IEC 62604-1:2015

Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification

IEC 62604-1:2015 specifies the methods of test and general requirements for SAW and BAW duplexers of assessed quality using either capability approval or qualification approval procedures.

Duplexeurs à ondes acoustiques de surface (OAS) et à ondes acoustiques de volume (OAV) sous assurance de la qualité - Partie 1: Spécification générique

IEC 62604-1:2015 spécifie les méthodes d'essai et les exigences générales pour les duplexeurs à OAS et à OAV dont la qualité est garantie par les procédures d'agrément de savoir-faire ou par les procédures d'homologation.

General Information

• Status: Published
• Publication Date: 15-Jul-2015
• ICS: 31.140 - Piezoelectric devices
• Technical Committee: TC 49 - Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection
• Drafting Committee: WG 10 - TC 49/WG 10
• Current Stage: DELPUB - Deleted Publication
• Start Date: 11-Jul-2022
• Completion Date: 03-Jul-2020

Relations

• Revised: IEC 62604-1:2022 - Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality - Part 1: Generic specification
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62604-1 ®
Edition 1.0 2015-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of
assessed quality –
Part 1: Generic specification
Duplexeurs a ondes acoustiques de surface (OAS) et a ondes acoustiques de
volume (OAV) sous assurance de la qualite –
Partie 1: Spécification générique

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IEC 62604-1 ®
Edition 1.0 2015-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Surface acoustic wave (SAW) and bulk acoustic wave (BAW) duplexers of

assessed quality –
Part 1: Generic specification
Duplexeurs a ondes acoustiques de surface (OAS) et a ondes acoustiques de

volume (OAV) sous assurance de la qualite –

Partie 1: Spécification générique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.140 ISBN 978-2-8322-2777-0

– 2 – IEC 62604-1:2015 © IEC 2015
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms, definitions, units and symbols . 8
3.1 Terms and definitions . 8
3.1.1 General terms . 9
3.1.2 Response characteristics related terms . 10
3.1.3 SAW and BAW duplexers related terms . 14
3.2 Units and graphical symbols . 16
4 Order of precedence of documents . 16
5 Preferred values for ratings and characteristics . 16
5.1 General . 16
5.2 Nominal frequency bands . 16
5.3 Operating temperature ranges, in degrees Celsius (°C) . 16
5.4 Climatic category . 17
5.5 Bump severity . 17
5.6 Vibration severity . 17
5.7 Shock severity . 18
5.8 Fine leak rate . 18
6 Marking . 18
6.1 Duplexer marking . 18
6.2 Package marking . 18
7 Quality assessment procedures . 19
7.1 General . 19
7.2 Primary stage of manufacture . 19
7.3 Structurally similar components . 19
7.4 Subcontracting . 19
7.5 Incorporated components . 19
7.6 Manufacturer’s approval . 19
7.7 Approval procedures . 19
7.7.1 General . 19
7.7.2 Capability approval . 19
7.7.3 Qualification approval . 20
7.8 Procedures for capability approval . 20
7.8.1 General . 20
7.8.2 Eligibility for capability approval . 20
7.8.3 Application for capability approval . 20
7.8.4 Granting of capability approval . 20
7.8.5 Capability manual . 20
7.9 Procedures for qualification approval . 20
7.9.1 General . 20
7.9.2 Eligibility for qualification approval . 20
7.9.3 Application for qualification approval . 21
7.9.4 Granting of qualification approval . 21
7.9.5 Quality conformance inspection . 21
7.10 Test procedures . 21

