IEC 60747-5-5:2020
(Main)Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers
IEC 60747-5-5:2020 specifies the terminology, essential ratings, characteristics, safety tests, as well as the measuring methods for photocouplers.
Note: The term "optocoupler" can also be used instead of "photocoupler".
This edition includes the following significant technical changes with respect to the previous edition:
a) optional data sheet basic insulation rating in accordance with IEC 60664-1:2007, 6.1.3.5;
b) editorial corrections on the use of VIORM;
c) editorial corrections on Figure 2: Time intervals for method b);
d) addition of an alternative surge pulse VIOSM test method.
Dispositifs à semiconducteurs - Partie 5-5: Dispositifs optoélectroniques - Photocoupleurs
L’IEC 60747-5-5:2020 spécifie la terminologie, les valeurs assignées essentielles, les caractéristiques, les essais de sécurité, ainsi que les méthodes de mesure pour les photocoupleurs.
NOTE Le terme "optocoupleur" peut aussi être employé à la place de "photocoupleur".
Cette édition inclut les modifications techniques majeures suivantes par rapport à l’édition précédente:
a) valeur assignée de l’isolation principale, élément facultatif de la fiche technique, consignée conformément à l’IEC 60664-1:2007, 6.1.3.5;
b) corrections éditoriales relatives à l’utilisation de VIORM;
c) corrections éditoriales à la Figure 2: Intervalles de temps pour la méthode b);
d) ajout d’une méthode d’essai en variante pour l’impulsion de tension d’isolement de surcharge VIOSM.
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IEC 60747-5-5
®
Edition 2.0 2020-07
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 5-5: Optoelectronic devices – Photocouplers
IEC 60747-5-5:2020-07(en)
---------------------- Page: 1 ----------------------
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IEC 60747-5-5
®
Edition 2.0 2020-07
INTERNATIONAL
STANDARD
Semiconductor devices –
Part 5-5: Optoelectronic devices – Photocouplers
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.01; 31.260 ISBN 978-2-8322-8602-9
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC 60747-5-5:2020 © IEC 2020
CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
3.7 Symbols for limiting values (absolute maximum system) over the operating
temperature range, unless otherwise stated . 16
4 Electrical characteristics . 16
4.1 Phototransistor output photocoupler . 16
4.2 Phototriac output photocoupler or solid state opto-relay . 17
5 Photocouplers providing protection against electric shock . 18
5.1 General . 18
5.2 Type . 18
5.3 Ratings . 18
5.3.1 Datasheet ratings . 18
5.3.2 Safety ratings . 18
5.3.3 Functional ratings . 18
5.3.4 Rated isolation voltages . 18
5.4 Electrical safety requirements . 18
5.5 Electrical, environmental and/or endurance test information (supplementary
information) . 19
5.5.1 Test and test sequence . 19
5.5.2 Routine test . 19
5.5.3 Sample test . 20
5.5.4 Type test . 20
6 Measuring methods for photocouplers . 27
6.1 Current transfer ratio H . 27
f(ctr)
6.2 Input-to-output capacitance C . 28
IO
6.3 Isolation resistance between input and output R . 29
IO
6.4 Isolation test . 30
6.5 Partial discharges of photocouplers . 31
6.6 Collector-emitter saturation voltage V of a photocoupler . 34
CE(sat)
6.6.1 Collector-emitter saturation voltage (DC method) . 34
6.6.2 Collector-emitter saturation voltage (pulse method) . 34
6.7 Switching times t t of a photocoupler . 35
on, off
6.8 Peak off-state current I . 37
DRM
6.9 Peak on-state voltage V . 39
TM
6.10 DC off-state current I . 41
BD
6.11 DC on-state voltage V . 42
T
6.12 Holding current I . 42
H
6.13 Critical rate of rise of off-state voltage dV/dt . 43
6.14 Trigger input current I . 46
FT
6.15 Measuring methods of common mode transient immunity (CMTI) for
photocouplers . 47
7 Testing methods of electrical ratings for phototriac couplers . 49
7.1 Repetitive peak off-state voltage V . 49
DRM
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IEC 60747-5-5:2020 © IEC 2020 – 3 –
7.2 DC off-state voltage V . 50
BD
Annex A (normative) Input/output safety test . 51
A.1 Purpose . 51
A.2 Circuit diagram . 51
A.3 Circuit description . 51
A.4 Precautions to be observed . 51
A.5 Measurement procedure . 51
A.6 Specified conditions . 51
Bibliography . 52
Figure 1 – Time intervals for method a) . 12
Figure 2 – Time intervals for method b) . 13
Figure 3 – Test voltage . 15
Figure 4 – Measurement circuit . 27
Figure 5 – Measurement circuit for input to output capacitance . 29
Figure 6 – Measurement circuit for isolation resistance . 29
Figure 7 – Test circuit for withstanding isolation voltage . 30
Figure 8 – Partial discharge test circuit . 31
Figure 9 – Complete test arrangement connections for calibration . 32
Figure 10 – DC measurement circuit . 34
Figure 11 – Pulse measurement circuit . 35
Figure 12 – Switching time measurement circuit . 36
Figure 13 – Switching times . 37
