IEC 60749-13:2018

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

IEC 60749-13:2018 describes a salt atmosphere test that determines the resistance of semiconductor devices to corrosion. It is an accelerated test that simulates the effects of severe sea-coast atmosphere on all exposed surfaces. It is only applicable to those devices specified for a marine environment. The salt atmosphere test is considered destructive.
This edition includes the following significant technical changes with respect to the previous edition:
a) alignment with MIL-STD-883J Method 1009.8, Salt Atmosphere (Corrosion), including information on conditioning and maintenance of the test chamber and mounting of test specimens (including explanatory figures).

Dispositifs à seminconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 13: Atmosphère saline

L’IEC 60749-13:2018 décrit un essai d’atmosphère saline réalisé pour déterminer la résistance à la corrosion des dispositifs à semiconducteurs. Il s’agit d’un essai accéléré qui simule les effets d’une atmosphère côtière corrosive sur toutes les surfaces exposées. Il n’est applicable qu’aux dispositifs spécifiés pour un environnement maritime. L’essai d’atmosphère saline est considéré comme destructif.
Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) alignement avec la norme MIL-STD-883J, Method 1009.8, Salt Atmosphere (Corrosion), y compris les informations sur le conditionnement et la maintenance de la chambre d’essai et sur le montage des spécimens d’essais (y compris les figures explicatives).

General Information

• Status: Published
• Publication Date: 14-Feb-2018
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: PPUB - Publication issued
• Start Date: 23-Feb-2018
• Completion Date: 15-Feb-2018

Standards Content (Sample)

IEC 60749-13
®

Edition 2.0 2018-02
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE


Semiconductor devices – Mechanical and climatic test methods –
Part 13: Salt atmosphere

Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –
Partie 13: Atmosphère saline
IEC 60749-13:2018-02(en-fr)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2018 IEC, Geneva, Switzerland

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.


Droits de reproduction réservés. Sauf indication contraire, aucune partie de cette publication ne peut être reproduite
ni utilisée sous quelque forme que ce soit et par aucun procédé, électronique ou mécanique, y compris la photocopie
et les microfilms, sans l'accord écrit de l'IEC ou du Comité national de l'IEC du pays du demandeur. Si vous avez des
questions sur le copyright de l'IEC ou si vous désirez obtenir des droits supplémentaires sur cette publication, utilisez
les coordonnées ci-après ou contactez le Comité national de l'IEC de votre pays de résidence.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland

About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigenda or an amendment might have been published.

IEC Catalogue - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
The stand-alone application for consulting the entire The world's leading online dictionary of electronic and
bibliographical information on IEC International Standards, electrical terms containing 21 000 terms and definitions in
Technical Specifications, Technical Reports and other English and French, with equivalent terms in 16 additional
documents. Available for PC, Mac OS, Android Tablets and languages. Also known as the International Electrotechnical
iPad. Vocabulary (IEV) online.

IEC publications search - webstore.iec.ch/advsearchform IEC Glossary - std.iec.ch/glossary
The advanced search enables to find IEC publications by a 67 000 electrotechnical terminology entries in English and
variety of criteria (reference number, text, technical French extracted from the Terms and Definitions clause of
committee,…). It also gives information on projects, replaced IEC publications issued since 2002. Some entries have been
and withdrawn publications. collected from earlier publications of IEC TC 37, 77, 86 and

CISPR.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Customer Service Centre - webstore.iec.ch/csc
details all new publications released. Available online and If you wish to give us your feedback on this publication or
also once a month by email. need further assistance, please contact the Customer Service
Centre: [e-mail].


A propos de l'IEC
La Commission Electrotechnique Internationale (IEC) est la première organisation mondiale qui élabore et publie des
Normes internationales pour tout ce qui a trait à l'électricité, à l'électronique et aux technologies apparentées.

A propos des publications IEC
Le contenu technique des publications IEC est constamment revu. Veuillez vous assurer que vous possédez l’édition la
plus récente, un corrigendum ou amendement peut avoir été publié.