7.11 Screening requirements . 21
7.12 Rework and repair work . 21
7.12.1 Rework . 21
7.12.2 Repair work . 21
7.13 Certified records of released lots . 21
7.14 Validity of release . 21
7.15 Release for delivery . 21
7.16 Unchecked parameters . 21
8 Test and measurement procedures . 22
8.1 General . 22
8.2 Test and measurement conditions . 22
8.2.1 Standard conditions for testing . 22
8.2.2 Precision of measurement . 22
8.2.3 Precautions . 22
8.2.4 Alternative test methods . 23
8.3 Visual inspection . 23
8.3.1 General . 23
8.3.2 Visual test A . 23
8.3.3 Visual test B . 23
8.4 Dimensions test . 23
8.5 Electrical test procedures . 23
8.5.1 S parameters measurement . 23
8.5.2 Intermodulation distortion measurement . 25
8.5.3 Insulation resistance . 25
8.5.4 Voltage proof . 25
8.6 Mechanical and environmental test procedures . 25
8.6.1 Sealing tests (non-destructive) . 25
8.6.2 Soldering (solderability and resistance to soldering heat) (destructive) . 26
8.6.3 Rapid change of temperature: severe shock by liquid immersion (non-
destructive). 26
8.6.4 Rapid change of temperature with prescribed time of transition (non-
destructive). 26
8.6.5 Bump (destructive) . 26
8.6.6 Vibration (destructive). 27
8.6.7 Shock (destructive) . 27
8.6.8 Free fall (destructive) . 27
8.6.9 Acceleration, steady state (non-destructive) . 28
8.6.10 Low air pressure (non-destructive) . 28
8.6.11 Dry heat (non-destructive) . 28
8.6.12 Damp heat, cyclic (destructive) . 28
8.6.13 Cold (non-destructive) . 28
8.6.14 Climatic sequence (destructive) . 28
8.6.15 Damp heat, steady state (destructive) . 29
8.6.16 Salt mist cyclic (destructive) . 29
8.6.17 Immersion in cleaning solvents (non-destructive) . 29
8.6.18 Flammability test (destructive) . 29
8.6.19 Electrostatic discharge (ESD) sensitivity test (destructive) . 29
8.7 Endurance test procedure . 30
Bibliography . 31

– 4 – IEC 62604-1:2015 © IEC 2015

Figure 1 – FBAR configuration . 9
Figure 2 – SMR configuration . 10
Figure 3 – Frequency response of SAW and BAW duplexers . 15
Figure 4 – S parameters measurement . 24

Table 1 – Frequency allocation of typical UMTS bands . 16

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SURFACE ACOUSTIC WAVE (SAW) AND
BULK ACOUSTIC WAVE (BAW) DUPLEXERS
OF ASSESSED QUALITY –
Part 1: Generic specification
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62604-1 has been prepared by IEC technical committee 49:
Piezoelectric, dielectric and electrostatic devices and associated materials for frequency
control, selection and detection.
NOTE In this standard, SAW and BAW duplexers are treated simultaneously because both duplexers are used in
the same manner especially in mobile phones and have the same requirements of characteristics, test method and
so on.
The text of this standard is based on the following documents:
FDIS Report on voting
49/1143/FDIS 49/1160/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.

– 6 – IEC 62604-1:2015 © IEC 2015
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62604 series, published under the general title: Surface acoustic
wave (SAW) and bulk acoustic wave (BAW) duplexers of assessed quality, can be found on
the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct
understanding of its contents. Users should therefore print this document using a
colour printer.
SURFACE ACOUSTIC WAVE (SAW) AND
BULK ACOUSTIC WAVE (BAW) DUPLEXERS
OF ASSESSED QUALITY –
Part 1: Generic specification
1 Scope
This part of IEC 62604 specifies the methods of test and general requirements for SAW and
BAW duplexers of assessed quality using either capability approval or qualification approval
procedures.
2 Normative references
The following documents, in whole or in part, are normatively referenced in this document and
are indispensable for its application. For dated references, only the edition cited applies. For
undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60027 (all parts), Letter symbols to be used in electrical technology
IEC 60050 (all parts), International Electrotechnical Vocabulary (available at
www.electropedia.org)
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-7, Basic environmental testing procedures – Part 2-7: Tests – Test Ga and
guidance: Acceleration, steady state
IEC 60068-2-13, Basic environmental testing procedures – Part 2-13: Tests – Test M: Low air
pressure
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-17:1994, Basic environmental testing procedures – Part 2-17: Tests – Test Q:
Sealing
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-31, Environmental testing – Part 2-31: Tests – Test Ec: Rough handling shocks,
primarily for equipment-type specimens

