ISO/IEC 30129:2015

Information technology - Telecommunications bonding networks for buildings and other structures

ISO/IEC 30129:2015(E) specifies requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be installed in order to: a) minimise the risk to the correct function of that equipment and interconnecting cabling from electrical hazards and b) provide the telecommunications installation with a reliable signal reference - which may improve immunity from electromagnetic interference (EMI).

General Information

• Status: Published
• Publication Date: 21-Feb-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 35.200 - Interface and interconnection equipment
• Technical Committee: ISO/IEC JTC 1/SC 25 - Interconnection of information technology equipment
• Current Stage: PPUB - Publication issued
• Start Date: 31-Jul-2015
• Completion Date: 13-Oct-2015

Relations

• Amended By: ISO/IEC 30129:2015/AMD1:2019 - Amendment 1 - Information technology - Telecommunications bonding networks for buildings and other structures
• Effective Date: 05-Sep-2023

Standards Content (Sample)

ISO/IEC 30129
Edition 1.0 2015-10
INTERNATIONAL
STANDARD
colour
inside
Information technology – Telecommunications bonding networks for buildings
and other structures
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about
ISO/IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address
below or your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé Fax: [phone]
CH-1211 Geneva 20 [e-mail]
Switzerland www.iec.ch
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

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The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the

latest edition, a corrigenda or an amendment might have been published.

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and withdrawn publications. have been collected from earlier publications of IEC TC 37,

77, 86 and CISPR.
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Centre: [e-mail].
ISO/IEC 30129
Edition 1.0 2015-10
INTERNATIONAL
STANDARD
colour
inside
Information technology – Telecommunications bonding networks for buildings

and other structures
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 35.200 ISBN 978-2-8322-2924-8

– 2 – ISO/IEC 30129:2015
 ISO/IEC 2015
CONTENTS
FOREWORD . 5
INTRODUCTION . 6
1 Scope . 8
2 Normative references . 8
3 Terms, definitions and abbreviations . 9
3.1 Terms and definitions . 9
3.2 Abbreviations . 11
4 Conformance . 12
5 Overview of bonding networks . 12
6 Selection of the telecommunications bonding network approach . 13
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment . 13
6.2 Telecommunications bonding networks . 14
6.3 Telecommunications bonding network performance . 15
6.3.1 General . 15
6.3.2 Requirements . 16
6.3.3 DC resistance measurements . 17
7 Common features . 17
7.1 General . 17
7.2 Protective bonding networks . 18
7.2.1 Protective bonding network conductors (PBNCs) . 18
7.2.2 Main earthing terminal (MET) . 18
7.3 Telecommunications entrance facility (TEF) . 18
7.4 Telecommunications bonding network components . 18
7.4.1 Telecommunications bonding network conductors . 18
7.4.2 Telecommunications bonding network connections . 19
7.5 Cabinets, frames and racks . 19
7.5.1 External connections to a bonding network . 19
7.5.2 Rack bonding conductors. 20
7.5.3 Internal connections . 21
7.6 Miscellaneous bonding connections . 22
7.6.1 General . 22
7.6.2 Bonding conductors for d.c. resistance control . 22
7.6.3 Bonding conductors for impedance control . 22
7.7 Documentation . 23
8 Dedicated telecommunications bonding network . 23
8.1 General . 23
8.2 Components . 24
8.2.1 Primary bonding busbar (PBB) . 24
8.2.2 Secondary bonding busbar (SBB) . 25
8.2.3 Bonding conductors for d.c. resistance control . 25
8.2.4 Bonding conductors for impedance control . 26
8.3 Implementation . 27
8.3.1 Primary bonding busbar (PBB) . 27
8.3.2 Secondary bonding busbar (SBB) . 28

