IEC TS 62239-2:2017
(Main)Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
IEC TS 62239-2:2017(E) applies to the development of COTS assembly management plans for the integration and management of electronic COTS assemblies in electronic systems used in the ADHP markets where reliability is generally critical. Depending on program or product line requirements and/or the technical characteristics of the electronic COTS assemblies and in agreement with the customer, the electronic COTS assembly management plans could consider tailoring the requirements of this document. Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.
General Information
Standards Content (sample)
IEC TS 62239-2
Edition 1.0 2017-02
TECHNICAL
SPECIFICATION
Process management for avionics – Management plan –
Part 2: Preparation and maintenance of an electronic COTS assembly
management plan
IEC TS 62239-2:2017-02(en)
---------------------- Page: 1 ----------------------
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IEC TS 62239-2
Edition 1.0 2017-02
TECHNICAL
SPECIFICATION
Process management for avionics – Management plan –
Part 2: Preparation and maintenance of an electronic COTS assembly
management plan
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-3905-6
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission---------------------- Page: 3 ----------------------
– 2 – IEC TS 62239-2:2017 IEC 2017
CONTENTS
FOREWORD ........................................................................................................................... 4
INTRODUCTION ..................................................................................................................... 6
1 Scope .............................................................................................................................. 7
2 Normative references ...................................................................................................... 7
3 Terms, definitions and abbreviated terms ........................................................................ 7
3.1 Terms and definitions.............................................................................................. 8
3.2 Abbreviated terms ................................................................................................. 14
4 Technical requirements ................................................................................................. 15
4.1 General ................................................................................................................. 15
4.2 COTS assembly selection ..................................................................................... 16
4.2.1 General ......................................................................................................... 16
4.2.2 Design assurance .......................................................................................... 16
4.3 COTS assembly application .................................................................................. 16
4.3.1 General ......................................................................................................... 16
4.3.2 Functionality .................................................................................................. 17
4.3.3 COTS assembly compatibility ........................................................................ 17
4.3.4 Assembly materials........................................................................................ 17
4.3.5 Heat dissipation and cooling .......................................................................... 17
4.3.6 Integrity analysis ........................................................................................... 17
4.3.7 Reliability analysis ......................................................................................... 18
4.3.8 Useful life ...................................................................................................... 19
4.3.9 Storage life .................................................................................................... 19
4.3.10 Failure modes and effects analysis ................................................................ 19
4.3.11 Maintainability and testability ......................................................................... 19
4.3.12 Markings ........................................................................................................ 20
4.3.13 Safety ............................................................................................................ 20
4.3.14 Acceptance by the plan owner ....................................................................... 20
4.4 Electronic COTS assembly manufacturer selection ............................................... 20
4.4.1 General ......................................................................................................... 20
4.4.2 Electronic COTS assembly manufacturer quality system ................................ 22
4.4.3 Franchised distributor quality system ............................................................. 22
4.4.4 Electronic COTS assembly derating and stress analysis ................................ 22
4.4.5 Electronic COTS assembly qualification/characterization ............................... 22
4.4.6 Electronic components used in electronic COTS assembly:Selection/qualification and acceptance .......................................................... 23
4.4.7 Electronic COTS assembly manufacturing and handling ................................ 23
4.4.8 Electronic COTS assembly qualification approval .......................................... 23
4.4.9 Electronic COTS assembly final acceptance .................................................. 23
4.4.10 Configuration management and documentation ............................................. 23
4.4.11 Plan owner documentation ............................................................................. 24
4.4.12 Electronic COTS assembly manufacturer documentation ............................... 25
4.4.13 Life cycle management .................................................................................. 25
4.4.14 COTS assembly availability risk management ................................................ 25
4.4.15 Equipment/system corrective action and product (electronic COTSassembly) change notices ............................................................................. 26
4.4.16 Electronic COTS assembly substitution or alternative source ......................... 26
