IEC TS 62647-4:2018

Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling

IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.

General Information

• Status: Published
• Publication Date: 09-Apr-2018
• ICS: 03.100.50 - Production. Production management
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Current Stage: PPUB - Publication issued
• Start Date: 16-Apr-2018
• Completion Date: 16-Apr-2018

Standards Content (Sample)

IEC TS 62647-4
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling
IEC TS 62647-4:2018-04(en)
---------------------- Page: 1 ----------------------
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IEC TS 62647-4
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5530-8

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC TS 62647-4:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 8

3 Terms and definitions ...................................................................................................... 9

4 Process approach .......................................................................................................... 12

4.1 Typical process ..................................................................................................... 12

4.2 Awareness ............................................................................................................ 14

5 General requirements .................................................................................................... 14

5.1 Process control at the customer level .................................................................... 14

5.1.1 Customer’s responsibilities ............................................................................ 14

5.1.2 Electronic components classes ...................................................................... 14

5.2 Process control at re-balling provider level ............................................................ 15

5.2.1 Re-balling provider’s responsibilities .............................................................. 15

5.2.2 Electronic component classes ........................................................................ 15

5.2.3 Counterfeit prevention and traceability management ...................................... 15

5.2.4 Quality ........................................................................................................... 16

5.2.5 Records ......................................................................................................... 16

5.2.6 Facility requirements ..................................................................................... 16

5.2.7 Electrostatic discharge (ESD) ........................................................................ 16

5.2.8 Physical handling of BGA components ........................................................... 16

5.2.9 Moisture/reflow sensitivity .............................................................................. 16

5.2.10 Configuration management ............................................................................ 17

5.2.11 Personnel proficiency .................................................................................... 17

5.2.12 Order of precedence ...................................................................................... 17

5.3 Customer and re-balling provider relationship ....................................................... 17

6 Technical requirements ................................................................................................. 17

6.1 Receipt of BGA components and separate balls .................................................... 17

6.1.1 General ......................................................................................................... 17

6.1.2 Incoming inspection of BGA components ....................................................... 17

6.1.3 Incoming inspection of separate solder balls .................................................. 19

6.2 Specific analysis based on component balls alloy ................................................. 19

6.3 BGA component de-balling.................................................................................... 20

6.3.1 General ......................................................................................................... 20

6.3.2 Temperature excursions ................................................................................ 20

6.3.3 Flux ............................................................................................................... 20

6.3.4 Preheat.......................................................................................................... 20

6.3.5 Solder balls removal (de-balling) ................................................................... 20

6.3.6 Cool down ..................................................................................................... 21

6.3.7 Cleaning (post de-balling) .............................................................................. 21

6.3.8 Complete removal and cleanliness verification ............................................... 21

6.4 BGA component re-balling .................................................................................... 21

6.4.1 General ......................................................................................................... 21

6.4.2 Capability ...................................................................................................... 21

6.4.3 Solder paste .................................................................................................. 22

6.4.4 Flux ............................................................................................................... 22

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IEC TS 62647-4:2018 © IEC 2018 – 3 –

6.4.5 Ball placement (alignment and co-planarity) .................................................. 22

6.4.6 Preheating ..................................................................................................... 22

6.4.7 Reflow temperature profile ............................................................................. 22

6.4.8 Cooling down ................................................................................................. 22

6.4.9 Cleaning (post re-balling) .............................................................................. 23

6.5 Post-process inspection of re-balled BGA components ......................................... 23

6.5.1 General ......................................................................................................... 23

6.5.2 Production lot tests ........................................................................................ 23

6.5.3 Process monitoring and control ...................................................................... 23

6.5.4 Case of failures ............................................................................................. 24

6.5.5 Records ......................................................................................................... 24

6.6 Rework ................................................................................................................. 24

6.6.1 General ......................................................................................................... 24

6.6.2 Rework if authorized by the customer ............................................................ 24

6.7 New BGA component part number qualification ..................................................... 24

6.7.1 General ......................................................................................................... 24

6.7.2 New BGA component part number qualification by similarity .......................... 25

6.7.3 New BGA component part number qualification ............................................. 25

6.7.4 Records ......................................................................................................... 26

6.7.5 Customer’s approval ...................................................................................... 26

6.7.6 Cases of BGA component re-qualification ...................................................... 26

6.8 Physical marking ................................................................................................... 27

6.9 Packaging and shipping ........................................................................................ 27

6.10 Re-balled BGA components segregation ............................................................... 27

Annex A (informative) Template for tailoring the requirements of IEC TS 62647-4................ 28

Annex B (informative) Requirement matrix for IEC TS 62647-4 ............................................ 29

