IEC 62228-5:2021
(Main)Integrated circuits - EMC evaluation of transceivers - Part 5: Ethernet transceivers
Integrated circuits - EMC evaluation of transceivers - Part 5: Ethernet transceivers
IEC 62228-5:2021 specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems
100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX according to ISO/IEC/IEEE 8802-3;
1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4
and covers
the emission of RF disturbances;
the immunity against RF disturbances;
the immunity against impulses;
the immunity against electrostatic discharges (ESD).
Circuits intégrés - Evaluation de la CEM des émetteurs-récepteurs - Partie 5: Emetteurs-récepteurs Ethernet
L’IEC 62228-5:2021 spécifie les méthodes d’essai et de mesure pour l’évaluation de la compatibilité électromagnétique (CEM) des circuits intégrés (CI) émetteurs‑récepteurs Ethernet placés en réseau. Elle définit les configurations d’essai, les conditions d’essai, les signaux d’essai, les critères de défaillance, les procédures d’essai, les montages d’essai et les cartes d’essai. Elle s’applique à l’émetteur-récepteur des systèmes Ethernet:
100BASE-T1 conformément à l’ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX conformément à l’ISO/IEC/IEEE 8802-3;
1000BASE-T1 conformément à l’ISO/IEC/IEEE 8802-3/AMD4.
et couvre:
l’émission de perturbations radioélectriques;
l’immunité aux perturbations radioélectriques;
l’immunité aux impulsions;
l’immunité aux décharges électrostatiques (DES).
General Information
Standards Content (Sample)
IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – EMC evaluation of transceivers –
Part 5: Ethernet transceivers
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IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – EMC evaluation of transceivers –
Part 5: Ethernet transceivers
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.200 ISBN 978-2-8322-9697-4
– 2 – IEC 62228-5:2021 © IEC 2021
CONTENTS
FOREWORD . 8
1 Scope . 10
2 Normative references . 10
3 Terms, definitions and abbreviated terms . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms . 12
4 General . 13
5 Test and operating conditions . 14
5.1 Supply and ambient conditions. 14
5.2 Test operation modes . 14
5.2.1 General . 14
5.2.2 Transceiver configuration for normal operation mode . 15
5.2.3 Transceiver configuration for low power mode . 15
5.3 Definition of BIN . 15
5.4 Test configuration . 16
5.4.1 General configuration for transceiver network . 16
5.4.2 General configuration for single transceiver . 18
5.4.3 Transceiver network tests – coupling ports and networks for conducted
tests . 18
5.4.4 Single transceiver tests – coupling ports and networks . 21
5.5 Test communication and signals . 22
5.5.1 General . 22
5.5.2 Test signals for normal operation mode . 22
5.5.3 Test signals for low power mode . 23
5.6 Evaluation criteria . 23
5.6.1 General . 23
5.6.2 Evaluation criteria for functional operation modes . 23
5.6.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 24
5.6.4 Status classes . 25
5.7 DUT specific information . 26
6 Test and measurement . 26
6.1 Emission of conducted RF disturbances . 26
6.1.1 Test method . 26
6.1.2 Test setup . 26
6.1.3 Test procedure and parameters . 27
6.2 Immunity to conducted RF disturbances . 28
6.2.1 Test method . 28
6.2.2 Test setup . 28
6.2.3 Test procedure and parameters . 29
6.3 Immunity to impulses . 33
6.3.1 Test method . 33
6.3.2 Test setup . 33
6.3.3 Test procedure and parameters . 34
6.4 Electrostatic Discharge (ESD) . 36
6.4.1 Test method . 36
6.4.2 Test setup . 36
6.4.3 Test procedure and parameters . 41
7 Test report . 43
Annex A (normative) Ethernet test circuits . 44
A.1 General . 44
A.2 Test circuit for Ethernet transceivers for functional tests . 44
A.3 Test circuit for Ethernet transceivers for ESD test . 46
Annex B (normative) Test circuit boards. 49
B.1 Test circuit board for transceiver network configuration . 49
B.2 Test circuit board for single transceiver configuration . 51
Annex C (informative) Test of Ethernet transceiver for radiated RF emission and RF
immunity . 53
C.1 General . 53
C.2 General configuration for transceiver network . 53
C.3 Tests . 54
C.3.1 General . 54
C.3.2 Emission of radiated RF disturbances . 58
C.3.3 Immunity to radiated RF disturbances . 59
Annex D (informative) Examples for test limits for Ethernet transceiver in automotive
application . 63
D.1 General . 63
D.2 Emission of conducted RF disturbances . 63
D.3 Immunity to conducted RF disturbances . 64
D.4 Immunity to impulses . 68
D.5 Electrostatic discharge (ESD) . 68
D.6 Emission of radiated RF disturbances . 69
D.7 Immunity to radiated RF disturbances . 70
Annex E (informative) Characterization of common mode chokes for EMC evaluation
of Ethernet transceivers . 72
E.1 General . 72
E.2 Test . 72
E.2.1 General . 72
E.2.2 S-parameter measurement mixed mode . 73
E.2.3 ESD damage . 80
E.2.4 Saturation test at RF disturbances . 82
E.2.5 Saturation test at ESD . 85
E.2.6 TDR measurement of differential mode impedance . 87
