IEC 60747-16-10:2004

Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits

IEC 60747-16-10:2004 specifies the terms, definitions, symbols, quality system, test, assessment and verification methods and other requirements relevant to the design, manufacture and supply of monolithic microwave integrated circuits in compliance with the general requirements of the IECQ-CECC System for electronic components of assessed quality.

Dispositifs à semiconducteurs - Partie 16-10: Format-cadre pour agrément de technologie (TAS) pour circuits intégrés monolithiques hyperfréquences

La CEI 60747-16-10:2004 spécifie les termes, les définitions, les symboles, le système de qualité, les méthodes d'essai, d'évaluation et de vérification et d'autres exigences relatives à la conception, la fabrication et la livraison de circuits intégrés monolithiques hyperfréquences conformément aux exigences générales du système IECQ-CECC pour les composants électroniques sous assurance de la qualité.

General Information

• Status: Published
• Publication Date: 14-Jul-2004
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47E - Discrete semiconductor devices
• Drafting Committee: WG 2 - TC 47/SC 47E/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 30-Nov-2004
• Completion Date: 15-Jul-2004

Standards Content (Sample)

INTERNATIONAL IEC
STANDARD 60747-16-10
QC 210021
First edition
2004-07
Semiconductor devices –
Part 16-10:
Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
Reference number
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INTERNATIONAL IEC
STANDARD 60747-16-10
QC 210021
First edition
2004-07
Semiconductor devices –
Part 16-10:
Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
© IEC 2004 ⎯ Copyright - all rights reserved
No part of this publication may be reproduced or utilized in any form or by any means, electronic or
mechanical, including photocopying and microfilm, without permission in writing from the publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, Switzerland
Telephone: [phone] Telefax: [phone] E-mail: [e-mail] Web: www.iec.ch
PRICE CODE
Commission Electrotechnique Internationale XA
International Electrotechnical Commission
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For price, see current catalogue

– 2 – 60747-16-10 © IEC:2004(E)
CONTENTS
FOREWORD.4
Foreword to this particular Technology Approval Schedule (TAS) .7
Organizations responsible for preparing the present TAS.7
Preface.7
INTRODUCTION.8
1 General .9
1.1 Scope.9
1.2 Normative documents.9
1.3 Units, symbols and terminology .10
1.4 Standard and preferred values .10
1.5 Definitions .10
2 Definition of the component technology .12
2.1 Scope.12
2.2 Description of activities and flow charts.13
2.3 Technical abstract .13
2.4 Requirements for control of subcontractors .16
3 Component design of MMICs.18
3.1 Scope.18
3.2 Description of activities and flow charts.18
3.3 Interfaces .19
3.4 Validations and control of the processes .21
4 Mask manufacture .23
4.1 Scope.23
4.2 Description of activities and flow charts.23
4.3 Validation and control of the processes .23
4.4 Subcontractors, vendors and internal suppliers .23
5 Wafer fabrication of MMICs .23
5.1 Scope.23
5.2 Description of activities and flow charts.24
5.3 Equipment.26
5.4 Materials .26
5.5 Re-work .26
5.6 Validation methods and control of the processes .27
5.7 Interrelationship .28
6 Wafer probing of MMICs .30
6.1 Scope.30
6.2 Description of activities and flow charts.30
6.3 Equipment.30
6.4 Test procedures .30
6.5 Interrelationship .30
7 Back-side process for bare chip delivery .32
7.1 Scope.32
7.2 Description of activity and flow charts.32
7.3 Equipment.33
7.4 Materials .33

60747-16-10 © IEC:2004(E) – 3 –
7.5 Validation methods and control of the processes .33
7.6 Interrelationship .33
7.7 Validity of release.34
8 Assembly of MMICs.36
8.1 Scope.36
8.2 Description of activities and flow charts.36
8.3 Materials, inspection and handling.37
8.4 Equipment.37
8.5 Re-work .37
8.6 Validation and control of the processes .37
8.7 Interrelationships.38
9 Testing of MMICs .40
9.1 Scope.40
9.2 Description of activities and flow charts.40
9.3 Equipment.40
9.4 Test procedures .41
9.5 Interfaces .42
9.6 Validation and control of the processes .43
9.7 Process boundary verification.46
9.8 Product verification.50
10 Process characterization .50
10.1 Identification of process characteristics .50
10.2 Description of activities .51
10.3 Characterization procedures.52
11 Packaging and shipping.53
11.1 Description of activities and flow charts.53
11.2 Interfaces .54
11.3 Validity of release.54
12 Withdrawal of Technology Approval.56
Figure 1 – Example flow chart of design/manufacture/test.16
Figure 2 – Example flow chart of a design.21
Figure 3 – Technology flow chart of the process .29
Figure 4 – Example flow chart for a wafer probing. .30
Figure 5 – Example flow chart for a back-side process for bare chip delivery .34
Figure 6 – Example flow chart for an assembly .38
Figure 7 – Example flow char for a testing .44
Figure 8 – Typical flow chart for packaging and shipping .54

