High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

IEC 62025-2:2019 is available as IEC 62025-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62025-2:2019 specifies a test method for the non-electrical characteristics of the surface mounted device (SMD) inductors to be used for electronic and telecommunication equipment. The object of this part of this document is to define methods for measuring mechanical performance only. As the reliability performances and specifications relative to non-electrical performances are defined in IEC 62211, detailed measuring methods for mechanical performance of reliability testing are defined in this document. This edition includes the following significant technical changes with respect to the previous edition:
- revision of Table 5;
- revision of normative references.

Composants inductifs à haute fréquence - Caractéristiques non électriques et méthodes de mesure - Partie 2: Méthodes d'essai pour caractéristiques non électriques

IEC 62025-2:2019 est disponible sous forme de IEC 62025-2:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 62025-2:2019 spécifie une méthode d’essai pour les caractéristiques non électriques pour inductances à montage en surface (CMS) utilisées pour les équipements électroniques et de télécommunications. L’objet du présent document concerne uniquement les méthodes de mesure de la performance mécanique. Comme les performances de fiabilité ainsi que les spécifications relatives aux performances non électriques sont spécifiées dans l’IEC 62211, les méthodes de mesures détaillées pour les performances mécaniques des essais de fiabilité sont définies dans le présent document. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- révision du Tableau 5;
- révision des références normatives.

General Information

Status
Published
Publication Date
19-Sep-2019
Current Stage
PPUB - Publication issued
Completion Date
20-Sep-2019
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IEC 62025-2
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics
Composants inductifs à haute fréquence – Caractéristiques non électriques et
méthodes de mesure –
Partie 2: Méthodes d’essai pour caractéristiques non électriques
IEC 62025-2:2019-09(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62025-2
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics
Composants inductifs à haute fréquence – Caractéristiques non électriques et
méthodes de mesure –
Partie 2: Méthodes d’essai pour caractéristiques non électriques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.100.10 ISBN 978-2-8322-7375-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62025-2:2019  IEC 2019
CONTENTS

FOREWORD ........................................................................................................................... 4

1 Scope .............................................................................................................................. 6

2 Normative references ...................................................................................................... 6

3 Terms and definitions ...................................................................................................... 7

4 Test conditions ................................................................................................................ 7

4.1 Standard atmospheric conditions for test ................................................................ 7

4.2 Referee conditions .................................................................................................. 7

5 Mechanical characteristics test ........................................................................................ 7

5.1 Body strength test ................................................................................................... 7

5.1.1 Body strength test procedures ......................................................................... 7

5.1.2 Information to be given in the detail specification ............................................. 9

5.2 Robustness of terminations (electrodes) ................................................................. 9

5.2.1 Resistance to bending of printed-circuit board ................................................. 9

5.2.2 Adherence test (see test of Ue of IEC 60068-2-21) ...................................... 13

5.3 Solderability .......................................................................................................... 15

5.3.1 General ......................................................................................................... 15

5.3.2 Preconditioning .............................................................................................. 15

5.3.3 Initial measurement ....................................................................................... 15

5.3.4 Test method .................................................................................................. 15

5.3.5 Recovery ....................................................................................................... 17

5.3.6 Final measurement ........................................................................................ 17

5.3.7 Items to be specified in detail specification .................................................... 17

5.4 Resistance to soldering heat ................................................................................. 18

5.4.1 General ......................................................................................................... 18

5.4.2 Preconditioning .............................................................................................. 18

5.4.3 Initial measurement ....................................................................................... 18

5.4.4 Test method .................................................................................................. 18

5.4.5 Recovery ....................................................................................................... 19

5.4.6 Final measurement ........................................................................................ 19

5.4.7 Items to be specified in detail specification .................................................... 19

5.5 Resistance to dissolution of metallization .............................................................. 20

5.5.1 General ......................................................................................................... 20

5.5.2 Preconditioning .............................................................................................. 20

5.5.3 Initial measurement ....................................................................................... 20

5.5.4 Test methods ................................................................................................. 20

5.5.5 Final measurements ...................................................................................... 20

5.5.6 Items to be specified in detail specification .................................................... 21

5.6 Vibration ............................................................................................................... 21

5.6.1 Test equipment .............................................................................................. 21

5.6.2 Preparation .................................................................................................... 21

5.6.3 Test method .................................................................................................. 21

5.6.4 Items to be specified in detail specification .................................................... 21

5.7 Resistance to shock .............................................................................................. 22

5.7.1 Mechanical shock method .............................................................................. 22

5.7.2 Items to be specified in detail specification .................................................... 22

---------------------- Page: 4 ----------------------
IEC 62025-2:2019  IEC 2019 – 3 –

Annex A (normative) Mounting of surface mounting inductor on test printed-circuit

board .................................................................................................................................... 23

A.1 General ................................................................................................................. 23

A.2 Mounting printed-circuit board and mounting land ................................................. 23

A.3 Solder ................................................................................................................... 23

A.4 Preparation ........................................................................................................... 24

A.5 Preheating ............................................................................................................ 24

A.6 Soldering .............................................................................................................. 24

