IEC 62025-2:2019

High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics

IEC 62025-2:2019 is available as IEC 62025-2:2019 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 62025-2:2019 specifies a test method for the non-electrical characteristics of the surface mounted device (SMD) inductors to be used for electronic and telecommunication equipment. The object of this part of this document is to define methods for measuring mechanical performance only. As the reliability performances and specifications relative to non-electrical performances are defined in IEC 62211, detailed measuring methods for mechanical performance of reliability testing are defined in this document. This edition includes the following significant technical changes with respect to the previous edition:
- revision of Table 5;
- revision of normative references.

Composants inductifs à haute fréquence - Caractéristiques non électriques et méthodes de mesure - Partie 2: Méthodes d'essai pour caractéristiques non électriques

IEC 62025-2:2019 est disponible sous forme de IEC 62025-2:2019 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 62025-2:2019 spécifie une méthode d’essai pour les caractéristiques non électriques pour inductances à montage en surface (CMS) utilisées pour les équipements électroniques et de télécommunications. L’objet du présent document concerne uniquement les méthodes de mesure de la performance mécanique. Comme les performances de fiabilité ainsi que les spécifications relatives aux performances non électriques sont spécifiées dans l’IEC 62211, les méthodes de mesures détaillées pour les performances mécaniques des essais de fiabilité sont définies dans le présent document. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- révision du Tableau 5;
- révision des références normatives.

General Information

• Status: Published
• Publication Date: 19-Sep-2019
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 29.100.10 - Magnetic components
• Technical Committee: TC 51 - Magnetic components, ferrite and magnetic powder materials
• Drafting Committee: WG 9 - TC 51/WG 9
• Current Stage: PPUB - Publication issued
• Start Date: 07-Oct-2019
• Completion Date: 20-Sep-2019

Relations

• Revises: IEC 62025-2:2005 - High frequency inductive components - Non-electrical characteristics and measuring methods - Part 2: Test methods for non-electrical characteristics
• Effective Date: 05-Sep-2023

Standards Content (Sample)

IEC 62025-2 ®
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

IEC Central Office Tel.: [phone]
3, rue de Varembé [e-mail]
CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

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and withdrawn publications. Also known as the International Electrotechnical Vocabulary

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need further assistance, please contact the Customer Service

Centre: [e-mail].
IEC 62025-2 ®
Edition 2.0 2019-09
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
High frequency inductive components – Non-electrical characteristics and

measuring methods –
Part 2: Test methods for non-electrical characteristics

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.100.10 ISBN 978-2-8322-7432-3

– 2 – IEC 62025-2:2019 RLV  IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Test conditions . 7
4.1 Standard atmospheric conditions for test . 7
4.2 Referee conditions . 7
5 Mechanical characteristics test . 8
5.1 Body strength test . 8
5.1.1 Body strength test procedures . 8
5.1.2 Information to be given in the detail specification . 9
5.2 Robustness of terminations (electrodes) . 9
5.2.1 Resistance to bending of printed-circuit board . 9
5.2.2 Adherence test (see test of Ue of IEC 60068-2-21) . 13
5.3 Solderability . 15
5.3.1 General . 15
5.3.2 Preconditioning . 15
5.3.3 Initial measurement . 15
5.3.4 Test method . 15
5.3.5 Recovery . 17
5.3.6 Final measurement . 17
5.3.7 Items to be specified in detail specification . 17
5.4 Resistance to soldering heat . 18
5.4.1 General . 18
5.4.2 Preconditioning . 18
5.4.3 Initial measurement . 18
5.4.4 Test method . 18
5.4.5 Recovery . 19
5.4.6 Final measurement . 19
5.4.7 Items to be specified in detail specification . 19
5.5 Resistance to dissolution of metallization . 20
5.5.1 General . 20
5.5.2 Preconditioning . 20
5.5.3 Initial measurement . 20
5.5.4 Test methods . 20
5.5.5 Final measurements . 20
5.5.6 Items to be specified in detail specification . 21
5.6 Vibration . 21
5.6.1 Test equipment . 21
5.6.2 Preparation . 21
5.6.3 Test method . 21
5.6.4 Items to be specified in detail specification . 21
5.7 Resistance to shock . 22
5.7.1 Mechanical shock method . 22
5.7.2 Items to be specified in detail specification . 22

Annex A (normative) Mounting of surface mounting inductor on test printed-circuit
board . 23
A.1 General . 23
A.2 Mounting printed-circuit board and mounting land . 23
A.3 Solder . 23
A.4 Preparation . 24
A.5 Preheating . 24
A.6 Soldering . 24
A.7 Cleaning . 24

Figure 1 – Method for pressurizing the body . 8
Figure 2 – Pressurizing jig . 9
Figure 3 – Example of printed-circuit board . 10
Figure 4 – Layout . 12
Figure 5 – Pressurizing jig . 12
Figure 6 – Pressurizing . 12
Figure 7 – Pressurizing and shape of jig . 14
Figure 8 – Reflow temperature profile . 17

Table 1 – Size of soldering lands according to the code of multi-layer chip inductors . 10
Table 2 – Thickness of solder paste by the size code of inductors . 11
Table 3 – Conditions of immersion into solder . 16
Table 4 – Reflow temperature . 16
Table 5 – Severity . 18
Table 6 – Reflow temperature . 19
Table 7 – Conditions of vibration . 21

– 4 – IEC 62025-2:2019 RLV  IEC 2019
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
HIGH FREQUENCY INDUCTIVE COMPONENTS –
NON-ELECTRICAL CHARACTERISTICS AND MEASURING METHODS –

Part 2: Test methods for non-electrical characteristics

FOREWORD
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...