– 4 – 60747-16-10 © IEC:2004(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 16-10: Technology Approval Schedule (TAS)
for monolithic microwave integrated circuits
FOREWORD
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Publications is accurate, IEC cannot be held r
...

IEC 60747-16-10 ®
Edition 1.0 2004-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave
integrated circuits
Dispositifs à semiconducteurs –
Partie 16-10: Format-cadre pour agrément de technologie (TAS) pour circuits
intégrés monolithiques hyperfréquences

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IEC 60747-16-10 ®
Edition 1.0 2004-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Semiconductor devices –
Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave

integrated circuits
Dispositifs à semiconducteurs –

Partie 16-10: Format-cadre pour agrément de technologie (TAS) pour circuits

intégrés monolithiques hyperfréquences

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX XA
ICS 31.200 ISBN 978-2-83220-619-5

– 2 – 60747-16-10  IEC:2004
CONTENTS
FOREWORD . 4
Foreword to this particular Technology Approval Schedule (TAS) . 7
Organizations responsible for preparing the present TAS . 7
Preface . 7
INTRODUCTION . 8
1 General . 9
1.1 Scope . 9
1.2 Normative documents . 9
1.3 Units, symbols and terminology . 10
1.4 Standard and preferred values . 10
1.5 Definitions . 10
2 Definition of the component technology . 12
2.1 Scope . 12
2.2 Description of activities and flow charts . 13
2.3 Technical abstract . 13
2.4 Requirements for control of subcontractors . 16
3 Component design of MMICs . 18
3.1 Scope . 18
3.2 Description of activities and flow charts . 18
3.3 Interfaces . 19
3.4 Validations and control of the processes . 21
4 Mask manufacture . 23
4.1 Scope . 23
4.2 Description of activities and flow charts . 23
4.3 Validation and control of the processes . 23
4.4 Subcontractors, vendors and internal suppliers . 23
5 Wafer fabrication of MMICs . 23
5.1 Scope . 23
5.2 Description of activities and flow charts . 24
5.3 Equipment . 26
5.4 Materials . 26
5.5 Re-work . 26
5.6 Validation methods and control of the processes . 27
5.7 Interrelationship . 28
6 Wafer probing of MMICs . 30
6.1 Scope . 30
6.2 Description of activities and flow charts . 30
6.3 Equipment . 30
6.4 Test procedures . 30
6.5 Interrelationship . 30
7 Back-side process for bare chip delivery . 32
7.1 Scope . 32
7.2 Description of activity and flow charts . 32
7.3 Equipment . 33
7.4 Materials . 33

60747-16-10  IEC:2004 – 3 –
7.5 Validation methods and control of the processes . 33
7.6 Interrelationship . 33
7.7 Validity of release . 34
8 Assembly of MMICs . 36
8.1 Scope . 36
8.2 Description of activities and flow charts . 36
8.3 Materials, inspection and handling. 37
8.4 Equipment . 37
8.5 Re-work . 37
8.6 Validation and control of the processes . 37
8.7 Interrelationships . 38
9 Testing of MMICs . 40
9.1 Scope . 40
9.2 Description of activities and flow charts . 40
9.3 Equipment . 40
9.4 Test procedures . 41
9.5 Interfaces . 42
9.6 Validation and control of the processes . 43
9.7 Process boundary verification . 46
9.8 Product verification. 50
10 Process characterization . 50
10.1 Identification of process characteristics . 50
10.2 Description of activities . 51
10.3 Characterization procedures . 52
11 Packaging and shipping . 53
11.1 Description of activities and flow charts . 53
11.2 Interfaces . 54
11.3 Validity of release .
...