Annex F (informative) Characterization of ESD suppression devices for EMC
evaluation of Ethernet transceivers . 89
F.1 General . 89
F.2 Test . 90
F.2.1 General . 90
F.2.2 S-parameter measurement mixed mode . 91
F.2.3 ESD damage . 97
F.2.4 ESD discharge current measurement . 100
F.2.5 Test of unwanted clamping effect at RF immunity tests . 104
Bibliography . 108
Figure 1 – Minimum MDI interface test network (Min-BIN) . 16
Figure 2 – Standard MDI interface test network (Std-BIN) . 16
– 4 – IEC 62228-5:2021 © IEC 2021
Figure 3 – Optimized MDI interface test network (Opt-BIN) . 16
Figure 4 – General test configuration for tests in transceiver network for conducted
tests . 17
Figure 5 – General test configuration for unpowered ESD test . 18
Figure 6 – Transceiver network tests – coupling ports and networks . 19
Figure 7 – Coupling ports and networks for unpowered ESD tests . 22
Figure 8 – Principle drawing of the maximum deviation on an I-V characteristic . 25
Figure 9 – Test setup for measurement of conducted RF disturbances . 27
Figure 10 – Test setup for DPI tests . 29
Figure 11 – Test setup for impulse immunity tests. 33
Figure 12 – Test setup for powered ESD tests – principle arrangement. 36
Figure 13 – Test setup for powered ESD tests – stimulation and monitoring . 37
Figure 14 – Test setup for unpowered ESD tests – principle arrangement . 38
Figure 15 – Test setup for unpowered ESD tests – stimulation and monitoring for
function validation pre and post ESD test . 40
Figure A.1 – General drawing of the circuit diagram of test network for 100BASE-T1
and 1000BASE-T1 Ethernet transceivers for functional test using conducted test
methods . 45
Figure A.2 – General drawing of the circuit diagram of test network for 100BASE-TX
Ethernet transceivers for functional test using conducted test methods . 46
Figure A.3 – General drawing of the circuit diagram for ESD tests of Ethernet
transceivers in powered mode . 47
Figure A.4 – General drawing of the circuit diagram for ESD tests of Ethernet
transceivers in unpowered mode . 48
Figure B.1 – Example of functional conducted test board for Ethernet transceiver ICs
(100BASE-T1) . 49
Figure B.2 – Example of powered ESD test board for Ethernet transceivers ICs
(100BASE-T1) . 50
Figure B.3 – Example of unpowered ESD test board for Ethernet transceivers ICs
(100BASE-T1), top layer . 51
Figure B.4 – Example of unpowered ESD test board for Ethernet transceivers ICs
(100BASE-T1), bottom layer . 51
Figure C.1 – General test configuration for tests in transceiver network used for
radiated tests . 53
Figure C.2 – General drawing of the circuit diagram of test network for 100BASE-T1
and 1000BASE-T1 Ethernet transceivers for functional test using radiated RF test
methods . 55
Figure C.3 – Example of functional radiated test board for Ethernet transceiver ICs
(100BASE-T1), top layer (DUT side) . 56
Figure C.4 – Example of functional radiated test board for Ethernet transceiver ICs
(100BASE-T1), bottom layer (external circuitry side) . 57
Figure C.5 – Test setup for measurement of radiated RF emission . 58
Figure C.6 – Test setup for radiated RF immunity tests . 60
Figure D.1 – Example of limits for conducted RF emission – MDI Opt-BIN, V and
BAT
WAKE . 63
Figure D.2 – Example of limits for conducted RF emission – local supplies . 64
Figure D.3 – Example of limits for conducted RF immunity for functional status
class A – MDI Opt-BIN . 65
IC
Figure D.4 – Example of limits for conducted RF immunity for functional status
class A – V and WAKE . 65
IC BAT
Figure D.5 – Example of limits for conducted RF immunity for functional status
class C or D – MDI Opt-BIN . 67
IC IC
Figure D.6 – Example of limits for conducted RF immunity for functional status
class C or D – V and WAKE . 67
IC IC BAT
Figure D.7 – Example of limits for radiated RF emission for IC stripline with 6,7 mm
active conductor height . 69
Figure D.8 – Example of limits for radiated RF immunity . 70
Figure E.1 – General electrical drawing of a CMC . 72
Figure E.2 – Test setup for S-parameter measurements at CMC . 73
Figure E.3 – Example of test board 4-port S-parameter measurement at CMC – mixed
mode, top layer . 74
Figure E.4 – Example of test board 3-port S-parameter measurement at CMC – single
ended, top layer . 74
Figure E.5 – Recommended characteristics for S , S (RL) for CMC . 77
dd11 dd22
Figure E.6 – Recommended characteristics for S (IL) for CMC. 78
dd21
Figure E.7 – Recommended characteristics for S (CMR) for CMC . 78
cc21
Figure E.8 – Recommended characteristics for S , S (LCL) for CMC . 79
dc11 dc22
Figure E.9 – Recommended characteristics for S , S (DCMR) and S ,
sd21 sd12 ds21
S (CDMR) for CMC . 79
ds12
Figure E.10 – Test setup for ESD damage tests at CMC . 80
Figure E.11 – Example of ESD test board for CMC, top layer . 81
Figure E.12 – Test setup for RF saturation measurements at CMC . 83
Figure E.13 – Example of RF saturation / S-parameter test board for CMC, top layer. 83
Figure E.14 – Test setup for ESD saturation measurements at CMC . 85
