IEC 62680-1-2:2016

Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification

IEC 62680-1-2:2016(E) defines a power delivery system covering all elements of a USB system including: Hosts, Devices, Hubs, Chargers and cable assemblies. This specification describes the architecture, protocols, power supply behaviour, connectors and cabling necessary for managing power delivery over USB at up to 100W. This specification is intended to be fully compatible and extend the existing USB infrastructure. It is intended that this specification will allow system OEMs, power supply and peripheral developers adequate flexibility for product versatility and market differentiation without losing backwards compatibility. USB Power Delivery is designed to operate independently of the existing USB bus defined mechanisms used to negotiate power.

General Information

• Status: Published
• Publication Date: 07-Nov-2016
• ICS: 29.220 - Galvanic cells and batteries
• ICS: 33.120 - Components and accessories for telecommunications equipment
• ICS: 35.200 - Interface and interconnection equipment
• Technical Committee: TC 100 - Audio, video and multimedia systems and equipment
• Current Stage: DELPUB - Deleted Publication
• Start Date: 22-Jun-2017
• Completion Date: 26-Oct-2025

Relations

• Revised: IEC 62680-1-2:2017 - Universal serial bus interfaces for data and power - Part 1-2: Common components - USB Power Delivery specification
• Effective Date: 05-Sep-2023

Overview

IEC 62680-1-2:2016 - Universal serial bus interfaces for data and power, Part 1-2: USB Power Delivery specification - defines a complete USB power delivery (USB PD) system. The standard covers all elements of a USB power ecosystem including Hosts, Devices, Hubs, Chargers and cable assemblies, and specifies the architecture, protocols, power-supply behaviour, connectors and cabling needed to manage power delivery over USB at up to 100 W. IEC 62680-1-2 is based on the USB Implementers Forum USB Power Delivery Specification (Revision 3.0, V1.0) and is intended to extend and remain compatible with the existing USB infrastructure while allowing OEMs and developers flexibility for product differentiation.

Key Topics and Technical Requirements

• Power architecture and system elements: Definitions and interactions for Hosts, Devices, Hubs, Chargers and cable assemblies within a USB PD system.
• Power negotiation protocols: Procedures and message flows required to negotiate delivered power independently of legacy USB bus mechanisms.
• Power-supply behaviour: Requirements for how power sources and sinks behave during negotiation, transitions and fault conditions to ensure safe, predictable power delivery up to 100 W.
• Connectors and cabling: Specification of connector and cable assembly roles and behavioural requirements to support negotiated power levels and system interoperability.
• Backward compatibility and extensibility: Rules to ensure new USB PD implementations interoperate with existing USB infrastructure while enabling vendor differentiation.
• Compliance and interoperability: Normative requirements that enable consistent implementation across OEMs, power-supply vendors and peripheral manufacturers.

Practical Applications and Who Uses This Standard

IEC 62680-1-2 is essential for organizations designing, manufacturing or certifying USB power systems and products that require negotiated power above legacy USB levels. Typical applications and users include:

• Consumer electronics: laptops, tablets, smartphones and peripherals that require flexible power delivery.
• Chargers and power adapters: manufacturers designing intelligent USB chargers and power supplies.
• Cable and connector makers: developers of cable assemblies and connector solutions that must support negotiated power.
• System OEMs and integrators: companies implementing USB-based power strategies in devices, docks and hubs.
• Test labs and compliance teams: organizations performing interoperability and safety testing against the standard.
• Power-supply and peripheral developers seeking market differentiation while maintaining backward compatibility.

Related Standards

• IEC 62680 series (other parts) - broader USB interfaces for data and power.
• USB Implementers Forum (USB-IF) USB Power Delivery Specification (Revision 3.0, V1.0) - the USB-IF technical basis for this IEC publication.

Keywords: IEC 62680-1-2, USB Power Delivery, USB PD, USB power specification, up to 100W, USB power negotiation, USB connectors, cable assemblies, power-supply behaviour.

