IEC 60068-2-83:2025
(Main)Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
IEC 60068-2-83:2025 is available as IEC 60068-2-83:2025 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.
IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method.
This edition includes the following significant technical change with respect to the previous edition:
a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.
Essais d’environnement - Partie 2-83: Essais - Essai Tf: Essai de brasabilité des composants électroniques pour les composants montés en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser
IEC 60068-2-83:2025 est disponible sous forme de IEC 60068-2-83:2025 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'�dition pr�c�dente.
L’IEC 60068-2-83:2025 fournit des méthodes d’enquêtes comparatives sur la mouillabilité des terminaisons métalliques ou métallisées des composants montés en surface (CMS) avec de la pâte à braser. Ces méthodes ne servent pas à fournir des données quantitatives absolues utilisées dans le cadre d’acceptations ou de rejets.
NOTE Différentes méthodes d’essai de brasabilité pour composants montés en surface (CMS) sont décrites dans l’IEC 60068‑2‑58 et dans l’IEC 60068‑2‑69. L’IEC 60068‑2‑58 spécifie une évaluation visuelle utilisant un bain de brasage et la méthode de refusion, l’IEC 60068‑2‑69 spécifie une évaluation par balance de mouillage utilisant la méthode du bain de brasage et des gouttelettes/globules de brasure.
Cette édition inclut la modification technique majeure suivante par rapport à l’édition précédente:
a) révision de l’Article 5 pour l’aligner sur celui de l’IEC 60068‑2‑20:2021.
General Information
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Standards Content (Sample)
IEC 60068-2-83 ®
Edition 2.0 2025-05
REDLINE VERSION
INTERNATIONAL
STANDARD
Environmental testing –
Part 2-83: Tests – Test Tf: Solderability testing of electronic components for
surface mounting devices (SMD) by the wetting balance method using solder
paste
ICS 19.040; 31.190 ISBN 978-2-8327-0470-7
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– 2 – IEC 60068-2-83:2025 RLV © IEC 2025
CONTENTS
FOREWORD . 5
INTRODUCTION .
1 Scope . 9
2 Normative references . 9
3 Terms and definitions . 10
4 Test . 10
4.1 General description . 10
4.2 Test methods . 10
5 Preconditioning . 11
6 Preparation . 11
6.1 Solder paste . 11
6.2 Test jig plate . 12
6.3 Specimen holder . 12
7 Quick heating method . 12
7.1 Equipment . 12
7.2 Test jig plate . 14
7.3 Preparation . 16
7.4 Test condition . 16
7.4.1 Test temperature . 16
7.4.2 Feed of solder paste and immersion condition . 18
7.4.3 Immersion and withdrawal conditions for test specimen . 19
7.5 Test procedure . 19
7.6 Presentation of the result . 20
7.7 Characterisation parameter examples . 22
8 Synchronous method . 22
8.1 Equipment . 22
8.2 Test jig plate . 24
8.3 Synchronous fixture . 25
8.4 Preparation . 25
8.5 Test condition . 25
8.5.1 Test temperature . 25
8.5.2 Feed of solder paste and immersion condition . 25
8.5.3 Immersion and withdrawal conditions for the test specimen . 25
8.6 Test procedure . 25
8.7 Presentation of the results . 26
8.8 Characterisation parameter examples . 28
9 Temperature profile method . 29
9.1 Equipment . 29
9.2 Test jig plate . 30
9.3 Preparation . 31
9.4 Test condition . 31
9.4.1 Test temperature . 31
9.4.2 Feed of solder paste and immersion condition . 32
9.4.3 Immersion and withdrawal conditions for test specimen . 33
9.5 Test procedure . 33
9.6 Presentation of the result . 34
9.7 Characterization parameter examples . 35
Annex A (normative) Equipment for the quick heating and synchronous method . 36
A.1 General . 36
A.2 Test equipment . 36
A.2.1 General . 36
A.2.2 Measuring system . 36
A.2.3 Heating system . 36
A.2.4 Lift system . 37
Annex B (informative) Reading of the output data and correction of the result in the
quick heating test . 38
B.1 General . 38
B.2 Reading of the output form in the quick heating test . 38
B.3 Correction to the typical data attained by the quick heating method . 39
Annex C (normative) Test equipment for the temperature profile method . 41
C.1 General . 41
C.2 Test equipment . 41
C.2.1 General . 41
C.2.2 Measuring system . 41
C.2.3 Heating system . 41
C.2.4 Lift system . 41
Annex D (informative) Reading of the output data and correction of the result in the
temperature profile test . 42
D.1 General . 42
D.2 Reading of the output form in the temperature profile test . 42
D.3 Correction to the typical data attained by the temperature profile method . 43
Annex E (informative) Caveats and notes . 45