Annex C (normative) Test methods ...................................................................................... 37

Annex D (informative) Template for test methods tailoring in the frame of a BGA

component production lot test plan or a new BGA component part number qualification

test plan ................................................................................................................................ 39

Bibliography .......................................................................................................................... 40

Figure 1 – Typical flowchart of de-balling/re-balling operations ............................................. 13

Table 1 – Electronic component class ................................................................................... 14

Table 2 – Typical control and inspection test methods .......................................................... 19

Table 3 – Typical production lot test methods ....................................................................... 23

Table 4 – Typical test methods for process monitoring and control ....................................... 24

Table 5 – Typical test methods used for inspection of re-balled BGA components

within the framework of new BGA component part number qualification ................................ 25

Table 6 – Typical optional additional tests for new BGA component part number

qualification .......................................................................................................................... 26

Table A.1 – Template for tailoring of requirements ................................................................ 28

Table B.1 – Requirement matrix ............................................................................................ 29

Table C.1 – Test methods ..................................................................................................... 37

Table D.1 – Template for requirements tailoring .................................................................... 39

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– 4 – IEC TS 62647-4:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –
Part 4: Ball grid array (BGA) re-balling
FOREWORD

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The main task of IEC technical committees is to prepare International Standards. In

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• the required support cannot be obtained for the publication of an International Standard,

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• the subject is still under technical development or where, for any other reason, there is the

future but no immediate possibility of an agreement on an International Standard.

Technical specifications are subject to review within three years of publication to decide

whether they can be transformed into International Standards.

IEC TS 62647-4, which is a Technical Specification, has been prepared by IEC technical

committee 107: Process management for avionics.
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IEC TS 62647-4:2018 © IEC 2018 – 5 –
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/314/DTS 107/331/RVDTS

Full information on the voting for the approval of this technical specification can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC 62647 series, published under the general title Process

management for avionics – Aerospace and defence electronic systems containing lead-free

solder, can be found on the IEC website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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– 6 – IEC TS 62647-4:2018 © IEC 2018
INTRODUCTION

As the result of RoHS directives, soldering assembly processes have migrated predominantly

from tin-lead to Pb-free, and a majority of BGA components manufacturers have converted

from tin-lead solder balls to Pb-free solder balls. This has introduced well documented

reliability concerns. In the case of a leaded soldering process, a solution can be to replace the

Pb-free solder balls on the BGA components with tin-lead solder balls. This will prevent

mixing solder alloys.

This document was prepared to standardize the requirements and guidelines for replacing the

solder balls on applicable BGA components. The requirements within this document are

derived from existing industry standards and a collaboration of service providers and

customers, typically avionics original equipment manufacturers (OEMs).

This document is intended to be used by de-balling/re-balling providers and customers to

incorporate these requirements into their operations to provide a consistent and well-

controlled process, or to create a de-balling/re-balling plan that augments their existing

processes.

There are two major reasons to de-ball/re-ball BGA components: alloy compatibility and

replacement of damaged balls.

The customer should understand the potential risks of the BGA de-balling/re-balling process

for a specific package.

To avoid reliability problems, the BGA de-balling/re-balling process should be qualified and

carefully controlled to prevent the possibility of BGA failure after re-balling. Generally,

automated processes contribute positively to this objective and are encouraged in the

electronic industry.

This document does not guarantee a particular yield or reliability of BGA components going

through the de-balling/re-balling process. BGA component construction and materials used

should be evaluated for compatibility with the solder re-balling process to ensure that BGA

component reliability and integrity are maintained.

Because of the dynamic nature of the transition to lead-free (Pb-free) electronics, this and

other similar documents are based on the best information and expertise available; its update

will be considered as future knowledge and data are obtained.
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IEC TS 62647-4:2018 © IEC 2018 – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –
Part 4: Ball grid array (BGA) re-balling
1 Scope

This part of IEC 62647, which is a Technical Specification, defines the requirements for

replacing solder balls on ball grid array (BGA) component packages in the context of an

electronic components management plan (ECMP) for aerospace, defence and high reliability

products.

NOTE 1 IEC TS 62239-1 and EIA-STD-4899 describe the electronic components management program (ECMP).

It does not apply to column grid array (CGA) components or chip scale components.

This re-balling document addresses two types of configurations. For other configuration types,

see Annex A for tailoring.

• Configuration 1: A BGA package that will be de-balled and then re-balled with tin-lead

balls compatible with a tin-lead soldering assembly process.

• Configuration 2: A BGA package that will be de-balled and then re-balled with Pb-free

balls compatible with a Pb-free soldering assembly process.