– 8 – IEC 62604-1:2015 © IEC 2015
IEC 60068-2-45, Basic environmental testing procedures – Part 2-45: Tests – Test XA and
guidance: Immersion in cleaning solvents
IEC 60068-2-52, Environmental testing – Part 2-52: Tests – Test Kb: Salt mist, cyclic (sodium
chloride solution)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-64, Environmental testing – Part 2-64: Tests – Test Fh: Vibration, broad-band
random and guidance
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60122-1, Quartz crystal units of assessed quality – Part 1: Generic specification
IEC 60617, Graphical symbols for diagrams (available at http://std.iec.ch/iec60617)
IEC 60642, Piezoelectric ceramic resonators and resonator units for frequency control and
selection – Chapter I: Standard values and conditions – Chapter II: Measuring and test
conditions
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method –
Apparatus, confirmatory test arrangement and guidance
IEC 60749-28 , Semiconductor devices – mechanical and climatic test methods – Part 28:
Electrostatic Discharge (ESD) Sensitivity testing direct contact charged device model (DC-
CDM)
IEC 61000-4-2, Electromagnetic compatibility (EMC) – Part 4-2: Testing and measurement
techniques – Electrostatic discharge immunity test
IEC 61340-3-1, Electrostatics – Part 3-1: Methods for simulation of electrostatic effects –
Human body model (HBM) electrostatic discharge test waveforms
IEC 61340-3-2, Electrostatics – Part 3-2: Methods for simulation of electrostatic effects –
Machine model (MM) electrostatic discharge test waveforms
IEC 62761, Guidelines for the measurement method of nonlinearity for surface acoustic wave
(SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF)
IEC 80000 (all parts), Quantities and units
ISO 80000 (all parts), Quantities and units
3 Terms, definitions, units and symbols
3.1 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
—————————
To be published.
3.1.1 General terms
3.1.1.1
surface acoustic wave
SAW
acoustic wave, propagating along a surface of an elastic material, whose amplitude decays
exponentially with the depth
[SOURCE: IEC 60862-1:2003, 2.2.1.1, modified — In the definition, "elastic substrate" has
been replaced with "elastic material" and "substrate depth" has been replaced with "the
depth".]
3.1.1.2
surface acoustic wave filter
SAW filter
filter characterized by one or more surface acoustic wave transmission line or resonant
elements, where the surface acoustic wave is usually generated by an interdigital transducer
and propagates along a material surface
[SOURCE: IEC 60862-1:2003, 2.2.1.2, modified]
3.1.1.3
bulk acoustic wave
BAW
acoustic wave, propagating inside an elastic material and then traversing the entire thickness
of the bulk
3.1.1.4
bulk acoustic wave filter
BAW filter
filter characterized by a bulk acoustic wave which is usually generated by a pair of electrodes
and propagates along a thickness direction
3.1.1.5
film bulk acoustic resonator
FBAR
thin film BAW resonator consisting of a piezoelectric layer sandwiched between two electrode
layers with stress-free top and bottom surface supported mechanically at the edge on a
substrate with cavity structure as shown in Figure 1 or membrane structure as an example
Note 1 to entry: This note applies to the French language only.
Electrodes
Piezoelectric layer
Stop etching layer
Substrate
Cavity
IEC
Figure 1 – FBAR configuration
3.1.1.6
solidly mounted resonator
SMR
BAW resonator, supporting the electrode/piezoelectric layer/electrode structure by a
sequence of additional thin films of alternately low and high acoustic impedance with quarter