E.1 General . 45
E.2 Influences . 45
E.2.1 Solder paste . 45
E.2.2 Components . 45
E.3 Interpreting results – Examples . 45
E.3.1 Quick heating method . 45
E.3.2 Synchronous method . 46
E.3.3 Temperature profile method . 47
Bibliography . 49
Figure 1 – Example of quick heating method test equipment . 13
Figure 2 – Example of test jig plate for quick heating and synchronous method . 16
Figure 3 – Example of temperature profile . 18
Figure 4 – Example of application of solder paste to a test jig plate . 19
Figure 5 – Typical output shape of signal in the quick heating method . 22
Figure 6 – Example of synchronous method test equipment . 24
Figure 7 – Example of synchronous fixture. 25
Figure 8 – Typical output shape of signal in the synchronous method . 28
Figure 9 – Example of system for temperature profile method test equipment . 30
Figure 10 – Example of temperature profile. 32
Figure 11 – Example of applying solder paste to a test jig plate . 33
– 4 – IEC 60068-2-83:2025 RLV © IEC 2025
Figure 12 – Typical output shape of signal in the temperature profile method . 35
Figure B.1 – Typical wetting force changes in quick heating method . 39
Figure B.2 – Example of correction of the initial time of wetting (F is larger than
a
0,5 F ) . 40
1,max
Figure B.3 – Example of correction of the initial time of wetting (F is 0,5 F or
a 1,max
less) . 40
Figure D.1 – Typical output forms for profile the temperature profile test. 43
Figure D.2 – The case when an Extruding force (1,1 F or larger) is being generated
max
immediately after the beginning of wetting . 44
Figure E.1 – Explanation diagram of test procedure for the quick heating method . 46
Figure E.2 – Explanation diagram of test procedure for synchronous method . 46
Figure E.3 – Showing the Wetting force (pull) of some solder pastes . 47
Figure E.4 – Explanation diagram of the test procedure for the temperature profile
method . 48
Table 1 – Specification of the test jig plate for quick heating and synchronous method . 14
Table 2 – Recommended test conditions of the quick heating and synchronous method
for rectangular SMD . 19
Table 3 – Specification of the test jig plate of the temperature profile method . 31
Table 4 – Recommended test conditions of the temperature profile method for
rectangular SMD . 33
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
ENVIRONMENTAL TESTING –
Part 2-83: Tests – Test Tf: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method using solder paste
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
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co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) IEC draws attention to the possibility that the implementation of this document may involve the use of (a)
patent(s). IEC takes no position concerning the evidence, validity or applicability of any claimed patent rights in
respect thereof. As of the date of publication of this document, IEC had received notice of (a) patent(s), which
may be required to implement this document. However, implementers are cautioned that this may not represent
the latest information, which may be obtained from the patent database available at https://patents.iec.ch. IEC
shall not be held responsible for identifying any or all such patent rights.
This redline version of the official IEC Standard allows the user to identify the changes
made to the previous edition IEC 60068-2-83:2011. A vertical bar appears in the margin
wherever a change has been made. Additions are in green text, deletions are in
strikethrough red text.
– 6 – IEC 60068-2-83:2025 RLV © IEC 2025
IEC 60068-2-83 has been prepared by IEC technical committee 91: Electronics assembly
technology. It is an International Standard.
This second edition cancels and replaces the first edition published in 2011. This edition
constitutes a technical revision.
This edition includes the following significant technical change with respect to the previous
edition:
a) Revise Clause 5 to align with that in IEC 60068-2-20:2021.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/2026/FDIS 91/2037/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.
This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 60068 series, published under the general title Environmental testing,
can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn, or
• revised.
INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is claimed
that compliance with this document may involve the use of patents as indicated below.
IEC takes no position concerning the evidence, validity and scope of patent rights.