Standards Content (Sample)

IEC 62680-1-2 ®
Edition 1.0 2016-11
INTERNATIONAL
STANDARD
colour
inside
Universal serial bus interfaces for data and power –
Part 1-2: Common components – USB Power Delivery specification

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IEC 62680-1-2 ®
Edition 1.0 2016-11
INTERNATIONAL
STANDARD
colour
inside
Universal serial bus interfaces for data and power –

Part 1-2: Common components – USB Power Delivery specification

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.220; 33.120; 35.200 ISBN 978-2-8322-3710-6

– 2 – IEC 62680-1-2:2016
© USB-IF:2015
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
UNIVERSAL SERIAL BUS INTERFACES FOR DATA AND POWER

Part 1-2: Common components – USB Power Delivery specification

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62680-1-2 has been prepared by technical area 14: Interfaces and
methods of measurement for personal computing equipment, of IEC technical committee 100:
Audio, video and multimedia systems and equipment.
The text of this standard was prepared by the USB Implementers Forum (USB-IF). The
structure and editorial rules used in this publication reflect the practice of the organization
which submitted it.
The text of this standard is based on the following documents:
CDV Report on voting
100/2728/CDV 100/2729/RVC
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.

© USB-IF:2015
A list of all parts in the IEC 62680 series, published under the general title Universal serial
bus interfaces for data and power, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
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– 4 – IEC 62680-1-2:2016
© USB-IF:2015
INTRODUCTION
The IEC 62680 series is based on a series of specifications that were originally developed by
the USB Implementers Forum (USB-IF). These specifications were submitted to the IEC under
the auspices of a special agreement between the IEC and the USB-IF.
This standard is the USB-IF publication USB Power Delivery Specification Revision 3.0 V.1.0.
The USB Implementers Forum, Inc.(USB-IF) is a non-profit corporation founded by the group
of companies that developed the Universal Serial Bus specification. The USB-IF was formed
to provide a support organization and forum for the advancement and adoption of Universal
Serial Bus technology. The Forum facilitates the development of high-quality compatible USB
peripherals (devices), and promotes the benefits of USB and the quality of products that have
passed compliance testing.
ANY USB SPECIFICATIONS ARE PROVIDED TO YOU "AS IS, "WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE USB
IMPLEMENTERS FORUM AND THE AUTHORS OF ANY USB SPECIFICATIONS DISCLAIM
ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY
RIGHTS, RELATING TO USE OR IMPLEMENTATION OR INFORMATION IN THIS
SPECIFICAITON.
THE PROVISION OF ANY USB SPECIFICATIONS TO YOU DOES NOT PROVIDE YOU
WITH ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS.
Entering into USB Adopters Agreements may, however, allow a signing company to
participate in a reciprocal, RAND-Z licensing arrangement for compliant products. For more
information, please see:
http://www.usb.org/developers/docs/
http://www.usb.org/developers/devclass_docs#approved
IEC DOES NOT TAKE ANY POSITION AS TO WHETHER IT IS ADVISABLE FOR YOU TO
ENTER INTO ANY USB ADOPTERS AGREEMENTS OR TO PARTICIPATE IN THE USB
IMPLEMENTERS FORUM.”
© USB-IF:2015
Universal Serial Bus
Power Delivery
Specification
Revision 3.0, V1.0. 11 December 2015

– 6 – IEC 62680-1-2:2016
© USB-IF:2015
Editors
Bob Dunstan Intel Corporation
Richard Petrie DisplayLink
Contributors
Charles Wang ACON, Advanced-Connectek, Inc.
Conrad Choy ACON, Advanced-Connectek, Inc.
Steve Sedio ACON, Advanced-Connectek, Inc.
Vicky Chuang ACON, Advanced-Connectek, Inc.
Joseph Scanlon Advanced Micro Devices
Howard Chang Allion Labs, Inc.
Greg Stewart Analogix Semiconductor, Inc.
Mehran Badii Analogix Semiconductor, Inc.
Bill Cornelius Apple
Colin Whitby-Strevens Apple
Corey Axelowitz Apple
Corey Lange Apple
Dave Conroy Apple
David Sekowski Apple
Girault Jones Apple
James Orr Apple
Jason Chung Apple
Jennifer Tsai Apple
Karl Bowers Apple
Keith Porthouse Apple
Matt Mora Apple
Paul Baker Apple
Reese Schreiber Apple
Sameer Kelkar Apple
Sasha Tietz Apple
Sree Raman Apple
William Ferry Apple
Zaki Moussaoui Apple
Bernard Shyu Bizlink Technology, Inc.
Eric Wu Bizlink Technology, Inc.
Morphy Hsieh Bizlink Technology, Inc.
Shawn Meng Bizlink Technology Inc.
Tiffany Hsiao Bizlink Technology, Inc.
Weichung Ooi Bizlink Technology, Inc.
Michal Staworko Cadence Design Systems, Inc.
Alessandro Ingrassia Canova Tech
Andrea Colognese Canova Tech
Davide Ghedin Canova Tech
Matteo Casalin Canova Tech
Nicola Scantamburlo Canova Tech

