IEC 62228-5:2021

Integrated circuits - EMC evaluation of transceivers - Part 5: Ethernet transceivers

IEC 62228-5:2021 specifies test and measurement methods for EMC evaluation of Ethernet transceiver ICs under network condition. It defines test configurations, test conditions, test signals, failure criteria, test procedures, test setups and test boards. It is applicable for transceiver of the Ethernet systems
100BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX according to ISO/IEC/IEEE 8802-3;
1000BASE-T1 according to ISO/IEC/IEEE 8802-3/AMD4
and covers
the emission of RF disturbances;
the immunity against RF disturbances;
the immunity against impulses;
the immunity against electrostatic discharges (ESD).

Circuits intégrés - Evaluation de la CEM des émetteurs-récepteurs - Partie 5: Emetteurs-récepteurs Ethernet

L’IEC 62228-5:2021 spécifie les méthodes d’essai et de mesure pour l’évaluation de la compatibilité électromagnétique (CEM) des circuits intégrés (CI) émetteurs‑récepteurs Ethernet placés en réseau. Elle définit les configurations d’essai, les conditions d’essai, les signaux d’essai, les critères de défaillance, les procédures d’essai, les montages d’essai et les cartes d’essai. Elle s’applique à l’émetteur-récepteur des systèmes Ethernet:
100BASE-T1 conformément à l’ISO/IEC/IEEE 8802-3/AMD1;
100BASE-TX conformément à l’ISO/IEC/IEEE 8802-3;
1000BASE-T1 conformément à l’ISO/IEC/IEEE 8802-3/AMD4.
et couvre:
l’émission de perturbations radioélectriques;
l’immunité aux perturbations radioélectriques;
l’immunité aux impulsions;
l’immunité aux décharges électrostatiques (DES).

General Information

• Status: Published
• Publication Date: 25-Apr-2021
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 9 - TC 47/SC 47A/WG 9
• Current Stage: PPUB - Publication issued
• Start Date: 14-May-2021
• Completion Date: 26-Apr-2021

Standards Content (Sample)

IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – EMC evaluation of transceivers –
Part 5: Ethernet transceivers
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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International Standards for all electrical, electronic and related technologies.

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IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – EMC evaluation of transceivers –

Part 5: Ethernet transceivers
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.200 ISBN 978-2-8322-9697-4

– 2 – IEC 62228-5:2021 © IEC 2021
CONTENTS
FOREWORD . 8
1 Scope . 10
2 Normative references . 10
3 Terms, definitions and abbreviated terms . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms . 12
4 General . 13
5 Test and operating conditions . 14
5.1 Supply and ambient conditions. 14
5.2 Test operation modes . 14
5.2.1 General . 14
5.2.2 Transceiver configuration for normal operation mode . 15
5.2.3 Transceiver configuration for low power mode . 15
5.3 Definition of BIN . 15
5.4 Test configuration . 16
5.4.1 General configuration for transceiver network . 16
5.4.2 General configuration for single transceiver . 18
5.4.3 Transceiver network tests – coupling ports and networks for conducted
tests . 18
5.4.4 Single transceiver tests – coupling ports and networks . 21
5.5 Test communication and signals . 22
5.5.1 General . 22
5.5.2 Test signals for normal operation mode . 22
5.5.3 Test signals for low power mode . 23
5.6 Evaluation criteria . 23
5.6.1 General . 23
5.6.2 Evaluation criteria for functional operation modes . 23
5.6.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 24
5.6.4 Status classes . 25
5.7 DUT specific information . 26
6 Test and measurement . 26
6.1 Emission of conducted RF disturbances . 26
6.1.1 Test method . 26
6.1.2 Test setup . 26
6.1.3 Test procedure and parameters . 27
6.2 Immunity to conducted RF disturbances . 28
6.2.1 Test method . 28
6.2.2 Test setup . 28
6.2.3 Test procedure and parameters . 29
6.3 Immunity to impulses . 33
6.3.1 Test method . 33
6.3.2 Test setup . 33
6.3.3 Test procedure and parameters . 34
6.4 Electrostatic Discharge (ESD) . 36
6.4.1 Test method . 36
6.4.2 Test setup . 36

6.4.3 Test procedure and parameters . 41
7 Test report . 43
Annex A (normative) Ethernet test circuits . 44
A.1 General . 44
A.2 Test circuit for Ethernet transceivers for functional tests . 44
A.3 Test circuit for Ethernet transceivers for ESD test . 46
Annex B (normative) Test circuit boards. 49
B.1 Test circuit board for transceiver network configuration . 49
B.2 Test circuit board for single transceiver configuration . 51
Annex C (informative) Test of Ethernet transceiver for radiated RF emission and RF
immunity . 53
C.1 General . 53
C.2 General configuration for transceiver network . 53
C.3 Tests . 54
C.3.1 General . 54
C.3.2 Emission of radiated RF disturbances . 58
C.3.3 Immunity to radiated RF disturbances . 59
Annex D (informative) Examples for test limits for Ethernet transceiver in automotive
application . 63
D.1 General . 63
D.2 Emission of conducted RF disturbances . 63
D.3 Immunity to conducted RF disturbances . 64
D.4 Immunity to impulses . 68
D.5 Electrostatic discharge (ESD) . 68
D.6 Emission of radiated RF disturbances . 69
D.7 Immunity to radiated RF disturbances . 70
Annex E (informative) Characterization of common mode chokes for EMC evaluation
of Ethernet transceivers . 72
E.1 General . 72
E.2 Test . 72
E.2.1 General . 72
E.2.2 S-parameter measurement mixed mode . 73
E.2.3 ESD damage . 80
E.2.4 Saturation test at RF disturbances . 82
E.2.5 Saturation test at ESD . 85
E.2.6 TDR measurement of differential mode impedance . 87
Annex F (informative) Characterization of ESD suppression devices for EMC
evaluation of Ethernet transceivers . 89
F.1 General . 89
F.2 Test . 90
F.2.1 General . 90
F.2.2 S-parameter measurement mixed mode . 91
F.2.3 ESD damage . 97
F.2.4 ESD discharge current measurement . 100
F.2.5 Test of unwanted clamping effect at RF immunity tests . 104
Bibliography . 108