Figure E.15 – Example of ESD saturation test board for CMC, top layer . 85
Figure E.16 – Example of ESD saturation tests results for CMC . 87
Figure E.17 – Test setup for TDR measurement at CMC . 87
Figure E.18 – Example of TDR test board for CMC, top layer . 88
Figure F.1 – Arrangement of ESD suppression device within the 100BASE-T1 and
1000BASE-T1 MDI interface . 90
Figure F.2 – Test setup for S-parameter measurements at ESD suppression device . 91
Figure F.3 – Example of test board 4-port S-parameter measurement for ESD
suppression device – mixed mode, top layer . 92
Figure F.4 – Example of test board 3-port S-parameter measurement for ESD
suppression device – single ended, top layer . 92
Figure F.5 – Recommended characteristics for S (RL) for ESD suppression device . 95
dd11
Figure F.6 – Recommended characteristics for S (IL) for ESD suppression device . 95
dd21
Figure F.7 – Recommended characteristics for S (DCMR) for ESD suppression
sd21
device . 96
Figure F.8 – Test setup for ESD damage tests at ESD suppression device . 97
Figure F.9 – Example of ESD test board for ESD suppression device, top layer . 98
Figure F.10 – Test setup for ESD discharge current measurement at ESD suppression
device . 100
– 6 – IEC 62228-5:2021 © IEC 2021
Figure F.11 – Example of ESD discharge current test board for ESD suppression
device, top and bottom layer . 101
Figure F.12 – Example of test results and recommended limits for remaining ESD
discharge current after the MDI test network for ESD suppression device . 103
Figure F.13 – Test setup for RF clamping test at ESD suppression device . 104
Figure F.14 – Example of test board RF clamping test at suppression device, top layer . 105
Figure F.15 – Recommended test power levels for RF clamping tests at ESD
suppression device . 107
Table 1 – Overview of measurements and tests . 13
Table 2 – Supply and ambient conditions for functional operation . 14
Table 3 – Definition for transceiver configuration for normal operation mode . 15
Table 4 – Definition for transceiver mode configuration for low power mode . 15
Table 5 – Selection recommendation of MII interfaces for transceiver network
configuration . 18
Table 6 – Transceiver network tests – component value definitions of coupling ports
and networks . 20
Table 7 – Definitions of coupling ports for unpowered ESD tests . 22
Table 8 – Definition for transceiver mode configuration for normal operation mode . 23
Table 9 – Evaluation criteria for Ethernet transceiver . 24
Table 10 – Definition of functional status classes . 25
Table 11 – Settings of the conducted RF measurement equipment . 27
Table 12 – Conducted emission measurements . 28
Table 13 – Specifications for DPI tests . 30
Table 14 – DPI tests for functional status class A evaluation of Ethernet transceivers . 31
IC
Table 15 – DPI tests for functional status class C or D evaluation of Ethernet
IC IC
transceivers . 32
Table 16 – Specifications for impulse immunity tests . 34
Table 17 – Parameters for impulse immunity test . 34
Table 18 – Impulse immunity tests for functional status class A evaluation of
IC
Ethernet transceivers . 35
Table 19 – Impulse immunity tests for functional status class C or D evaluation of
IC IC
Ethernet transceivers . 35
Table 20 – Specifications for ESD tests . 41
Table 21 – ESD tests in powered mode for functional status class A , C and D
IC IC IC
evaluation of Ethernet transceivers . 42
Table 22 – ESD tests in unpowered mode for functional status class D evaluation of
IC
Ethernet transceiver ICs . 43
Table B.1 – Parameter ESD test circuit board . 52
Table C.1 – Settings of the radiated RF measurement equipment . 59
Table C.2 – Radiated RF emission measurements . 59
Table C.3 – Specifications for radiated RF immunity tests . 61
Table C.4 – Radiated RF immunity tests for functional status class AIC evaluation of
Ethernet transceivers . 62
Table D.1 – Example of limits for conducted RF emission – test cases with
recommended limit classes . 64
Table D.2 – Example of limits for conducted RF immunity – test cases with
recommended limit classes for functional status class A . 66
IC
Table D.3 – Example of limits for conducted RF immunity – test cases with
recommended limit classes for functional status class C or D . 68
IC IC
Table D.4 – Example of limits for impulse immunity – Class I . 68
Table D.5 – Example of limits for impulse immunity – test cases with recommended
limit classes for functional status class C or D . 68
IC IC
Table D.6 – Example of limits for powered and unpowered ESD tests – test cases with
recommended limits for functional status class A1 A2 A3 C or D . 69
IC, IC, IC, IC IC
Table D.7 – Example of limits for radiated RF emission – test cases with recommended
limit classes . 70
Table D.8 – Example of limits for radiated RF immunity – test cases with recommended
limit classes . 71
Table E.1 – Test procedure and parameters for 3-port test board characterization for
CMC . 75
Table E.2 – Test procedure and parameters for S-parameter measurements at CMC . 76