The holders of the patent rights have assured the IEC that they are willing to negotiate licences
either free of charge or under reasonable and non-discriminatory terms and conditions with
applicants throughout the world. In this respect, the statement of the holders of these patent
rights are registered with IEC. Information may be obtained as indicated below.
a) EU patent 0920488.4 “Synchronous test method for assessing soldering pastes”
Gen3 Systems LTD
Unit B2
Armstrong Mall
Farnborough GU14 0NR
United Kingdom
b) JP Patent 2630712 “Testing method of characteristics of solder paste and the equipment
for the test”
Malcom Co., Ltd
4-15-10 Honmachi, Shibuya-ku
Tokyo, 151-0071
Japan
c) Patent JP 3789041 “Solderability measuring apparatus”
Patent JP 3552061 “Solderability tester and solderability test method”
Patent JP 3498100 “Method and device for testing solderability and microcrucible for
testing”
Patent JP 3153884 “Measuring device for soldering performance of cream solder”
Tarutin Kester Co., Ltd.
2-20-11 Yokokawa,
Sumida-ku
Tokyo, 130-0003
Japan
d) Sony Corporation
1-7-1 Konan Minato-ku
Tokyo 108-0075
Japan
Attention is drawn to the possibility that some of the elements of this standard may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
Status of patent: Pending.
– 8 – IEC 60068-2-83:2025 RLV © IEC 2025
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users are encouraged to consult the data bases for the
most up to date information concerning patents.
ENVIRONMENTAL TESTING –
Part 2-83: Tests – Test Tf: Solderability testing of electronic
components for surface mounting devices (SMD)
by the wetting balance method using solder paste
1 Scope
This part of IEC 60068 provides methods for comparative investigation of the wettability of the
metallic terminations or metallized terminations of SMDs with solder paste.
Data obtained by these methods are not intended to be used as absolute quantitative data for
pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69.
IEC 60068-2-58 prescribes specifies visual evaluation using solder bath and reflow method, IEC 60068-2-69
prescribes specifies wetting balance evaluation using solder bath and solder globule method.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 60068-1, Environmental testing – Part 1: General and guidance
IEC 60068-2-20:20082021, Environmental testing – Part 2-20: Tests – Test T Ta and Tb: Test
methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface mounting
devices (SMD)
IEC 60194, Printed board design, manufacture and assembly – Terms and definitions
IEC 60194-2, Printed boards design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
IEC 61190-1-3, Attachment materials for electronic assembly – Part 1-3: Requirements for
electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering
applications
– 10 – IEC 60068-2-83:2025 RLV © IEC 2025
3 Terms and definitions
For the purposes of this document, the terms and definitions given in IEC 60068-1,
IEC 60068-2-20:2008, IEC 60068-2-58, IEC 60194-2, and IEC 61190-1-3 and the following
apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp
3.1
wettability
ease with which a metal or metal alloy can be wetted by molten solder
intrinsic property of the termination material to form an alloy with the solder
Note 1 to entry: Wettability depends on the base metal used to produce the termination or, in the case of a plated
termination, the condition and material used to plate the base metal.
[SOURCE: IEC 60068-3-13:2016, 3.1.3]
3.2
wetting balance method
method to measure wetting performance and solderability by measuring vertical force
(difference with surface tension and buoyancy) to the specimen and recording as a function of
time, when the specimen is immersed into molten solder
3.3
starting point of heating
time of the start of temperature rise by heating the solder paste applied to a testing jig
3.3
zero line
line extended to the time axis of the force experienced by the specimen as indicated by the test
equipment (force sensor) when the specimen is taken out from the molten solder after the end
of the measurement
4 Test
4.1 General description
The specimen is held on a holder suitable to the specimen and is suspended from sensitive
balance. The specimen is immersed into solder paste applied onto the test jig plate, then solder
paste is heated to melt. The resultant of the vertical forces of buoyancy and surface tension
(hereafter, referred to as “acting force”) acting upon the immersed specimen by force sensor
and converted into a signal which is continuously recorded or monitored as a function of time
on recorder.
NOTE The wetting force can be evaluated only for components of the same shape and size. The absolute evaluation
is not achieved by this method.
4.2 Test methods
There are three methods as described below. The choice of the method shall be specified in
the relevant specification.
a) Quick heating method: the wettability of electrodes of a component is evaluated while the
solder paste is melted in a rapid temperature rise. The specimen is immersed in the solder
paste before the temperature rise starts.
b) Synchronous method: the wettability of electrodes of a component is evaluated while the
solder paste is melted due to a rapid temperature rise. The specimen is immersed in the
solder paste when the temperature rise starts.
c) Temperature profile method: solder paste is melted using a similar temperature profile used
in production and the wettability of the electrodes of a component is evaluated.
