Field Device Integration (FDI) - Part 103-4: Profiles - PROFINET

IEC 62769-103-4:2020 is available as IEC 62769-103-4:2020 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition. IEC 62769-103-4:2020 specifies an FDI profile of IEC 62769 for IEC 61784-2_CP 3/4, IEC 61784-2_CP3/5 and IEC 61784-2_CP3/6 (PROFINET). This second edition cancels and replaces the first edition published in 2015. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) support for generic protocol extension for faster adoption of other technologies;
b) support for Package Developers to build EDDs targeted for today’s EDD bases system under a single development tool.

Intégration des appareils de terrain (FDI) - Partie 103-4: Profils - PROFINET

IEC 62769-103-4:2020 est disponible sous forme de IEC 62769-103-4:2020 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente. IEC 62769-103-4:2020 spécifie un profil FDI de l’IEC 62769 pour l’IEC 617842_CP 3/4, l’IEC 61784-2_CP 3/5 et l’IEC 61784-2_CP 3/6 (PROFINET ). Cette deuxième édition annule et remplace la première édition parue en 2015. Cette édition constitue une révision technique. Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) prise en charge d’extensions de protocoles génériques, pour une adoption plus rapide d’autres technologies;
b) capacité offerte aux Développeurs de Paquetages d’élaborer des EDD ciblant les systèmes actuels de bases EDD, en exploitant un seul outil de développement.

General Information

Status
Published
Publication Date
27-Apr-2020
Current Stage
DELPUB - Deleted Publication
Start Date
28-Jan-2022
Completion Date
18-Apr-2023
Ref Project

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IEC 62769-103-4 ®
Edition 2.0 2020-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –
Part 103-4: Profiles – PROFINET

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form

or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from

either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or

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3, rue de Varembé info@iec.ch
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

need further assistance, please contact the Customer Service

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IEC 62769-103-4 ®
Edition 2.0 2020-04
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Field device integration (FDI) –

Part 103-4: Profiles – PROFINET

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-8288-5

– 2 – IEC 62769-103-4:2020 RLV © IEC 2020

CONTENTS
FOREWORD . 4

INTRODUCTION .

1 Scope . 7

2 Normative references . 7

3 Terms, definitions, abbreviated terms and acronyms conventions . 8

3.1 Terms and definitions . 8

3.2 Abbreviated terms and acronyms . 8
3.3 Conventions . 8
3.3.1 EDDL syntax. 8
3.3.2 XML syntax . 8
3.3.3 Capitalizations . 8
4 Profile for PROFINET . 9
4.1 General . 9
4.2 Catalog profile . 9
4.2.1 Protocol support file . 9
4.2.2 CommunicationProfile definition . 10
4.2.3 Profile device . 10
4.2.4 Protocol version information . 10
4.3 Associating a Package with a device . 11
4.3.1 Device type identification mapping . 11
4.3.2 Device type revision mapping . 12
4.4 Information Model mapping . 13
4.4.1 ProtocolType definition . 13
4.4.2 DeviceType mapping . 13
4.4.3 FunctionalGroup identification definition . 14
4.5 Topology elements . 14
4.5.1 ConnectionPoint definition . 14
4.5.2 Communication Device definition . 16
4.5.3 Communication service provider definition . 17
4.5.4 Network definition . 18
4.6 Methods . 18
4.6.1 Methods for FDI Communication Servers . 18

4.6.2 Methods for Gateways . 22
Annex A (normative) Topology scan schema . 29
A.1 General . 29
A.2 Network . 29
A.3 ProfinetNetworkT . 29
A.4 ProfinetConnectionPointT . 29
A.5 ProfinetIdentificationT . 30
A.6 MACT . 31
A.7 IPv4T . 31
A.8 IPv6T . 31
A.9 DNSNameT . 31
A.10 Hex4DigitT . 31
Annex B (normative) Transfer service parameters . 32
B.1 General . 32

B.2 sendData . 32

B.3 receiveData . 32

B.4 TransferSendDataT . 32

B.5 TransferResultDataT . 33

B.6 OperationT . 33

Bibliography . 34

Figure 1 – Version mapping problem . 12

Table 1 – ProtocolSupportFile for FDI Device Packages . 9
Table 2 – ProtocolSupportFile for FDI Communication Packages . 10
Table 3 – Catalog values for profile devices . 10
Table 4 – Version mapping examples . 11
Table 5 – Device identification information mapping . 12
Table 6 – Protocol type Profinet_IO . 13
Table 7 – DeviceType Property mapping . 14
Table 8 – PROFINET identification type definition . 14
Table 9 – ConnectionPoint type for Profinet_IO . 15
Table 10 – Method Connect arguments . 19
Table 11 – Method Disconnect arguments . 19
Table 12 – Method Transfer arguments . 20
Table 13 – Method SetAddress arguments . 21
Table 14 – Method Connect arguments . 23
Table 15 – Method Transfer arguments . 24
Table 16 – Method SetAddress arguments . 26
Table A.1 – Elements of ProfinetNetworkT . 29
Table A.2 – Attributes of ProfinetConnectionPointT . 30
Table A.3 – Elements of ProfinetConnectionPointT . 30
Table A.4 – Attributes of ProfinetIdentificationT . 30
Table B.1 – Attributes of TransferSendDataT . 33
Table B.2 – Attributes of TransferResultDataT . 33