© USB-IF:2015
Yi-Feng Lin Canyon Semiconductor
Anup Nayak Cypress Semiconductor
Jagadeesan Raj Cypress Semiconductor
Pradeep Bajpai Cypress Semiconductor
Rushil Kadakia Cypress Semiconductor
Steven Wong Cypress Semiconductor
Subu Sankaran Cypress Semiconductor
Sumeet Gupta Cypress Semiconductor
Adolfo Montero Dell Inc.
Bruce Montag Dell Inc.
Gary Verdun Dell Inc.
Merle Wood Dell Inc.
Mohammed Hijazi Dell Inc.
Siddhartha Reddy Dell Inc.
Dan Ellis DisplayLink
Jason Young DisplayLink
Peter Burgers DisplayLink
Richard Petrie DisplayLink PD Chair/Device Policy Lead
Abel Astley Ellisys
Chuck Trefts Ellisys
Emmanuel Durin Ellisys
Mario Pasquali Ellisys
Chien-Cheng Kuo Etron Technology, Inc.
Jack Yang Etron Technology, Inc.
Richard Crisp Etron Technology, Inc.
Shyanjia Chen Etron Technology, Inc.
TsungTa Lu Etron Technology, Inc.
Christian Klein Fairchild Semiconductor
Oscar Freitas Fairchild Semiconductor
Souhib Harb Fairchild Semiconductor
AJ Yang Foxconn / Hon Hai
Fred Fons Foxconn / Hon Hai
Steve Sedio Foxconn / Hon Hai
Terry Little Foxconn / Hon Hai
Bob McVay Fresco Logic Inc.
Christopher Meyers Fresco Logic Inc.
Tom Burton Fresco Logic Inc.
Dian Kurniawan Fresco Logic Inc.
Adam Rodriguez Google Inc.
Alec Berg Google Inc.
David Schneider Google Inc.
Jim Guerin Google Inc.
Juan Fantin Google Inc.
Ken Wu Google Inc.
Mark Hayter Google Inc.
Nithya Jagannathan Google Inc.

– 8 – IEC 62680-1-2:2016
© USB-IF:2015
Todd Broch Google Inc.
Vincent Palatin Google Inc.
Mike Engbretson Granite River Labs
Rajaraman V Granite River Labs
Alan Berkema Hewlett Packard
Lee Atkinson Hewlett Packard
Rahul Lakdawala Hewlett Packard
Robin Castell Hewlett Packard
Roger Benson Hewlett Packard
Ron Schooley Hewlett Packard
Vaibhav Malik Hewlett Packard
Walter Fry Hewlett Packard
Bob Dunstan Intel Corporation PD Chair/Protocol WG Lead
Brad Saunders Intel Corporation
Chee Lim Nge Intel Corporation
Christine Krause Intel Corporation
Dan Froelich Intel Corporation
David Harriman Intel Corporation
David Hines Intel Corporation
David Thompson Intel Corporation
Guobin Liu Intel Corporation
Harry Skinner Intel Corporation
Henrik Leegaard Intel Corporation
Jervis Lin Intel Corporation
John Howard Intel Corporation
Karthi Vadivelu Intel Corporation
Leo Heiland Intel Corporation
Maarit Harkonen Intel Corporation
Nge Chee Lim Intel Corporation
Paul Durley Intel Corporation
Rahman Ismail Intel Corporation System Policy Lead
Ronald Swartz Intel Corporation
Sarah Sharp Intel Corporation
Scott Brenden Intel Corporation
Sridharan Ranganathan Intel Corporation
Steve McGowan Intel Corporation
Tim McKee Intel Corporation PD Chair/Compliance Lead
Toby Opferman Intel Corporation
Japan Aviation Electronics
Kenta Minejima
Industry Ltd. (JAE)
Japan Aviation Electronics
Mark Saubert
Industry Ltd. (JAE)
Japan Aviation Electronics
Toshio Shimoyama
Industry Ltd. (JAE)
Brian Fetz Keysight Technologies Inc.
Babu Mailachalam Lattice Semiconductor Corp
Gianluca Mariani Lattice Semiconductor Corp
Joel Coplen Lattice Semiconductor Corp