NOTE 1 This test (Tf) may can be applicable to leaded SMD packages. In order to achieve comparable and
repeatable results, test Tf should be done on straight leads.
NOTE 2 Solder paste to be used is not specified in this standard agreed between the trading partners.
5 Preconditioning
The test shall be made on the specimens as received and care shall be taken not to contaminate
the specimens shall not be contaminated by fingers and other items, unless otherwise specified
in the detailed specification of the component. The specimen may be immersed in organic
solvent at room temperature to remove possible contamination such as grease attached to the
surface if the preconditioning is specified in the cleaning is required by the relevant specification.
No other method shall be used to clean the specimen. The specimen thus cleaned may be dried
in air.
When accelerated ageing is prescribed by the relevant specification, one of the methods of
4.1.4 (Ageing 1) of IEC 60068-2-20:2008 shall be used. The aging condition shall be specified
in the relevant specification.
If required by the relevant specification, one of the preconditioning methods specified in
IEC 60068-2-20:2021, 4.1.1, may be used.
6 Preparation
6.1 Solder paste
Use solder paste that has been stored in a sealed container and stored in a dark environment
and below 10 °C, avoiding exposure to direct sunlight. Before conducting this test, the solder
paste preparation procedure is important. Expiration date of the solder paste shall be checked
before initiating the solder paste preparation procedure listed below.
a) The solder paste shall be allowed to achieve ambient conditions that shall be nominally
25 °C ± 5 °C and relative humidity of (50 ± 10) % for 8 h or in accordance with the
manufacturer’s data sheet.
b) Open the supply container(s). Remove any internal cover, scrape off the paste adhering to
the lid(s), internal covers, and the container walls. Add this material to the paste in the
supply container(s). Check that the solder paste is not obviously deteriorated nor separated.
c) Using a spatula, stir the paste gently for 1 min to 2 min to homogenize it; taking care to
avoid the introduction of air ensuring that no air is introduced.
If necessary, Gently transfer the paste to a test container of sufficient volume, taking care
to avoid the introduction of air.
d) Gently transfer the paste to a test container of sufficient volume, ensuring that no air is
introduced. The solder paste that is once taken out from the container and not used for the
test shall be discarded. The remaining solder paste in the supply container shall be stored
in the original dark and cool environment.
– 12 – IEC 60068-2-83:2025 RLV © IEC 2025
6.2 Test jig plate
Test jig plates shall be stored in a sealed container. Immediately prior to their use, they shall
be cleaned using acid such as dilute hydrochloric acid. A new test jig plate shall be used for
each test. Unused test jig plates shall be discarded and not be returned to the sealed container.
6.3 Specimen holder
The specimen holder is usually contaminated by creeping of flux used in a test. A specimen
holder shall be cleaned using a neutral organic solvent. It is desirable recommended to use
ultrasonic agitation in cleaning.
7 Quick heating method
7.1 Equipment
The equipment used for the quick heating method consists of a measurement, heating and lift
system, as shown in Figure 1. The detailed requirements to the equipment are specified in
Annex A.
The measurement, heating and lift system shall be as follows.
a) The measuring system consists of the force sensor that can measure the force vertically
acted on a specimen, signal transducer and a recorder.
b) The heating system shall be capable of controlling the determined set temperature within
±3 °C.
c) The lift system shall be capable of carrying out immersion and withdrawal of the specimen,
as specified in 7.4.3.
9 10 11
5 6
IEC 1936/11
Key
1 Specimen 7 Holding jig of a test jig plate
2 Test jig plate 8 Housing
3 solder paste 9 Sensor
4 heating bath 10 Transducer
5 lift for test jig plate 11 Recorder
6 lift for heating bath 12 Controller
Key
1 specimen 8 housing
2 test jig plate 9 sensor
3 solder paste 10 transducer
4 heating bath 11 recorder
5 lift for test jig plate 12 controller
6 lift for heating bath 13 specimen holder
7 holding jig of a test jig plate
Figure 1 – Example of quick heating method test equipment
– 14 – IEC 60068-2-83:2025 RLV © IEC 2025
7.2 Test jig plate
The test jig plate shall be as specified in Table 1.
