Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

IEC 62047-27:2017(E) specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries.
The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron-samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance, it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance.

General Information

Status
Published
Publication Date
19-Jan-2017
Current Stage
PPUB - Publication issued
Start Date
20-Jan-2017
Completion Date
20-Jan-2017
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IEC 62047-27
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices

Part 27: Bond strength test for glass frit bonded structures using micro-chevron-

tests (MCT)
IEC 62047-27:2017-01(en)
---------------------- Page: 1 ----------------------
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IEC 62047-27
Edition 1.0 2017-01
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Micro-electromechanical devices

Part 27: Bond strength test for glass frit bonded structures using micro-chevron-

tests (MCT)
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-3831-8

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 62047-27:2017 © IEC 2017
CONTENTS

FOREWORD ........................................................................................................................... 3

INTRODUCTION ..................................................................................................................... 5

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 7

3 Terms, definitions, symbols and abbreviated terms .......................................................... 7

3.1 Terms and definitions .............................................................................................. 7

3.2 Symbols and abbreviated terms .............................................................................. 7

4 Principle .......................................................................................................................... 8

5 Test setup ....................................................................................................................... 8

5.1 General ................................................................................................................... 8

5.2 Actuator .................................................................................................................. 8

5.3 Force transducers ................................................................................................... 8

5.4 Mounting ................................................................................................................. 8

5.5 Data acquisition ...................................................................................................... 8

6 Specimens ....................................................................................................................... 9

6.1 Sample design ........................................................................................................ 9

6.2 Determination and verification of the specimen geometry ...................................... 11

7 Conduction of the test .................................................................................................... 11

8 Test parameter .............................................................................................................. 12

8.1 Test velocity ......................................................................................................... 12

8.2 Specimen alignment .............................................................................................. 13

8.3 Environmental conditions ...................................................................................... 13

9 Analysis and evaluation ................................................................................................. 13

9.1 General requirements for test series ..................................................................... 13

9.2 Valid test .............................................................................................................. 13

9.3 Calculation of the fracture toughness of the glass frit connection .......................... 14

9.4 Statistical evaluation ............................................................................................. 15

10 Test report ..................................................................................................................... 15

Bibliography .......................................................................................................................... 16

Figure 1 – Test setup of the micro-chevron-test ...................................................................... 6

Figure 2 – Standard geometry design of glass frit specimen.................................................. 10

Figure 3 – Design of the load application elements ............................................................... 11

Figure 4 – Permissible deviation for stud application ............................................................. 12

Figure 5 – Connection of the free sample parts as a result of the application of the

applied force initiation elements ............................................................................................ 12

Figure 6 – Exemplary measurement graph of a valid attempt ................................................ 14

Table 1 – Geometry factors in relation to substrate thickness ............................................... 14

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IEC 62047-27:2017 © IEC 2017 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES
Part 27: Bond strength test for glass frit bonded
structures using micro-chevron-tests (MCT)
FOREWORD

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International Standard IEC 62047-27 has been prepared by subcommittee 47F:

Microelectromechanical systems, of IEC technical committee 47: Semiconductor devices.

The text of this standard is based on the following documents:
CDV Report on voting
47F/230A/CDV 47F/259/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

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– 4 – IEC 62047-27:2017 © IEC 2017

A list of all parts in the IEC 62047 series, published under the general title Semiconductor

devices – Micro-electromechanical devices, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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IEC 62047-27:2017 © IEC 2017 – 5 –
INTRODUCTION

MEMS devices, e.g. for automotive applications, have to ensure lifecycles of up to 15 years or

more. In order to guarantee functionality and reliability of the used interconnection

technologies, qualified test methods are required for evaluating the quality and strength of the

bonding interfaces. One of the preferred interconnection technologies for MEMS

encapsulation is glass frit bonding, using an additional intermediate bond layer.

The micro-chevron-test is an experimental method to determine the fracture toughness of

brittle materials or bond interfaces using specifically designed test chips (micro-chevron-

samples) under defined load conditions. It was established for characterizing the strength of

wafer bonds without additional intermediate bond layers. By analysis of test results from a

series of tests at the Fraunhofer Institute for Mechanics of Materials and the Fraunhofer

Institute for Electronic Nano Systems with different geometry and layout of the test-probes,

the micro-chevron-test was established for the bonding reliability of glass frit bonded devices

as well.
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– 6 – IEC 62047-27:2017 © IEC 2017
SEMICONDUCTOR DEVICES –
MICRO-ELECTROMECHANICAL DEVICES
Part 27: Bond strength test for glass frit bonded
structures using micro-chevron-tests (MCT)
1 Scope

This part of IEC 62047 specifies a method for assessing the bond strength of glass frit bonded

structures using micro-chevron-tests (MCT). It describes suitable sample geometry and

provides guidance for the design of deviating sample geometries.

The micro-chevron-test is an experimental method to determine the fracture toughness K of

brittle materials or bond interfaces using specifically designed test chips (micro-chevron-

samples) under defined load conditions (crack opening mode I). Owing to its high precision

and low variance, it is suitable for analysing the influence of different process parameters on

bond strength as well as for quality assurance.
The exemplary setup of the micro-chevron-test is given in Figure 1.
IEC
Key
1 upper glued stud for application of tensile force
2 micro-chevron-test sample with patterned glass-frit-interface
3 lower glued stud for application of tensile force
F applied force
Figure 1 – Test setup of the micro-chevron-test
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IEC 62047-27:2017 © IEC 2017 – 7 –

These operational instructions are applicable for symmetrically glass frit bonded silicon-

silicon-stacks, i.e. the joint upper and lower chip of the chevron sample exhibit identical

thickness and mechanical properties.

The method is suitable for test samples, which are either produced directly from individual

chips in corresponding dimensions, or for integrated samples, which have been singled out

from processed wafers using suitable methods.

This document determines preferential dimensions for samples as well as parameters for the

test conditions. Deviating geometries can potentially influence the viability of the tests as well

as the comparability of the results. On that score, all parameters are determined and

documented accurately.
2 Normative references
There are no normative references in this document.
3 Terms, definitions, symbols and abbreviated terms
3.1 Terms and definitions
No terms and definitions are listed in this document.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
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• ISO Online browsing platf
...

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