A.7 Cleaning ............................................................................................................... 24

Figure 1 – Method for pressurizing the body ........................................................................... 8

Figure 2 – Pressurizing jig ...................................................................................................... 9

Figure 3 – Example of printed-circuit board ........................................................................... 10

Figure 4 – Layout .................................................................................................................. 12

Figure 5 – Pressurizing jig .................................................................................................... 12

Figure 6 – Pressurizing ......................................................................................................... 12

Figure 7 – Pressurizing and shape of jig ............................................................................... 14

Figure 8 – Reflow temperature profile ................................................................................... 17

Table 1 – Size of soldering lands according to the code of multi-layer chip inductors ........... 10

Table 2 – Thickness of solder paste by the size code of inductors ........................................ 11

Table 3 – Conditions of immersion into solder ....................................................................... 16

Table 4 – Reflow temperature ............................................................................................... 16

Table 5 – Severity ................................................................................................................. 18

Table 6 – Reflow temperature ............................................................................................... 19

Table 7 – Conditions of vibration ........................................................................................... 21

---------------------- Page: 5 ----------------------
– 4 – IEC 62025-2:2019  IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
Part 2: Test methods for non-electrical characteristics
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

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with the International Organization for Standardization (ISO) in accordance with conditions determined by

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2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62025-2 has been prepared by IEC technical committee 51:

Magnetic components, ferrite and magnetic powder materials.

This second edition cancels and replaces the first edition published in 2005. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) revision of Table 5;
b) revision of normative references.
---------------------- Page: 6 ----------------------
IEC 62025-2:2019  IEC 2019 – 5 –
The text of this standard is based on the following documents:
CDV Report on voting
51/1273/CDV 51/1301/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62025 series, published under the general title High frequency

inductive components – Non-electrical characteristics and measuring methods, can be found

on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
---------------------- Page: 7 ----------------------
– 6 – IEC 62025-2:2019  IEC 2019
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –
Part 2: Test methods for non-electrical characteristics
1 Scope

This part of IEC 62025 specifies a test method for the non-electrical characteristics of the

surface mounted device (SMD) inductors to be used for electronic and telecommunication

equipment. The object of this part of this document is to define methods for measuring

mechanical performance only. As the reliability performances and specifications relative to

non-electrical performances are defined in IEC 62211, detailed measuring methods for

mechanical performance of reliability testing are defined in this document.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance

IEC 60068-2-6:2007, Environmental testing – Part 2: Tests – Test Fc: Vibration (sinusoidal)

IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for

solderability and resistance to soldering heat of devices with leads

IEC 60068-2-21:2006, Environmental testing – Part 2-21: Tests – Test U: Robustness of

terminations and integral mounting devices

IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock

IEC 60068-2-45:1980, Basic environmental testing procedures – Part 2-45: Tests – Test XA

and guidance: Immersion in cleaning solvents
IEC 60068-2-45:1980/AMD1:1993

IEC 60068-2-58:2015, Environmental testing – Part 2-58: Tests – Test Td: Test methods for

solderability, resistance to dissolution of metallization and to soldering heat of surface

mounting devices (SMD)
IEC 60068-2-58:2015/AMD1:2017

IEC 60068-2-69, Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing

of electronic components and printed boards by the wetting balance (force measurement)

method

IEC 60068-2-77, Environmental testing – Part 2-77: Tests – Test 77: Body strength and

impact shock

IEC 61188-5-2, Printed boards and printed board assemblies – Design and use – Part 5-2:

Attachment (land/joint) considerations – Discrete components
---------------------- Page: 8 ----------------------
IEC 62025-2:2019  IEC 2019 – 7 –

IEC 61190-1-2:2014, Attachment materials for electronic assembly – Part 1-2: Requirements

for soldering pastes for high-quality interconnections in electronics assembly

IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for

electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering

applications
IEC 62211:2017, Inductive components – Reliability management
3 Terms and definitions
No terms and definitions are listed in this document.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
4 Test conditions
4.1 Standard atmospheric conditions for test

Unless otherwise specified in the detail specification, the tests and measurements shall be

carried out under the standard atmospheric conditions for test as given in the requirements for

standard reference atmosphere of IEC 60068-1:
– temperature: 15 °C to 35 °C;
– relative humidity: 25 % to 75 %;
– air pressure: 86 kPa to 106 kPa.

In the event of dispute or where required, the measurements shall be repeated using the

referee temperatures (as given in 4.2) and such other conditions as are specified in this

document.

In addition, when it is difficult to make measurements in standard atmospheric conditions,

unless a doubt arises about the validity of the result, the tests and measurements may be

performed in non-standard atmospheric conditions.
4.2 Referee conditions

For referee purposes, one of the standard atmospheric conditions for referee tests taken from

the requirements for standard atmospheres for referee measurements and tests of
IEC 60068-1, shall be selected and shall be as follows:
– temperature: 20 °C ± 2 °C;
– relative humidity: 60 % to 70 %;
– air pressure: 86 kPa to 106 kPa.
5 Mechanical characteristics test
5.1 Body strength test
5.1.1 Body strength test procedures

The body strength test procedure, as specified in IEC 60068-2-77, shall be as follows:

---------------------- Page: 9 ----------------------
– 8 – IEC 62025-2:2019  IEC 2019
a) Preconditioning

If required, preconditioning shall be performed on the specimens in accordance with the

detail specification.
b) Initial measurement

The appearance of the specimen shall be checked with a magnification of at least 10×

under adequate light.

