parameter download . 154
Figure 88 – The Data Storage (DS) state machine . 156
Figure 89 – Data Storage request message sequence . 157
Figure 90 – Cycle timing . 160
Figure 91 – Event flow in case of successive errors . 165
Figure 92 – Device LED indicator timing . 165
Figure 93 – Generic relationship of SDCI technology and fieldbus technology . 166
Figure 94 – Structure and services of a Master . 168
Figure 95 – Relationship of the common Master applications . 168
Figure 96 – Sequence diagram of configuration manager actions . 170
Figure 97 – Ports in MessageSync mode . 171
Figure 98 – State machine of the Configuration Manager . 173
Figure 99 – Main state machine of the Data Storage mechanism . 175
Figure 100 – Submachine "UpDownload_2" of the Data Storage mechanism . 176
Figure 101 – Data Storage submachine "Upload_7" . 177
Figure 102 – Data Storage upload sequence diagram . 177
Figure 103 – Data Storage submachine "Download_10" . 178
Figure 104 – Data Storage download sequence diagram . 178
Figure 105 – State machine of the On-request Data Exchange . 181
Figure 106 – System overview of SDCI diagnosis information propagation via Events . 183
Figure 107 – Process Data mapping from ports to the gateway data stream. 184
Figure 108 – Propagation of PD qualifier status between Master and Device . 184
– 8 – 61131-9 © IEC:2013
Figure 109 – Example 1 of a PDCT display layout . 185
Figure 110 – Example 2 of a PDCT display layout . 186
Figure 111 – Alternative Device configuration . 187
Figure 112 – Virtual port mode "DIwithSDCI" . 188
Figure A.1 – M-sequence control . 190
Figure A.2 – Checksum/M-sequence type octet . 191
Figure A.3 – Checksum/status octet . 192
Figure A.4 – Principle of the checksum calculation and compression . 193
Figure A.5 – M-sequence TYPE_0 . 194
Figure A.6 – M-sequence TYPE_1_1 . 194
Figure A.7 – M-sequence TYPE_1_2 . 195
Figure A.8 – M-sequence TYPE_1_V . 195
Figure A.9 – M-sequence TYPE_2_1 . 196
Figure A.10 – M-sequence TYPE_2_2 . 196
Figure A.11 – M-sequence TYPE_2_3 . 196
Figure A.12 – M-sequence TYPE_2_4 . 197
Figure A.13 – M-sequence TYPE_2_5 . 197
Figure A.14 – M-sequence TYPE_2_6 . 197
Figure A.15 – M-sequence TYPE_2_V . 198
Figure A.16 – M-sequence timing . 201
Figure A.17 – I-Service octet . 203
Figure A.18 – Check of ISDU integrity via CHKPDU . 205
Figure A.19 – Examples of request formats for ISDUs . 206
Figure A.20 – Examples of response ISDUs . 206
Figure A.21 – Examples of read and write request ISDUs . 207
Figure A.22 – Structure of StatusCode type 1 . 208
Figure A.23 – Structure of StatusCode type 2 . 208
Figure A.24 – Indication of activated Events . 209
Figure A.25 – Structure of the EventQualifier . 209
Figure B.1 – Classification and mapping of Direct Parameters . 211
Figure B.2 – MinCycleTime . 213
Figure B.3 – M-sequence Capability . 214
Figure B.4 – RevisionID . 215
Figure B.5 – ProcessDataIn . 215
Figure B.6 – Index space for ISDU data objects . 217
Figure B.7 – Structure of the Offset Time . 226
Figure E.1 – Coding examples of UIntegerT . 237
Figure E.2 – Coding examples of IntegerT . 239
Figure E.3 – Singular access of StringT . 240
Figure E.4 – Coding example of OctetStringT . 241
Figure E.5 – Definition of TimeT . 241
Figure E.6 – Example of an ArrayT data structure . 243
Figure E.7 – Example 2 of a RecordT structure . 245
61131-9 © IEC:2013 – 9 –
Figure E.8 – Example 3 of a RecordT structure . 245
Figure E.9 – Write requests for example 3 . 246
Figure G.1 – Test setup for electrostatic discharge (Master) . 250
Figure G.2 – Test setup for RF electromagnetic field (Master) . 250
Figure G.3 – Test setup for fast transients (Master) . 251
Figure G.4 – Test setup for RF common mode (Master) . 251
Figure G.5 – Test setup for electrostatic discharges (Device) . 252
Figure G.6 – Test setup for RF electromagnetic field (Device) . 252
Figure G.7 – Test setup for fast transients (Device) . 252
Figure G.8 – Test setup for RF common mode (Device) . 253
Figure H.1 – Residual error probability for the SDCI data integrity mechanism . 254
Figure I.1 – Example for ISDU transmissions (1 of 2) . 256
Table 1 – Service assignments of Master and Device . 35
Table 2 – PL_SetMode . 35
Table 3 – PL_WakeUp . 36
Table 4 –
...
Questions, Comments and Discussion
Ask us and Technical Secretary will try to provide an answer. You can facilitate discussion about the standard in here.
Loading comments...