IEC 62025-2 ®
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Non-electrical characteristics and
measuring methods –
Part 2: Test methods for non-electrical characteristics

Composants inductifs à haute fréquence – Caractéristiques non électriques et
méthodes de mesure –
Partie 2: Méthodes d’essai pour caractéristiques non électriques

All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or
your local IEC member National Committee for further information.

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About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.

About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.

IEC publications search - webstore.iec.ch/advsearchform Electropedia - www.electropedia.org
The advanced search enables to find IEC publications by a The world's leading online dictionary on electrotechnology,
variety of criteria (reference number, text, technical containing more than 22 000 terminological entries in English
committee,…). It also gives information on projects, replaced and French, with equivalent terms in 16 additional languages.
and withdrawn publications. Also known as the International Electrotechnical Vocabulary

(IEV) online.
IEC Just Published - webstore.iec.ch/justpublished
Stay up to date on all new IEC publications. Just Published IEC Glossary - std.iec.ch/glossary
details all new publications released. Available online and 67 000 electrotechnical terminology entries in English and
once a month by email. French extracted from the Terms and Definitions clause of
IEC publications issued since 2002. Some entries have been
IEC Customer Service Centre - webstore.iec.ch/csc collected from earlier publications of IEC TC 37, 77, 86 and
If you wish to give us your feedback on this publication or CISPR.

need further assistance, please contact the Customer Service

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IEC 62025-2 ®
Edition 2.0 2019-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
High frequency inductive components – Non-electrical characteristics and

measuring methods –
Part 2: Test methods for non-electrical characteristics

Composants inductifs à haute fréquence – Caractéristiques non électriques et

méthodes de mesure –
Partie 2: Méthodes d’essai pour caractéristiques non électriques

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.100.10 ISBN 978-2-8322-7375-3

– 2 – IEC 62025-2:2019  IEC 2019
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 7
4 Test conditions . 7
4.1 Standard atmospheric conditions for test . 7
4.2 Referee conditions . 7
5 Mechanical characteristics test . 7
5.1 Body strength test . 7
5.1.1 Body strength test procedures . 7
5.1.2 Information to be given in the detail specification . 9
5.2 Robustness of terminations (electrodes) . 9
5.2.1 Resistance to bending of printed-circuit board . 9
5.2.2 Adherence test (see test of Ue of IEC 60068-2-21) . 13
5.3 Solderability . 15
5.3.1 General . 15
5.3.2 Preconditioning . 15
5.3.3 Initial measurement . 15
5.3.4 Test method . 15
5.3.5 Recovery . 17
5.3.6 Final measurement . 17
5.3.7 Items to be specified in detail specification . 17
5.4 Resistance to soldering heat . 18
5.4.1 General . 18
5.4.2 Preconditioning . 18
5.4.3 Initial measurement . 18
5.4.4 Test method . 18
5.4.5 Recovery . 19
5.4.6 Final measurement . 19
5.4.7 Items to be specified in detail specification . 19
5.5 Resistance to dissolution of metallization . 20
5.5.1 General . 20
5.5.2 Preconditioning . 20
5.5.3 Initial measurement . 20
5.5.4 Test methods . 20
5.5.5 Final measurements . 20
5.5.6 Items to be specified in detail specification . 21
5.6 Vibration . 21
5.6.1 Test equipment . 21
5.6.2 Preparation . 21
5.6.3 Test method . 21
5.6.4 Items to be specified in detail specification . 21
5.7 Resistance to shock . 22
5.7.1 Mechanical shock method . 22
5.7.2 Items to be specified in detail specification . 22

Annex A (normative) Mounting of surface mounting inductor on test printed-circuit
board . 23
A.1 General . 23
A.2 Mounting printed-circuit board and mounting land . 23
A.3 Solder . 23
A.4 Preparation . 24
A.5 Preheating . 24
A.6 Soldering . 24
A.7 Cleaning . 24

Figure 1 – Method for pressurizing the body . 8
Figure 2 – Pressurizing jig . 9
Figure 3 – Example of printed-circuit board . 10
Figure 4 – Layout . 12
Figure 5 – Pressurizing jig . 12
Figure 6 – Pressurizing . 12
Figure 7 – Pressurizing and shape of jig . 14
Figure 8 – Reflow temperature profile . 17

Table 1 – Size of soldering lands according to the code of multi-layer chip inductors . 10
Table 2 – Thickness of solder paste by the size code of inductors . 11
Table 3 – Conditions of immersion into solder . 16
Table 4 – Reflow temperature . 16
Table 5 – Severity . 18
Table 6 – Reflow temperature . 19
Table 7 – Conditions of vibration . 21

– 4
...