Catalogue IEC - webstore.iec.ch/catalogue Electropedia - www.electropedia.org
Application autonome pour consulter tous les renseignements
Le premier dictionnaire en ligne de termes électroniques et
bibliographiques sur les Normes internationales,
électriques. Il contient 21 000 termes et définitions en anglais
Spécifications techniques, Rapports techniques et autres
et en français, ainsi que les termes équivalents dans 16
documents de l'IEC. Disponible pour PC, Mac OS, tablettes
langues additionnelles. Egalement appelé Vocabulaire
Android et iPad.
Electrotechnique International (IEV) en ligne.


Recherche de publications IEC -
Glossaire IEC - std.iec.ch/glossary
webstore.iec.ch/advsearchform
67 000 entrées terminologiques électrotechniques, en anglais
La recherche avancée permet de trouver des publications IEC et en français, extraites des articles Termes et Définitions des
en utilisant différents critères (numéro de référence, texte, publications IEC parues depuis 2002. Plus certaines entrées
comité d’études,…). Elle donne aussi des informations sur les antérieures extraites des publications des CE 37, 77, 86 et
projets et les publications remplacées ou retirées. CISPR de l'IEC.

IEC Just Published - webstore.iec.ch/justpublished Service Clients - webstore.iec.ch/csc
Restez informé sur les nouvelles publications IEC. Just Si vous désirez nous donner des commentaires sur cette
Published détaille les nouvelles publications parues. publication ou si vous avez des questions contactez-nous:
Disponible en ligne et aussi une fois par mois par email. [e-mail].

---------------------- Page: 2 ----------------------
IEC 60749-13

®


Edition 2.0 2018-02




INTERNATIONAL



STANDARD




NORME



INTERNATIONALE











Semiconductor devices – Mechanical and climatic test methods –

Part 13: Salt atmosphere



Dispositifs à semiconducteurs – Méthodes d’essais mécaniques et climatiques –

Partie 13: Atmosphère saline















INTERNATIONAL

ELECTROTECHNICAL

COMMISSION


COMMISSION

ELECTROTECHNIQUE


INTERNATIONALE




ICS 31.080.01 ISBN 978-2-8322-5369-4



Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale

---------------------- Page: 3 ----------------------
– 2 – IEC 60749-13:2018 © IEC 2018
CONTENTS
FOREWORD . 3
1 Scope . 5
2 Normative references . 5
3 Terms and definitions . 5
4 Test apparatus . 5
5 Procedure . 6
5.1 Conditioning and maintenance of test chamber . 6
5.2 Initial preconditioning of leads . 6
5.3 Mounting of test specimens . 6
5.4 Chamber operation . 10
5.5 Length of test . 10
5.6 Examination . 11
5.7 Failure criteria . 11
5.7.1 Finished product . 11
5.7.2 Package elements . 12
6 Summary . 12
Bibliography . 14

Figure 1 – Dual-in-line packages with leads attached to, or exiting from package sides
(such as side-brazed packages and ceramic dual-in-line packages) . 7
Figure 2 – Packages with leads attached to, or exiting from the opposite side of the lid . 9
Figure 3 – Packages with leads attached to, or exiting from package sides, parallel to
lids (such as flatpacks) . 9
Figure 4 – Leadless and leaded chip carriers . 10
Figure 5 – Corrosion area charts . 13

Table 1 – Minimum duration of exposure . 11

---------------------- Page: 4 ----------------------
IEC 60749-13:2018 © IEC 2018 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________

SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 13: Salt atmosphere

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and
non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates
closely with the International Organization for Standardization (ISO) in accordance with conditions determined
by agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60749-13 has been prepared by IEC technical committee 47:
Semiconductor devices.
This second edition cancels and replaces the first edition published in 2002. This edition
constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) alignment with MIL-STD-883J Method 1009.8, Salt Atmosphere (Corrosion), including
information on conditioning and maintenance of the test chamber and mounting of test
specimens (including explanatory figures).

