Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.

General Information

Status
Published
Publication Date
19-Jan-2017
Current Stage
PPUB - Publication issued
Start Date
31-Jan-2017
Completion Date
20-Jan-2017
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IEC 62047-27
®

Edition 1.0 2017-01
INTERNATIONAL
STANDARD

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inside


Semiconductor devices – Micro-electromechanical devices
Part 27: Bond strength test for glass frit bonded structures using micro-chevron-
tests (MCT)
IEC 62047-27:2017-01(en)

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IEC 62047-27

®


Edition 1.0 2017-01




INTERNATIONAL



STANDARD








colour

inside










Semiconductor devices – Micro-electromechanical devices

Part 27: Bond strength test for glass frit bonded structures using micro-chevron-

tests (MCT)


























INTERNATIONAL

ELECTROTECHNICAL


COMMISSION





ICS 31.080.99 ISBN 978-2-8322-3831-8



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® Registered trademark of the International Electrotechnical Commission

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– 2 – IEC 62047-27:2017 © IEC 2017
CONTENTS

FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 7
3 Terms, definitions, symbols and abbreviated terms . 7
3.1 Terms and definitions . 7
3.2 Symbols and abbreviated terms . 7
4 Principle . 8
5 Test setup . 8
5.1 Genera
...

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