IEC 61000-4-33:2005

Electromagnetic compatibility (EMC) - Part 4-33: Testing and measurement techniques - Measurement methods for high-power transient parameters

Provides a basic description of the methods and means (e.g., instrumentation) for measuring responses arising from high-power transient electromagnetic parameters. These responses can include: - the electric (E) and/or magnetic (H) fields (e.g., incident fields or incident plus scattered fields within a system under test); - the current I (e.g., induced by a transient field or within a system under test); - the voltage V (e.g., induced by a transient field or within a system under test); - the charge Q induced on a cable or other conductor. These measured quantities are generally complicated time-dependent waveforms, which can be described approximately by several scalar parameters, or "observables". These parameters include: - the peak amplitude of the response, - the waveform rise-time, - the pulse width, and - mathematically defined norms obtained from the waveform. This International Standard provides information on the measurement of these waveforms and on the mathematical determination of the characterizing parameters. It does not provide information on specific level requirements for testing. It has the status of a basic EMC publication in accordance with IEC Guide 107.

General Information

• Status: Published
• Publication Date: 26-Sep-2005
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 33.100.10 - Emission
• ICS: 33.100.20 - Immunity
• Technical Committee: SC 77C - High power transient phenomena
• Drafting Committee: PT 61000-4-33 - TC 77/SC 77C/PT 61000-4-33
• Current Stage: PPUB - Publication issued
• Start Date: 15-Dec-2005
• Completion Date: 27-Sep-2005

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 61000-4-33
First edition
2005-09
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 4-33:
Testing and measurement techniques –
Measurement methods for high-power
transient parameters
Reference number
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INTERNATIONAL IEC
STANDARD 61000-4-33
First edition
2005-09
BASIC EMC PUBLICATION
Electromagnetic compatibility (EMC) –
Part 4-33:
Testing and measurement techniques –
Measurement methods for high-power
transient parameters
© IEC 2005 ⎯ Copyright - all rights reserved
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– 2 – 61000-4-33 ” IEC:2005(E)
CONTENTS
FOREWORD.4
INTRODUCTION .6
1 Scope.7
2 Normative references.7
3 Terms and definitions.8
4 Measurement of high-power transient responses .9
4.1 Overall measurement concepts and requirements.9
4.2 Representation of a measured response. 12
4.3 Measurement equipment. 12
4.4 Measurement procedures. 27
5 Measurement of low frequency responses. 27
6 Calibration procedures . 28
6.1 Calibration of the entire measurement channel. 28
6.2 Calibration of individual measurement channel components . 31
6.3 Approximate calibration techniques. 37
Annex A (normative) Methods of characterizing measured responses . 40
Annex B (informative) Characteristics of measurement sensors. 45
Annex C (normative) HPEM measurement procedures . 59
Annex D (informative) Two-port representations of measurement chain components . 62
Bibliography. 69
Figure 1 – Illustration of a typical instrumentation chain for measuring high-power
transient responses . 10
Figure 2 – Illustration of a balanced sensor and cable connecting to an unbalanced
(coaxial) line where I + I = I . 16
out in 1
Figure 3 – Examples of some simple baluns [4b] . 18
Figure 4 – A typical circuit for an in-line attenuator in the measurement chain. 18
Figure 5 – Illustration of the typical attenuation of a nominal 20 dB attenuator for a
50–: system, as a function of frequency. 19
Figure 6 – Typical circuit diagram for an in-line integrator. 20
Figure 7 – Plot of the transfer function of the integrating circuit of Figure 6. 20
Figure 8 – Illustration of the frequency dependent per-unit-length signal transmission
of a standard coaxial cable, and a semi-rigid coaxial line. 21
Figure 9 – Illustration of sensor cable routing in regions not containing EM fields. 24
Figure 10 – Treatment of sensor cables when located in a region containing EM fields. 25
Figure 11 – Conforming cables to local system shielding topology . 26
Figure 12 – Correct and incorrect methods of cable routing. 27
Figure 13 – The double-ended TEM Cell for providing a uniform field illumination for
probe calibration . 29
Figure 14 – Illustration of the single-ended TEM cell and associated equipment. 30
Figure 15 – Dimensions of a small test fixture for probe calibration. 30

61000-4-33 ” IEC:2005(E) – 3 –
Figure 16 – Electrical representation of a measurement chain, (a) with the E-field
sensor represented by a general Thevenin circuit, and (b) the Norton equivalent circuit
for the same sensor. 31
Figure 17 – Example of a simple E-field probe. 34
Figure 18 – Plot of the real and imaginary parts of the input impedance, Z , for the E-
i
field sensor of Figure 17. 34
Figure 19 – Plot of the magnitude of the short-circuit current flowing in the sensor input
for different angles of incidence, as computed by an antenna analysis code . 35
Figure 20 – Plot of the magnitude of the effective height of the sensor for different
angles of incidence. 36
Figure 21 – High frequency equivalent circuit of an attenuator element . 39
Figure A.1 – Illustration of various parameters used to characterize the pulse
component of a transient response waveform R(t). 41
Figure A.2 – Illustration of an oscillatory waveform frequently encountered in high-
power transient EM measurements. 41
Figure A.3 – Example of the calculated spectral magnitude of the waveform of Figure A.2 . 44
Figure B.1 – Illustration of a simple E-field sensor, together with its Norton equivalent
circuit. 46
~
Figure B.2 – Magnitude and phase of the normalized frequency function F(ZW ) for
the field sensor . 47
Figure B.3 – Illustration of a simple B-field sensor, together with its Thevenin
equivalent circuit . 49
Figure B.4 – Illustration of an E-field sensor over a ground plane used for measuring
the vertical electric field, or equivalently, the surface charge density. 50
Figure B.5 – Illustration of the half-loop B-dot sensor used for measuring the
tangential magnetic field, or equivalently, the surface current density . 52
Figure B.6 – Simplified concept for measuring wire currents . 53
Figure B.7 – Construction details of a current sensor . 54
Figure B.8 – Example of the measured sensor impedance magnitude of a nominal 1 :
current sensor. 55
Figure B.9 – Geometry of the in-line I-dot current sensor . 55
Figure B.10 – Design concept for a coaxial cable current sensor . 56
Figure B.11 – Shape and dimensions of a CIP-10 coaxial cable current sensor. 57
Figure B.12 – Configuration of a coaxial cable I-dot current sensor. 57
Figure D.1 – Voltage and current relationships for a general two-port network . 62
Figure D.2 – Voltage and current definitions for the chain parameters. 63
Figure D.3 – Cascaded two-port networks. 64
Figure D.4 – Representation of the of a simple measurement chain using the chain
parameter matrices. 64
Figure D.5 – Simple equivalent circuit for the measurement chain . 65
Figure D.6 – A simple two-port network modelled by chain parameters . 65
Table A.1 – Examples of time waveform p-norms. 42
Table A.2 – Time waveform norms used for high-power transient waveforms. 42
Table D.1 – Chain parameters for simple circuit elements. 66

– 4 – 61000-4-33 ” IEC:2005(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ELECTROMAGNETIC COMPATIBILITY (EMC) –
Part 4-33: Testing and measurement techniques –
Measurement methods for high-power transient parameters
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