IEC 61967-8:2011

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

IEC 61967-8:2011 defines a method for measuring the electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the frequency range of 150 kHz up to 3 GHz. The IC being evaluated is mounted on an EMC test board (PCB) between the active conductor and the ground plane of the IC stripline arrangement.
This publication is to be read in conjunction with  IEC 61967-1:2002.

Circuits intégrés - Mesure des émissions électromagnétiques - Partie 8: Mesure des émissions rayonnées - Méthode de la ligne TEM à plaques (stripline) pour CI

La CEI 61967-8:2011 définit une méthode en vue de mesurer l'émission électromagnétique rayonnée d'un circuit intégré (CI) utilisant une ligne TEM à plaques (stripline) pour CI dans la plage de fréquences comprise entre 150 kHz et 3 GHz. Le CI évalué est monté sur une carte d'essai CEM (CCI, Carte de Circuit Imprimé) entre le conducteur actif et le plan de masse de l'agencement de la ligne TEM à plaques (stripline) pour CI.
Cette publication doit être lue conjointement avec la  CEI 61967-1:2002.

General Information

• Status: Published
• Publication Date: 10-Aug-2011
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 9 - TC 47/SC 47A/WG 9
• Current Stage: DELPUB - Deleted Publication
• Start Date: 03-May-2023
• Completion Date: 31-Mar-2022

Relations

• Revised: IEC 61967-8:2023 - Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 61967-8 ®
Edition 1.0 2011-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –
Part 8: Measurement of radiated emissions – IC stripline method

Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 8: Mesure des émissions rayonnées – Méthode de la ligne TEM à plaques
(stripline) pour CI
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IEC 61967-8 ®
Edition 1.0 2011-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –
Part 8: Measurement of radiated emissions – IC stripline method

Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 8: Mesure des émissions rayonnées – Méthode de la ligne TEM à plaques
(stripline) pour CI
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
PRICE CODE
INTERNATIONALE
CODE PRIX Q
ICS 31.200 ISBN 978-2-88912-619-4

– 2 – 61967-8 © IEC:2011
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 General . 6
5 Test conditions . 6
5.1 General . 6
5.2 Supply voltage. 6
5.3 Frequency range . 6
6 Test equipment . 7
6.1 General . 7
6.2 RF measuring instrument . 7
6.3 Preamplifier . 7
6.4 IC stripline . 7
6.5 50 Ω termination . 7
6.6 System gain . 7
7 Test set-up . 8
7.1 General . 8
7.2 Test configuration . 8
7.3 EMC test board (PCB) . 8
8 Test procedure . 9
8.1 General . 9
8.2 Ambient conditions . 9
8.3 Operational check . 9
8.4 Verification of IC stripline RF characteristic . 9
8.5 Test technique. 9
9 Test report. 10
9.1 General . 10
9.2 Measurement conditions . 10
10 IC Emissions reference levels. 10
Annex A (normative) IC stripline description. 11
Annex B (informative) Specification of emission levels . 15
Bibliography . 17

Figure 1 – IC stripline test set-up . 8
Figure A.1 – Cross section view of an example of an unshielded IC stripline . 11
Figure A.2 – Cross section view of an example of an IC stripline with housing . 12
Figure A.3 – Example of IC stripline with housing . 14
Figure B.1 – Emission characterization levels . 16

Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version . 12
Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version . 12

61967-8 © IEC:2011 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-8 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/868/FDIS 47A/870/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

– 4 – 61967-8 © IEC:2011
This part of IEC 61967 is to be read in conjunction with IEC 61967-1.
A list of all parts of IEC 6xxxx series, under the general title Integrated circuits –
Measurement of electromagnetic emissions can be found on the IEC website.
NOTE Future standards in this series will carry the new general title as cited above. Titles of existing standards in
this series will be updated at the time of the next edition.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC web site under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
61967-8 © IEC:2011 – 5 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS –

Part 8: Measurement of radiated emissions –
IC stripline method
1 Scope
The measurement procedure of this part of IEC 61967 defines a method for measuring the
electromagnetic radiated emission from an integrated circuit (IC) using an IC stripline in the
frequency range of 150 kHz up to 3 GHz. The IC being evaluated is mounted on an EMC test
board (PCB) between the active conductor and the ground plane of the IC stripline
arrangement.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60050-131: International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory
IEC 60050-161: International Electrotechnical Vocabulary (IEV) – Chapter 161: Electro-
magnetic compatibility
IEC 61967-1: Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-2: Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 2: Measurement of radiated emissions – TEM cell and wideband TEM cell
method
IEC 61000-4-20: Electromagnetic compatibility (EMC) – Part 4-20: Testing and measurement
techniques – Emission and immunity testing in transverse electromagnetic (TEM) waveguides
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 61967-1,
IEC 60050-131 and IEC 60050-161 as well as the following apply.
3.1
transverse electromagnetic (TEM) mode
waveguide mode in which the components of the electric and magnetic fields in the
propagation direction are much less than the primary field components across any transverse
cross-section
3.2
TEM waveguide
open or closed transmission line system, in which a wave is propagating in the transverse
electromagnetic mode to produce a specified field for testing purposes

– 6 – 61967-8 © IEC:2011
3.3
IC stripline
TEM waveguide, consisting of an active conductor placed on a defined spacing over an
enlarged ground plane, connected to a port structure on each end and an optional shielded
enclosure
NOTE This arrangement guides a wave propagation in the transverse electromagnetic mode to produce a specific
field for testing purposes between the active conductor and the enlarged ground plane. As enlarged ground plane
the ground plane of the standard EMC test board according to IEC 61967-1 should be used. An optional shielding
enclosure may be used for fixing the IC stripline configuration and for shielding purposes. This leads to a closed
version of the IC stripline in opposite to the open version without shielding enclosure. For further information see
Annex A.
3.4
two-port TEM waveguide
TEM waveguide with input/output measurement ports at both ends
3.5
characteristic impedance
magnitude of the ratio of the voltage between the active conductor and the corresponding
ground plane to the current on either conductor for any constant phase wave-front
NOTE The characteristic impedance is independent of the voltage/current magnitudes and depends only on the
cross sectional geometry of the transmission line. TEM waveguides are typically designed to have 50 Ω
characteristic impedance. For further information and equation to stripline arrangements, see Annex A.
3.6
primary (field) component
electric field component aligned with the intended test polarization
NOTE For example, in IC stripline, the active conductor is parallel to the horizontal floor, and the primary mode
electric field vector is vertical at the transverse centre of the IC stripline.
4 General
This test method is based on the TEM wave guide measurement principle according to
IEC 61000-4-20. A stripline set-up is used to measure the RF emission of ICs. The RF voltage
at the stripline port is related to the electromagnetic radiation potential of the IC and will be
measured using a spectrum analyzer or measuring receiver. The intent of this test method is
to provide a quantitative measure of the RF emissions from ICs for comparison or other
evaluation.
5 Test conditions
5.1 General
The test conditions shall meet the requirements as described in IEC 61967-1. In addition, the
following test conditions shall apply.
5.2 Supply voltage
The supply voltage shall be as specified by the IC manufacturer. If the users of this procedure
agree to other values, they shall be documented in the test report.
5.3 Frequency range
The effective frequency range for the IC stripline is 150 kHz to 3 GHz. The range is limited by
its Voltage Standing Wave Ratio (VSWR) characteristics (≤ 1,25).