– 10 – IEC 62604-1:2015 © IEC 2015
wavelength layer, these layers acting as acoustic reflectors and decoupling the resonator
acoustically from the substrate, as shown in Figure 2 as an example
Note 1 to entry: This note applies to the French language only.
Electrodes
Piezoelectric layer
Low impedance layer
λ/4 reflector layers
High impedance layer
Substrate
IEC
Figure 2 – SMR configuration
3.1.2 Response characteristics related terms
3.1.2.1
reference frequency
frequency defined by the specification to which other frequencies may be referred
[SOURCE: IEC 60862-1:2003, 2.2.2.3]
3.1.2.2
insertion attenuation
logarithmic ratio of the power delivered directly to the load impedance before insertion of the
duplexer to the power delivered to the load impedance after insertion of the duplexer
[SOURCE: IEC 60862-1:2003, 2.2.2.6, modified — In the definition, "filter" has been replaced
with "duplexer".]
3.1.2.3
nominal insertion attenuation
insertion attenuation at a specified reference frequency
[SOURCE: IEC 60862-1:2003, 2.2.2.7]
3.1.2.4
relative attenuation
difference between the attenuation at a given frequency and the attenuation at the reference
frequency
[SOURCE: IEC 60862-1:2003, 2.2.2.8]
3.1.2.5
pass band
band of frequencies in which the relative attenuation is equal to or less than a specified value
[SOURCE: IEC 60862-1:2003, 2.2.2.9]
3.1.2.6
pass bandwidth
separation of frequencies between which the relative attenuation is equal to or less than a
specified value
[SOURCE: IEC 60862-1:2003, 2.2.2.10]
3.1.2.7
pass band ripple
maximum variation in attenuation characteristics within a specified pass band
[SOURCE: IEC 60862-1:2003, 2.2.2.11]
3.1.2.8
minimum insertion attenuation
minimum value of insertion attenuation in the pass band
[SOURCE: IEC 60862-1:2003, 2.2.2.13]
3.1.2.9
maximum insertion attenuation
maximum value of insertion attenuation in the pass band
[SOURCE: IEC 60862-1:2003, 2.2.2.14]
3.1.2.10
stop band
band of frequencies in which the relative attenuation is equal to or greater than a specified
value
[SOURCE: IEC 60862-1:2003, 2.2.2.15]
3.1.2.11
stop bandwidth
separation of frequencies between which the relative attenuation is equal to or greater than a
specified value
[SOURCE: IEC 60862-1:2003, 2.2.2.16]
3.1.2.12
stop band rejection
minimum relative attenuation at a specified stop band
3.1.2.13
group delay
time equal to the first derivative of the phase shift, in radians, with respect to the angular
frequency
[SOURCE: IEC 60862-1:2003, 2.2.2.18]
3.1.2.14
trap frequency
specified frequency at which the relative attenuation is equal to or greater than a specified
value
[SOURCE: IEC 60862-1:2003, 2.2.2.21]
3.1.2.15
trap attenuation
relative attenuation at a specified trap frequency

– 12 – IEC 62604-1:2015 © IEC 2015
[SOURCE: IEC 60862-1:2003, 2.2.2.22]
3.1.2.16
transition band
band of frequencies between the cut-off frequency and the nearest point of the adjacent stop
band
[SOURCE: IEC 60862-1:2003, 2.2.2.23]
3.1.2.17
reflectivity
dimensionless measure of the degree of mismatch between two impedances Z and Z :
a b
Z − Z
a b
,
Z + Z
a b
where Z and Z represent, respectively, the input and source impedance or the output and
a b
load impedance
Note 1 to entry: The absolute value of reflectivity is called the reflection coefficient.
3.1.2.18
return attenuation
value of the reflection coefficient given by the sign changed expression in decibels:
Z − Z
a b
−20 log dB
Z + Z
a b
[SOURCE: IEC 60862-1:2003, 2.2.2.25, modified]
3.1.2.19
input level
power, voltage or current value applied to the input port of a duplexer
[SOURCE: IEC 60862-1:2003, 2.2.2.29, modified — In the definition, "input terminal pair of a
filter" has been replaced with "input port of a duplexer".]
3.1.2.20
output level
power, voltage or current value delivered to the load circuit
[SOURCE: IEC 60862-1:2003, 2.2.2.30, modified — In the definition, "load" has been
replaced with "load circuit".]
3.1.2.21
nominal level
power, voltage or current value at which the performance measurement is specified
[SOURCE: IEC 60862-1:2003, 2.2.2.31]
3.1.2.22
input impedance
impedance presented by the duplexer to the signal source when the output is terminated by a
specified load impedance
[SOURCE: IEC 60862-1:2003, 2.2.2.32, modified — In the definition, "filter" has been
replaced with "duplexer".]
3.1.2.23
output impedance
impedance presented by the duplexer to the load when the input is terminated by a specified
source impedance
[SOURCE: IEC 60862-1:2003, 2.2.2.33, modified — In the definition, "filter" has been
replaced with "duplexer".]
3.1.2.24
terminating impedance
impedance presented to the duplexer by the source or by the load
[SOURCE: IEC 60862-1:2015, 3.1.2.35, modified — In the definition, "filter" has been
replaced with "duplexer".]
3.1.2.25
operating temperature range
range of temperatures, over which the SAW or BAW duplexer will function while maintaining
its specified characteristics within specified tolerances
[SOURCE: IEC 60862-1:2003, 2.2.2.37, modified — In the definition, "SAW filter" has been
replaced with "SAW or BAW duplexer".]
3.1.2.26
intermodulation distortion
IMD
non-linear distortion of a device response characterized by the appearance of frequencies at
the output which is equal to the differences (or sums) of integral multiples of the two or more
component frequencies present at the input
[SOURCE: IEC 60862-1:2003, 2.2.2.41, modified — The abbreviation "IMD" has been added.
In the definition, "SAW transducer or filter" has been replaced with "device".]
Note 1 to entry: This note applies to the French language only.
3.1.2.27
duplex image frequency
f
DIM
undesired input frequency that is converted to the receiving frequency (f ) by subtracting it
R
)
from twice the transmitting frequency (2f
T
f = 2f – f
DIM T R
3.1.2.28
isolation
isolation from TX port to RX port
leakage power ratio from the TX port to the RX port in a duplexer
Note 1 to entry: Figure 3c gives an example of isolation response.
3.1.2.29
guard band
unused part of the radio spectrum between radio bands, for the purpose of preventing
interference
– 14 – IEC 62604-1:2015 © IEC 2015
3.1.3 SAW and BAW duplexers related terms
3.1.3.1
duplexer
device used in the frequency division duplex system, which enables signal to be received and
transmitted through a common antenna simultaneously
3.1.3.2
diplexer
device which separates composite signals into two parts of two frequency domains
Note 1 to entry: This can be used to combine signals in two frequency domains into composite signals, in reverse.
3.1.3.3
TX filter
filter used in a transmitter part to eliminate unnecessary signals
Note 1 to entry: This is a basic part of a duplexer.
Note 2 to entry: Figure 3a gives an example of TX filter response.
3.1.3.4
RX filter
filter used in a receiver part to eliminate unnecessary signals
Note 1 to entry: This is a basic part of a duplexer.
Note 2 to entry: Figure 3b gives an example of RX filter response.
3.1.3.5
phase shifter
device which changes the phase of signals, not the frequency of them
Note 1 to entry: This is a basic part of a duplexer.
3.1.3.6
stress migration
phenomenon of electrode defect caused by stress corresponding to distortion proportional to
the input power in the resonator
3.1.3.7
breakdown
phenomenon of failure by insulation breakdown when applying high power
3.1.3.8
void
vacancy in the IDT electrode caused by stress migration resulting from diffusing and/or
transfer of metal atoms forming part of the electrode
3.1.3.9
hillock
projection on the side or upper surface of the electrode caused by stress migration resulting
from diffusing and/or transfer of metal atoms forming part of the electrode