Table 1 – Specification of the test jig plate for quick heating and synchronous method
Item Specification of the test jig
material oxygen-free phosphate copper
shape circular indented pan
dimensions (L, W) less than 30 mm on one side, or less than a total area of 900 mm
thickness (l) 0,3 mm ± 0,03 mm
drawing diameter
9 mm to 10 mm at the bottom,
(D , D )
13 mm to 14 mm at the top
1 2
drawing depth (h) 0,4 mm ± 0,04 mm
solder resist diameter
10 mm ± 0,02 mm for the inner diameter,
(D , D )
over 20 mm for the outer diameter
3 4
Resist coat solder resist
0,035 mm ± 0,01 mm
thickness
warp ±0,05 mm (for the longer side for a rectangular shape)
An example of the test jig plate used in the quick heating and synchronous method is shown in
Figure 2.
L A-A’
D
D
h (0,4 ± 0,04)
l (0,3± 0,03)
A
A’
W
D (10 ± 0,02)
D
IEC 1937/11
Key
1 Drawing for solder resist h Drawing depth
2 Solder resist l Thickness
L, W Outer dimension
D Outer diameter of drawing D Inner diameter of solder resist
1 3
D Inner diameter of drawing D Outer diameter of solder resist
2 4
– 16 – IEC 60068-2-83:2025 RLV © IEC 2025
Key
1 drawing for solder resist D drawing outer diameter
2 solder resist D drawing inner diameter
L, W outer dimension D solder resist inner diameter
l thickness D solder resist outer diameter
h drawing depth
Figure 2 – Example of test jig plate for quick heating and synchronous method
7.3 Preparation
See Clause 6 for details.
The preparation shall be as specified in Clause 6.
7.4 Test condition
7.4.1 Test temperature
The test jig plate shall be processed using the temperature profile as specified. Figure 3 shows
a typical example.
t
t
T
1 T
Time (s)
t
IEC 1938/11
Symbol SAC type Sn-Pb type
T
217 °C 183 °C
T 245 °C ± 3 °C 235 °C ± 3°C
Key
T Solder melting temperature T Test temperature
1 2
t Test duration (5 s to15 s) t Time from start to T
1 1
t Time from start to T
2 2
The test starts at a temperature of 50 °C or less.
Time from start to T (t ) shall be 1,5 s or less. Time from start to T (t ) shall be 3 s or less. The ramp down rate is
1 1 2 2
not specified.
Temperature (°C)
– 18 – IEC 60068-2-83:2025 RLV © IEC 2025
a a
Symbol
Sn-Ag-Cu (SAC) type Sn-Pb type
T 217 °C 183 °C
T 245 °C ± 3 °C 235 °C ± 3 °C
a
If agreed between the trading partners, the other types of solder paste can be
used.
Key
T liquidous temperarure T test temperature
1 2
T test duration (5 s to15 s) t time from start to T
1 1
t time from start to T
2 2
The test starts at a temperature of 50 °C or below. Time from start to T (t ) shall be 1,5 s or less. Time from start to
1 1
T (t ) shall be 3 s or less. The ramp down rate is not specified.
2 2
Figure 3 – Example of temperature profile
7.4.2 Feed of solder paste and immersion condition
The recommended condition of immersing a specimen into the solder paste is given in Table 2.
For components not specified in Table 2, test conditions shall be specified in the relevant
specification or agreed upon between the trading partners.
Table 2 – Recommended test conditions of the quick heating
and synchronous method for rectangular SMD
Angle and Direction of
a b, c
Sizes of specimen Immersion depth specimen immersing into
solder paste
1005 (0402) 0,15 mm Horizontal
1608 (0603)
resistors
2012 (0805) 0,20 mm
3216 (1206)
1005 (0402) 0,15 mm
1608 (0603)
capacitors
2012 (0805) 0,20 mm
3216 (1206)
a
Designation of the size, for example of 1005, means a specimen with a length of 1,0 mm and a width of 0,5 mm.
The dimensions in parentheses are expressed in imperial units.
b
The immersion depths specified in this table are recommended since the buoyancy force varies depending on
the electrode configuration.
c
The immersion depths are the target values.
7.4.3 Immersion and withdrawal conditions for test specimen
The immersion speed of the specimen into the solder paste shall be 0,5 mm/s to 1 mm/s. The
immersion speed of the test jig into the heating bath shall be 1 mm/s to 5 mm/s.
NOTE Since the speed of taking out the specimen from the solder paste and the speed of taking out the test jig
plate from the heating bath after the tests does not affect to the test results, these speeds are arbitrary.