© USB-IF:2015
Thomas Watza Lattice Semiconductor Corp
Vesa Lauri Lattice Semiconductor Corp
Daniel H Jacobs LeCroy Corporation
Jake Jacobs LeCroy Corporation
Kimberley McKay LeCroy Corporation
Mike Micheletti LeCroy Corporation
Roy Chestnut LeCroy Corporation
Phil Jakes Lenovo
Dave Thompson LSI Corporation
Alan Kinningham Luxshare-ICT
Daniel Chen Luxshare-ICT
Josue Castillo Luxshare-ICT
Chris Yokum MCCI Corporation
Geert Knapen MCCI Corporation
Terry Moore MCCI Corporation
Velmurugan Selvaraj MCCI Corporation
Brian Marley Microchip Technology Inc.
Dave Perchlik Microchip Technology Inc.
Don Perkins Microchip Technology Inc.
John Sisto Microchip Technology Inc.
Josh Averyt Microchip Technology Inc.
Kiet Tran Microchip Technology Inc.
Mark Bohm Microchip Technology Inc.
Matthew Kalibat Microchip Technology Inc.
Mick Davis Microchip Technology Inc.
Rich Wahler Microchip Technology Inc.
Ronald Kunin Microchip Technology Inc.
Shannon Cash Microchip Technology Inc.
Anthony Chen Microsoft Corporation
Dave Perchlik Microsoft Corporation
David Voth Microsoft Corporation
Geoff Shew Microsoft Corporation
Jayson Kastens Microsoft Corporation
Kai Inha Microsoft Corporation
Marwan Kadado Microsoft Corporation
Rahul Ramadas Microsoft Corporation
Randy Aull Microsoft Corporation
Shiu Ng Microsoft Corporation
Timo Toivola Microsoft Corporation
Toby Nixon Microsoft Corporation
Vivek Gupta Microsoft Corporation
Yang You Microsoft Corporation
Dan Wagner Motorola Mobility Inc.
Ben Crowe MQP Electronics Ltd.
Pat Crowe MQP Electronics Ltd.
Sten Carlsen MQP Electronics Ltd.

