IEC 62137-3:2011

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.

Techniques d'assemblage des composants électroniques - Partie 3: Guide de choix des méthodes d'essai d'environnement et d'endurance des joints brasés

La CEI 62137-3:2011 présente la méthodologie de choix d'une méthode d'essai appropriée à un essai de fiabilité des joints brasés de divers types et formes de dispositifs montés en surface (CMS), de dispositifs du type en réseau, de dispositifs à connexions filaires et de dispositifs du type à insertion de connexions, utilisant divers types d'alliages de matériaux de soudure. Cette première édition annule et remplace la CEI/PAS 62137-3, publiée en 2008, et comporte des modifications éditoriales. Les principales modifications par rapport au PAS sont les suivantes:
- pas de modifications techniques;
- des corrections et modifications éditoriales;
- un réagencement du document.

General Information

• Status: Published
• Publication Date: 07-Nov-2011
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.190 - Electronic component assemblies
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 3 - TC 91/WG 3
• Current Stage: PPUB - Publication issued
• Start Date: 31-Oct-2011
• Completion Date: 08-Nov-2011

Relations

• Replaces: IEC PAS 62137-3:2008 - Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62137-3 ®
Edition 1.0 2011-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electronics assembly technology –
Part 3: Selection guidance of environmental and endurance test methods for
solder joints
Techniques d'assemblage des composants électroniques –
Partie 3: Guide de choix des méthodes d'essai d'environnement et d'endurance
des joints brasés
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IEC 62137-3 ®
Edition 1.0 2011-11
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Electronics assembly technology –
Part 3: Selection guidance of environmental and endurance test methods for
solder joints
Techniques d'assemblage des composants électroniques –
Partie 3: Guide de choix des méthodes d'essai d'environnement et d'endurance
des joints brasés
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX X
ICS 31.190 ISBN 978-2-88912-711-5

– 2 – 62137-3 © IEC:2011
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General remarks . 9
5 Procedure of selecting the applicable test method . 10
5.1 Stress to solder joints in the field and test methods . 10
5.2 Selection of test methods based on the shapes and terminations/leads of
electronic devices . 12
5.2.1 Surface mount devices . 12
5.2.2 Lead insertion type device . 13
6 Common subjects in each test method . 14
6.1 Mounting device and materials used . 14
6.2 Soldering condition . 15
6.2.1 General . 15
6.2.2 Reflow soldering . 15
6.2.3 Wave soldering . 17
6.3 Accelerated stress conditioning . 18
6.3.1 Rapid temperature change (applies to all solder alloys in this
document) . 18
6.3.2 Dry heat (applies to Bi58Sn42 alloy solder only) . 19
6.3.3 Damp heat (steady state) (applies to Sn91Zn9 and Sn89Zn8Bi3 alloy
solder) . 19
6.4 Selection of test conditions and judgement of test results . 19
7 Evaluation test method . 19
7.1 Solder joint strength test of SMD . 19
7.1.1 General . 19
7.1.2 Pull strength test . 19
7.1.3 Shear strength test . 20
7.1.4 Torque shear strength test . 21
7.1.5 Monotonic bending strength test . 21
7.2 Cyclic bending strength test . 22
7.3 Mechanical shear fatigue test . 23
7.4 Cyclic drop test and cyclic steel ball drop strength test . 24
7.4.1 Overview . 24
7.4.2 Cyclic steel ball drop strength test . 25
7.5 Solder joint strength test for lead insertion type device . 26
7.5.1 Pull strength test for insertion type device . 26
7.5.2 Creep strength test for lead insertion type device . 26
Annex A (informative) Condition of rapid temperature change . 28
Annex B (informative) Electrical continuity test for solder joint . 30
Annex C (informative) Torque shear strength test . 31
Annex D (informative) Monotonic bending strength test . 34
Annex E (informative) Cyclic steel ball drop strength test . 36
Annex F (informative) Pull strength test . 38
Annex G (informative) Creep strength test . 39

62137-3 © IEC:2011 – 3 –
Annex H (informative) Evaluation method for the fillet lifting phenomenon of a lead
insertion type device solder joint . 41
Bibliography . 43

Figure 1 – Joint regions for the reliability tests . 9
Figure 2 – Factors affecting the joint reliability made by lead-free solder . 10
Figure 3 – An example of the mounting position of SMD for monotonic bending and
cyclic bending tests . 15
Figure 4 – An example of reflow soldering temperature profile (Sn96,5Ag3Cu,5) . 16
Figure 5 – Examples of reflow soldering temperature profile other than
Sn96,5Ag3Cu,5 . 16
Figure 6 – An example of wave soldering temperature profile (Sn96,5Ag3Cu,5) . 17
Figure 7 – An example of wave soldering temperature profile . 18
Figure 8 – Pull strength test . 20
Figure 9 – Shear strength test. 20
Figure 10 – Torque shear strength test . 21
Figure 11 – Monotonic bending strength test . 21
Figure 12 – Cyclic bending strength test . 22
Figure 13 – Structure of cyclic bending strength test . 23
Figure 14 – Schematic diagram of mechanical shear fatigue for solder joint . 24
Figure 15 – Cyclic drop test . 25
Figure 16 – Cyclic steel ball drop test . 25
Figure 17 – Pull strength test . 26
Figure 18 – Creep strength test . 27
Figure A.1 – Stress relation curve for a given strain to a solder joint (Sn96,5Ag3Cu,5) . 28
Figure A.2 – Time to reach steady state in the temperature cycle chamber . 29
Figure B.1 – Example of the test circuit for an electrical continuity test of a solder joint . 30
Figure C.1 – Fixing of substrate for torque shear strength test . 32
Figure C.2 – Torque shear strength test jig and position adjustment . 33
Figure C.3 – Torque shear strength test for a connector . 33
Figure D.1 – Example of a board bending jig . 34
Figure E.1 – Cyclic steel ball drop test . 37
Figure E.2 – Comparison of cyclic drop test and cyclic steel ball drop test . 37
Figure F.1 – Pull strength test . 38
Figure G.1 – Creep strength test
...