IEC 61191-1:2013

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-1:2013 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. It also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- reference standard IEC 61192-1 has been replaced by IPC-A-610;
- some of the terminology has been updated;
- references to IEC standards have been corrected;
- the use of lead-free alloys in the assembly have been added.

Ensembles de cartes imprimées - Partie 1: Spécification générique - Exigences relatives aux ensembles électriques et électroniques brasés utilisant les techniques de montage en surface et associées

La CEI 61191-1:2013 établit les exigences relatives aux matériaux, méthodes et critères de vérification utilisés dans le cadre de la production d'interconnexions et d'ensembles brasés de qualité faisant appel à la technique de montage en surface ainsi qu'à des techniques de montage associées. Il comprend également des recommandations concernant la qualité des processus de fabrication. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- remplacement de la norme de référence CEI 61192-1 par le document IPC-A-610;
- mise à jour d'une partie de la terminologie;
- correction des références aux normes CEI;
- ajout de l'utilisation d'alliages sans plomb dans l'assemblage.

General Information

• Status: Published
• Publication Date: 20-May-2013
• ICS: 31.190 - Electronic component assemblies
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 2 - TC 91/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 14-Sep-2018

Relations

• Revised: IEC 61191-1:2018 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61191-1


®


Edition 2.0 2013-05



INTERNATIONAL



STANDARD



NORME
INTERNATIONALE


Printed board assemblies –
Part 1: Generic specification – Requirements for soldered electrical and
electronic assemblies using surface mount and related assembly technologies

Ensembles de cartes imprimées –
Partie 1: Spécification générique – Exigences relatives aux ensembles
électriques et électroniques brasés utilisant les techniques de montage en
surface et associées


IEC 61191-1:2013

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IEC 61191-1



®



Edition 2.0 2013-05







INTERNATIONAL





STANDARD







NORME



INTERNATIONALE











Printed board assemblies –

Part 1: Generic specification – Requirements for soldered electrical and

electronic assemblies using surface mount and related assembly technologies




Ensembles de cartes imprimées –

Partie 1: Spécification générique – Exigences relatives aux ensembles


électriques et électroniques brasés utilisant les techniques de montage en

surface et associées













INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE

PRICE CODE
INTERNATIONALE

CODE PRIX X


ICS 31.190; 31.240 ISBN 978-2-83220-810-6



Warning! Make sure that you obtained this publication from an authorized distributor.

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® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

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– 2 – 61191-1 © IEC:2013


CONTENTS




FOREWORD . 6


1 Scope . 8

2 Normative references . 8

3 Terms and definitions . 9

4 General requirements . 10

4.1 Order of precedence. 10

4.1.1 General remark . 10
4.1.2 Conflict . 10
4.1.3 Conformance documentation . 10
4.2 Interpretation of requirements . 10
4.3 Classification . 11
4.4 Defects and process indicators . 11
4.5 Process control requirements . 11
4.6 Requirements flowdown . 11
4.7 Physical designs . 12
4.7.1 Design requirements . 12
4.7.2 New designs . 12
4.7.3 Existing designs . 12
4.8 Visual aids . 12
4.9 Proficiency of personnel . 12
4.9.1 Design proficiency . 12
4.9.2 Manufacturing proficiency . 12
4.10 Electrostatic discharge (ESD) . 12
4.11 Facilities . 13
4.11.1 General . 13
4.11.2 Environmental controls . 13
4.11.3 Temperature and humidity . 13
4.11.4 Lighting . 13
4.11.5 Field conditions . 13
4.11.6 Clean rooms . 13
4.12 Assembly tools and equipment . 13
4.12.1 General . 13

4.12.2 Process control . 14
5 Materials requirements . 14
5.1 Overview . 14
5.2 Solder . 14
5.3 Flux . 14
5.4 Solder paste . 15
5.5 Preform solder . 15
5.6 Adhesives . 15
5.7 Cleaning agents . 15
5.7.1 General . 15
5.7.2 Cleaning agents selection . 15
5.8 Polymeric coatings . 15
5.8.1 General . 15

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61191-1 © IEC:2013 – 3 –


5.8.2 Solder resists and localized maskants . 15

5.8.3 Conformal coating and encapsulants . 15

5.8.4 Spacers (permanent and temporary) . 16

5.9 Chemical strippers. 16

5.10 Heat shrinkable soldering devices . 16

6 Components and printed board requirements . 16

6.1 General . 16

6.2 Solderability . 16

6.2.1 Parts solderability . 16


6.2.2 Reconditioning . 16
6.2.3 Solderability testing of ceramic boards . 16
6.3 Solderability maintenance . 17
6.3.1 General . 17
6.3.2 Preconditioning . 17
6.3.3 Gold embrittlement of solder joints . 17
6.3.4 Tinning of non-solderable parts . 17
6.4 Solder purity maintenance . 18
6.5 Lead preparation . 18
6.5.1 General . 18
6.5.2 Lead forming . 19
6.5.3 Lead forming limits . 19
7 Assembly process requirements . 19
7.1 Overview . 19
7.2 Cleanliness . 19
7.3 Part markings and reference designations . 19
7.4 Solder connection contours . 19
7.5 Moisture traps . 19
7.6 Thermal dissipation . 20
8 Assembly soldering requirements . 20
8.1 General . 20
8.2 General . 20
8.2.1 Soldering process . 20
8.2.2 Machine maintenance . 20
8.2.3 Handling of parts . 20
8.2.4 Preheating . 20