If specified in the detail specification, the electrical performances shall be measured.

c) Layout

Unless otherwise specified in the detail specification, the specimen shall be placed on

the supporting base, as shown in Figure 1, so that both ends of the specimen are

symmetrically positioned on the supporting base. The test table shall be placed on a plane,

robust platform so that the test result is not affected when a force is applied.
Dimensions en millimètres
NOTE The angle of the taper in part A shall be between 70° and 90°.
Figure 1 – Method for pressurizing the body
d) Applied force

The force shall be applied to the centre of the specimen by the pressurizing jig as shown

in Figure 2, for a duration of (10 ± 1) s. Unless otherwise specified in the detail

specification, the force shall be selected from either (one of) 10 N, 20 N or 30 N.

If specified in the detail specification, the electrical performances shall be measured

during the application of the force.
---------------------- Page: 10 ----------------------
IEC 62025-2:2019  IEC 2019 – 9 –
Dimensions in millimetres

NOTE 1 Dimension W of the pressurizing jig is wider than the width of the specimen.

NOTE 2 Hardness: HV 500 and more.

When the length of the specimen is 2 mm or less, the radius of the pressurizing jig should be 0,2 mm.

Figure 2 – Pressurizing jig
e) Recovery

If required, recovery conditioning shall be performed for the specimens in accordance with

the detail specification.
f) Final measurement

After the test, the appearance of the specimen shall be checked with a magnification of at

least 10× under adequate light. There shall be no signs of damage such as cracks or flaws.

If specified in the detail specification, the electrical performances shall be measured.

5.1.2 Information to be given in the detail specification
The following information shall be given in the detail specification:
a) preconditioning (if required) – see 5.1.1.a);

b) initial measurement items, final measurement items (if required) – see 5.1.1.b) and f);

c) measurement during applied force (if required) – see 5.1.1.d);
d) recovery (if required) – see 5.1.1.e).
5.2 Robustness of terminations (electrodes)
5.2.1 Resistance to bending of printed-circuit board
5.2.1.1 General

The test for the resistance of terminations and electrodes mounted on a printed-circuit board

shall be as follows.
5.2.1.2 Specification of soldering lands

The soldering lands of multi-layer chip inductors shall be designed according to Table 1, as

specified in IEC 61188-5-2. With regard to inductors, except for those specified in

IEC 61188-5-2, the size of the solder lands shall be specified in the detail specification.

---------------------- Page: 11 ----------------------
– 10 – IEC 62025-2:2019  IEC 2019
Table 1 – Size of soldering lands according to the code
of multi-layer chip inductors
Dimensions in millimetres
Size code a b c
1005 0,65 0,55 0,50
1608 0,95 0,85 0,50
2012 1,45 1,10 0,50
3216 1,80 1,30 1,20
3225 2,70 1,05 1,80
4532 3,40 1,10 3,00
5650 5,30 1,30 3,70
NOTE Tolerance: 0,05 mm; see Figure 3.
5.2.1.3 Specification of printed-circuit board

The printed-circuit board shall be made of epoxide woven glass (FR4) as specified in

IEC 60068-2-21, and, unless specified in the detail specification, the printed-circuit board

shall be as shown in Figure 3. The dimension of W shall be specified in the detail specification.

Dimensions in millimetres
Key
solderable areas
non-solderable areas (covered with non-solderable lacquer)
Materials of substrate: epoxide woven glass (FR4)
Thickness: 1,6 mm ± 0,2 mm (for size code from 1608)
Thickness: 0,8 mm ± 0,1 mm (for size code up to 1005)
Conductors: copper
Thickness: 0,035 mm ± 0,010 mm

When the board is designed to mount more than two specimens, allow sufficient space between specimens so as

not to influence the test result. Dimensions not given shall be chosen according to the design and size of the

specimen to be tested.
Figure 3 – Example of printed-circuit board
---------------------- Page: 12 ----------------------
IEC 62025-2:2019  IEC 2019 – 11 –
5.2.1.4 Mounting of specimen

The specimen shall be mounted on the printed-circuit board in accordance with Annex A and

other specifications as mentioned below.

a) The solder paste shall be placed on the soldering lands. The applied solder paste shall

cover the soldering lands completely. The thickness of the solder paste according to the

size code of inductors is recommended in Table 2. The appropriate height of the filet

should be the smaller value of either 50 % of the thickness of the specimen or 0,5 mm.

Table 2 – Thickness of solder paste by the size code of inductors
Thickness of solder paste
Size code
Up to 1608 100 to 150
From 2012 150 to 200

b) The specimen shall then be placed on the printed-circuit board. The terminations of the

specimen shall be placed on the soldering lands symmetrically in both horizon
...

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