f
T
f
R
Frequency
IEC
Figure 3a – Basic TX filter response example of SAW and BAW duplexers
f
R
f
T
Frequency
IEC
Figure 3b – Basic RX filter response example of SAW and BAW duplexers
f
R
f
T
Frequency
IEC
Figure 3c – Basic isolation response example of SAW and BAW duplexers
Figure 3 – Frequency response of SAW and BAW duplexers
Attenuation (dB)
Attenuation (dB)
Attenuation (dB)
– 16 – IEC 62604-1:2015 © IEC 2015
3.2 Units and graphical symbols
Units, graphical symbols, letter symbols and terminology shall, wherever possible, be taken
from the following International Standards:
– IEC 60027;
– IEC 60050-561;
– IEC 60617;
– IEC 60642;
– IEC 60122-1;
– IEC 80000;
– ISO 80000.
4 Order of precedence of documents
Where any discrepancies occur for any reason, documents shall rank in the following order of
precedence:
– the detail specification;
– the sectional specification;
– the generic specification;
– any other international documents (for example, of the IEC) to which reference is made.
The same order of precedence shall apply to equivalent national documents.
5 Preferred values for ratings and characteristics
5.1 General
Values should be chosen from subclauses 5.2 to 5.8 unless otherwise stated in the detail
specification.
5.2 Nominal frequency bands
Table 1 shows the frequency allocation of typical UMTS bands.
Table 1 – Frequency allocation of typical UMTS bands
Band Transmitting frequency Receiving frequency
(MHz) (MHz)
I 1 920 to 1 980 2 110 to 2 170
II 1 850 to 1 910 1 930 to 1 990
III 1 710 to 1 785 1 805 to 1 880
IV 1 710 to 1 755 2 110 to 2 155
V 824 to 849 869 to 894
VIII 880 to 915 925 to 960
5.3 Operating temperature ranges, in degrees Celsius (°C)
–45 to +125
–40 to +85
–30 to +85
–20 to +75
–20 to +70
–10 to +60
0 to +60
Other temperature ranges may be used but the lowest temperature should be not lower
than -60 °C and the highest temperature should not exceed 125 °C
5.4 Climatic category
• 40/085/56 (climatic categories are given in accordance with Annex A of IEC 60068-1:2013):
for ceramic enclosures.
For requirements where the operating temperature range of the SAW and BAW duplexers
is greater than –40 °C to +85 °C, a climatic category consistent with the operating
temperature range shall be specified.
• 20/085/21 (climatic categories are given in accordance with Annex A of IEC 60068-1:2013):
for plastic packages.
5.5 Bump severity
(4 000 ± 10) bumps at 400 m/s peak acceleration in each direction along three mutually
perpendicular axes (see 8.6.5).
Pulse duration: 6 ms.
5.6 Vibration severity
a) Sinusoidal
10 Hz to 55 Hz
0,75 mm displacement amplitude
(peak value) 30 min in each of three
mutually perpendicular axes
55 Hz to 500 Hz or 55 Hz to 2 000 Hz at 1 octave/min (see 8.6.6)
100 m/s acceleration amplitude
(peak value)
or
10 Hz to 55 Hz
1,5 mm displacement amplitude
(peak value) 30 min in each of three
mutually perpendicular axes
55 Hz to 2 000 Hz at 1 octave/min (see 8.6.6)
200 m/s acceleration amplitude
(peak value)
b) Random
2 2
(19,2 m/s ) /Hz between 30 min in each of three
20 Hz and 2 000 Hz mutually perpendicular axes
62 m/s acceleration at 1 octave/min (see 8.6.6)

