IEC 61967-4:2021
(Main)Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
Integrated circuits - Measurement of electromagnetic emissions - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
IEC 61967-4:2021 is available as IEC 61967-4:2021 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.IEC 61967-4:2021 specifies a method to measure the conducted electromagnetic emission (EME) of integrated circuits by direct radio frequency (RF) current measurement with a 1 Ω resistive probe and RF voltage measurement using a 150 Ω coupling network. These methods ensure a high degree of reproducibility and correlation of EME measurement results. This edition includes the following significant technical changes with respect to the previous edition:
- frequency range of 150 kHz to 1 GHz has been deleted from the title;
- recommended frequency range for 1 Ω method has been reduced to 30 MHz;
- Annex G with recommendations and guidelines for frequency range extension beyond 1 GHz has been added.
Circuits intégrés - Mesure des émissions électromagnétiques - Partie 4: Mesure des émissions conduites - Méthode par couplage direct 1 ohm/150 ohms
IEC 61967-4:2021 est disponible sous forme de IEC 61967-4:2021 RLV qui contient la Norme internationale et sa version Redline, illustrant les modifications du contenu technique depuis l'édition précédente.
L’IEC 61967-4:2021 spécifie une méthode de mesure de l’émission électromagnétique (EME) conduite des circuits intégrés par mesure directe des courants RF avec une sonde résistive de 1 Ω et mesure des tensions RF en utilisant un réseau de couplage de 150 Ω. Ces méthodes assurent un degré élevé de reproductibilité, ainsi que la corrélation des résultats des mesures EME. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
- la gamme de fréquences de 150 kHz à 1 GHz a été supprimée du titre;
- la gamme de fréquences recommandée pour la méthode à 1 Ω a été réduite à 30 MHz;
- l’Annexe G avec les recommandations et les lignes directrices pour l’extension de gamme de fréquences au-dessus de 1 GHz a été ajoutée.
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IEC 61967-4 ®
Edition 2.0 2021-03
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1
Ghz –
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling
method
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
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International Standards for all electrical, electronic and related technologies.
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IEC 61967-4 ®
Edition 2.0 2021-03
REDLINE VERSION
INTERNATIONAL
STANDARD
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to 1
Ghz –
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling
method
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.200 ISBN 978-2-8322-9590-8
– 2 – IEC 61967-4:2021 RLV © IEC:2021
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General . 8
4.1 Measurement basics . 8
4.2 RF current measurement . 9
4.3 RF voltage measurement at IC pins . 9
4.4 Assessment of the measurement technique . 10
5 Test conditions . 10
6 Test equipment . 10
6.1 Test receiver specification RF measuring instrument . 10
6.2 RF current probe specification . 10
6.3 Test of the RF current probe capability . 11
6.4 Matching network specification . 11
7 Test setup . 12
7.1 General test configuration . 12
7.2 Printed circuit test board layout . 12
8 Test procedure . 13
9 Test report . 13
Annex A (normative informative) Probe calibration verification procedure . 15
Annex B (informative) Classification of conducted emission levels . 19
B.1 Introductory remark . 19
B.2 General . 19
B.3 Definition of emission levels . 19
B.4 Presentation of results . 19
B.4.1 General . 19
B.4.2 Examples. 21
Annex C (informative) Example of reference levels for automotive applications. 23
C.1 Introductory remark . 23
C.2 General . 23
C.3 Reference levels . 23
C.3.1 General . 23
C.3.2 Measurements of conducted emissions, 1 Ω method . 24
C.3.3 Measurements of conducted emissions, 150 Ω method . 24
Annex D (informative) EMC requirements and how to use EMC IC measurement
techniques . 25
D.1 Introduction Introductory remark . 25
D.2 Using EMC measurement procedures . 25
D.3 Assessment of the IC influence to the EMC behaviour of the modules . 25
Annex E (informative) Example of a test setup consisting of an EMC main test board
and an EME IC test board . 27
E.1 Introductory remark . 27
E.2 EMC main test board . 27
E.3 EME IC test board. 29
E.3.1 General explanation of the test board . 29
E.3.2 How to build the test system . 29
E.3.3 PCB layout and component positioning . 31
Annex F (informative) 150 Ω direct coupling networks for common mode emission
measurements of differential mode data transfer ICs and similar circuits . 33
F.1 Basic direct coupling network . 33
F.2 Example of a common-mode coupling network alternative for high speed
CAN or LVDS or RS485 or similar systems . 34
F.3 Example of a common-mode coupling network alternative for differential IC
outputs to resistive loads (e.g. airbag ignition driver) . 35
F.4 Example of a common-mode coupling network for fault tolerant CAN
systems . 35
Annex G (informative) Measurement of conducted emissions in extended frequency
range . 37
G.1 General . 37
G.2 Guidelines . 37
G.2.1 Measurement network . 37
G.2.2 Network components . 38
G.2.3 Network layout . 40
G.2.4 Network verification . 40
G.2.5 Test board . 41
G.3 Application area . 43
Bibliography . 45
Figure 1 – Example of two emitting loops returning to the IC via common ground . 8
Figure 2 – Example of IC with two ground pins, a small I/O loop and two emitting loops . 9
Figure 3 – Construction of the1 Ω RF current probe . 10
Figure 4 – Impedance matching network corresponding with IEC 61000-4-6 . 12
Figure 5 – General test configuration . 12
Figure A.1 – Test circuit . 15
Figure A.2 – Insertion loss of the 1 Ω probe . 16
Figure A.3 – Layout of the calibration verification test circuit . 17
Figure A.4 – Connection of the calibration verification test circuit . 17
Figure A.5 – Minimum decoupling limit versus frequency . 18
Figure A.6 – Example of 1 Ω probe input impedance characteristic . 18
Figure B.1 – Emission level scheme. 20
Figure B.2 – Example of the maximum emission level G8f . 21
Figure C.1 – 1 Ω method − Examples of reference levels for conducted disturbances
from semiconductors (peak detector) . 24
Figure C.2 – 150 Ω method − Examples of reference levels for conducted disturbances
from semiconductors (peak detector) . 24
Figure E.1 – EMC main test board . 28
Figure E.2 – Jumper field . 28
Figure E.3 – EME IC test board (contact areas for the spring connector pins of the
main test board) . 29
Figure E.4 – Example of an EME IC test system . 30
Figure E.5 – Component side of the EME IC test board . 31
– 4 – IEC 61967-4:2021 RLV © IEC:2021
Figure E.6 – Bottom side of the EME IC test board . 32
Figure F.1 – Basic direct coupling for common mode EMC measurements . 33
Figure F.2 – Measurement setup for the S21 measurement of the common-mode
coupling . 34
Figure F.3 – Using split load termination as coupling for measuring equipment . 34
Figure F.4 – Using split load termination as coupling for measuring equipment . 35
Figure F.5 – Example of an acceptable adaptation for special network requirements
(e.g. for
...