– 10 – IEC 62680-1-2:2016
© USB-IF:2015
Frank Borngräber Nokia Corporation
Kai Inha Nokia Corporation
Pekka Leinonen Nokia Corporation
Richard Petrie Nokia Corporation PD Vice-Chair/Device Policy Lead
Sten Carlsen Nokia Corporation Physical Layer WG Lead
Abhijeet Kulkarni NXP Semiconductors
Ahmad Yazdi NXP Semiconductors
Bart Vertenten NXP Semiconductors
Dong Nguyen NXP Semiconductors
Guru Prasad NXP Semiconductors
Ken Jaramillo NXP Semiconductors
Krishnan TN NXP Semiconductors
Michael Joehren NXP Semiconductors
Robert de Nie NXP Semiconductors
Rod Whitby NXP Semiconductors
Vijendra Kuroodi NXP Semiconductors
Robert Heaton Obsidian Technology
Bryan McCoy ON Semiconductor
Cor Voorwinden ON Semiconductor
Edward Berrios ON Semiconductor Power Supply WG Lead
Tom Duffy ON Semiconductor
Craig Wiley Parade Technologies Inc.
Ricardo Pregiteer Power Integrations
Chris Sporck Qualcomm, Inc.
Craig Aiken Qualcomm, Inc.
George Paparrizos Qualcomm, Inc
Giovanni Garcea Qualcomm, Inc
James Goel Qualcomm, Inc
Joshua Warner Qualcomm, Inc
Narendra Mehta Qualcomm, Inc.
Terry Remple Qualcomm, Inc.
Yoram Rimoni Qualcomm, Inc.
Atsushi Mitamura Renesas Electronics Corp.
Dan Aoki Renesas Electronics Corp.
Kiichi Muto Renesas Electronics Corp.
Masami Katagiri Renesas Electronics Corp.
Nobuo Furuya Renesas Electronics Corp.
Patrick Yu Renesas Electronics Corp.
Peter Teng Renesas Electronics Corp.
Philip Leung Renesas Electronics Corp.
Steve Roux Renesas Electronics Corp.
Tetsu Sato Renesas Electronics Corp.
Heinz Wei Richtek Technology Corporation
Tatsuya Irisawa Ricoh Company Ltd.
Akihiro Ono Rohm Co. Ltd.
Chris Lin Rohm Co. Ltd.
© USB-IF:2015
Hidenori Nishimoto Rohm Co. Ltd.
Kris Bahar Rohm Co. Ltd.
Manabu Miyata Rohm Co. Ltd.
Ruben Balbuena Rohm Co. Ltd.
Takashi Sato Rohm Co. Ltd.
Vijendra Kuroodi Rohm Co. Ltd.
Yusuke Kondo Rohm Co. Ltd.
Matti Kulmala Salcomp Plc
Toni Lehimo Salcomp Plc
Tong Kim Samsung Electronics Co. Ltd.
Alvin Cox Seagate Technology LLC Cab Con WG Lead
John Hein Seagate Technology LLC
Marc Noblitt Seagate Technology LLC
Ronald Rueckert Seagate Technology LLC
Tony Priborsky Seagate Technology LLC
John Sisto SMSC
Ken Gay SMSC
Mark Bohm SMSC
Richard Wahler SMSC
Shannon Cash SMSC
Tim Knowlton SMSC
William Chiechi SMSC
Fabien Friess ST-Ericsson
Giuseppe Platania ST-Ericsson
Jean-Francois Gatto ST-Ericsson
Milan Stamenkovic ST-Ericsson
Nicolas Florenchie ST-Ericsson
Patrizia Milazzo ST-Ericsson
Christophe Lorin ST-Microelectronics
John Bloomfield ST-Microelectronics
Massimo Panzica ST-Microelectronics
Meriem Mersel ST-Microelectronics
Nathalie Ballot ST-Microelectronics
Pascal Legrand ST-Microelectronics
Patrizia Milazzo ST-Microelectronics
Zongyao Wen Synopsys, Inc.
Joan Marrinan Tektronix
Kimberley McKay Teledyne-LeCroy
Matthew Dunn Teledyne-LeCroy
Tony Minchell Teledyne-LeCroy
Anand Dabak Texas Instruments
Bill Waters Texas Instruments
Deric Waters Texas Instruments Physical Layer WG Lead
Grant Ley Texas Instruments
Ingolf Frank Texas Instruments
Ivo Huber Texas Instruments
– 12 – IEC 62680-1-2:2016
© USB-IF:2015
Javed Ahmad Texas Instruments
Jean Picard Texas Instruments
Martin Patoka Texas Instruments
Scott Jackson Texas Instruments
Srinath Hosur Texas Instruments
Steven Tom Texas Instruments
Dydron Lin VIA Technologies, Inc.
Fong-Jim Wang VIA Technologies, Inc.
Jay Tseng VIA Technologies, Inc.
Rex Chang VIA Technologies, Inc.
Terrance Shih VIA Technologies, Inc.
Charles Neumann Western Digital Technologies, Inc.
Curtis Stevens Western Digital Technologies, Inc.
John Maroney Western Digital Technologies, Inc.

Revision History
Revision Version Comments Issue Date
1.0 1.0 Initial release Revision 1.0 5 July, 2012
1.0 1.1 Including errata through 31-October-2012 31 October 2012
1.0 1.2 Including errata through 26-June-2013 26 June, 2013
1.0 1.3 Including errata through 11-March-2014 11 March 2014
2.0 1.0 Initial release Revision 2.0 11 August 2014
2.0 1.1 Including errata through 7-May 2015 7 May 2015
3.0 1.0 Initial release Revision 3.0 11 December 2015

INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES
WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-
INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE AUTHORS OF
THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR
INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR
IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS
SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
Please send comments via electronic mail to [e-mail]
For industry information, refer to the USB Implementers Forum web page at
http://www.usb.org
All product names are trademarks, registered trademarks, or service marks of their respective
owners.
Microsoft Corporation, Renesas, STMicroelectronics, and Texas Instruments
All rights reserved.
© USB-IF:2015
Table of Contents
FOREWORD . 2
INTRODUCTION . 4
Contributors . 6
Revision History . 12
Table of Contents . 13
List of Tables . 18
List of Figures . 22
1 Introduction . 29
1.1 Overview . 29
1.2 Purpose . 30
1.3 Scope . 30
1.4 Conventions . 31
1.4.1 Precedence . 31
1.4.2 Keywords . 31
1.4.3 Numbering . 32
1.5 Related Documents. 32
1.6 Terms and Abbreviations . 33
1.7 Parameter Values . 39
2 Overview . 39
2.1 Introduction . 39
2.2 Section Overview . 40
2.3 USB Power Delivery Capable Devices . 41
2.4 SOP* Communication . 42
2.4.1 Introduction . 42
2.4.2 SOP* Collision Avoidance . 42
2.4.3 SOP Communication . 43
2.4.4 SOP’/SOP’’ Communication with Cable Plugs . 43
2.5 Operational Overview . 44
2.5.1 Source Operation . 44
2.5.2 Sink Operation . 46
2.5.3 Cable Plugs . 48
2.6 Architectural Overview . 49
2.6.1 Policy . 51
2.6.2 Message Formation and Transmission . 52
2.6.3 Collision Avoidance . 52
2.6.4 Power supply . 53
2.6.5 DFP/UFP . 53
2.6.6 VCONN Source . 54
2.6.7 Cable and Connectors . 54
2.6.8 Interactions between Non-PD, BC and PD devices . 54
2.6.9 Power Rules . 54
3 USB Type-A and USB Type-B Cable Assemblies and Connectors . 54
4 Electrical Requirements . 54
4.1 Interoperability with other USB Specifications . 54
4.2 Dead Battery Detection / Unpowered Port Detection . 55
4.3 Cable IR Ground Drop (IR Drop) . 55

– 14 – IEC 62680-1-2:2016
© USB-IF:2015
4.4 Cable Type Detection . 55
5 Physical Layer . 55
5.1 Physical Layer Overview . 55
5.2 Physical Layer Functions . 56
5.3 Symbol Encoding . 56
5.4 Ordered Sets . 57
5.5 Transmitted Bit Ordering . 59
5.6 Packet Format . 59
5.6.1 Packet Framing . 60
5.6.2 CRC . 62
5.6.3 Packet Detection Errors . 64
5.6.4 Hard Reset . 65
5.6.5 Cable Reset . 65
5.7 Collision Avoidance . 66
5.8 Biphase Mark Coding (BMC) Signaling Scheme . 67
5.8.1 Encoding and signaling . 67
5.8.2 Transmit and Receive Masks . 71
5.8.3 Transmitter Load Model . 78
5.8.4 BMC Common specifications . 79
5.8.5 BMC Transmitter Specifications . 80
5.8.6 BMC Receiver Specifications . 84
5.9 Built in Self-Test (BIST) . 86
5.9.1 BIST Carrier Mode . 86
5.9.2 BIST Test Data . 86
6 Protocol Layer . 87
6.1 Overview . 87
6.2 Messages . 87
6.2.1 Message Construction . 88
6.3 Control Message . 94
6.3.1 GoodCRC Message . 95
6.3.2 GotoMin Message . 96
6.3.3 Accept Message . 96
6.3.4 Reject Message . 96
6.3.5 Ping Message . 97
6.3.6 PS_RDY Message . 97
6.3.7 Get_Source_Cap Message . 97
6.3.8 Get_Sink_Cap Message . 97
6.3.9 DR_Swap Message . 97
6.3.10 PR_Swap Message. 98
6.3.11 VCONN_Swap Message . 99
6.3.12 Wait Message . 99
6.3.13 Soft Reset Message . 100
6.3.14 Not_Supported Message . 100
6.3.15 Get_Source_Cap_Extended Message . 101
6.3.16 Get_ Source_Status Message. 101
6.3.17 FR_Swap Message . 101
6.4 Data Message . 102
6.4.1 Capabilities Message . 102
6.4.2 Request Message . 112