Table E.3 – Required S-parameter measurements for CMC . 77
Table E.4 – Test parameters for ESD damage tests at CMC . 81
Table E.5 – Required ESD tests for damage for CMC . 82
Table E.6 – Test procedure and parameters for RF saturation tests at CMC . 84
Table E.7 – Required RF saturation tests for CMC . 84
Table E.8 – Test procedure and parameters for ESD saturation tests at CMC . 86
Table E.9 – Required ESD saturation tests for CMC . 86
Table E.10 – ESD saturation break down voltage classes for CMC . 86
Table E.11 – Test procedure and parameters for TDR measurement at CMC . 88
Table E.12 – Required TDR measurements for CMC . 88
Table F.1 – Specification of ESD suppression device . 89
Table F.2 – Test procedure and parameters for 3-port test board characterization for
ESD suppression device . 93
Table F.3 – Test procedure and parameters for S-parameter measurements at ESD
suppression device . 94
Table F.4 – Required S-parameter measurements for ESD suppression device . 94
Table F.5 – Test parameters for ESD damage tests at ESD suppression device . 99
Table F.6 – Required ESD tests for damage for ESD suppression device . 99
Table F.7 – Test parameters for ESD discharge current measurement at ESD
suppression device . 102
Table F.8 – Required current measurement for ESD suppression device . 102
Table F.9 – Recommended limits for remaining ESD discharge current after the MDI
test network for ESD suppression device . 103
Table F.10 – Limit classes and related applied ESD test voltages . 104
Table F.11 – Test procedure and parameters for RF clamping tests at ESD
suppression device . 106
Table F.12 – Required RF clamping tests for ESD suppression device . 107
– 8 – IEC 62228-5:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –
Part 5: Ethernet transceivers
FOREWORD
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all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62228-5 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1115/FDIS 47A/1117/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
– 10 – IEC 62228-5:2021 © IEC 2021
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –
Part 5: Ethernet transceivers
1 Scope
This part of IEC 62228 specifies test and measurement methods for EMC evaluation of Ethernet
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for
transceiver of the Ethernet systems
• 100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
• 100BASE-TX according to ISO/IEC/IEEE 8802-3;
• 1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4
and covers
• the emission of RF disturbances;
• the immunity against RF disturbances;
• the immunity against impulses;
• the immunity against electrostatic discharges (ESD).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1
GHz – Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method
IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity – Part 1: General
conditions and definitions
IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to 1 GHz
– Part 4: Direct RF power injection method
IEC 62215-3, Integrated circuits – Measurement of impulse immunity – Part 3: Non-
synchronous transient injection method
IEC 62228-1, Integrated circuits – EMC evaluation of transceivers – Part 1: General conditions
and definitions
ISO 10605, Road vehicles – Test methods for electrical disturbances from electrostatic
discharge
ISO 21111-2, Road vehicles – In-vehicle Ethernet – Part 2: Common physical entity
requirements
ISO 7637-2, Road vehicles – Electrical disturbances from conduction and coupling – Part 2:
Electrical transient conduction along supply lines only
ISO/IEC/IEEE 8802-3:2017, Information technology – Telecommunications and information
exchange between systems – Local and metropolitan area networks – Specific requirements –
Part 3: Standard for Ethernet
ISO/IEC/IEEE 8802-3:2017/AMD1:2017, Amendment 1 – Information technology –
Telecommunications and information exchange between systems – Local and metropolitan area
networks – Specific requirements – Part 3: Standard for Ethernet – Physical layer specifications
and management parameters for 100 Mb/s operation over a single balanced twisted pair cable
(100BASE-T1)
ISO/IEC/IEEE 8802-3:2017/AMD4:2017, Amendment 4 – Information technology –
Telecommunications and information exchange between systems – Local and metropolitan area
networks – Specific requirements – Part 3: Standard for Ethernet – Physical layer specifications
and management parameters for 1 Gb/s operation over a single twisted-pair copper cable
Electronic Components Industry Association, EIA-198-1, Ceramic Dielectric Capacitors Classes
I, II, III and IV
3 Terms, definitions and abbreviated terms
For the purposes of this document, the terms and definitions given in IEC 61967-1, IEC 62132‑1,
IEC 62228-1, as well as the following apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• ISO Online browsing platform: available at http://www.iso.org/obp
• IEC Electropedia: available at http://www.electropedia.org/
3.1 Terms and definitions
