IEC 62899-202-10:2023
(Main)Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
Printed electronics - Part 202-10: Materials - Resistance measurement method for thermoformable conducting layer
IEC 62899-202-10:2023 defines terminology and measurement methods for the resistance change of conductive ink layer(s) as a function of thermoplastic elongation. The method measures resistance changes in-situ or post-elongation.
This document is applicable to thermoformable substrates with conductive ink layers. The thermoformable substrates can have printed graphic ink as well and cover insulation layers.
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Standards Content (Sample)
IEC 62899-202-10 ®
Edition 1.0 2023-08
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-10: Materials – Resistance measurement method for thermoformable
conducting layer
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IEC 62899-202-10 ®
Edition 1.0 2023-08
INTERNATIONAL
STANDARD
colour
inside
Printed electronics –
Part 202-10: Materials – Resistance measurement method for thermoformable
conducting layer
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 29.035.01; 31.180 ISBN 978-2-8322-7325-8
– 2 – IEC 62899-202-10:2023 © IEC 2023
CONTENTS
FOREWORD . 4
INTRODUCTION . 6
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 In-situ resistance measurement method. 9
4.1 Measured value . 9
4.2 Test specimen . 9
4.2.1 Ink stack . 9
4.2.2 Size and shape . 10
4.2.3 Conductive layer layout . 10
4.3 Measurement apparatus . 11
4.3.1 General . 11
4.3.2 Elongation equipment . 11
4.3.3 Resistance measurement equipment . 12
4.4 Measurement parameters . 13
4.4.1 Elongation . 13
4.4.2 Elongation speed . 13
4.4.3 Elongation temperature . 13
4.5 Measurement procedure . 13
4.6 Measuring conductive line elongation . 14
4.7 Data analysis . 14
4.7.1 General . 14
4.7.2 Calculating results . 14
4.7.3 Excluding outliers in data analysis . 15
4.8 Measurement report . 16
5 Pre-and post-elongation resistance measurement method . 16
5.1 Measured value . 16
5.2 Test specimen . 16
5.3 Measurement apparatus . 16
5.3.1 Elongation equipment . 16
5.3.2 Resistance measurement equipment . 17
5.4 Measurement parameters . 17
5.5 Measurement procedure . 17
5.6 Measuring conductive line elongation . 17
5.7 Data analysis . 17
5.7.1 General . 17
5.7.2 Calculating results . 17
5.7.3 Excluding outliers in data analysis . 18
5.8 Measurement report . 18
Annex A (informative) Example report for pre- and post-elongation resistance
measurement . 19
A.1 Test specimen information . 19
A.2 Elongation parameters . 19
A.3 Results . 19
A.3.1 Measured line elongation range and elongation at electric break . 19
A.3.2 Analysis of potential outliers . 20
A.3.3 Average resistance changes . 20
A.4 Date of the measurements . 21
Annex B (informative) Guidelines for test specimen shape and conductive layer layout . 22
B.1 Test specimen shape and dimensions . 22
B.2 Conductive layer layout . 23
B.3 General guidelines for specimen shapes and conductive layer layout. 24
Bibliography . 26
Figure 1 – Substrate with ink stack in 2D (top) and 3D (bottom) shape . 6
Figure 2 – Example of test specimen shape . 10
Figure 3 – Example of conductive layer layout . 11
Figure 4 – Example of elongation equipment . 12
Figure 5 – Example of test specimen holder . 12
Figure 6 – Example of measuring conductive line elongation . 14
Figure 7 – Example of conductive line resistance increase (%) as a function of
elongation time (s) . 15
Figure A.1 – Conductive layer layout . 19
Figure A.2 – Boxplot of resistance change before outlier analysis . 20
Figure A.3 – Boxplot of conductive line resistance changes . 21
Figure B.1 – Example of the test specimen shape . 22
Figure B.2 – Example of conductive layer layout . 24
Table 1 – Test specimen ink stack . 10
Table A.1 – Conductive lines that had electric break during elongation . 20
Table A.2 – Resistance changes according to line elongation ranges . 21
– 4 – IEC 62899-202-10:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PRINTED ELECTRONICS –
Part 202-10: Materials – Resistance measurement
method for thermoformable conducting layer
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