8.2.5 Carriers . 20
8.2.6 Hold down of surface mount leads . 20
8.2.7 Heat application. 21
8.2.8 Cooling . 21
8.3 Reflow soldering . 21
8.3.1 Requirements . 21
8.3.2 Process development for reflow soldering . 21
8.3.3 Flux application . 21
8.3.4 Solder application . 21
8.4 Mechanized immersion soldering (non-reflow) . 22
8.4.1 General . 22
8.4.2 Process development for mechanized immersion soldering . 22
8.4.3 Drying/degassing . 23
8.4.4 Holding fixtures and materials . 23

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8.4.5 Flux application . 23

8.4.6 Solder bath . 23

8.5 Manual/hand soldering . 23

8.5.1 Requirements . 23

8.5.2 Non-reflow manual soldering . 24

8.5.3 Reflow manual soldering. 24

9 Cleanliness requirements . 25

9.1 General . 25

9.2 Equipment and material compatibility . 25


9.3 Pre-soldering cleaning . 25
9.4 Post-soldering cleaning . 25
9.4.1 General . 25
9.4.2 Ultrasonic cleaning . 25
9.5 Cleanliness verification. 26
9.5.1 General . 26
9.5.2 Visual inspection . 26
9.5.3 Testing . 26
9.6 Cleanliness criteria . 26
9.6.1 General . 26
9.6.2 Particulate matter . 26
9.6.3 Flux residues and other ionic or organic contaminants . 26
9.6.4 Cleaning option . 27
9.6.5 Test for cleanliness . 27
9.6.6 Rosin residues on cleaned board assemblies . 27
9.6.7 Ionic residues (instrument method) . 28
9.6.8 Ionic residues (manual method) . 28
9.6.9 Surface insulation resistance (SIR) . 28
9.6.10 Other contamination . 28
10 Assembly requirements . 28
10.1 General . 28
10.2 Acceptance requirements . 28
10.2.1 Process control . 28
10.2.2 Corrective action limits . 29
10.2.3 Control limit determination . 29
10.3 General assembly requirements . 29

10.3.1 Assembly integrity . 29
10.3.2 Assembly damage . 29
10.3.3 Markings. 30
10.3.4 Flatness (bow and twist) . 30
10.3.5 Solder connection . 30
10.3.6 Interfacial connections . 31
11 Coating and encapsulation . 31
11.1 Detail requirements . 31
11.2 Conformal coating . 32
11.2.1 Coating instructions . 32
11.2.2 Application . 32
11.2.3 Performance requirements. 33
11.2.4 Rework of conformal coating . 34
11.2.5 Conformal coating inspection . 34

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61191-1 © IEC:2013 – 5 –


11.3 Encapsulation . 34

11.3.1 Encapsulation instructions . 34

11.3.2 Application . 34

11.3.3 Performance requirements. 34

11.3.4 Rework of encapsulant material . 34

11.3.5 Encapsulant inspection . 34

12 Rework and repair . 35

12.1 General . 35

12.2 Rework of unsatisfactory soldered electrical and electronic assemblies . 35


12.3 Repair . 36
12.4 Post rework/repair cleaning . 36
13 Product quality assurance . 37
13.1 System requirements . 37
13.2 Inspection methodology . 37
13.2.1 Verification inspection . 37
13.2.2 Visual inspection . 37
13.2.3 Sampling inspection . 38
13.3 Process control . 38
13.3.1 System details . 38
13.3.2 Defect reduction . 38
13.3.3 Variance reduction. 39
14 Other requirements . 39
14.1 Health and safety . 39
14.2 Special manufacturing requirements . 39
14.2.1 Manufacture of devices incorporating magnetic windings . 39
14.2.2 High-frequency applications . 39
14.2.3 High-voltage or high-power applications . 39
14.3 Guidance on requirement flowdown . 39
15 Ordering data . 39
Annex A (normative) Requirements for soldering tools and equipment . 41
Annex B (normative) Qualification of fluxes . 43
Annex C (normative) Quality assessment . 44
Bibliography . 46


Figure 1 – Solder contact angle . 30
Figure 2 – Solder wetting of plated through-holes without leads . 31
Figure 3 – Coating conditions . 33

Table 1 – Solder contamination limits; maximum contaminant limit (percentage by
weight) . 18
Table 2 – Electrical and electronic assembly defects . 36
Table 3 – Magnification requirements . 37

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INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________



PRINTED BOARD ASSEMBLIES –



Part 1: Generic specification –

Requirements for soldered electrical and electronic assemblies

using surface mount and related assembly technologies



FOREWORD

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