IEC TS 62647-4:2018
(Main)Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.
General Information
Standards Content (Sample)
IEC TS 62647-4
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling
IEC TS 62647-4:2018-04(en)
---------------------- Page: 1 ----------------------
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IEC TS 62647-4
Edition 1.0 2018-04
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace and defence electronic systems
containing lead-free solder –
Part 4: Ball grid array (BGA) re-balling
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-5530-8
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission---------------------- Page: 3 ----------------------
– 2 – IEC TS 62647-4:2018 © IEC 2018
CONTENTS
FOREWORD ........................................................................................................................... 4
INTRODUCTION ..................................................................................................................... 6
1 Scope .............................................................................................................................. 7
2 Normative references ...................................................................................................... 8
3 Terms and definitions ...................................................................................................... 9
4 Process approach .......................................................................................................... 12
4.1 Typical process ..................................................................................................... 12
4.2 Awareness ............................................................................................................ 14
5 General requirements .................................................................................................... 14
5.1 Process control at the customer level .................................................................... 14
5.1.1 Customer’s responsibilities ............................................................................ 14
5.1.2 Electronic components classes ...................................................................... 14
5.2 Process control at re-balling provider level ............................................................ 15
5.2.1 Re-balling provider’s responsibilities .............................................................. 15
5.2.2 Electronic component classes ........................................................................ 15
5.2.3 Counterfeit prevention and traceability management ...................................... 15
5.2.4 Quality ........................................................................................................... 16
5.2.5 Records ......................................................................................................... 16
5.2.6 Facility requirements ..................................................................................... 16
5.2.7 Electrostatic discharge (ESD) ........................................................................ 16
5.2.8 Physical handling of BGA components ........................................................... 16
5.2.9 Moisture/reflow sensitivity .............................................................................. 16
5.2.10 Configuration management ............................................................................ 17
5.2.11 Personnel proficiency .................................................................................... 17
5.2.12 Order of precedence ...................................................................................... 17
5.3 Customer and re-balling provider relationship ....................................................... 17
6 Technical requirements ................................................................................................. 17
6.1 Receipt of BGA components and separate balls .................................................... 17
6.1.1 General ......................................................................................................... 17
6.1.2 Incoming inspection of BGA components ....................................................... 17
6.1.3 Incoming inspection of separate solder balls .................................................. 19
6.2 Specific analysis based on component balls alloy ................................................. 19
6.3 BGA component de-balling.................................................................................... 20
6.3.1 General ......................................................................................................... 20
6.3.2 Temperature excursions ................................................................................ 20
6.3.3 Flux ............................................................................................................... 20
6.3.4 Preheat.......................................................................................................... 20
6.3.5 Solder balls removal (de-balling) ................................................................... 20
6.3.6 Cool down ..................................................................................................... 21
6.3.7 Cleaning (post de-balling) .............................................................................. 21
6.3.8 Complete removal and cleanliness verification ............................................... 21
6.4 BGA component re-balling .................................................................................... 21
6.4.1 General ......................................................................................................... 21
6.4.2 Capability ...................................................................................................... 21
6.4.3 Solder paste .................................................................................................. 22
6.4.4 Flux ............................................................................................................... 22
---------------------- Page: 4 ----------------------IEC TS 62647-4:2018 © IEC 2018 – 3 –
6.4.5 Ball placement (alignment and co-planarity) .................................................. 22
6.4.6 Preheating ..................................................................................................... 22
6.4.7 Reflow temperature profile ............................................................................. 22
6.4.8 Cooling down ................................................................................................. 22
6.4.9 Cleaning (post re-balling) .............................................................................. 23
6.5 Post-process inspection of re-balled BGA components ......................................... 23
6.5.1 General ......................................................................................................... 23
6.5.2 Production lot tests ........................................................................................ 23
6.5.3 Process monitoring and control ...................................................................... 23
6.5.4 Case of failures ............................................................................................. 24
6.5.5 Records ......................................................................................................... 24