IEC 61967-4 ®
Edition 2.0 2021-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling
method
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 4: Mesure des émissions conduites – Méthode par couplage direct
1 Ω/150 Ω
All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form
or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from
either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC
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CH-1211 Geneva 20 www.iec.ch
Switzerland
About the IEC
The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes
International Standards for all electrical, electronic and related technologies.
About IEC publications
The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the
latest edition, a corrigendum or an amendment might have been published.
IEC publications search - webstore.iec.ch/advsearchform IEC online collection - oc.iec.ch
The advanced search enables to find IEC publications by a Discover our powerful search engine and read freely all the
variety of criteria (reference number, text, technical publications previews. With a subscription you will always
committee, …). It also gives information on projects, replaced have access to up to date content tailored to your needs.
and withdrawn publications.
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Stay up to date on all new IEC publications. Just Published
containing more than 22 000 terminological entries in English
details all new publications released. Available online and
and French, with equivalent terms in 18 additional languages.
once a month by email.
Also known as the International Electrotechnical Vocabulary
(IEV) online.
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IEC 61967-4 ®
Edition 2.0 2021-03
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions –
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling
method
Circuits intégrés – Mesure des émissions électromagnétiques –
Partie 4: Mesure des émissions conduites – Méthode par couplage direct
1 Ω/150 Ω
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 978-2-8322-9568-7
– 2 – IEC 61967-4:2021 © IEC:2021
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 7
4 General . 7
4.1 Measurement basics . 7
4.2 RF current measurement . 9
4.3 RF voltage measurement at IC pins . 9
4.4 Assessment of the measurement technique . 9
5 Test conditions . 9
6 Test equipment . 10
6.1 RF measuring instrument . 10
6.2 RF current probe specification . 10
6.3 Test of the RF current probe capability . 11
6.4 Matching network specification . 11
7 Test setup . 12
7.1 General test configuration . 12
7.2 Printed circuit test board layout . 12
8 Test procedure . 13
9 Test report . 13
Annex A (informative) Probe verification procedure . 14
Annex B (informative) Classification of conducted emission levels . 18
B.1 Introductory remark . 18
B.2 General . 18
B.3 Definition of emission levels . 18
B.4 Presentation of results . 18
B.4.1 General . 18
B.4.2 Examples. 20
Annex C (informative) Example of reference levels for automotive applications. 22
C.1 Introductory remark . 22
C.2 General . 22
C.3 Reference levels . 22
C.3.1 General . 22
C.3.2 Measurements of conducted emissions, 1 Ω method . 23
C.3.3 Measurements of conducted emissions, 150 Ω method . 23
Annex D (informative) EMC requirements and how to use EMC IC measurement
techniques . 24
D.1 Introductory remark . 24
D.2 Using EMC measurement procedures . 24
D.3 Assessment of the IC influence to the EMC behaviour of the modules . 24
Annex E (informative) Example of a test setup consisting of an EMC main test board
and an EME IC test board . 26
E.1 Introductory remark . 26
E.2 EMC main test board . 26
E.3 EME IC test board. 28
E.3.1 General explanation of the test board . 28
E.3.2 How to build the test system . 28
E.3.3 PCB layout and component positioning . 30
Annex F (informative) 150 Ω direct coupling networks for common mode emission
measurements of differential mode data transfer ICs and similar circuits . 32
F.1 Basic direct coupling network . 32
F.2 Example of a common-mode coupling network alternative for LVDS or
RS485 or similar systems . 33
F.3 Example of a common-mode coupling network alternative for differential IC
outputs to resistive loads (e.g. airbag ignition driver) . 34
F.4 Example of a common-mode coupling network for CAN systems . 34
Annex G (informative) Measurement of conducted emissions in extended frequency
range . 35
G.1 General . 35
G.2 Guidelines . 35
G.2.1 Measurement network . 35
G.2.2 Network components . 36
G.2.3 Network layout . 38
G.2.4 Network verification . 38
G.2.5 Test board . 39
G.3 Application area . 41
Bibliography . 43
Figure 1 – Example of two emitting loops returning to the IC via common ground . 8
Figure 2 – Example of IC with two ground pins, a small I/O loop and two emitting loops . 8
Figure 3 – Construction of the 1 Ω RF current probe . 10
Figure 4 – Impedance matching network corresponding with IEC 61000-4-6 . 12
Figure 5 – General test configuration . 12
Figure A.1 – Test circuit . 14
Figure A.2 – Insertion loss of the 1 Ω probe .
...
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