IEC TS 62610-1:2009

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance wit IEC 60297 and IEC 60917 series - Part 1: Design guide: Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

IEC/TS 62610-1:2009(E) provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets ofthe IEC 60297 (19 inch) and IEC 60917 (25 mm) series. The cooling performance is in direct relation with the mounting location within a cabinet. Three typical mounting locations are identified:
1) cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;
2) cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;
3) cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.

General Information

• Status: Published
• Publication Date: 15-Sep-2009
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 31.240 - Mechanical structures for electronic equipment
• Technical Committee: SC 48D - Mechanical structures for electrical and electronic equipment
• Drafting Committee: WG 5 - TC 48/SC 48D/WG 5
• Current Stage: PPUB - Publication issued
• Start Date: 15-Dec-2009
• Completion Date: 16-Sep-2009

Standards Content (Sample)

IEC/TS 62610-1 ®
Edition 1.0 2009-09
TECHNICAL
SPECIFICATION
colour
inside
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 1: Design guide: Interface dimension and provision for thermoelectrical
cooling systems (Peltier effect)

IEC/TS 62610-1:2009(E)
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IEC/TS 62610-1 ®
Edition 1.0 2009-09
TECHNICAL
SPECIFICATION
colour
inside
Mechanical structures for electronic equipment – Thermal management for
cabinets in accordance with IEC 60297 and IEC 60917 series –
Part 1: Design guide: Interface dimension and provision for thermoelectrical
cooling systems (Peltier effect)

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
PRICE CODE
T
ICS 31.240 ISBN 978-2-88910-772-8
– 2 – TS 62610-1 © IEC:2009(E)
CONTENTS
FOREWORD.4
INTRODUCTION.6
1 Scope.7
2 Normative references .7
3 Arrangement overview.7
4 Mounting location 1: cabinet with inside or outside mounted thermoelectrical
cooling system in a vertical alignment .8
4.1 Cabinet with inside mounted thermoelectrical cooling system in a vertical
alignment .8
4.1.1 General .8
4.1.2 Overview .8
4.1.3 Performance guideline for cabinets with inside or outside mounted
thermoelectrical cooling system.10
4.2 Cabinet with inside mounted thermoelectrical cooling system in a horizontal
alignment .12
5 Mounting location 2: cabinet with top mounted thermoelectrical cooling system for
the cooling of a whole cabinet .13
5.1 Overview .13
5.2 Cooling performance in cabinets with top mounted thermoelectrical cooling
systems.14
6 Mounting location 3: cabinet with inbuilt thermoelectrical cooling system for hot
spot cooling.14
6.1 Overview .14
6.2 Cooling performance for an inbuilt thermoelectrical cooling system for hot
spot cooling.16
7 Remark .16
Annex A (informative) Heat management under environmental aspects .18
Bibliography.23

Figure 1 – Arrangement overview .8
Figure 2 – Mounting location 1.9
Figure 3 – Mounting location 1: arrangement of two cabinets with inside mounted
Peltier system and minimized distance W .10
Figure 4 – Performance guideline for cabinets with inside mounted thermoelectrical
cooling system.11
Figure 5 – Mounting location 1a: cabinet with side mounted thermoelectrical cooling
system in a horizontal alignment .12
Figure 6 – Mounting location 2: cabinet with top mounted thermoelectrical cooling
system .13
Figure 7 – Performance guideline for a top mounted thermoelectrical cooling system .14
Figure 8 – Mounting location 3.15
Figure 9 – Performance guideline for inbuilt thermoelectrical cooling system for hot
spot cooling .16
Figure A.1 – Current CO emission situation.19
Figure A.2 – Changes in greenhouse gases from ice-core and modern data [5] .19
Figure A.3 – Radiative forcing of climate between 1750 and 2005 [4].20

TS 62610-1 © IEC:2009(E) – 3 –
Figure A.4 – Coefficient of performance depending on the cooling power at the
boundary conditions of T = 50 °C .21
a
Figure A.5 – Electrical power usage of compressor cooling unit versus Peltier cooling
unit at given ambient temperature and given heating dissipation to keep the internal
temperature fixed.22

Table A.1 – Advantages and disadvantages of different cooling systems .22

– 4 – TS 62610-1 © IEC:2009(E)
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT –
THERMAL MANAGEMENT FOR CABINETS IN ACCORDANCE
WITH IEC 60297 AND IEC 60917 SERIES –

Part 1: Design guide: Interface dimension and provision
for thermoelectrical cooling systems (Peltier effect)

FOREWORD
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The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when
• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or
• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.
IEC 62610-1, which is a technical specification, has been prepared by subcommittee 48D:
Mechanical structures for electronic equipment, of IEC technical committee 48:
Electromechanical components and mechanical structures for electronic equipment.

TS 62610-1 © IEC:2009(E) – 5 –
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
48D/393/DTS 48D/405/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts of the IEC 62610 series can be found, under the general title Mechanical
structures for electronic equipment – Thermal management for cabinets in accordance with
IEC 60297 and IEC 60917 series, on the IEC website.
The committee has decided that the contents of this publication will remain unchanged until
the maintenance result date indicated on the IEC web site under "http://webstore.iec.ch" in
the data related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this standard may be issued at a later date.

IMPORTANT – The “colour
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