The intent of this document is to provide re-balling companies (hereinafter referred to as the

re-balling provider) with the administrative and technical requirements to be incorporated

within existing processes or for establishing, implementing and maintaining a new set of

processes or the creation of a stand-alone re-balling process.

This document is intended to be used by de-balling/re-balling providers and customers,

typically avionics original equipment manufacturers (OEM); it defines the requirements for re-

balling providers who are providing services to the aerospace, defence, high performance and

high reliability electronics industry.

Requirements for new BGA component part number qualification are also included. This

document identifies the need for the creation of new part numbers for re-balled BGA

components, covers process and testing requirements for the de-balling/re-balling process

and encourages the automated processes due to the ability to control the process.

Companies engaged in re-balling are supposed to have the necessary knowledge, experience

and tools, and to customize if needed their own methods for defining a de-balling/re-balling

process that meets the requirements in this document.

Each customer determines the applicability of this document and the need for full replacement

of the existing solder balls. Some applications can have unique requirements that exceed the

scope of this document and are therefore specified separately.

This document is not intended to address all procedures and processes associated with a de-

balling/re-balling facility; it is assumed there are management, quality, manufacturing, safety,

calibration and training processes/procedures in place as well as all the necessary tools and

equipment to accomplish the work.

NOTE 2 For the purposes of this document, if the term “BGA” is used alone, it is stated as “BGA component".

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– 8 – IEC TS 62647-4:2018 © IEC 2018

NOTE 3 The replacement, for example, of damaged tin-lead balls by new tin-lead balls or damaged Pb-free balls

by new Pb-free balls is not specifically addressed in this document but some parts of the document and the table

for tailoring the requirements (see Annex A) can be used for supporting the operations.

Although developed for the avionics industry, this process can be applied by other industrial

sectors at their discretion.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic

phenomena – General requirements

IEC TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from

electrostatic phenomena – User guide

IEC 62090, Product package labels for electronic components using bar code and two-

dimensional symbologies
IEC 62668 (all parts), Process management for avionics – Counterfeit prevention
AEC-Q100-010, Solder ball shear test

ANSI/ESD S20.20, Protection of Electrical and Electronic Parts, Assemblies and Equipment

(Excluding Electrically Initiated Explosive Devices)

ECA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly

Processes
IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies

IPC J-STD-001xS , Space Applications Electronic Hardware Addendum to IPC J-STD-001x

Requirements for Soldered Electrical and Electronic Assemblies

IPC J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and

Wires
IPC J-STD-004, Requirements for Soldering Fluxes
IPC J-STD-005, Requirements for Soldering Pastes

IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-hermetic Solid

State Surface Mount Devices

IPC/JEDEC J-STD-033, Handling, Packing Shipping and Use of Moisture/Reflow Sensitive

Surface Mount Devices

IPC/JEDEC J-STD-035, Acoustic Microscopy for Non-Hermetic. Encapsulated. Electronic.

Components
___________

In « IPC J-STD-001xS » the « x » refers to the issue of the IPC J-STD-001 document ; for exemple « IPC J-

STD-001FS » refers to « IPC JST-001F » (issue F).
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IEC TS 62647-4:2018 © IEC 2018 – 9 –

IPC-TM-650 number 2.3.25, Test Methods Manual – Detection and Measurement of Ionizable

Surface Contaminants by Resistivity of Solvent Extract (ROSE)

JEDEC J-STD-046, Customer Notification of Product/Process Changes by Electronic Product

Suppliers

JEDEC JESD625, Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS)

Devices
JEDEC JESD22-A101, Steady State Temperature Humidity Bias Life Test
JEDEC JESD22-B101, External visual
JEDEC JESD22-B107, Mark Permanency
JEDEC JESD22-B117, Solder Ball Shear

JEDEC JESD213, Standard Test Method Utilizing X-ray Fluorescence (XRF) for Analyzing

Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content
MIL-STD-883, Test Method Standard: Microcircuits

SAE AS5553, Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition

3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
acoustic microscopy
microscopy that employs very high or ultra-high frequency ultrasound

Note 1 to entry: Acoustic microscopy is a technical field where the acoustic microscope operates non-

destructively and penetrates most solid materials to make visible images of internal features, including defects

such as cracks, delaminations and voids; the acoustic microscope is generally called “scanning acoustic

microscope (SAM)”.
3.2
approved supplier

organization selling or supplying materiel, parts, products or provision of a service, which has

been determined capable by a procuring organization to deliver throughout the lifetime of a

contract
3.3
BGA
ball grid array

surface mount package wherein the balls for terminations are formed in a grid on the bottom

of a package

Note 1 to entry: There are different varieties of BGA packages and solder ball technologies such as CBGA,

PBGA, TBGA pac
...