© USB-IF:2015
6.4.3 BIST Message . 116
6.4.4 Vendor Defined Message . 117
6.4.5 Battery_Status Message . 141
6.4.6 Source_Alert Message . 142
6.5 Extended Message . 144
6.5.1 Source_Capabilities_Extended Message . 144
6.5.2 Source_Status Message . 148
6.5.3 Get_Battery_Cap Message . 150
6.5.4 Get_Battery_Status Message . 150
6.5.5 Battery_Capabilities Message . 151
6.5.6 Get_Manufacturer_Info Message . 152
6.5.7 Manufacturer_Info Message . 152
6.5.8 Security Messages . 153
6.6 Timers . 154
6.6.1 CRCReceiveTimer . 154
6.6.2 SenderResponseTimer . 154
6.6.3 Capability Timers . 155
6.6.4 SinkRequestTimer . 155
6.6.5 Power Supply Timers . 156
6.6.6 NoResponseTimer . 157
6.6.7 BIST Timers . 158
6.6.8 Power Role Swap Timers . 158
6.6.9 Hard Reset Timers. 159
6.6.10 Structured VDM Timers . 159
6.6.11 VCONN Timers . 161
6.6.12 tCableMessage . 161
6.6.13 DiscoverIdentityTimer . 161
6.6.14 Collision Avoidance Timers . 161
6.6.15 tFRSwapInit . 162
6.6.16 Time Values and Timers . 162
6.7 Counters . 164
6.7.1 MessageID Counter . 164
6.7.2 Retry Counter . 165
6.7.3 Hard Reset Counter . 165
6.7.4 Capabilities Counter . 165
6.7.5 Discover Identity Counter . 166
6.7.6 VDMBusyCounter . 166
6.7.7 Counter Values and Counters . 166
6.8 Reset . 166
6.8.1 Soft Reset and Protocol Error . 166
6.8.2 Hard Reset . 167
6.8.3 Cable Reset . 168
6.9 Collision Avoidance . 168
6.10 Message Discarding. 169
6.11 State behavior . 169
6.11.1 Introduction to state diagrams used in Chapter 6 . 169
6.11.2 State Operation . 170
6.11.3 List of Protocol Layer States . 181
6.12 Message Applicability . 182

– 16 – IEC 62680-1-2:2016
© USB-IF:2015
6.12.1 Applicability of Control Messages . 183
6.12.2 Applicability of Data Messages . 185
6.12.3 Applicability of Extended Messages . 185
6.12.4 Applicability of VDM Commands . 186
6.12.5 Applicability of Reset Signaling . 187
6.12.6 Applicability of Fast Role Swap signal . 187
6.13 Value Parameters . 188
7 Power Supply . 188
7.1 Source Requirements . 188
7.1.1 Behavioral Aspects . 188
7.1.2 Source Bulk Capacitance . 188
7.1.3 Types of Sources . 189
7.1.4 Positive Voltage Transitions . 189
7.1.5 Negative Voltage Transitions . 190
7.1.6 Response to Hard Resets . 191
7.1.7 Changing the Output Power Capability . 192
7.1.8 Robust Source Operation . 192
7.1.9 Output Voltage Tolerance and Range . 193
7.1.10 Charging and Discharging the Bulk Capacitance on V . 194
BUS
7.1.11 Swap Standby for Sources . 194
7.1.12 Source Peak Current Operation . 195
7.1.13 Source Capabilities Extended Parameters . 195
7.1.14 Fast Role Swap . 197
7.2 Sink Requirements . 198
7.2.1 Behavioral Aspects . 198
7.2.2 Sink Bulk Capacitance . 198
7.2.3 Sink Standby . 199
7.2.4 Suspend Power Consumption . 199
7.2.5 Zero Negotiated Current . 199
7.2.6 Transient Load Behavior . 199
7.2.7 Swap Standby for Sinks . 200
7.2.8 Sink Peak Current Operation . 200
7.2.9 Robust Sink Operation . 200
7.2.10 Fast Role Swap . 201
7.3 Transitions . 202
7.3.1 Increasing the Current . 203
7.3.2 Increasing the Voltage . 204
7.3.3 Increasing the Voltage and Current. 206
7.3.4 Increasing the Voltage and Decreasing the Current . 208
7.3.5 Decreasing the Voltage and Increasing the Current . 210
7.3.6 Decreasing the Current . 212
7.3.7 Decreasing the Voltage . 214
7.3.8 Decreasing the Voltage and the Current .
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