Figure 14 – Measurement circuit for peak off-state current . 38
Figure 15 – Waveforms of the peak off-state voltage and current . 39
Figure 16 – Measurement circuit for peak on-state voltage . 40
Figure 17 – Waveforms of the peak on-state voltage and current . 41
Figure 18 – Measurement circuit for DC off-state current . 41
Figure 19 – Measurement circuit for DC on-state voltage . 42
Figure 20 – Measurement circuit for holding current . 43
Figure 21 – Measurement circuit for critical rate of rise of off-state voltage . 44
Figure 22 – Exponential waveform of the off-voltage (V ) . 45
D
Figure 23 – Linear pulse form of the off-voltage (V ) . 45
D
Figure 24 – Measurement circuit for the trigger input current . 46
Figure 25 – Output terminal voltage versus input forward current . 46
Figure 26 – Common mode transient immunity (CMTI) measurement circuit for
photocoupler . 47
Figure 27 – Typical waveforms of the common mode pulse (V ) and photocoupler
CM
output (V ). 49
O
Figure A.1 – Circuit diagram . 51
Table 1 – Phototransistor electrical characteristics . 16
Table 2 – Phototriac electrical characteristics . 17
Table 3 – Datasheet characteristics . 19
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Table 4 – Tests and test sequence for photocoupler providing protection against
electrical shock . 26
Table 5 – Test conditions . 27
Table 6 – Specified conditions for methods a) and b) . 33
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IEC 60747-5-5:2020 © IEC 2020 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 5-5: Optoelectronic devices –
Photocouplers
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
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agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
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3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
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5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
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6) All users should ensure that they have the latest edition of this publication.
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-5-5 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2007 and
Amendment 1:2013. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) optional data sheet basic insulation rating in accordance with IEC 60664-1:2007, 6.1.3.5;
b) editorial corrections on the use of V ;
IORM
c) editorial corrections on Figure 2: Time intervals for method b);
d) addition of an alternative surge pulse V test method.
IOSM
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– 6 – IEC 60747-5-5:2020 © IEC 2020
The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/706/FDIS 47E/714/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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IEC 60747-5-5:2020 © IEC 2020 – 7 –
SEMICONDUCTOR DEVICES –
Part 5-5: Optoelectronic devices –
Photocouplers
1 Scope
This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety
tests, as well as the measuring methods for photocouplers.
NOTE The term "optocoupler" can also be used instead of "photocoupler".
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-17, Basic environmental testing procedures – Part 2-17: Tests – Test Q: Sealing
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60112, Method for the determination of the proof and the comparative tracking indices of
solid insulating materials
IEC 60216-1, Electrical insulating materials – Thermal endurance properties – Part 1: Ageing
procedures and evaluation of test results
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– 8 – IEC 60747-5-5:2020 © IEC 2020
IEC 60216-2, Electrical insulating materials – Thermal endurance properties – Part 2:
Determination of thermal endurance properties of electrical insulating materials – Choice of
test criteria
IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:
Principles, requirements and tests
IEC 60672-2, Ceramic and glass insulating materials – Part 2: Methods of test
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method –
Apparatus, confirmatory test arrangement and guidance
IEC 61000-4-5, Electromagnetic compatibility (EMC) – Part 4-5: Testing and measurement
techniques – Surge immunity test
IEC 62368-1:2018, Audio/video, information and communication technology equipment –
Part 1: Safety requirements
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses: ISO and IEC maintain terminological databases for use in standardization at the
following addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
photocoupler
optoelectronic device designed for the transfer of electrical signals by utilizing optical
radiation to provide coupling with electrical isolation between the input and the output
Note 1 to entry: Different types of photocouplers include ambient-rated or case-rated photocouplers, for
signal-isolation applications.