3.1.1
100BASE-T1 transceiver
transceiver 100 Mbit/s via single balanced twisted pair, with a functionality according to
ISO/IEC/IEEE 8802-3/AMD1 (100BASE-T1)
3.1.2
100BASE-TX transceiver
transceiver 100 Mbit/s via two balanced twisted pairs, with a functionality according to
ISO/IEC/IEEE 8802-3(100BASE-TX)
3.1.3
1000BASE-T1 transceiver
transceiver 1000 Mbit/s via single balanced twisted pair, with a functionality according to
ISO/IEC/IEEE 8802-3/AMD4 (1000BASE-T1)
3.1.4
global pin
pin that carries a signal or power, which enters or leaves the application board without any
active component in between
– 12 – IEC 62228-5:2021 © IEC 2021
3.1.5
local pin
pin that carries a signal or power, which does not leave the application board
3.1.6
mandatory components
pl
components needed for proper function and/or technical requirement of IC as specified by the
IC manufacturer
3.1.7
switch
IC with integrated Ethernet transceivers and switch functionality as defined in ISO/IEC/IEEE
8802-3
3.2 Abbreviated terms
ASIC Application specific integrated circuit
BIN Bus interface network
BIST Built in self-test
CMC Common mode choke
CDMR Common to differential mode conversion ratio
CMR Common mode rejection
DCMR Differential to common mode conversion ratio
DPI Direct RF power injection
DTT Data transfer test
DUT Device under test
FPGA Field programmable gate array
GMII Gigabit media independent interface
GPIO General purpose input or output
IL Insertion loss
INH Inhibit
LCL Longitudinal conversion loss
LPF Low pass filter
MDI Medium dependent interface
MII Media independent interface
PCB Printed circuit board
PRBS Pseudo random bit stream
PHY Ethernet single transceiver
RGMII Reduced gigabit media independent interface
...
IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – EMC evaluation of transceivers –
Part 5: Ethernet transceivers
Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –
Partie 5: Émetteurs-récepteurs Ethernet
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IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – EMC evaluation of transceivers –
Part 5: Ethernet transceivers
Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –
Partie 5: Émetteurs-récepteurs Ethernet
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-1037-4
– 2 – IEC 62228-5:2021 © IEC 2021
CONTENTS
FOREWORD . 8
1 Scope . 10
2 Normative references . 10
3 Terms, definitions and abbreviated terms . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms . 12
4 General . 13
5 Test and operating conditions . 14
5.1 Supply and ambient conditions. 14
5.2 Test operation modes . 14
5.2.1 General . 14
5.2.2 Transceiver configuration for normal operation mode . 15
5.2.3 Transceiver configuration for low power mode . 15
5.3 Definition of BIN . 15
5.4 Test configuration . 16
5.4.1 General configuration for transceiver network . 16
5.4.2 General configuration for single transceiver . 18
5.4.3 Transceiver network tests – coupling ports and networks for conducted
tests . 18
5.4.4 Single transceiver tests – coupling ports and networks . 21
5.5 Test communication and signals . 22
5.5.1 General . 22
5.5.2 Test signals for normal operation mode . 22
5.5.3 Test signals for low power mode . 23
5.6 Evaluation criteria . 23
5.6.1 General . 23
5.6.2 Evaluation criteria for functional operation modes . 23
5.6.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 24
5.6.4 Status classes . 25
5.7 DUT specific information . 26
6 Test and measurement . 26
6.1 Emission of conducted RF disturbances . 26
6.1.1 Test method . 26
6.1.2 Test setup . 26
6.1.3 Test procedure and parameters . 27
6.2 Immunity to conducted RF disturbances . 28
6.2.1 Test method . 28
6.2.2 Test setup . 28
6.2.3 Test procedure and parameters . 29
6.3 Immunity to impulses . 33
6.3.1 Test method . 33
6.3.2 Test setup . 33
6.3.3 Test procedure and parameters . 34
6.4 Electrostatic Discharge (ESD) . 36
6.4.1 Test method . 36
6.4.2 Test setup . 36
6.4.3 Test procedure and parameters . 41
7 Test report . 43
Annex A (normative) Ethernet test circuits . 44
A.1 General . 44
A.2 Test circuit for Ethernet transceivers for functional tests . 44
A.3 Test circuit for Ethernet transceivers for ESD test . 46
Annex B (normative) Test circuit boards. 49
B.1 Test circuit board for transceiver network configuration . 49
B.2 Test circuit board for single transceiver configuration . 51
Annex C (informative) Test of Ethernet transceiver for radiated RF emission and RF
immunity . 53
C.1 General . 53
C.2 General configuration for transceiver network . 53
C.3 Tests . 54
C.3.1 General . 54
C.3.2 Emission of radiated RF disturbances . 58
C.3.3 Immunity to radiated RF disturbances . 59
Annex D (informative) Examples for test limits for Ethernet transceiver in automotive
application . 63
D.1 General . 63
D.2 Emission of conducted RF disturbances . 63
D.3 Immunity to conducted RF disturbances . 64
D.4 Immunity to impulses . 68
D.5 Electrostatic discharge (ESD) . 68
D.6 Emission of radiated RF disturbances . 69
D.7 Immunity to radiated RF disturbances . 70