61967-8 © IEC:2011 – 7 –
6 Test equipment
6.1 General
The test equipment shall meet the requirements as described in IEC 61967-1. In addition, the
following test equipment requirements shall apply.
6.2 RF measuring instrument
A spectrum analyzer or EMI receiver shall be used. The resolution bandwidth shall be 9 kHz
for EMI receivers or 10 kHz for spectrum analyzers in the frequency range from 150 kHz to
30 MHz and respectively 120 kHz or 100 kHz above 30 MHz according to IEC 61967-1.
Measurements shall be made with a peak detector and presented in units of dBµV [for 50 Ω
system: (dBm readings) + 107 = dBµV]. For spectrum analyzers, the frequency band of
interest shall be swept in calibrated or coupled mode (auto sweep).
6.3 Preamplifier
Optionally, a 20 dB to 30 dB gain, low noise preamplifier might be used. If used, the
preamplifier shall be connected directly to the measurement port of the IC stripline using the
appropriate 50 Ω coaxial adapter.
6.4 IC stripline
TEM waveguide, consisting of an active conductor placed on a defined spacing over an
enlarged ground plane, connected to a port structure on each end and an optional shielded
enclosure. The spacing between active conductor and ground plane of the IC stripline has a
default value of 6,7 mm. Other spacing can be used but has to be noted in the test report.
NOTE A conversion factor allows comparisons between IC stripline arrangements with different spacing between
active conductor and ground plane (see Annex A).
This IC stripline arrangement guides wave propagation in the transverse electromagnetic
mode to produce a specific field for testing purposes between the active conductor and the
enlarged ground plane which is preferably the ground plane of a standard EMC test board
according to IEC 61967-1. The EMC test board controls the geometry and orientation of the
operating IC relative to the IC stripline and eliminates any connecting leads within the IC
stripline (these are on the backside of the board, which is opposite to the IC stripline). An
optional shielding enclosure may be used for fixing the IC stripline configuration and for
shielding purposes. This leads to a closed version of the IC stripline as opposed to the open
version without shielding enclosure.
For further information, see Annex A.
Ω termination
6.5 50
A 50 Ω termination with a VSWR less than 1,1 over the frequency range of measurement is
recommended for the IC stripline 50 Ω port not connected to the RF measuring instrument.
6.6 System gain
The gain (or attenuation) of the measuring equipment, without the IC stripline, shall be known
with an accuracy ±0,5 dB. The gain of the RF measurement system shall remain within a 6 dB
envelope for the frequency range of interest.

– 8 – 61967-8 © IEC:2011
7 Test set-up
7.1 General
The test set-up shall meet the requirements as described in IEC 61967-1. In addition, the
following test set-up requirements shall apply.
7.2 Test configuration
See Figure 1 for IC stripline test configuration. One of the 50 Ω ports is terminated with a
50 Ω load. The remaining 50 Ω port is connected to the spectrum analyzer through the
optional preamplifier. For further information and cross section view of the IC stripline
arrangement, see Annex A.
DUT stimulation
Power supply
and monitor
Spectrum analyzer /
EMI receiver
EMC test
Port 2
Preamplifier board
(RF connector)
(if necessary)
Port 1
(RF connector)
50 Ω
DUT
IC stripline
termination
IEC  1771/11
Figure 1 – IC stripline test set-up
7.3 EMC test board (PCB)
The DUT shall be mounted on a PCB according to IEC 61967-1 and in this standard. In cases
where IEC 61967-1 and this standard are in conflict, the requirements of this standard shall
apply.
The EMC test board is provided with the appropriate measurement or monitoring points to
ensure the correct DUT operation. It controls the geometry and orientation of the DUT relative
to the active conductor and eliminates in case of a closed version of the IC stripline any
connecting leads within the housing (these are on the backside of the board, which is outside
the housing).
61967-8 © IEC:2011 – 9 –
8 Test procedure
8.1 General
These default test conditions are intended to assure a consistent test environment. If the
users of this procedure agree to other conditions, they shall be documented in the test report.
8.2 Ambient conditions
The definitions for ambient temperature and general condition of IEC 61967-1 are valid.
The ambient RF noise level shall be verified to be at least 6 dB below the lowest emission
level(s) to be measured. The DUT shall be installed in the test set-up, as used for testing. The
DUT shall not be activated (e.g. power supply voltage disabled). A scan shall be made to
measure the ambient noise. A description of the ambient shall be a part of the test report.
If the measured noise floor is excessive, e.g. due to external ambient noises or the noise floor
of the measurement system itself, shielded enclosure should be used. The noise floor
measurement system can be improved by using a lower noise preamplifier.
8.3 Operational check
Energize the DUT and complete an operational check to assure proper function of the device
(i.e. run IC test code).
8.4 Verification of IC stripline RF characteristic
For verification of the IC stripline RF characteristic the VSWR value of the empty IC stripline
with a 50 Ω-load termination at the second port shall be measured and documented in the test
report. The value shall be lower than 1,25.
Optionally it is recommended to check the DUT-loaded IC stripline. In this case, the IC
stripline resonances shall be verified with unpowered DUT in accordance to IEC 61000-4-20.
 