---------------------- Page: 5 ----------------------
– 4 – IEC 60749-13:2018 © IEC 2018
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2446/FDIS 47/2455/RVD

Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60749 series, published under the general title Semiconductor
devices – Mechanical and climatic test methods, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

---------------------- Page: 6 ----------------------
IEC 60749-13:2018 © IEC 2018 – 5 –
SEMICONDUCTOR DEVICES –
MECHANICAL AND CLIMATIC TEST METHODS –

Part 13: Salt atmosphere



1 Scope
This part of IEC 60749 describes a salt atmosphere test that determines the resistance of
semiconductor devices to corrosion. It is an accelerated test that simulates the effects of
severe sea-coast atmosphere on all exposed surfaces. It is only applicable to those devices
specified for a marine environment.
The salt atmosphere test is considered destructive.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60749-14, Semiconductor devices – Mechanical and climatic test methods – Part 14:
Robustness of terminations (lead integrity)
3 Terms and definitions
No terms and definitions are listed in this document.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Test apparatus
The following items are required for performing the salt atmosphere test.
a) Temperature-controlled chamber with suitable non-corrodible rack for supporting devices.
All parts within the test chamber which come in contact with test specimens shall be of
materials that will not cause electrolytic corrosion. The chamber shall be properly vented
to prevent pressure build-up and allow uniform distribution of salt fog.
b) Salt solution reservoir adequately protected from the surrounding ambient.
The salt concentration shall be 0,5 % to 3,0 % by weight in deionized or distilled water as
required to achieve the deposition rates required by 5.4. The salt used shall be sodium
chloride containing on the dry basis not more than 0,1 % by weight of sodium iodide and
not more than 0,3 % by weight total impurities. The pH of the salt solution shall be
maintained between 6,5 and 7,2 when measured at 35 °C ± 3 °C. Only CP grade (dilute
solution) hydrochloric acid or sodium hydroxide shall be used to adjust the pH.

---------------------- Page: 7 ----------------------
– 6 – IEC 60749-13:2018 © IEC 2018
c) Means for atomizing the salt solution, including suitable nozzles and compressed air
supply or a 20 % oxygen, 80 % nitrogen mixture (the gas entering the atomizers shall be
free from all impurities such as oil and dirt).
d) Means for humidifying the air at a temperature above the chamber temperature.
e) Air or inert gas dryer.
f) Magnifier(s), 1× to 3×, 10× to 20× and 30× to 60×.
5 Procedure
5.1 Conditioning and maintenance of test chamber
The purpose of the cleaning cycle is to assure that all materials which could adversely affect
the results of the subsequent tests are removed from the chamber. The chamber shall be
cleaned by operating it at 35 °C ± 3 °C with deionized or distilled water as long as necessary.
The chamber shall be cleaned each time the salt solution in the reservoir has been used up.
Several test runs therefore could be run before cleaning, depending on the size of the
reservoir and the specified test condition (see 5.5). When long duration conditions (test
conditions C and D, see 5.5) are required, the reservoir may be refilled via auxiliary reservoirs
so that the test cycle does not need to be interrupted. After the cleaning cycle, on restarting
the chamber, the reservoir shall be filled with salt solution and the chamber shall be stabilized
by operating it until the temperature comes to equilibrium, see 5.4. If operation of the
chamber is discontinued for more than one week, the remaining salt solution, if any, shall be
discarded. Cleaning shall then be performed prior to restarting the test chamber. Intermittent
operation of the chamber is acceptable provided the pH and concentration of the salt solution
are kept within the limits defined in item b) of Clause 4.
5.2 Initial preconditioning of leads
Unless otherwise specified, the test specimens shall not be preconditioned. When initial
conditioning is specified, the device terminals shall be subjected to a stress in accordance
with test condition B of the method specified in IEC 60749-14 before the specimens are
mounted for the salt atmosphere test. When the sample devices being subjected to the salt
atmosphere have already received the required initial conditioning, as part of another test
employing the same sample devices, the terminal bend need not be repeated.
5.3 Mounting of test specimens
Test specimens shall be positioned so that they do not contact each other, so that they do not
shield each other from the freely settling fog, and so that corrosion products and condensate
from one specimen does not fall on another.
In cases where two orientations are required for testing, the specified sample size shall be
divided in half (or as close to one-half as possible). In all cases, inspections following the test
in accordance with 5.7 shall be performed on all package surfaces.
Precautions shall be used to prevent light induced photovoltaic electrolytic effects when
testing windowed UV erasable devices.
The test specimens shall be mounted on the holding fixtures (plexiglass rods, nylon or
fiberglass screens, nylon cords, etc.) in accordance with the applicable orientation(s) below.
a) Dual-in-line packages with leads attached to, or exiting from, package sides (such as
side-brazed packages and ceramic dual-in-line packages): lid upwards 15° to 45° from
vertical. One of the package sides on which the leads are located shall be oriented
upwards at an angle greater than or equal to 15° from vertical (see Figure 1).
b) Packages with leads attached to, or exiting from the opposite side of the lid (such as TO
cans, solid sidewall packages, and metal platform packages): lid 15° to 45° from vertical.
One-half of the samples shall be tested with the lid upwards; the remaining samples shall