Annex E (informative) Characterization of common mode chokes for EMC evaluation
of Ethernet transceivers . 72
E.1 General . 72
E.2 Test . 72
E.2.1 General . 72
E.2.2 S-parameter measurement mixed mode . 73
E.2.3 ESD damage . 80
E.2.4 Saturation test at RF disturbances . 82
E.2.5 Saturation test at ESD . 85
E.2.6 TDR measurement of differential mode impedance . 87
Annex F (informative) Characterization of ESD suppression devices for EMC
evaluation of Ethernet transceivers . 89
F.1 General . 89
F.2 Test . 90
F.2.1 General . 90
F.2.2 S-parameter measurement mixed mode . 91
F.2.3 ESD damage . 97
F.2.4 ESD discharge current measurement . 100
F.2.5 Test of unwanted clamping effect at RF immunity tests . 104
Bibliography . 108
Figure 1 – Minimum MDI interface test network (Min-BIN) . 16
Figure 2 – Standard MDI interface test network (Std-BIN) . 16
– 4 – IEC 62228-5:2021 © IEC 2021
Figure 3 – Optimized MDI interface test network (Opt-BIN) . 16
Figure 4 – General test configuration for tests in transceiver network for conducted
tests . 17
Figure 5 – General test configuration for unpowered ESD test . 18
Figure 6 – Transceiver network tests – coupling ports and networks . 19
Figure 7 – Coupling ports and networks for unpowered ESD tests . 22
Figure 8 – Principle drawing of the maximum deviation on an I-V characteristic . 25
Figure 9 – Test setup for measurement of conducted RF disturbances . 27
Figure 10 – Test setup for DPI tests . 29
Figure 11 – Test setup for impulse immunity tests. 33
Figure 12 – Test setup for powered ESD tests – principle arrangement. 36
Figure 13 – Test setup for powered ESD tests – stimulation and monitoring . 37
Figure 14 – Test setup for unpowered ESD tests – principle arrangement . 38
Figure 15 – Test setup for unpowered ESD tests – stimulation and monitoring for
function validation pre and post ESD test . 40
Figure A.1 – General drawing of the circuit diagram of test network for 100BASE-T1
and 1000BASE-T1 Ethernet transceivers for functional test using conducted test
methods . 45
Figure A.2 – General drawing of the circuit diagram of test network for 100BASE-TX
Ethernet transceivers for functional test using conducted test methods . 46
Figure A.3 – General drawing of the circuit diagram for ESD tests of Ethernet
transceivers in powered mode . 47
Figure A.4 – General drawing of the circuit diagram for ESD tests of Ethernet
transceivers in unpowered mode . 48
Figure B.1 – Example of functional conducted test board for Ethernet transceiver ICs
(100BASE-T1) . 49
Figure B.2 – Example of powered ESD test board for Ethernet transceivers ICs
(100BASE-T1) . 50
Figure B.3 – Example of unpowered ESD test board for Ethernet transceivers ICs
(100BASE-T1), top layer . 51
Figure B.4 – Example of unpowered ESD test board for Ethernet transceivers ICs
(100BASE-T1), bottom layer . 51
Figure C.1 – General test configuration for tests in transceiver network used for
radiated tests . 53
Figure C.2 – General drawing of the circuit diagram of test network for 100BASE-T1
and 1000BASE-T1 Ethernet transceivers for functional test using radiated RF test
methods . 55
Figure C.3 – Example of functional radiated test board for Ethernet transceiver ICs
(100BASE-T1), top layer (DUT side) . 56
Figure C.4 – Example of functional radiated test board for Ethernet transceiver ICs
(100BASE-T1), bottom layer (external circuitry side) . 57
Figure C.5 – Test setup for measurement of radiated RF emission . 58
Figure C.6 – Test setup for radiated RF immunity tests . 60
Figure D.1 – Example of limits for conducted RF emission – MDI Opt-BIN, V and
BAT
WAKE . 63
Figure D.2 – Example of limits for conducted RF emission – local supplies . 64
Figure D.3 – Example of limits for conducted RF immunity for functional status
class A – MDI Opt-BIN . 65
IC
Figure D.4 – Example of limits for conducted RF immunity for functional status
class A – V and WAKE . 65
IC BAT
Figure D.5 – Example of limits for conducted RF immunity for functional status
class C or D – MDI Opt-BIN . 67
IC IC
Figure D.6 – Example of limits for conducted RF immunity for functional status
class C or D – V and WAKE . 67
IC IC BAT
Figure D.7 – Example of limits for radiated RF emission for IC stripline with 6,7 mm
active conductor height . 69
Figure D.8 – Example of limits for radiated RF immunity . 70
Figure E.1 – General electrical drawing of a CMC . 72
Figure E.2 – Test setup for S-parameter measurements at CMC . 73
Figure E.3 – Example of test board 4-port S-parameter measurement at CMC – mixed
mode, top layer . 74
Figure E.4 – Example of test board 3-port S-parameter measurement at CMC – single
ended, top layer . 74
Figure E.5 – Recommended characteristics for S , S (RL) for CMC . 77
dd11 dd22
Figure E.6 – Recommended characteristics for S (IL) for CMC. 78
dd21
Figure E.7 – Recommended characteristics for S (CMR) for CMC . 78
cc21
Figure E.8 – Recommended characteristics for S , S (LCL) for CMC . 79
dc11 dc22
Figure E.9 – Recommended characteristics for S , S (DCMR) and S ,
