IEC TS 62610-1:2009

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified:
1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;
2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;
3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

General Information

• Status: Published
• Publication Date: 15-Sep-2009
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SC 48D - Mechanical structures for electrical and electronic equipment
• Drafting Committee: WG 5 - TC 48/SC 48D/WG 5
• Current Stage: PPUB - Publication issued
• Start Date: 16-Sep-2009
• Completion Date: 15-Dec-2009

Overview

IEC TS 62610-1:2009 - Mechanical structures for electronic equipment: Thermal management for cabinets (Part 1) - is a technical specification that gives a design guide for the installation of thermoelectrical cooling systems (Peltier effect) in equipment cabinets conforming to the IEC 60297 (19 in) and IEC 60917 (25 mm) series. The document defines interface dimensions, arrangement options and performance guidance for Peltier-based cooling in rack and subrack assemblies. It also discusses environmental aspects and compares cooling alternatives.

Key topics and requirements

• Scope and purpose: Guidelines for integrating Peltier (thermoelectrical) coolers into standard IEC cabinets; emphasis on dimensional interfaces and placement that affect cooling performance.
• Mounting locations (three canonical arrangements):
  • Location 1: Inside or outside mounted thermoelectrical system for cooling an entire cabinet (vertical or horizontal alignment variations).
  • Location 2: Top-mounted thermoelectrical system for whole-cabinet cooling.
  • Location 3: Inbuilt thermoelectrical cooling subrack for localized “hot spot” cooling.
• Design guidance: Interface dimensions and provisions for mounting, airflow path considerations, and performance guidelines linked to mounting location (document includes illustrative figures and performance guidance).
• Environmental considerations: Annex A compares Peltier cooling with compressor and absorption systems and addresses refrigerant/environmental impacts; highlights advantages of Peltier units (no refrigerant, minimal moving parts).
• Normative references: Relies on IEC 60297 and IEC 60917 series for cabinet/rack dimensional standards.

Practical applications

• Use this technical specification when designing or retrofitting rack-mounted equipment that requires controlled internal temperatures or targeted hotspot mitigation.
• Typical use cases:
  • Whole-cabinet cooling in telecom and network racks where space or refrigerants are constrained.
  • Top-mounted cooling for distributed airflow strategies.
  • Subrack-level Peltier modules for high heat-density electronics or localized temperature control.
• Benefits for practitioners:
  • Ensures mechanical compatibility with IEC rack standards.
  • Helps select mounting location to optimize cooling performance.
  • Supports low-GWP and refrigerant-free cooling choices.

Who should use it

• Mechanical designers and cabinet manufacturers
• Thermal engineers and system integrators
• Product architects for telecom, data center, and industrial electronics
• Compliance and standards professionals specifying rack cooling interfaces

Related standards

• IEC 60297 (all parts): Dimensions of 482.6 mm (19 in) series mechanical structures
• IEC 60917 (all parts): Modular order for mechanical structures (25 mm series)

Keywords: IEC TS 62610-1:2009, thermoelectrical cooling systems, Peltier effect, cabinet thermal management, IEC 60297, IEC 60917, rack cooling, hotspot cooling, design guide, interface dimensions.

Standards Content (Sample)

IEC/TS 62610-1 ®
Edition 1.0 2009-09
TECHNICAL
SPECIFICATION
colour
inside
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 1: Design guide: Interface dimension and provision for thermoelectrical
cooling systems (Peltier effect)

IEC/TS 62610-1:2009(E)
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IEC/TS 62610-1 ®
Edition 1.0 2009-09
TECHNICAL
SPECIFICATION
colour
inside
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 1: Design guide: Interface dimension and provision for thermoelectrical
cooling systems (Peltier effect)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
T
ICS 31.240 ISBN 978-2-88910-772-8
– 2 – TS 62610-1 © IEC:2009(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Arrangement overview.7
4 Mounting location 1: cabinet with inside or outside mounted thermoelectrical
cooling system in a vertical alignment .8
4.1 Cabinet with inside mounted thermoelectrical cooling system in a vertical
alignment .8
4.1.1 General .8
4.1.2 Overview .8
4.1.3 Performance guideline for cabinets with inside or outside mounted
thermoelectrical cooling system.10
4.2 Cabinet with inside mounted thermoelectrical cooling system in a horizontal
alignment .12
5 Mounting location 2: cabinet with top mounted thermoelectrical cooling system for
the cooling of a whole cabinet .13
5.1 Overview .13
5.2 Cooling performance in cabinets with top mounted thermoelectrical cooling
systems.14
6 Mounting location 3: cabinet with inbuilt thermoelectrical cooling system for hot
spot cooling.14
6.1 Overview .14
6.2 Cooling performance for an inbuilt thermoelectrical cooling system for hot
spot cooling.16
7 Remark .16
Annex A (informative) Heat management under environmental aspects .18
Bibliography.23