3.1.1
DC input photocoupler
photocoupler consisting at the input of a photoemitter to which DC current is applied
3.1.2
AC input photocoupler
photocoupler consisting at the input of antiparallel photoemitters to which AC current is
applied
3.1.3
phototransistor output photocoupler
photocoupler whose photosensitive element is a phototransistor
Note 1 to entry: Phototransistor is a transistor in which the current produced by the photoelectric effect in the
neighbourhood of the emitter-base junction acts as base current, which is amplified.
3.1.4
photothyristor photocoupler
photocoupler whose photosensitive element is a photothyristor
Note 1 to entry: Photothyristor is a thyristor that is designed to be triggered by optical radiation.
Note 2 to entry: Gate terminal may or may not be provided.
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IEC 60747-5-5:2020 © IEC 2020 – 9 –
3.1.5
phototriac output photocoupler
photocoupler whose photosensitive element is a phototriac and photocoupler whose
photosensitive element is a phototriac and output is triac
Note 1 to entry: A phototriac is a triac that is designed to be triggered by optical radiation.
3.1.6
IC photocoupler
photocoupler whose photosensitive element is a photodiode/phototransistor and an integrated
circuit
3.1.7
FET photocoupler
photocoupler with one or more field-effect transistors (FETs) in the output stage
Note 1 to entry: A FET is activated by photoemitter by direct optical radiation from a photoemitter.
3.1.8
photodiode photocoupler
photocoupler whose photosensitive element is a photodiode or photodiode array
3.1.9
IC input photocoupler
photocoupler whose input element consists of an integrated circuit and a photoemitter
3.1.10
solid state opto-relay
photocoupler whose output switches digitally without requiring a supply voltage
Note 1 to entry: The term "solid state opto-relay" includes photorelay, photothyristor photocoupler, phototriac
photocoupler and FET/IGBT photocoupler.
3.1.11
current transfer ratio
H
f(ctr)
ratio of the DC output current to the DC input current, the output voltage being held constant
Note 1 to entry: The abbreviated term CTR (DC) is sometimes used instead of a symbol.
3.1.12
small-signal short-circuit forward current transfer ratio
h
f(ctr)
ratio of the AC output current to the AC input current, the output being short-circuited to AC
Note 1 to entry: The abbreviated term CTR (AC) is sometimes used instead of a symbol.
3.2
cut-off frequency
f
co
frequency at which the modulus of the small-signal current transfer ratio has decreased to
1 2 of its low-frequency value
3.3
input-to-output capacitance
C
IO
total capacitance between all input terminals or pins connected together and all output
terminals or pins connected together
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– 10 – IEC 60747-5-5:2020 © IEC 2020
3.4
isolation resistance
R
IO
resistance between all input terminals or pins connected together and all output terminals or
pins connected together
3.4.1
repetitive peak off-state voltage for phototriac output and/or solid state opto-relay with
triac output
V
DRM
maximum applicable repetitive peak reverse voltage between anode and cathode in off-state
under specified gate conditions
3.4.2
peak off-state current
I
DRM
forward leakage current between the off-state output terminals under specified conditions
3.4.3
peak on-state voltage
V
TM
peak forward voltage between on-state output terminals under specified conditions
3.4.4
DC off-state current
I
BD
forward leakage current between off-state output terminals under specified conditions
3.4.5
DC on-state voltage
V
T
DC forward voltage between on-state output terminals under specified conditions, when the
specified forward current is applied between on-state output terminals
3.4.6
holding current
I
H
minimum on-state current in output to maintain the on-state under specified conditions
3.4.7
critical rate of rise of off-state voltage
dV/dt
rate of rise of off-state voltage just before the transition from off-state to on-state under the
specified operating conditions
3.4.8
trigger input current
I
FT
minimum input forward current to switch from off-state to on-state in output under specified
conditions
3.5
common mode transient immunity
CMTI
maximum tolerable rate of rise (or fall) of a common mode voltage (V ), the specification of
CM
which should include the amplitude of the common mode pulse (V ), which is applied across
CM
the two grounds of the photocoupler and should not exceed the maximum rated transient
isolation voltage specification of the photocoupler as defined by the V
IOTM
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IEC 60747-5-5:2020 © IEC 2020 – 11 –
3.6
photocoupler providing protection against electric shock
photocoupler which has been subjected to operating conditions (safety ratings) that exceed
the specified ratings (limiting values) for normal operation
3.6.1
safety rating
˂of a photocoupler˃ electrical, thermal, and mechanical operating conditions that exceed the
specified ratings for reinforced isolation (limiting values) for normal operation, and to which
the specified safety requirements refer
3.6.2
electrical safety requirement
˂of a photocoupler˃ electrical requirements for reinforced or double insulation that have to be
met and maintained after the photocoupler has been subjected to specified safety ratings, to
ensure protection against electrical shock
Note 1 to entry: The photocoupler may become permanently inoperative when safety ratings are applied.