 ISO/IEC 2015
8.3.3 Telecommunications bonding conductor (TBC) . 28
8.3.4 Telecommunications bonding backbone (TBB) . 29
8.3.5 Backbone bonding conductor (BBC) . 29
8.3.6 Bonds to continuous conductive pathway systems . 29
8.3.7 Bonds to structural metal . 29
9 Local telecommunications bonding networks in conjunction with protective
bonding networks . 30
9.1 Bonding for local distribution . 30
9.1.1 Star protective bonding networks . 30
9.1.2 Ring protective bonding networks . 31
9.2 Telecommunications bonding conductors . 32
9.2.1 Bonding conductors for d.c. resistance control . 32
9.2.2 Bonding conductors for impedance control . 32
9.3 Bonding for areas of telecommunications equipment concentration . 33
10 Local telecommunications bonding networks in conjunction with dedicated
telecommunications bonding networks . 33
10.1 Bonding for areas of telecommunications equipment concentration . 33
10.1.1 Requirements . 33
10.1.2 Recommendations . 33
10.1.3 Cabinets, frames and racks . 33
10.2 Telecommunications equipment bonding conductors (TEBC) . 33
10.2.1 TEBC for d.c. resistance control . 33
10.2.2 TEBC for impedance control . 34
10.2.3 Implementation . 34
11 Mesh bonded networks . 34
11.1 General . 34
11.2 Mesh bonding alternatives . 35
11.2.1 Local mesh bonding (MESH-IBN) networks . 35
11.2.2 MESH-BN . 37
11.3 Bonding conductors of a mesh bonding network . 38
11.3.1 Requirements . 38
11.3.2 Recommendations . 38
11.4 Bonding conductors to the mesh bonding network . 38
11.5 Supplementary bonding grid (SBG) . 39
11.6 System reference potential plane (SRPP) . 39
11.6.1 General . 39
11.6.2 Access floors . 40
11.6.3 Transient suppression plate (TSP) . 41
Annex A (normative) Maintenance of telecommunications bonding network
performance . 42
A.1 General . 42
A.2 Periodic activity . 42
A.2.1 Schedule . 42
A.2.2 Implementation . 42
A.3 Causes of performance deterioration . 43
A.3.1 Galvanic corrosion . 43
A.3.2 Requirements . 43
Annex B (normative) Bonding conductor cross-sectional area . 44
Annex C (infomative) Alternative terminology . 45

– 4 – ISO/IEC 30129:2015
 ISO/IEC 2015
Bibliography . 46

Figure 1 – Schematic relationship between ISO/IEC 30129 and other relevant
standards . 7
Figure 2 – Schematic of telecommunications equipment distribution and associated
bonding con
...

ISO/IEC 30129
Edition 1.1 2019-02
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
Information technology – Telecommunications bonding networks for buildings
and other structures
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about
ISO/IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address
below or your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished

Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

need further assistance, please contact the Customer Service

Centre: [e-mail].
ISO/IEC 30129
Edition 1.1 2019-02
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
Information technology – Telecommunications bonding networks for buildings
and other structures
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 35.200 ISBN 978-2-8322-6604-5
ISO/IEC 30129
Edition 1.1 2019-02
CONSOLIDATED VERSION
REDLINE VERSION
colour
inside
Information technology – Telecommunications bonding networks for buildings
and other structures
– 2 – ISO/IEC 30129:2015+AMD1:2019 CSV
 ISO/IEC 2019
CONTENTS
FOREWORD . 5
INTRODUCTION . 7
1 Scope . 9
2 Normative references . 9
3 Terms, definitions and abbreviations . 10
3.1 Terms and definitions . 10
3.2 Abbreviations . 12
4 Conformance . 13
5 Overview of bonding networks . 14
6 Selection of the telecommunications bonding network approach . 15
6.1 Assessment of the impact of the telecommunications bonding network on the
interconnection of telecommunications equipment . 15
6.2 Telecommunications bonding networks . 16
6.3 Telecommunications bonding network performance . 17
6.3.1 General . 17
6.3.2 Requirements . 18
6.3.3 DC resistance measurements . 19
7 Common features . 20
7.1 General . 20
7.2 Protective bonding networks . 20
7.2.1 Protective bonding network conductors (PBNCs) . 20
7.2.2 Main earthing terminal (MET) . 20
7.3 Telecommunications entrance facility (TEF) . 20
7.4 Telecommunications bonding network components . 21
7.4.1 Telecommunications bonding network conductors . 21
7.4.2 Telecommunications bonding network connections . 21
7.5 Cabinets, frames and racks . 22
7.5.1 External connections to a bonding network . 22
7.5.2 Rack bonding conductors. 23
7.5.3 Internal connections . 23
7.6 Miscellaneous bonding connections . 24
7.6.1 General . 24
7.6.2 Bonding conductors for d.c. resistance control . 25
7.6.3 Bonding conductors for impedance control . 25
7.7 Documentation . 25
8 Dedicated telecommunications bonding network . 25
8.1 General . 25
8.2 Components . 27
8.2.1 Primary bonding busbar (PBB) . 27
8.2.2 Secondary bonding busbar (SBB) . 27
8.2.3 Bonding conductors for d.c. resistance control . 27
8.2.4 Bonding conductors for impedance control . 28
8.3 Implementation . 29
8.3.1 Primary bonding busbar (PBB) . 29
8.3.2 Secondary bonding busbar (SBB) . 30