6.6 Rework ................................................................................................................. 24
6.6.1 General ......................................................................................................... 24
6.6.2 Rework if authorized by the customer ............................................................ 24
6.7 New BGA component part number qualification ..................................................... 24
6.7.1 General ......................................................................................................... 24
6.7.2 New BGA component part number qualification by similarity .......................... 25
6.7.3 New BGA component part number qualification ............................................. 25
6.7.4 Records ......................................................................................................... 26
6.7.5 Customer’s approval ...................................................................................... 26
6.7.6 Cases of BGA component re-qualification ...................................................... 26
6.8 Physical marking ................................................................................................... 27
6.9 Packaging and shipping ........................................................................................ 27
6.10 Re-balled BGA components segregation ............................................................... 27
Annex A (informative) Template for tailoring the requirements of IEC TS 62647-4................ 28
Annex B (informative) Requirement matrix for IEC TS 62647-4 ............................................ 29
Annex C (normative) Test methods ...................................................................................... 37
Annex D (informative) Template for test methods tailoring in the frame of a BGAcomponent production lot test plan or a new BGA component part number qualification
test plan ................................................................................................................................ 39
Bibliography .......................................................................................................................... 40
Figure 1 – Typical flowchart of de-balling/re-balling operations ............................................. 13
Table 1 – Electronic component class ................................................................................... 14
Table 2 – Typical control and inspection test methods .......................................................... 19
Table 3 – Typical production lot test methods ....................................................................... 23
Table 4 – Typical test methods for process monitoring and control ....................................... 24
Table 5 – Typical test methods used for inspection of re-balled BGA componentswithin the framework of new BGA component part number qualification ................................ 25
Table 6 – Typical optional additional tests for new BGA component part numberqualification .......................................................................................................................... 26
Table A.1 – Template for tailoring of requirements ................................................................ 28
Table B.1 – Requirement matrix ............................................................................................ 29
Table C.1 – Test methods ..................................................................................................... 37
Table D.1 – Template for requirements tailoring .................................................................... 39
---------------------- Page: 5 ----------------------– 4 – IEC TS 62647-4:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –
Part 4: Ball grid array (BGA) re-balling
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.IEC TS 62647-4, which is a Technical Specification, has been prepared by IEC technical
committee 107: Process management for avionics.---------------------- Page: 6 ----------------------
IEC TS 62647-4:2018 © IEC 2018 – 5 –
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/314/DTS 107/331/RVDTS
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all the parts in the IEC 62647 series, published under the general title Process
management for avionics – Aerospace and defence electronic systems containing lead-free
solder, can be found on the IEC website.The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
---------------------- Page: 7 ----------------------
– 6 – IEC TS 62647-4:2018 © IEC 2018
INTRODUCTION
As the result of RoHS directives, soldering assembly processes have migrated predominantly
from tin-lead to Pb-free, and a majority of BGA components manufacturers have converted
from tin-lead solder balls to Pb-free solder balls. This has introduced well documented
reliability concerns. In the case of a leaded soldering process, a solution can be to replace the
Pb-free solder balls on the BGA components with tin-lead solder balls. This will prevent
mixing solder alloys.This document was prepared to standardize the requirements and guidelines for replacing the
solder balls on applicable BGA components. The requirements within this document are
derived from existing industry standards and a collaboration of service providers and
customers, typically avionics original equipment manufacturers (OEMs).This document is intended to be used by de-balling/re-balling providers and customers to
incorporate these requirements into their operations to provide a consistent and well-
controlled process, or to create a de-balling/re-balling plan that augments their existing
processes.There are two major reasons to de-ball/re-ball BGA components: alloy compatibility and
replacement of damaged balls.The customer should understand the potential risks of the BGA de-balling/re-balling process
for a specific package.To avoid reliability problems, the BGA de-balling/re-balling process should be qualified and
carefully controlled to prevent the possibility of BGA failure after re-balling. Generally,
automated processes contribute positively to this objective and are encouraged in the
electronic industry.This document does not guarantee a particular yield or reliability of BGA components going
through the de-balling/re-balling process. BGA component construction and materials used
should be evaluated for compatibility with the solder re-balling process to ensure that BGA
component reliability and integrity are maintained.Because of the dynamic nature of the transition to lead-free (Pb-free) electronics, this and
other similar documents are based on the best information and expertise available; its update
will be considered as future knowledge and data are obtained.---------------------- Page: 8 ----------------------
IEC TS 62647-4:2018 © IEC 2018 – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE AND DEFENCE ELECTRONIC
SYSTEMS CONTAINING LEAD-FREE SOLDER –
Part 4: Ball grid array (BGA) re-balling
1 Scope
This part of IEC 62647, which is a Technical Specification, defines the requirements for
replacing solder balls on ball grid array (BGA) component packages in the context of an
electronic components management plan (ECMP) for aerospace, defence and high reliability
products.NOTE 1 IEC TS 62239-1 and EIA-STD-4899 describe the electronic components management program (ECMP).
It does not apply to column grid array (CGA) components or chip scale components.