Note 2 to entry: For the definition of double and reinforced insulation, see 3.17.4 and 3.17.5 of IEC 60664-1:2007.
3.6.3
partial discharge
p
d
localized electrical discharge which occurs in the insulation between input and output
terminals of the photocoupler
Note 1 to entry: For the technical details of partial discharge, see 3.1 of IEC 60270:2000.
3.6.4
apparent charge
q
electrical charge caused by a partial discharge in the photocoupler
3.6.5
threshold apparent charge
q
TH
specified value of apparent charge that is as small as technically feasible and to which
measured values of the partial-discharge inception voltage or extinction voltage, respectively,
refer
Note 1 to entry: A threshold apparent charge of 5 pC was found to be a practicable criterion for a photocoupler.
Otherwise it should be defined on each individual device desi
...
IEC 60747-5-5
®
Edition 2.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 5-5: Optoelectronic devices – Photocouplers
Dispositifs à semiconducteurs –
Partie 5-5: Dispositifs optoélectroniques – Photocoupleurs
IEC 60747-5-5:2020-07(en-fr)
---------------------- Page: 1 ----------------------
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IEC 60747-5-5
®
Edition 2.0 2020-07
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Semiconductor devices –
Part 5-5: Optoelectronic devices – Photocouplers
Dispositifs à semiconducteurs –
Partie 5-5: Dispositifs optoélectroniques – Photocoupleurs
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.080.01; 31.260 ISBN 978-2-8322-1001-4
Warning! Make sure that you obtained this publication from an authorized distributor.
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CONTENTS
FOREWORD . 5
1 Scope . 7
2 Normative references . 7
3 Terms and definitions . 8
3.7 Symbols for limiting values (absolute maximum system) over the operating
temperature range, unless otherwise stated . 16
4 Electrical characteristics . 16
4.1 Phototransistor output photocoupler . 16
4.2 Phototriac output photocoupler or solid state opto-relay . 17
5 Photocouplers providing protection against electric shock . 18
5.1 General . 18
5.2 Type . 18
5.3 Ratings . 18
5.3.1 Datasheet ratings . 18
5.3.2 Safety ratings . 18
5.3.3 Functional ratings . 18
5.3.4 Rated isolation voltages . 18
5.4 Electrical safety requirements . 18
5.5 Electrical, environmental and/or endurance test information (supplementary
information) . 19
5.5.1 Test and test sequence . 19
5.5.2 Routine test . 19
5.5.3 Sample test . 20
5.5.4 Type test . 20
6 Measuring methods for photocouplers . 27
6.1 Current transfer ratio H . 27
f(ctr)
6.2 Input-to-output capacitance C . 28
IO
6.3 Isolation resistance between input and output R . 29
IO
6.4 Isolation test . 30
6.5 Partial discharges of photocouplers . 31
6.6 Collector-emitter saturation voltage V of a photocoupler . 34
CE(sat)
6.6.1 Collector-emitter saturation voltage (DC method) . 34
6.6.2 Collector-emitter saturation voltage (pulse method) . 34
6.7 Switching times t t of a photocoupler . 35
on, off
6.8 Peak off-state current I . 37
DRM
6.9 Peak on-state voltage V . 39
TM
6.10 DC off-state current I . 41
BD
6.11 DC on-state voltage V . 42
T
6.12 Holding current I . 42
H
6.13 Critical rate of rise of off-state voltage dV/dt . 43
6.14 Trigger input current I . 46
FT
6.15 Measuring methods of common mode transient immunity (CMTI) for
photocouplers . 47
7 Testing methods of electrical ratings for phototriac couplers . 49
7.1 Repetitive peak off-state voltage V . 49
DRM
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IEC 60747-5-5:2020 © IEC 2020 – 3 –
7.2 DC off-state voltage V . 50
BD
Annex A (normative) Input/output safety test . 51
A.1 Purpose . 51
A.2 Circuit diagram . 51
A.3 Circuit description . 51
A.4 Precautions to be observed . 51
A.5 Measurement procedure . 51
A.6 Specified conditions . 51
Bibliography . 52
Figure 1 – Time intervals for method a) . 12
Figure 2 – Time intervals for method b) . 13
Figure 3 – Test voltage . 15
Figure 4 – Measurement circuit . 27
Figure 5 – Measurement circuit for input to output capacitance . 29
Figure 6 – Measurement circuit for isolation resistance . 29
Figure 7 – Test circuit for withstanding isolation voltage . 30
Figure 8 – Partial discharge test circuit . 31
Figure 9 – Complete test arrangement connections for calibration . 32
Figure 10 – DC measurement circuit . 34
Figure 11 – Pulse measurement circuit . 35
Figure 12 – Switching time measurement circuit . 36
Figure 13 – Switching times . 37
Figure 14 – Measurement circuit for peak off-state current . 38
Figure 15 – Waveforms of the peak off-state voltage and current . 39
Figure 16 – Measurement circuit for peak on-state voltage . 40
Figure 17 – Waveforms of the peak on-state voltage and current . 41
Figure 18 – Measurement circuit for DC off-state current . 41