 ISO/IEC 2019
8.3.3 Telecommunications bonding conductor (TBC) . 31
8.3.4 Telecommunications bonding backbone (TBB) . 31
8.3.5 Backbone bonding conductor (BBC) . 31
8.3.6 Bonds to continuous conductive pathway systems . 31
8.3.7 Bonds to structural metal . 32
9 Local telecommunications bonding networks in conjunction with protective
bonding networks . 32
9.1 Bonding for local distribution . 32
9.1.1 Star protective bonding networks . 32
9.1.2 Ring protective bonding networks . 33
9.2 Telecommunications bonding conductors . 34
9.2.1 Bonding conductors for d.c. resistance control . 34
9.2.2 Bonding conductors for impedance control . 35
9.3 Bonding for areas of telecommunications equipment concentration . 35
10 Local telecommunications bonding networks in conjunction with dedicated
telecommunications bonding networks . 36
10.1 Bonding for areas of telecommunications equipment concentration . 36
10.1.1 Requirements . 36
10.1.2 Recommendations . 36
10.1.3 Cabinets, frames and racks . 36
10.2 Telecommunications equipment bonding conductors (TEBC) . 36
10.2.1 TEBC for d.c. resistance control . 36
10.2.2 TEBC for impedance control . 36
10.2.3 Implementation . 36
11 Mesh bonded networks . 37
11.1 General . 37
11.2 Mesh bonding alternatives . 38
11.2.1 Local mesh bonding (MESH-IBN) networks . 38
11.2.2 MESH-BN . 39
11.3 Bonding conductors of a mesh bonding network . 40
11.3.1 Requirements . 40
11.3.2 Recommendations . 41
11.4 Bonding conductors to the mesh bonding network . 41
11.5 Supplementary bonding grid (SBG) . 41
11.6 System reference potential plane (SRPP) . 42
11.6.1 General . 42
11.6.2 Access floors . 42
11.6.3 Transient suppression plate (TSP) . 43
Annex A (normative) Maintenance of telecommunications bonding network
performance . 45
A.1 General . 45
A.2 Periodic activity . 45
A.2.1 Schedule . 45
A.2.2 Implementation . 45
A.3 Causes of performance deterioration . 46
A.3.1 Galvanic corrosion . 46
A.3.2 Requirements . 46
Annex B (normative) Bonding conductor cross-sectional area . 47
Annex C (infomative) Alternative terminology . 48

– 4 – ISO/IEC 30129:2015+AMD1:2019 CSV
 ISO/IEC 2019
Bibliography . 49

Figure 1 – Schematic relationship between ISO/IEC 30129 and other relevant
standards . 8
Figure 2 – Schematic of telecommunications equipment distribution and associated
bonding connections .
...