7.5 Test procedure
The test procedure shall be as follows.
a) Apply solder paste to the test jig keeping the surface flat. Figure 4 shows an example.
Key
1 test jig plate
2 solder paste
3 squeegee
4 direction of squeeze movement
Figure 4 – Example of application of solder paste to a test jig plate
b) Mount a specimen into the clip until so that the angle direction specified in 7.4.2 (horizontal)
is realized. The clip shall be centralised to the upper surface of a test jig plate into which
the solder paste has been applied.
c) Adjust the output of the force sensor and the recorder to zero before the test commences.
– 20 – IEC 60068-2-83:2025 RLV © IEC 2025
d) Immerse the specimens as follows.
1) The specimen shall be immersed into the solder paste to the specified depth in 7.4.2.
Then, heat the jig plate to melt the solder paste in accordance with the temperature
profile as specified in Figure 3.
NOTE 2) The specimen may need can be required to be immersed into the solder paste
to the depth of twice or more the specified depth, and then the specified depth.
The purpose of this procedure is to apply flux on the portion of the specimen which
corresponds to the immersion depth before heating.
e) Withdraw the specimen from the molten solder paste when measurement is finished.
Recording of the result is completed when the force reaches to a stable state or specified
duration.
7.6 Presentation of the result
The recorder records the force acted to the specimen in the vertical direction. The force acted
upward (pushing force or buoyancy) is recorded as a negative value, and the force acted
downward to the specimen (wetting force) is recorded as a positive value.
A typical shape of the output signal obtained is shown in Figure 5. The meaning and correction
of the data if different from the shape shown in Figure 5 are given in Annex B.
t
t
D
C 1
E
B
A
Zero line
F
Time
IEC 1940/11
Key
A Reference point to start time measurement.
NOTE Point A is the first positive force peak during the test.
B Instance when the force curve crosses the zero line.
C Instance when the wetting force reaches to 2/3 of the maximum wetting force.
D Instance when the maximum force is obtained in the measurement.
E Instance when the specimen is withdrawn after the measurement is completed.
F Instance when the force reaches stable state after the specimen is withdrawn from the jig plate.
t Time to start wetting. Time duration from point A to point B .
01 1 1
t Wetting time. The time duration from point B to point C .
11 1 1
F Maximum wetting force. The maximum force obtained (the value from the zero line) in the measurement.
1,max
F Final wetting force. The force obtained (the value from the zero line) at the end of the test.
1,end
Acting force
Negative
Positive
2/3F
1,max
F
1,max
F
1,end
– 22 – IEC 60068-2-83:2025 RLV © IEC 2025
Key
A reference point to start time measurement (point A is the first positive force peak during the test)
1 1
B instance when the force curve crosses the zero line
C instance when the wetting force reaches 2/3 of the maximum wetting force
D instance when the maximum force is obtained in the measurement
E instance when the specimen is withdrawn after the measurement is completed
F instance when the force reaches stable state after the specimen is withdrawn from the jig plate
t time to start wetting (time duration from point A to point B )
01 1 1
t wetting time (time duration from point B to point C )
11 1 1
F maximum wetting force - maximum force obtained (the value from the zero line) in the measurement
1,max
F final wetting force - force obtained (the value from the zero line) at the end of the test
1,end
Figure 5 – Typical output shape of signal in the quick heating method
7.7 Characterisation parameter examples
The items for the characteristic evaluation should include the following:
a) time to start wetting: t
b) wetting time: t
c) maximum wetting force: F
1,max
d) wetting stability: Sb ; the ratio of the final wetting force (F ) and the maximum wetting
1 1,end
force (F )
1,max
NOTE Wetting stability is calculated as follows: Sb = F /F
1 1,end 1,max
8 Synchronous method
8.1 Equipment
The equipment used for the synchronous method consists of measurement, heating and lift
system as shown in Figure 6. The detailed requirements to the equipment are specified in
Annex A.
The measurement, heating and lift system shall be as follows.
a) The measuring system consists of the force sensor that can measure the force vertically
acted on a specimen, signal transducer and a recorder.
b) The heating system shall be capable of controlling the set temperature within the preset
tolerances specified in 8.5.1.
c) The lift system shall be capable of carrying out immersion and withdrawal of the specimen
as specified in 8.5.3.
d) The synchronous fixturing system shall be capable of permitting the simultaneous immersion
and heating of the specimen as specified in 8.6.
– 24 – IEC 60068-2-83:2025 RLV © IEC 2025
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