5 Plan administration ........................................................................................................ 26
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5.1 Plan content and organization ............................................................................... 26
5.2 Plan terms, definitions and abbreviated terms ....................................................... 27
5.3 Plan focal point ..................................................................................................... 27
5.4 Plan references .................................................................................................... 27
5.5 Plan applicability ................................................................................................... 27
5.6 Plan implementation ............................................................................................. 27
5.7 Plan acceptance ................................................................................................... 27
Annex A (informative) Template for tailoring the requirements of IEC TS 62239-2 .............. 28
Annex B (informative) Cross-reference between IEC TS 62239-2 and SAE EIA-933B .......... 29
Annex C (informative) Electronic COTS assembly design guidelines and COTSassembly manufacturer’s risk assessment ............................................................................ 31
C.1 COTS assembly design guidelines ........................................................................ 31
C.1.1 Open system architecture .............................................................................. 31
C.1.2 Risk assessment and performance ................................................................ 31
C.1.3 Assembly criticality ........................................................................................ 31
C.2 COTS assembly manufacturer’s risk assessment .................................................. 31
Annex D (informative) Typical electronic COTS assembly mitigation methods andtechniques ............................................................................................................................ 46
Annex E (informative) Requirements matrix for IEC TS 62239-2 ......................................... 54
Bibliography .......................................................................................................................... 61
Table 1 – Electronic COTS assembly manufacturer selection recommendations ................... 21
Table A.1 – Template for tailoring requirements of IEC TS 62239-2 ...................................... 28
Table B.1 – Cross-reference between IEC TS 62239-2 and SAE EIA-933Brequirements ......................................................................................................................... 29
Table C.1 – Template for electronic COTS assembly manufacturer’s risk assessment .......... 33
Table C.2 – Template for the plan owner’s mitigation and risk assessment of theelectronic COTS assembly manufacturer analysed in Table C.1 ............................................ 39
Table D.1 – Typical electronics COTS assembly mitigation methods and techniques ............ 46
Table E.1 – Requirements matrix for IEC TS 62239-2 ........................................................... 54
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS – MANAGEMENT PLAN –
Part 2: Preparation and maintenance of an electronic
COTS assembly management plan
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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indispensable for the correct application of this publication.9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.IEC TS 62239-2, which is a technical specification, has been prepared by IEC Technical
Committee 107: Process management for avionics.---------------------- Page: 6 ----------------------
IEC TS 62239-2:2017 IEC 2017 – 5 –
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/288/DTS 107/293/RVDTS
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62239 series, published under the general title Process
management for avionics – Management plan, can be found on the IEC website.The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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– 6 – IEC TS 62239-2:2017 IEC 2017
INTRODUCTION
The purpose of this document is to define the requirements for developing an electronic
commercial off the shelf (COTS) assembly management plan (CAMP), hereinafter also called
the plan, to assure customers that all of the electronic COTS assemblies in the equipment of
the plan owner are selected and applied in controlled processes, and that the technical
requirements detailed in this document are accomplished. In general the owners of an
electronic COTS assembly management plan are original (electronic) equipmentmanufacturers (OEMs) and system integrators for the aerospace, defence and high
performance (ADHP) electronics industry.
The objective is to define and document, as necessary, processes to assure the adequacy of
electronic COTS assemblies selected for use in electronic systems. This document states
objectives to be accomplished; it does not specify how tasks are performed, specific data
collected or reports issued. Those who prepare plans in compliance with this document are
encouraged to document processes that are the most effective and efficient for them in
accomplishing the objectives of this document. In order to allow flexibility in implementing and
updating the documented processes, plan authors are encouraged to refer to their own
internal process documents instead of including detailed process documentation within their
plans.Organizations that prepare such plans are called the plan owners and may prepare a single
plan, and use it for all relevant products supplied by the organization, or may prepare a
separate plan for each relevant product or customer.---------------------- Page: 8 ----------------------
IEC TS 62239-2:2017 IEC 2017 – 7 –
PROCESS MANAGEMENT FOR AVIONICS – MANAGEMENT PLAN –
Part 2: Preparation and maintenance of an electronic
COTS assembly management plan
1 Scope
This part of IEC 62239, which is a technical specification, applies to the development of
COTS assembly management plans (CAMPs) for the integration and management ofelectronic COTS assemblies (see 3.1.13 and 3.1.20) in electronic systems used in the ADHP
markets where reliability is generally critical.NOTE 1 Best practices for managing the electronic components within the electronic assemblies are described in
IEC TS 62239-1 and SAE EIA-STD-4899 which describe the electronic component management program (ECMP).