sd21 sd12 ds21
S (CDMR) for CMC . 79
ds12
Figure E.10 – Test setup for ESD damage tests at CMC . 80
Figure E.11 – Example of ESD test board for CMC, top layer . 81
Figure E.12 – Test setup for RF saturation measurements at CMC . 83
Figure E.13 – Example of RF saturation / S-parameter test board for CMC, top layer. 83
Figure E.14 – Test setup for ESD saturation measurements at CMC . 85
Figure E.15 – Example of ESD saturation test board for CMC, top layer . 85
Figure E.16 – Example of ESD saturation tests results for CMC . 87
Figure E.17 – Test setup for TDR measurement at CMC . 87
Figure E.18 – Example of TDR test board for CMC, top layer . 88
Figure F.1 – Arrangement of ESD suppression device within the 100BASE-T1 and
1000BASE-T1 MDI interface . 90
Figure F.2 – Test setup for S-parameter measurements at ESD suppression device . 91
Figure F.3 – Example of test board 4-port S-parameter measurement for ESD
suppression device – mixed mode, top layer . 92
Figure F.4 – Example of test board 3-port S-parameter measurement for ESD
suppression device – single ended, top layer . 92
Figure F.5 – Recommended characteristics for S (RL) for ESD suppression device . 95
dd11
Figure F.6 – Recommended characteristics for S (IL) for ESD suppression device . 95
dd21
Figure F.7 – Recommended characteristics for S (DCMR) for ESD suppression
sd21
device . 96
Figure F.8 – Test setup for ESD damage tests at ESD suppression device . 97
Figure F.9 – Example of ESD test board for ESD suppression device, top layer . 98
Figure F.10 – Test setup for ESD discharge current measurement at ESD suppression
device . 100
– 6 – IEC 62228-5:2021 © IEC 2021
Figure F.11 – Example of ESD discharge current test board for ESD suppression
device, top and bottom layer . 101
Figure F.12 – Example of test results and recommended limits for remaining ESD
discharge current after the MDI test network for ESD suppression device . 103
Figure F.13 – Test setup for RF clamping test at ESD suppression device . 104
Figure F.14 – Example of test board RF clamping test at suppression device, top layer . 105
Figure F.15 – Recommended test power levels for RF clamping tests at ESD
suppression device . 107
Table 1 – Overview of measurements and tests . 13
Table 2 – Supply and ambient conditions for functional operation . 14
Table 3 – Definition for transceiver configuration for normal operation mode . 15
Table 4 – Definition for transceiver mode configuration for low power mode . 15
Table 5 – Selection recommendation of MII interfaces for transceiver network
configuration . 18
Table 6 – Transceiver network tests – component value definitions of coupling ports
and networks . 20
Table 7 – Definitions of coupling ports for unpowered ESD tests . 22
Table 8 – Definition for transceiver mode configuration for normal operation mode . 23
Table 9 – Evaluation criteria for Ethernet transceiver . 24
Table 10 – Definition of functional status classes . 25
Table 11 – Settings of the conducted RF measurement equipment . 27
Table 12 – Conducted emission measurements . 28
Table 13 – Specifications for DPI tests . 30
Table 14 – DPI tests for functional status class A evaluation of Ethernet transceivers . 31
IC
Table 15 – DPI tests for functional status class C or D evaluation of Ethernet
IC IC
transceivers . 32
Table 16 – Specifications for impulse immunity tests . 34
Table 17 – Parameters for impulse immunity test . 34
Table 18 – Impulse immunity tests for functional status class A evaluation of
IC
Ethernet transceivers . 35
Table 19 – Impulse immunity tests for functional status class C or D evaluation of
IC IC
Ethernet transceivers . 35
Table 20 – Specifications for ESD tests . 41
Table 21 – ESD tests in powered mode for functional status class A , C and D
IC IC IC
evaluation of Ethernet transceivers . 42
Table 22 – ESD tests in unpowered mode for functional status class D evaluation of
IC
Ethernet transceiver ICs . 43
Table B.1 – Parameter ESD test circuit board . 52
Table C.1 – Settings of the radiated RF measurement equipment . 59
Table C.2 – Radiated RF emission measurements . 59
Table C.3 – Specifications for radiated RF immunity tests . 61
Table C.4 – Radiated RF immunity tests for functional status class AIC evaluation of
Ethernet transceivers . 62
Table D.1 – Example of limits for conducted RF emission – test cases with
recommended limit classes . 64
Table D.2 – Example of limits for conducted RF immunity – test cases with
recommended limit classes for functional status class A . 66
IC
Table D.3 – Example of limits for conducted RF immunity – test cases with
recommended limit classes for functional status class C or D . 68
IC IC
Table D.4 – Example of limits for impulse immunity – Class I . 68
Table D.5 – Example of limits for impulse immunity – test cases with recommended
limit classes for functional status class C or D . 68
IC IC
Table D.6 – Example of limits for powered and unpowered ESD tests – test cases with
recommended limits for functional status class A1 A2 A3 C or D . 69
IC, IC, IC, IC IC