Figure 1 – Minimum MDI interface test network (Min-BIN) . 16
Figure 2 – Standard MDI interface test network (Std-BIN) . 16

– 4 – IEC 62228-5:2021 © IEC 2021
Figure 3 – Optimized MDI interface test network (Opt-BIN) . 16
Figure 4 – General test configuration for tests in transceiver network for conducted
tests . 17
Figure 5 – General test configuration for unpowered ESD test .
...

IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – EMC evaluation of transceivers –
Part 5: Ethernet transceivers
Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –
Partie 5: Émetteurs-récepteurs Ethernet

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch
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details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
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(IEV) online.
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IEC 62228-5 ®
Edition 1.0 2021-04
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – EMC evaluation of transceivers –

Part 5: Ethernet transceivers
Circuits intégrés – Évaluation de la CEM des émetteurs-récepteurs –

Partie 5: Émetteurs-récepteurs Ethernet

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-1037-4

– 2 – IEC 62228-5:2021 © IEC 2021
CONTENTS
FOREWORD . 8
1 Scope . 10
2 Normative references . 10
3 Terms, definitions and abbreviated terms . 11
3.1 Terms and definitions . 11
3.2 Abbreviated terms . 12
4 General . 13
5 Test and operating conditions . 14
5.1 Supply and ambient conditions. 14
5.2 Test operation modes . 14
5.2.1 General . 14
5.2.2 Transceiver configuration for normal operation mode . 15
5.2.3 Transceiver configuration for low power mode . 15
5.3 Definition of BIN . 15
5.4 Test configuration . 16
5.4.1 General configuration for transceiver network . 16
5.4.2 General configuration for single transceiver . 18
5.4.3 Transceiver network tests – coupling ports and networks for conducted
tests . 18
5.4.4 Single transceiver tests – coupling ports and networks . 21
5.5 Test communication and signals . 22
5.5.1 General . 22
5.5.2 Test signals for normal operation mode . 22
5.5.3 Test signals for low power mode . 23
5.6 Evaluation criteria . 23
5.6.1 General . 23
5.6.2 Evaluation criteria for functional operation modes . 23
5.6.3 Evaluation criteria in unpowered condition after exposure to
disturbances . 24
5.6.4 Status classes . 25
5.7 DUT specific information . 26
6 Test and measurement . 26
6.1 Emission of conducted RF disturbances . 26
6.1.1 Test method . 26
6.1.2 Test setup . 26
6.1.3 Test procedure and parameters . 27
6.2 Immunity to conducted RF disturbances . 28
6.2.1 Test method . 28
6.2.2 Test setup . 28
6.2.3 Test procedure and parameters . 29
6.3 Immunity to impulses . 33
6.3.1 Test method . 33
6.3.2 Test setup . 33
6.3.3 Test procedure and parameters . 34
6.4 Electrostatic Discharge (ESD) . 36
6.4.1 Test method . 36
6.4.2 Test setup . 36

6.4.3 Test procedure and parameters . 41
7 Test report . 43
Annex A (normative) Ethernet test circuits . 44
A.1 General . 44
A.2 Test circuit for Ethernet transceivers for functional tests . 44
A.3 Test circuit for Ethernet transceivers for ESD test . 46
Annex B (normative) Test circuit boards. 49
B.1 Test circuit board for transceiver network configuration . 49
B.2 Test circuit board for single transceiver configuration . 51
Annex C (informative) Test of Ethernet transceiver for radiated RF emission and RF
immunity . 53
C.1 General . 53
C.2 General configuration for transceiver network . 53
C.3 Tests . 54
C.3.1 General . 54
C.3.2 Emission of radiated RF disturbances . 58
C.3.3 Immunity to radiated RF disturbances . 59
Annex D (informative) Examples for test limits for Ethernet transceiver in automotive
application . 63
D.1 General . 63
D.2 Emission of conducted RF disturbances . 63
D.3 Immunity to conducted RF disturbances . 64
D.4 Immunity to impulses . 68
D.5 Electrostatic discharge (ESD) . 68
D.6 Emission of radiated RF disturbances . 69
D.7 Immunity to radiated RF disturbances . 70
Annex E (informative) Characterization of common mode chokes for EMC evaluation
of Ethernet transceivers . 72
E.1 General .
...