In cases where the electronic components can be identified and managed at the component level, ECMP can be
considered as an option to manage the components.NOTE 2 The distinction between an electronic component and an electronic assembly is provided by the
definitions in Clause 3. This distinction between an electronic component and an electronic assembly is not always
recognized by industry: for example, filters, contactors, power supply modules, relays, magnetic assemblies, etc.,
can be considered as either components or assemblies. In each application it is considered a best practice for the
user of this document to clarify this distinction.Depending on program or product line requirements and/or the technical characteristics of the
electronic COTS assemblies and in agreement with the customer, the electronic COTS
assembly management plans (CAMPs) could consider tailoring the requirements of this
document. See Annex A.Although developed for the avionics industry, this document can be applied by other high
performance and high reliability industries at their discretion.2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.There are no normative references in this document.
3 Terms, definitions and abbreviated terms
For the purposes of this document, the following terms, definitions and abbreviated terms
apply.ISO and IEC maintain terminological databases for use in standardization at the following
addresses:• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
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– 8 – IEC TS 62239-2:2017 IEC 2017
3.1 Terms and definitions
3.1.1
analysis
utilization of data, reference materials, actions, or test results previously obtained that can be
utilized for comparison to verify that a requirement, a characteristic, a parameter or a criteria
has been metNote 1 to entry: Test results and associated data can be part of the analysis.
3.1.2
assembly characterization
process of testing and/or analysis of assembly capability when configuration control of the
assembly's internal details is inadequate to support traditional qualificationNote 1 to entry MIL-STD-1521 provides information on qualification purposes.
3.1.3
assembly manufacturer
organization responsible for the assembly specification and its production
3.1.4
assembly obsolescence management
range of management and engineering actions taken to avoid or resolve the effects of
assemblies not being procurable due to the manufacturer(s) ceasing production3.1.5
assembly qualification
process used to demonstrate that the assembly is capable of meeting specified requirements
for all required conditions and environmentsNote 1 to entry: This may include qualification beyond the assembly manufacturer’s limits for the assembly.
3.1.6assembly quality assurance
all activities and processes providing adequate confidence that each individual assembly
meets specified requirements3.1.7
assurance
result of planned and systematic actions necessary to provide adequate confidence and
evidence that a product or process satisfies given requirements3.1.8
component
piece part
electrical, optical, electro/optical-mechanical or electronic device that is not subject to
disassembly without destruction or impairment of design useNote 1 to entry: Resistors, capacitors, diodes, integrated circuits, hybrids, busbars, circuit cards/modules,
printers, laptop computers, disk drives, application specific integrated circuits, wound components and relays, etc.
are examples of component.3.1.9
configuration
performance, functional, and physical attributes of an existing or planned product or a
combination of productsNote 1 to entry: Generally each variation of a product leads to a configuration change.
---------------------- Page: 10 ----------------------IEC TS 62239-2:2017 IEC 2017 – 9 –
3.1.10
configuration change management
configuration control
systematic process which ensures that changes to released configuration documentation are
properly identified, documented, evaluated for effect, approved by an appropriate level of
authority, incorporated and verifiedNote 1 to entry: Generally configuration management activity concerns systematic proposal, justification,
evaluation, coordination, and disposition of proposed changes, and implementation of all approved and released
changes into• applicable configurations of a product,
• associated product information, and
• supporting and interfacing products and their associated product information.
