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IEC TR 62658:2013

(Main)

Roadmap of optical circuit boards and their related packaging technologies

Roadmap of optical circuit boards and their related packaging technologies

IEC/TR 62658:2013(E) covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards. Keywords: optical packaging technology road map, roadmap of optical circuit boards

General Information

Status
Published
Publication Date
14-Jul-2013
ICS
01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
33.180.01 - Fibre optic systems in general
33.180.99 - Other fibre optic equipment
Technical Committee
TC 86 - Fibre optics
Drafting Committee
JWG 9 - TC 86/JWG 9
Current Stage
PPUB - Publication issued
Start Date
31-Oct-2013
Completion Date
15-Jul-2013
Ref Project

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IEC TR 62658:2013 - Roadmap of optical circuit boards and their related packaging technologiesIEC TR 62658:2013 - Roadmap of optical circuit boards and their related packaging technologies
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Technical report
IEC TR 62658:2013 - Roadmap of optical circuit boards and their related packaging technologies
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19 pages
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IEC/TR 62658
®

Edition 1.0 2013-07
TECHNICAL
REPORT

colour
inside


Roadmap of optical circuit boards and their related packaging technologies

IEC/TR 62658:2013(E)

---------------------- Page: 1 ----------------------
THIS PUBLICATION IS COPYRIGHT PROTECTED
Copyright © 2013 IEC, Geneva, Switzerland

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---------------------- Page: 2 ----------------------
IEC/TR 62658

®

Edition 1.0 2013-07




TECHNICAL



REPORT








colour

inside










Roadmap of optical circuit boards and their related packaging technologies



























INTERNATIONAL

ELECTROTECHNICAL

COMMISSION

PRICE CODE
R


ICS 33.180.01; 33.180.99 ISBN 978-2-8322-0915-8



  Warning! Make sure that you obtained this publication from an authorized distributor.


® Registered trademark of the International Electrotechnical Commission

---------------------- Page: 3 ----------------------
– 2 – TR 62658 © IEC:2013(E)
CONTENTS
FOREWORD . 3
1 Scope . 5
2 General . 5
2.1 Background of optical packaging technology road map . 5
2.2 Advantages of optical interconnects . 7
2.3 Planar embedded optical waveguides . 9
3 Standardization of board-level optical packaging . 9
3.1 Role of IEC TC86/JWG9 (with TC91) . 9
3.2 Optical circuit boards [20] . 10
3.3 Optical backplanes [22] . 11
3.4 Optical circuit board connectors [23]. 13
3.5 Opto-electronic modules on boards . 14
3.6 Originating standards . 15
4 Standardization road map . 16
4.1 Performance trends for optical circuit boards . 16
5 Standardization road map of optical circuit boards .
...

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