This re-balling document addresses two types of configurations. For other configuration types,
see Annex A for tailoring.• Configuration 1: A BGA package that will be de-balled and then re-balled with tin-lead
balls compatible with a tin-lead soldering assembly process.• Configuration 2: A BGA package that will be de-balled and then re-balled with Pb-free
balls compatible with a Pb-free soldering assembly process.The intent of this document is to provide re-balling companies (hereinafter referred to as the
re-balling provider) with the administrative and technical requirements to be incorporated
within existing processes or for establishing, implementing and maintaining a new set of
processes or the creation of a stand-alone re-balling process.This document is intended to be used by de-balling/re-balling providers and customers,
typically avionics original equipment manufacturers (OEM); it defines the requirements for re-
balling providers who are providing services to the aerospace, defence, high performance and
high reliability electronics industry.Requirements for new BGA component part number qualification are also included. This
document identifies the need for the creation of new part numbers for re-balled BGA
components, covers process and testing requirements for the de-balling/re-balling process
and encourages the automated processes due to the ability to control the process.
Companies engaged in re-balling are supposed to have the necessary knowledge, experience
and tools, and to customize if needed their own methods for defining a de-balling/re-balling
process that meets the requirements in this document.Each customer determines the applicability of this document and the need for full replacement
of the existing solder balls. Some applications can have unique requirements that exceed the
scope of this document and are therefore specified separately.This document is not intended to address all procedures and processes associated with a de-
balling/re-balling facility; it is assumed there are management, quality, manufacturing, safety,
calibration and training processes/procedures in place as well as all the necessary tools and
equipment to accomplish the work.NOTE 2 For the purposes of this document, if the term “BGA” is used alone, it is stated as “BGA component".
---------------------- Page: 9 ----------------------– 8 – IEC TS 62647-4:2018 © IEC 2018
NOTE 3 The replacement, for example, of damaged tin-lead balls by new tin-lead balls or damaged Pb-free balls
by new Pb-free balls is not specifically addressed in this document but some parts of the document and the table
for tailoring the requirements (see Annex A) can be used for supporting the operations.
Although developed for the avionics industry, this process can be applied by other industrial
sectors at their discretion.2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic
phenomena – General requirementsIEC TR 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from
electrostatic phenomena – User guideIEC 62090, Product package labels for electronic components using bar code and two-
dimensional symbologiesIEC 62668 (all parts), Process management for avionics – Counterfeit prevention
AEC-Q100-010, Solder ball shear test
ANSI/ESD S20.20, Protection of Electrical and Electronic Parts, Assemblies and Equipment
(Excluding Electrically Initiated Explosive Devices)ECA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly
ProcessesIPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies
IPC J-STD-001xS , Space Applications Electronic Hardware Addendum to IPC J-STD-001x
Requirements for Soldered Electrical and Electronic AssembliesIPC J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and
WiresIPC J-STD-004, Requirements for Soldering Fluxes
IPC J-STD-005, Requirements for Soldering Pastes
IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Non-hermetic Solid
State Surface Mount DevicesIPC/JEDEC J-STD-033, Handling, Packing Shipping and Use of Moisture/Reflow Sensitive
Surface Mount DevicesIPC/JEDEC J-STD-035, Acoustic Microscopy for Non-Hermetic. Encapsulated. Electronic.
Components___________
In « IPC J-STD-001xS » the « x » refers to the issue of the IPC J-STD-001 document ; for exemple « IPC J-
STD-001FS » refers to « IPC JST-001F » (issue F).---------------------- Page: 10 ----------------------
IEC TS 62647-4:2018 © IEC 2018 – 9 –
IPC-TM-650 number 2.3.25, Test Methods Manual – Detection and Measurement of Ionizable
Surface Contaminants by Resistivity of Solvent Extract (ROSE)JEDEC J-STD-046, Customer Notification of Product/Process Changes by Electronic Product
SuppliersJEDEC JESD625, Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS)
DevicesJEDEC JESD22-A101, Steady State Temperature Humidity Bias Life Test
JEDEC JESD22-B101, External visual
JEDEC JESD22-B107, Mark Permanency
JEDEC JESD22-B117, Solder Ball Shear
JEDEC JESD213, Standard Test Method Utilizing X-ray Fluorescence (XRF) for Analyzing
Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) ContentMIL-STD-883, Test Method Standard: Microcircuits
SAE AS5553, Counterfeit Electronic Parts; Avoidance, Detection, Mitigation, and Disposition
3 Terms and definitionsFor the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
acoustic microscopy
microscopy that employs very high or ultra-high frequency ultrasound
Note 1 to entry: Acoustic microscopy is a technical field where the acoustic microscope operates non-
destructively and penetrates most solid materials to make visible images of internal features, including defects
such as cracks, delaminations and voids; the acoustic microscope is generally called “scanning acoustic
microscope (SAM)”.3.2
approved supplier
organization selling or supplying materiel, parts, products or provision of a service, which has
been determined capable by a procuring organization to deliver throughout the lifetime of a
contract3.3
BGA
ball grid array
surface mount package wherein the balls for terminations are formed in a grid on the bottom
of a packageNote 1 to entry: There are different varieties of BGA packages and solder ball technologies such as CBGA,
PBGA, TBGA pac...
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