3.1.11
configuration documentation
technical information whose purpose is to identify and define a product’s performance
functional and physical attributes (for example specifications, drawings)3.1.12
configuration verification
action verifying that the product has achieved its required attributes (for example performance
requirements, functional constraints) and the product’s design is accurately documented
3.1.13COTS product
commercial off-the-shelf product
one or more components, assembled and developed for multiple commercial consumers,
whose design and/or configuration is controlled by the manufacturer’s specification or industry
standardNote 1 to entry: COTS products can include electronic components, subassemblies or assemblies, or top level
assemblies. Electronic COTS subassemblies or assemblies include circuit card assemblies, power supplies, hard
drives, and memory modules. Top-level COTS assemblies include a fully integrated rack of equipment such as raid
arrays, file servers to individual switches, routers, personal computers, or similar equipment.
[SOURCE: IEC TS 62668-1:2016, 3.1.3]3.1.14
COTS assembly management plan
CAMP
document that defines the processes and practices for integrating and managing assemblies
in an equipment or systemNote 1 to entry: Generally, it addresses all relevant aspects of managing assemblies during system design,
development, production, and post-production support.3.1.15
COTS assembly manufacturer
organization responsible for the specification and the production of the COTS assembly
Note 1 to entry: Generally the COTS assembly manufacturer controls the design and the configuration (even if
subcontracted), but it is not a rule in this market segment which is not fully dedicated to avionics, and the COTS
assembly manufacturer ensures generally also the sale of the product to the commercial market.
3.1.16dependability
measure of consistency in meeting reliability, availability and obsolescence expectations,
using logistical support methods---------------------- Page: 11 ----------------------
– 10 – IEC TS 62239-2:2017 IEC 2017
3.1.17
derating
design method which increases the operational margins of items by imposing modified item
usage limitations which are more restrictive than the usual or manufacturer’s item operational
ratings3.1.18
design process
process of creating an item, equipment or system from a set of requirements
Note 1 to entry: In general, the design process follows a set of sub-processes such as requirements capture,
conceptual design, detailed design, implementation and production transition. Functional and physical verification,
as well as qualification, can be part of the design process which may be called in some organizations “development
process”.3.1.19
durability analysis
structured analysis of the assembly’s response to the stresses resulting from operation,
maintenance, shipping, storage, and other activities throughout its specified life in order to
estimate its expected life3.1.20
electronic assembly
electrical or electronic device that is not subject to disassembly without destruction or
impairment of design useEXAMPLE Electronic circuit cards or modules, displays, storage devices, printers, laptop computer, electro/optical
devices, etc.3.1.21
electronic equipment
functioning electronic device produced by the plan owner, which incorporates electronic
componentsNote 1 to entry: End items, sub-assemblies, line-replaceable units and shop-replaceable units are examples of
electronic equipment.[SOURCE: IEC TS 62239-1:2015, 3.1.20]
3.1.22
failure
inability of an item to perform a required function within specified limits
Note 1 to entry: A failure may be produced when a fault is encountered.
3.1.23
form
shape, size, dimensions, and other physically measurable parameters that uniquely
characterize a product3.1.24
franchised distributor or agent
individual or corporate organization that is legally independent from the franchiser (in this
case the electronic component manufacturer or OCM) and agrees under contract to distribute
products using the franchiser’s name and sales networkNote 1 to entry: Distribution activities are carried out in accordance with standards set and controlled by the
franchiser. Shipments against orders placed can be despatched either direct from the OCM or the franchised
distributor or agent. In other words, the franchised distributor enters into contractual agreements with one or more
electronic component manufacturers to distribute and sell the said components. Distribution agreements may be
stipulated according to the following criteria: geographical area, type of clientele
...
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