– 4 – IEC 62769-103-4:2020 RLV © IEC 2020

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
FIELD DEVICE INTEGRATION (FDI) –

Part 103-4: Profiles – PROFINET

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports,
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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence between
any IEC Publication and the corresponding national or region
...


IEC 62769-103-4 ®
Edition 2.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –
Part 103-4: Profiles – PROFINET

Intégration des appareils de terrain (FDI) –
Partie 103-4: Profils – PROFINET

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
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IEC Central Office Tel.: +41 22 919 02 11
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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

need further assistance, please contact the Customer Service

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IEC 62769-103-4 ®
Edition 2.0 2020-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Field device integration (FDI) –

Part 103-4: Profiles – PROFINET

Intégration des appareils de terrain (FDI) –

Partie 103-4: Profils – PROFINET

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 25.040.40; 35.100.05 ISBN 978-2-8322-8139-0

– 2 – IEC 62769-103-4:2020 © IEC 2020
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms, definitions, abbreviated terms and conventions . 7
3.1 Terms and definitions . 7
3.2 Abbreviated terms . 7
3.3 Conventions . 7
3.3.1 EDDL syntax. 7
3.3.2 XML syntax . 7
3.3.3 Capitalizations . 7
4 Profile for PROFINET . 8
4.1 General . 8
4.2 Catalog profile . 8
4.2.1 Protocol support file . 8
4.2.2 CommunicationProfile definition . 9
4.2.3 Profile device . 9
4.2.4 Protocol version information . 9
4.3 Associating a Package with a device . 10
4.3.1 Device type identification mapping . 10
4.3.2 Device type revision mapping . 11
4.4 Information Model mapping . 12
4.4.1 ProtocolType definition . 12
4.4.2 DeviceType mapping . 12
4.4.3 FunctionalGroup identification definition . 13
4.5 Topology elements . 13
4.5.1 ConnectionPoint definition . 13
4.5.2 Communication Device definition . 15
4.5.3 Communication service provider definition . 16
4.5.4 Network definition . 17
4.6 Methods . 17
4.6.1 Methods for FDI Communication Servers . 17
4.6.2 Methods for Gateways . 21
Annex A (normative) Topology scan schema . 28
A.1 General . 28
A.2 Network . 28
A.3 ProfinetNetworkT . 28
A.4 ProfinetConnectionPointT . 28
A.5 ProfinetIdentificationT . 29
A.6 MACT . 30
A.7 IPv4T . 30
A.8 IPv6T . 30
A.9 DNSNameT . 30
A.10 Hex4DigitT . 30
Annex B (normative) Transfer service parameters . 31
B.1 General . 31
B.2 sendData . 31

B.3 receiveData . 31
B.4 TransferSendDataT . 31
B.5 TransferResultDataT . 32
B.6 OperationT . 32
Bibliography . 33

Figure 1 – Version mapping problem . 11

Table 1 – ProtocolSupportFile for FDI Device Packages . 8
Table 2 – ProtocolSupportFile for FDI Communication Packages . 9
Table 3 – Catalog values for profile devices . 9
Table 4 – Version mapping examples . 10
Table 5 – Device identification information mapping . 11
Table 6 – Protocol type Profinet_IO . 12
Table 7 – DeviceType Property mapping . 13
Table 8 – PROFINET identification type definition . 13
Table 9 – ConnectionPoint type for Profinet_IO . 14
Table 10 – Method Connect arguments . 18
Table 11 – Method Disconnect arguments . 18
Table 12 – Method Transfer arguments . 19
Table 13 – Method SetAddress arguments . 20
Table 14 – Method Connect arguments . 22
Table 15 – Method Transfer arguments . 23
Table 16 – Method SetAddress arguments . 25
Table A.1 – Elements of ProfinetNetworkT . 28
Table A.2 – Attributes of ProfinetConnectionPointT . 29
Table A.3 – Elements of ProfinetConnectionPointT . 29
Table A.4 – Attributes of ProfinetIdentificationT .
...

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