P P
refl output
 
A = 10× lg + ≤ 1dB (1)
tloss
 
P P
fwd fwd
 
where
A is the transmission loss of loaded IC stripline (dB);
tloss
P is the reflected power at input port (W);
l
ref
P is the forward power at input port (W);
fwd
P is the measured power at output port (W).
output
Measurements carried out at frequencies where the VSWR and losses A exceed the
tloss
maximum tolerated values shall be ignored.
8.5 Test technique
With the EMC test board energized and the DUT being operated in the intended test mode,
measure the RF emissions over the desired frequency band.
When using a spectrum analyzer, enable the “Max Hold” function and allow the analyzer to
perform a minimum of three sweeps while the IC code loop executes. The sweep time shall be
much greater than the IC code loop execution time.

– 10 – 61967-8 © IEC:2011
NOTE The “Max Hold” setting on a spectrum analyzer maintains the maximum level of each trace data point and
updates each point if a new maximum level is detected in successive sweeps.
When using a receiver, the dwell time for each test frequency shall be greater than or equal to
two times the IC code loop execution time and record the maximum level detected.
Four separate emissions measurements are performed resulting in four sets of data. The first
measurement is made with the EMC test board mounted in an arbitrary orientation in the test
setup. The second measurement is made with the EMC test board rotated 90 degrees from
the orientation in the first measurement. For each of the third and fourth measurements, the
EMC test board is rotated again to ensure emissions are measured from all four possible
orientations. The four sets of data shall be documented in the test report.
9 Test report
9.1 General
The test report shall be in accordance with the requirements of IEC 61967-1. In addition, the
following test report requirements shall apply.
9.2 Measurement conditions
All measurement conditions shall be documented in the test report.
10 IC Emissions reference levels
IC emissions acceptance levels, if any, are to be agreed upon between the manufacturers and
the users of ICs and may be selected using the reference level scheme in Annex B. These
reference levels apply to measurements over the frequency range of 150 kHz to 3 GHz in
units of dBµV.
61967-8 © IEC:2011 – 11 –
Annex A
(normative)
IC stripline description
A.1 General
The IC stripline offers a broadband method of measuring either immunity of a DUT to fields
generated within the IC stripline or radiated emission from a DUT placed within the IC stripline.
It eliminates the use of conventional antennas with their inherent measurement limitations of
bandwidth, non-linear phase, directivity and polarization. The IC stripline is a special kind of
transmission line that propagates a TEM wave. This wave is characterized by transverse
orthogonal electric (E) and magnetic (H) fields, which are perpendicular to the direction of
propagation along the length of the IC stripline or transmission line. This field simulates a
planar field generated in free space with impedance of 377 Ω. The TEM mode has no low
frequency cut-off. This allows the IC stripline to be used at frequencies as low as desired. The
TEM mode also has linear phase and constant amplitude response as a function of frequency.
This makes it possible to use the IC stripline to generate or detect the field intensity in a
defined way. The upper useful frequency for an IC stripline is limited by distortion of the test
signal caused by resonances and multi-moding that occur within the IC stripline. These effects
are a function of the physical size and shape of the IC stripline.
The IC stripline is of a size and shape, with impedance matching at the input and output feed
points of the IC stripline that limits the VSWR to less than 1,25 up to its rated frequency. In
principle there are two versions of IC stripline possible – open and closed version. The open
version uses the common stripline configuration (Figure A.1). At the closed version a
shielding case is added (Figure A.2). The active conductor of the IC stripline is tapered at
each end to adapt to conventional 50 Ω coaxial connectors. The requested EMC test board
can be based on a TEM cell board according to IEC 61967-1. The first resonance is
demonstrated by a high VSWR over a narrow frequency range. An IC stripline verified for field
generation to a maximum frequency will also be suitable for emission measurements to this
frequency.
DUT
EMC test
IC stripline
RF connector
active conductor board
IEC  1772/11
Figure A.1 – Cross section view of an example of an unshielded IC stripline