Table D.7 – Example of limits for radiated RF emission – test cases with recommended
limit classes . 70
Table D.8 – Example of limits for radiated RF immunity – test cases with recommended
limit classes . 71
Table E.1 – Test procedure and parameters for 3-port test board characterization for
CMC . 75
Table E.2 – Test procedure and parameters for S-parameter measurements at CMC . 76
Table E.3 – Required S-parameter measurements for CMC . 77
Table E.4 – Test parameters for ESD damage tests at CMC . 81
Table E.5 – Required ESD tests for damage for CMC . 82
Table E.6 – Test procedure and parameters for RF saturation tests at CMC . 84
Table E.7 – Required RF saturation tests for CMC . 84
Table E.8 – Test procedure and parameters for ESD saturation tests at CMC . 86
Table E.9 – Required ESD saturation tests for CMC . 86
Table E.10 – ESD saturation break down voltage classes for CMC . 86
Table E.11 – Test procedure and parameters for TDR measurement at CMC . 88
Table E.12 – Required TDR measurements for CMC . 88
Table F.1 – Specification of ESD suppression device . 89
Table F.2 – Test procedure and parameters for 3-port test board characterization for
ESD suppression device . 93
Table F.3 – Test procedure and parameters for S-parameter measurements at ESD
suppression device . 94
Table F.4 – Required S-parameter measurements for ESD suppression device . 94
Table F.5 – Test parameters for ESD damage tests at ESD suppression device . 99
Table F.6 – Required ESD tests for damage for ESD suppression device . 99
Table F.7 – Test parameters for ESD discharge current measurement at ESD
suppression device . 102
Table F.8 – Required current measurement for ESD suppression device . 102
Table F.9 – Recommended limits for remaining ESD discharge current after the MDI
test network for ESD suppression device . 103
Table F.10 – Limit classes and related applied ESD test voltages . 104
Table F.11 – Test procedure and parameters for RF clamping tests at ESD
suppression device . 106
Table F.12 – Required RF clamping tests for ESD suppression device . 107
– 8 – IEC 62228-5:2021 © IEC 2021
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –
Part 5: Ethernet transceivers
FOREWORD
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 62228-5 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this International Standard is based on the following documents:
Draft Report on voting
47A/1115/FDIS 47A/1117/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/standardsdev/publications.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this document using a colour printer.
– 10 – IEC 62228-5:2021 © IEC 2021
INTEGRATED CIRCUITS –
EMC EVALUATION OF TRANSCEIVERS –
Part 5: Ethernet transceivers
1 Scope
This part of IEC 62228 specifies test and measurement methods for EMC evaluation of Ethernet
transceiver ICs under network condition. It defines test configurations, test conditions, test
signals, failure criteria, test procedures, test setups and test boards. It is applicable for
transceiver of the Ethernet systems
• 100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
• 100BASE-TX according to ISO/IEC/IEEE 8802-3;
• 1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4
and covers
• the emission of RF disturbances;
• the immunity against RF disturbances;
• the immunity against impulses;
• the immunity against electrostatic discharges (ESD).
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions – Part 1: General
conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1
GHz – Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method
IEC 62132-1, Integrated circuits – Measurement of electromagnetic immunity – Part 1: General
conditions and definitions
IEC 62132-4, Integrated circuits – Measurement of electromagnetic immunity 150 kHz to 1 GHz
– Part 4: Direct RF power injection method
IEC 62215-3, Integrated circuits – Measurement of impulse immunity – Part 3: Non-
synchronous transient injection method
IEC 62228-1, Integrated circuits – EMC evaluation of transceivers – Part 1: General conditions
and definitions
ISO 10605, Road vehicles – Test methods for electrical disturbances from electrostatic
discharge
ISO 21111-2, Road vehicles – In-vehicle Ethernet – Part 2: Common physical entity
requirements
ISO 7637-2, Road vehicles – Electrical disturbances from conduction and coupling – Part 2:
Electrical transient conduction along supply lines only
ISO/IEC/IEEE 8802-3:2017, Information technology – Telecommunications and information
exchange between systems – Local and metropolitan area networks – Specific requirements –
Part 3: Standard for Ethernet
ISO/IEC/IEEE 8802-3:2017/AMD1:2017, Amendment 1 – Information technology –
Telecommunications and information exchange between systems – Local and metropolitan area
networks – Specific requirements – Part 3: Standard for Ethernet – Physical layer specifications
and management parameters for 100 Mb/s operation over a single balanced twisted pair cable
(1
...
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