---------------------- Page: 8 ----------------------
IEC 60749-13:2018 © IEC 2018 – 7 –
be tested with the leads upwards (see Figure 2). For packages with leads attached to, or
exiting from the same side as the lid, only one orientation (lid and leads upwards) is
required.
c) Packages with leads attached to, or exiting from package sides, parallel to the lid (such as
flatpacks): Lid 15° to 45° from vertical. One of the package sides on which the leads are
located shall be oriented upwards at an angle greater than or equal to 15° from vertical.
For packages with a metal case, one-half of the samples shall be tested with the lid
upwards; the remaining samples shall be tested with the case upwards. All other
packages shall be tested with the lid upwards (Figure 3).
d) Leadless and leaded chip carriers: lid 15° to 45° from vertical. One-half of the samples
shall be tested with the lid upwards; the remaining samples shall be tested with the lid
downwards (see Figure 4).
e) Flat specimens (e.g., lids only and lead frames only): 15° to 45° from vertical.

45°
45° ≥15°
15°
15°
IEC
IEC IEC IEC


a) End view b) Front view c) End View d) Front view

Figure 1 – Dual-in-line packages with leads attached to, or exiting from package sides
(such as side-brazed packages and ceramic dual-in-line packages)

---------------------- Page: 9 ----------------------
– 8 – IEC 60749-13:2018 © IEC 2018
45°
15°
IEC IEC

End view Front view
a) TO can exposed with cap upwards
45°
15°
IEC IEC

End view Front view
b) TO can exposed with leads upwards
45°
15°
IEC IEC

End view Front view
c) Solid sidewall package, metal platform package, pin grid array,
exposed with lid upwards

---------------------- Page: 10 ----------------------
IEC 60749-13:2018 © IEC 2018 – 9 –
45°
15°
IEC
IEC


End view Front view
d) Solid sidewall package, metal platform package, pin grid array,
exposed with leads upwards
Figure 2 – Packages with leads attached to, or exiting from the opposite side of the lid
45° 45°
15° 15° ≥15°
IEC
IEC IEC IEC


a) End view b) Front view c) End view d) Front view
NOTE If the case is metal, one-half of the samples is tested with the lids exposed upward, the other one-half
with the cases exposed upward.
Figure 3 – Packages with leads attached to, or exiting from package sides,
parallel to lids (such as flatpacks)

---------------------- Page: 11 ----------------------
– 10 – IEC 60749-13:2018 © IEC 2018
45°
15°
IEC IEC


End view Front view
a) Leadless or leaded chip carrier with lid upwards
45°
15°
IEC
IEC


End view Front view
b) Leadless or leaded chip carrier with lid downwards
Figure 4 – Leadless and leaded chip carriers
5.4 Chamber operation
After chamber conditioning in accordance with 5.1, the devices shall be placed in the test
chamber in such a way that they do not contact each other or shield each other from the
freely settling fog and that corrosion product and condensate from one specimen does not fall
on another. A salt atmosphere fog shall be maintained in the test chamber for the time
specified by the required test condition listed in 5.5. During the test, the chamber shall be
held at a temperature of 35 °C ± 3 °C. The fog concentration and velocity shall be such that
2 2
the rate of salt deposit in the test area is between 20 g/m and 50 g/m per 24 h.
5.5 Length of test
The minimum duration of exposure of the salt atmosphere test shall be chosen from Table 1.
Unless otherwise specified, test condition A shall apply.