– 18 – IEC 62604-1:2015 © IEC 2015
or
2 2
(19,2 m/s ) /Hz between 30 min in each of three
20 Hz and 2 000 Hz mutually perpendicular axes
196 m/s acceleration at 1 octave/min (see 8.6.6)
or
2 2
(48 m/s ) /Hz between 30 min in each of three
20 Hz et 2 000 Hz mutually perpendicular axes
314 m/s acceleration at 1 octave/min (see 8.6.6)

5.7 Shock severity
1 000 m/s peak acceleration for 6 ms duration; three shocks in each direction along three
mutually perpendicular axes (see 8.6.7), half sine pulse, unless otherwise stated in the detail
specification.
5.8 Fine leak rate
–1 3 –6 3
10 Pa cm /s (10 bar cm /s)
–3 3 –8 3
10 Pa cm /s (10 bar cm /s)
6 Marking
6.1 Duplexer marking
Surface acoustic wave and bulk acoustic wave duplexers shall be clearly and durably marked
(see 8.6.17) along with items a) to g) in the order given below and, if possible, with as many
of the remaining items as considered necessary:
a) type designation as defined in the detail specification;
b) nominal frequency in megahertz (MHz);
c) year and week of manufacture;
d) mark of conformity (unless a certificate of conformity is used);
e) factory identification code;
f) manufacturer’s name or trademark;
g) terminal identification (if applicable);
h) designation of electrical connections (if applicable);
i) serial number (if applicable);
j) surface mounted device classification (if applicable).
Where the available surface area of miniature SAW and BAW duplexers imposes practical
limits on the amount of marking, instructions on the marking to be applied shall be given in
the detail specification.
6.2 Package marking
The primary packaging containing the SAW and BAW duplexers shall be clearly marked with
the information listed in 6.1, except item g), and electrostatic sensitive device identification
where necessary.
7 Quality assessment procedures
7.1 General
Two methods are available for the approval of SAW and BAW duplexers of assessed quality:
capability approval and qualification approval.
7.2 Primary stage of manufacture
The primary stage of manufacture for a SAW or BAW duplexer is the final surface cleaning of
substrates.
7.3 Structurally similar components
The grouping of structurally similar SAW and BAW duplexers for the purpose of qualification
approval, capability approval and quality conformance inspection shall be prescribed in the
relevant sectional specification.
7.4 Subcontracting
These procedures shall be in accordance with the specified quality assessment system.
However, the final surface cleaning of the substrate and all subsequent processes shall be
carried out by the manuf
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