– 12 – 61967-8 © IEC:2011
DUT IC stripline
µ-stripline
EMC test
active conductor
RF connector
housing
board
IEC  1773/11
Figure A.2 – Cross section view of an example of an IC stripline with housing
The maximum usable DUT size is limited by the IC stripline dimensions. The ratio of DUT
package height to IC stripline height is recommended to one third but shall not exceed one
half according to IEC 61000-4-20. In x-y dimension the package shall not exceed the width of
active conductor by more than 10 %.
NOTE 3 D field simulations have shown that an uniform field (not more than +0 dB and not less than -3 dB) is
present outside the active conductor width geometrical boundary up to a package size which exceeds the width of
the active conductor by 10 % at a half of active conductor height [4] .
The limitation values for the 6,7 mm IC stripline for example are given in Table A.1 and Table
A.2. The active conductor width for the closed version is dependent on the distance between
active conductor and housing. The complete setup has to fulfill the requirements of 8.4.
Table A.1 – Maximum DUT dimensions for 6,7 mm IC stripline open version
Active conductor 6,7 mm DUT
IC stripline open version
z dimension (height) 6,7 mm
≤3,35 mm
x-y dimension (width) 33 mm
≤36,3 mm
Table A.2 – Maximum DUT dimensions for 6,7 mm IC stripline closed version
Active conductor 6,7 mm DUT
IC stripline closed version
z dimension (height) 6,7 mm
≤3,35 mm
x-y dimension (width) 24 mm
≤26,4 mm
NOTE The 24 mm width of the closed version stripline is related to the stripline height and shielding design with
shape and distance to achieve the stripline characteristic defined in 8.4.
A.2 Characteristic impedance of stripline arrangements
The nominal, characteristic impedance of an open version of IC stripline can be calculated as
follows [3], if 1 < w/h ≤ 10
___________
Figures in square brackets refer to the Bibliography.

61967-8 © IEC:2011 – 13 –
120π
Z= (A.1)
w h h
 
+ 2,42− 0,44 + 1−
 
h w w
 
where
Z is the characteristic impedance (Ω), typical 50 Ω;
w is the width (m) of active conductor ;
h is the height (m) between the active conductor and ground plane.
For the closed version of the IC stripline the influence of housing has to be taken into account.
This correction depends on the housing geometry. For spherical housing surface an analytical
formula for the characteristic impedance cannot be provided, empirical investigations are
necessary. The characteristic impedance of those stripline arrangements have to be verified
by measurement.
A.3 Conversion for different active conductor heights
A conversion factor (X) to correlate measuring results of IC striplines with different heights to
the default IC stripline height of 6,7 mm can be calculated by:
 h 
 
X = 20× lg (A.2)
 
h
 2
where
X is the conversion factor (dB) to IC stripline 6,7 mm height type results;
h is the active conductor height of specific type;
h is the active conductor height of 6,7 mm type .
For example the conversion factor for a 8 mm IC stripline is X = 1,54 dB. That means 1,54 dB
has to be added to the measured voltage in dBµV at the measurement port of the 8 mm height
IC stripline.
A.4 Example for IC stripline arrangement
An example for IC stripline with housing is given in Figure A.3. The housing x-y dimensions
are defined by the used EMC test board (IEC 61967-1: 100 mm × 100 mm). The housing in z
direction shall be as far as possible from the active conductor but avoid resonances and multi-
moding in the frequency range of interest.

– 14 – 61967-8 © IEC:2011
EMC test
board IC stripline
Optional housing
50 Ω port
(RF connector)
IEC  1774/11
Figure A.3 – Example of IC stripline with housing

61967-8 © IEC:2011 – 15 –
Annex B
(informative)
Specification of emission levels

B.1 Scope
This annex provides a method of specifying the emission level profiles of integrated circuits.
B.2 General
This annex is not a product specification. However, using the concept described in this
standard and by careful application and agreement between the manufacturer and the user, it
is possible to develop a description of the RF emissions behavior for a specific integrated
circuit in one of three (x-y-z) field orientations.
B.3 Specification of emission levels
The diagram in Figure B.1 represents a scheme that facilitates classification of emission
levels for ICs. In order to be able to use the classification as defined in IEC 61967-2 values
are to be calculated using the Equation (B.1):
h 
IC Stripline
 
A= B+ 20× lg (B.1)
 
h
µTEM
 
where
A is the converted result for comparison with reference levels;
B is the measurement result ;
h is the septum height µTEM cell 45 mm (default);
µTEM
h is the active conductor height 6,7 mm (default) .

IC stripline
B.4 Presentation of results
The typical description of the maximum emission level consists of two letters and one number
always following the same sequence. If one of the three slopes is not needed, the
corresponding letter or number will be omitted.
The first character shall be a capital letter indicating the position of the horizontal line with
zero dB/decade slope. The second character shall be a number indicating the position of
the -20 dB/decade slope. The third character shall be a small letter indicating the position of
the -40 dB/decade slope.
Such defined maximum emission levels with the described notation offer a standardized way
to communicate maximum emission levels unambiguously.