---------------------- Page: 12 ----------------------
IEC 60749-13:2018 © IEC 2018 – 11 –
Table 1 – Minimum duration of exposure
Test condition Length of test
h
A
24 ± 2
B
48 ± 4
C
96 ± 4
D 240 ± 8

5.6 Examination
Upon completion of the salt exposure test, the test specimens shall be immediately washed
with free flowing deionized water (not warmer than 38 °C) for at least 5 min to remove salt
deposits from their surface after which they shall be dried with air or inert gas, and subjected
to the inspections below.
All inspections shall be performed at a magnification of 10× to 20×, unless otherwise specified
in this procedure (see items b) and c) of 5.7.1), in accordance with the following criteria.
a) Corrosion stains shall not be considered as part of the defective area of item a) of 5.7.1.
b) Corrosion products resulting from lead corrosion that deposit onto areas other than the
lead shall not be considered as part of the defective area of item a) of 5.7.1.
c) Corrosion at the tips of the leads and corrosion products resulting from such corrosion
shall be disregarded.
d) Portions of leads which cannot be further tested in accordance with item b) of 5.7.1, due
to geometry or design (such as standoffs on pin grid arrays or the brazed portion of leads
on side-brazed packages), shall be subject to the failure criteria of item a) of 5.7.1.
5.7 Failure criteria
5.7.1 Finished product
No device is acceptable that exhibits:
a) corrosion defects over more than 5 % of the area of the finish or base metal of any
package element other than leads such as lid, cap, or case. Corrosion defects to be
included in this measurement are: pitting, blistering, flaking, and corrosion products. The
defective area may be determined by comparison with charts or photographs of known
defective areas (see Figure 5), direct measurement using a grid or similar measuring
device, or image analysis;
b) leads missing, broken, or partially separated. In addition, any lead which exhibits
pinholes, pitting, blistering, flaking, corrosion product that completely crosses the lead, or
any evidence of pinholes, pitting, blistering, flaking, corrosion product, or corrosion stain
at the glass seal shall be further tested as follows:
Bend the lead through 90° at the point of degradation in such a manner that tensile stress
is applied to the defect region. Any lead which breaks or shows fracture of the base metal
through greater than 50 % of the cross-sectional area of the lead shall be considered a
reject. In the case of multiple defects, the bend shall be made at the site exhibiting the
worst case corrosion. On packages exhibiting defects on more than ten leads, bends shall
be made on a maximum of ten leads exhibiting the worst case corrosion. The examination
of the fracture shall be performed with a magnification of 30× to 60×;
c) specified markings, which are missing in whole or in part, faded, smeared, blurred,
shifted, or dislodged to the extent that they are not legible. This examination shall be
conducted with normal room lighting and with a magnification of 1× to 3×.

---------------------- Page: 13 ----------------------
– 12 – IEC 60749-13:2018 © IEC 2018
5.7.2 Package elements
When this test is performed on package elements or partially assembled packages during
incoming inspection or any time prior to completion of package assembly as an optional
quality control gate or as a required test, no part is acceptable that exhibits:
a) corrosion defects over more than 1,0 % of the area of the finish or base metal of lids or
over more than 2,5 % of the area of the finish or base metal of any other package element
other than leads (such as case). Corrosion on areas of the finish or base metal that will
not be exposed to surrounding ambient after device fabrication shall be disregarded. This
inspection shall be performed according to the procedure set out in item a) of 5.7.1;
b) leads with final lead finishes that are rejectable in accordance with item b) of 5.7.1.
6 Summary
The following details shall be specified in the applicable procurement document:
a) initial conditioning, if required (see 5.2);
b) test condition, if other than test condition A (see 5.5);
c) cleaning procedure, if different from 5.6;
d) measurements and examinations after test, when applicable for other than visual (see
5.6);
e) failure criteria, if different from 5.7;
f) sample size and accept number.

---------------------- Page: 14 ----------------------
IEC 60749-13:2018 © IEC 2018 – 13 –
0,1 %

0,5 %

1 %

2,5 %

5 %

10 %

Random Slightly grouped Grouped Concentrated
IEC
Figure 5 – Corrosion area charts

---------------------- Page: 15 ----------------------
– 14 – IEC 60749-13:2018 © IEC 2018
Bibliography
MIL-STD-883J, Department Of Defense, Test Method Standard Microcircuits Method 1009.8,
Salt Atmosphere (Corrosion)

___________

---------------------- Page: 16 ----------------------
– 16 – IEC 60749-13:2018 © IEC 2018
SOMMAIRE
AVANT-PROPOS . 17
1 Domaine d’application .
...