Figure 1 – Arrangement overview .8
Figure 2 – Mounting location 1.9
Figure 3 – Mounting location 1: arrangement of two cabinets with inside mounted
Peltier system and minimized distance W .10
Figure 4 – Performance guideline for cabinets with inside mounted thermoelectrical
cooling system.11
Figure 5 – Mounting location 1a: cabinet with side mounted thermoelectrical cooling
system in a horizontal alignment .12
Figure 6 – Mounting location 2: cabinet with top mounted thermoelectrical cooling
system .13
Figure 7 – Performance guideline for a top mounted thermoelectrical cooling system .14
Figure 8 – Mounting location 3.15
Figure 9 – Performance guideline for inbuilt thermoelectrical cooling system for hot
spot cooling .16
Figure A.1 – Current CO emission situation.19
Figure A.2 – Changes in greenhouse gases from ice-core and modern data [5] .19
Figure A.3 – Radiative forcing of climate between 1750 and 2005 [4].20

TS 62610-1 © IEC:2009(E) – 3 –
Figure A.4 – Coefficient of performance depending on the cooling power at the
boundary conditions of T = 50 °C .21
a
Figure A.5 – Electrical power usage of compressor cooling unit versus Peltier cooling
unit at given ambient temperature and given heating dissipation to keep the internal
temperature fixed.22

Table A.1 – Advantages and disadvantages of different cooling systems .22

– 4 – TS 62610-1 © IEC:2009(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 1: Design guide: Interface dimension and provision
for thermoelectrical cooling systems (Peltier effect)

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
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The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 62610-1, which is a technical specification, has been prepared by subcommittee 48D:
Mechanical structures for electronic equipment, of IEC technical committee 48:
Electromechanical components and mechanical structures for electronic equipment.

TS 62610-1 © IEC:2009(E) – 5 –
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
48D/393/DTS 48D/405/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 62610 series can be found, under the general title Mechanical
structures for electronic equipment – Thermal management for cabinets in accordance with
IEC 60297 and IEC 60917 series, on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this standard may be issued at a later date.

IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

– 6 – TS 62610-1 © IEC:2009(E)
INTRODUCTION
According to the Kyoto Protocol and to the directives of the European Parliament and of the
Council, the usage of coolants with high potential for environmental pollution and global
warming (Global Warming Potential (GWP) factor) is to be avoided.
The most promising alternatives to compressor cooling with e.g. R 134a are compressor
cooling with CO , active cooling based on the Peltier effect and absorption cooling systems.
Each of these techniques has its advantages and disadvantages.
The compressor cooling with CO at the current state is more or less efficient, but high
installation costs due to working pressures up to 100 bars makes this technique less
interesting. Another disadvantage of CO cooling systems occurs out of the physical
properties of this coolant and requires additional cooling power to run this process. This fact
reduces the degree of efficiency enormously.
The Peltier-effect seems to be very promising as the cooling effect is highly dependent of the
properties of the material. Newly tested materials based on either porous materials or nano-
structures show an improvement of the degree of efficiency. Furthermore, Peltier techniques
do not need any kind of coolant and the only moving parts are the fans.
The absorption technique is a very intelligent way for cooling, but it is only profitable in
combination with a heat-regenerator what makes absorption cooling system only feasible in
very few applications.
For more details on mentioned alternatives for cooling, please see Annex A.
With respect to the demands of industry concerning high heat density/hotspots cooling,
available space for the cooling systems, adapting to existing infrastructures, noise emission
and respectively to the fact that conventional coolants like R 134a need to be replaced, this
technical specification was initiated for the definition of dimensional interfaces and
performances guidelines for thermoelectrical cooling systems based on the Peltier effect.
Three different arrangements for thermoelectrical cooling systems within cabinets, called
“mounting locations”, have been regarded where locations 1 and 2 are feasible for cooling a
whole cabinet and location 3 is for hotspot cooling inside the cabinet.
Below is the definition of each mounting location for thermoelectrical cooling systems within
cabinets:
– mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling
system for the cooling of a whole cabinet;
– mounting location 2: cabinet with top mounted thermoelectrical cooling system for the
cooling of a whole cabinet;
– mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a
subrack for hot spot cooling.
For a clear definition of interface dimensions and cooling performance guidelines, only
cabinets from the IEC 60297 (19 inch) and IEC 60917 (25 mm) series have been regarded.

TS 62610-1 © IEC:2009(E) – 7 –
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 1: Design guide: Interface dimension and provision
for thermoelectrical cooling systems (Peltier effect)

1 Scope
This Technical Specification provides guidelines for the installation of thermoelectrical cooling
systems (Peltier effect) within cabinets of the IEC 60297 (19 inch) and IEC 60917 (25 mm)
series.
The cooling performance is in direct relation with the mounting location within a cabinet.
Three typical mounting locations are identified:
– mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling
system for the cooling of a whole cabinet;
– mounting location 2: cabinet with top mounted thermoelectrical cooling system for the
cooling of a whole cabinet;
– mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a
subrack for hot spot cooling.
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 60297 (all parts), Mechanical structures for electronic equipment – Dimensions of
mechanical structures of the 482,6 mm (19 in) series
IEC 60917 (all parts), Modular order for the development of mechanical structures for
electronic equipment practices
3 Arrangement overview
Figure 1 illustrates the three mounting locations for thermoelectrical cooling systems.
NOTE This guideline for mounting thermoelectrical cooling systems applies to any width of cabinets. Second, the
air flow management should satisfy the followings: no airflow short circuit depending on the equipment and the
cable management inside the
...