– 16 – 61967-8 © IEC:2011
84 A
78 B
C
66 D
60 E
F a
b
9 c
G
d
e
f
42 H
g
h
12 i
36 I
k
l
m
K
14 n
o
15 p
L
q
r
s
18 M
t
u
18 v
N
w
x
y
O
z
0,1 1 10 100 1000 10000
Frequency  (MHz)
[Frequency] MHz
IEC  1775/11
Figure B.1 – Emission characterization levels
Voltage  (dBµV)
[Voltage] dBµV
61967-8 © IEC:2011 – 17 –
Bibliography
[1] Körber, Klotz, Mueller, Trebeck, IC- Stripline – A new Proposal for Susceptibility and
Emission Testing of ICs, EMC COMPO 2007
[2] Körber, Mueller, Trebeck, IC- Streifenleitung – Neues Messverfahren zur Bewertung der
EMV- Eigenschaften von Halbleitern, EMV Düsseldorf 2008
[3] M. V. Schneider, Microstrip Lines for Microwave Integrated Circuits The Bell System
Technical Journal, vol. 48, pp. 1421–1444, May 1969
[4] Körber, Klotz, Müller, Müllerwiebus, Trebeck, IC- Stripline for Susceptibility and
Emission Testing of ICs, EMC COMPO 2009

_____________
– 18 – 61967-8 © CEI:2011
SOMMAIRE
AVANT-PROPOS . 20
1 Domaine d'application . 22
2 Références normatives . 22
3 Termes et définitions . 22
4 Généralités . 23
5 Conditions d'essai . 23
5.1 Généralités. 23
5.2 Tension d’alimentation . 24
5.3 Plage de fréquences . 24
6 Appareillage d’essai . 24
6.1 Généralités. 24
6.2 Appareil de mesure RF . 24
6.3 Préamplificateur . 24
6.4 Ligne TEM à plaques (stripline) pour CI . 24
6.5 Terminaison de 50 Ω . 25
6.6 Gain du système . 25
7 Montage d’essai . 25
7.1 Généralités. 25
7.2 Configuration d’essai . 25
7.3 Carte d'essai CEM (CCI) . 26
8 Procédure d’essai . 26
8.1 Généralités. 26
8.2 Conditions ambiantes . 26
8.3 Vérification opérationnelle . 26
8.4 Vérification des caractéristiques RF de la ligne TEM à plaques (stripline)
pour CI . 26
8.5 Technique d’essai . 27
9 Rapport d’essai . 27
9.1 Généralités. 27
9.2 Conditions de mesure . 27
10 Niveaux de référence des émissions du CI . 27
Annexe A (normative) Description de la ligne TEM à plaques (stripline) pour CI . 28
Annexe B (informative) Spécification des niveaux d’émission . 32
Bibliographie . 34

Figure 1 – Montage d’essai de la ligne TEM à plaques (stripline) pour CI . 25
Figure A.1 – Vue en coupe d’un exemple de ligne TEM à plaques (stripline) pour CI
non blindée . 28
Figure A.2 – Vue en coupe d’un exemple de ligne TEM à plaques (stripline) pour CI
comportant une enceinte d’essai . 29
Figure A.3 – Exemple de ligne TEM à plaques (stripline) pour CI comportant une
enceinte d’essai . 31
Figure B.1 – Niveaux de caractérisation des émissions . 33

61967-8 © CEI:2011 – 19 –
Tableau A.1 – Dimensions maximales du DEE pour la version ouverte de la ligne TEM
à plaques (stripline) pour CI de 6,7 mm . 29
Tableau A.2 – Dimensions maximales du DEE pour la version fermée de la ligne TEM

à plaques (stripline) pour CI de 6,7 mm . 29

– 20 – 61967-8 © CEI:2011
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
CIRCUITS INTÉGRÉS –
MESURE DES ÉMISSIONS ÉLECTROMAGNÉTIQUES –

Partie 8: Mesure des émissions rayonnées –
Méthode de la ligne TEM à plaques (stripline) pour CI

AVANT-PROPOS
1) La Commission Electrotechnique Internationale (CEI) est une organisation mondiale de normalisation
composée de l'ensemble des comités électrotechniques nationaux (Comités nationaux de la CEI). La CEI a
pour objet de favoriser la coopération internationale pour toutes les q
...