IEC TS 62647-4:2018

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.

General Information

• Status: Published
• Publication Date: 09-Apr-2018
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Drafting Committee: WG 1 - TC 107/WG 1
• Current Stage: PPUB - Publication issued
• Start Date: 25-Apr-2018
• Completion Date: 16-Apr-2018

Standards Content (Sample)

IEC TS 62647-4 ®
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling

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IEC TS 62647-4 ®
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems

containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5530-8

– 2 – IEC TS 62647-4:2018 © IEC 2018
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 8
3 Terms and definitions . 9
4 Process approach . 12
4.1 Typical process . 12
4.2 Awareness . 14
5 General requirements . 14
5.1 Process control at the customer level . 14
5.1.1 Customer’s responsibilities . 14
5.1.2 Electronic components classes . 14
5.2 Process control at re-balling provider level . 15
5.2.1 Re-balling provider’s responsibilities . 15
5.2.2 Electronic component classes . 15
5.2.3 Counterfeit prevention and traceability management . 15
5.2.4 Quality . 16
5.2.5 Records . 16
5.2.6 Facility requirements . 16
5.2.7 Electrostatic discharge (ESD) . 16
5.2.8 Physical handling of BGA components . 16
5.2.9 Moisture/reflow sensitivity . 16
5.2.10 Configuration management . 17
5.2.11 Personnel proficiency . 17
5.2.12 Order of precedence . 17
5.3 Customer and re-balling provider relationship . 17
6 Technical requirements . 17
6.1 Receipt of BGA components and separate balls . 17
6.1.1 General . 17
6.1.2 Incoming inspection of BGA components . 17
6.1.3 Incoming inspection of separate solder balls . 19
6.2 Specific analysis based on component balls alloy . 19
6.3 BGA component de-balling. 20
6.3.1 General . 20
6.3.2 Temperature excursions . 20
6.3.3 Flux . 20
6.3.4 Preheat. 20
6.3.5 Solder balls removal (de-balling) . 20
6.3.6 Cool down . 21
6.3.7 Cleaning (post de-balling) . 21
6.3.8 Complete removal and cleanliness verification . 21
6.4 BGA component re-balling . 21
6.4.1 General . 21
6.4.2 Capability . 21
6.4.3 Solder paste . 22
6.4.4 Flux . 22

6.4.5 Ball placement (alignment and co-planarity) . 22
6.4.6 Preheating . 22
6.4.7 Reflow temperature profile . 22
6.4.8 Cooling down . 22
6.4.9 Cleaning (post re-balling) . 23
6.5 Post-process inspection of re-balled BGA components . 23
6.5.1 General . 23
6.5.2 Production lot tests . 23
6.5.3 Process monitoring and control . 23
6.5.4 Case of failures . 24
6.5.5 Records . 24
6.6 Rework . 24
6.6.1 General . 24
6.6.2 Rework if authorized by the customer . 24
6.7 New BGA component part number qualification . 24
6.7.1 General . 24
6.7.2 New BGA component part number qualification by similarity . 25
6.7.3 New BGA component part number qualification . 25
6.7.4 Records . 26
6.7.5 Customer’s approval . 26
6.7.6 Cases of BGA component re-qualification . 26
6.8 Physical marking . 27
6.9 Packaging and shipping . 27
6.10 Re-balled BGA components segregation . 27
Annex A (informative) Template for tailoring the requirements of IEC TS 62647-4. 28
Annex B (informative) Requirement matrix for IEC TS 62647-4 . 29
Annex C (normative) Test methods . 37
Annex D (informative) Template for test methods tailoring in the frame of a BGA
component production lot test plan or a new BGA component part number qualification
test plan . 39
Bibliography . 40

Figure 1 – Typical flowchart of de-balling/re-balling operations . 13

Table 1 – Electronic component class . 14
Table 2 – Typical control and inspection test methods . 19
Table 3 – Typical production lot test methods . 23
Table 4 – Typical test methods for process monitoring and control . 24
Table 5 – Typical test methods used for inspection of re-balled BGA components
within the framework of new BGA component part number qualification . 25
Table 6 – Typical optional additional tests for new BGA component part number
qualification . 26
Table A.1 – Template for tailoring of requirements . 28
Table B.1 – Requirement matrix . 29
Table C.1 – Test methods . 37
Table D.1 – Template for requirements tailoring . 39

– 4 – IEC TS 62647-4:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –

Part 4: Ball grid array (BGA) re-balling

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on al
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