Figure 19 – Measurement circuit for DC on-state voltage . 42
Figure 20 – Measurement circuit for holding current . 43
Figure 21 – Measurement circuit for critical rate of rise of off-state voltage . 44
Figure 22 – Exponential waveform of the off-voltage (V ) . 45
D
Figure 23 – Linear pulse form of the off-voltage (V ) . 45
D
Figure 24 – Measurement circuit for the trigger input current . 46
Figure 25 – Output terminal voltage versus input forward current . 46
Figure 26 – Common mode transient immunity (CMTI) measurement circuit for
photocoupler . 47
Figure 27 – Typical waveforms of the common mode pulse (V ) and photocoupler
CM
output (V ). 49
O
Figure A.1 – Circuit diagram . 51
Table 1 – Phototransistor electrical characteristics . 16
Table 2 – Phototriac electrical characteristics . 17
Table 3 – Datasheet characteristics . 19
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Table 4 – Tests and test sequence for photocoupler providing protection against
electrical shock . 26
Table 5 – Test conditions . 27
Table 6 – Specified conditions for methods a) and b) . 33
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IEC 60747-5-5:2020 © IEC 2020 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
Part 5-5: Optoelectronic devices –
Photocouplers
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "IEC
Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested
in the subject dealt with may participate in this preparatory work. International, governmental and non-
governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely
with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.
2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.
3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
misinterpretation by any end user.
4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications
transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
the latter.
5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity
assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.
6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
members of its technical committees and IEC National Committees for any personal injury, property damage or
other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.
8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 60747-5-5 has been prepared by subcommittee 47E: Discrete
semiconductor devices, of IEC technical committee 47: Semiconductor devices.
This second edition cancels and replaces the first edition published in 2007 and
Amendment 1:2013. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous
edition:
a) optional data sheet basic insulation rating in accordance with IEC 60664-1:2007, 6.1.3.5;
b) editorial corrections on the use of V ;
IORM
c) editorial corrections on Figure 2: Time intervals for method b);
d) addition of an alternative surge pulse V test method.
IOSM
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The text of this International Standard is based on the following documents:
FDIS Report on voting
47E/706/FDIS 47E/714/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 60747 series, published under the general title Semiconductor
devices, can be found on the IEC website.
Future standards in this series will carry the new general title as cited above. Titles of existing
standards in this series will be updated at the time of the next edition.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to
the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
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IEC 60747-5-5:2020 © IEC 2020 – 7 –
SEMICONDUCTOR DEVICES –
Part 5-5: Optoelectronic devices –
Photocouplers
1 Scope
This part of IEC 60747 specifies the terminology, essential ratings, characteristics, safety
tests, as well as the measuring methods for photocouplers.
NOTE The term "optocoupler" can also be used instead of "photocoupler".
2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.
IEC 60068-1:2013, Environmental testing – Part 1: General and guidance
IEC 60068-2-1, Environmental testing – Part 2-1: Tests – Test A: Cold
IEC 60068-2-2, Environmental testing – Part 2-2: Tests – Test B: Dry heat
IEC 60068-2-6, Environmental testing – Part 2-6: Tests – Test Fc: Vibration (sinusoidal)
IEC 60068-2-14, Environmental testing – Part 2-14: Tests – Test N: Change of temperature
IEC 60068-2-17, Basic environmental testing procedures – Part 2-17: Tests – Test Q: Sealing
IEC 60068-2-20, Environmental testing – Part 2-20: Tests – Test T: Test methods for
solderability and resistance to soldering heat of devices with leads
IEC 60068-2-27, Environmental testing – Part 2-27: Tests – Test Ea and guidance: Shock
IEC 60068-2-30, Environmental testing – Part 2-30: Tests – Test Db: Damp heat, cyclic
(12 h + 12 h cycle)
IEC 60068-2-58, Environmental testing – Part 2-58: Tests – Test Td: Test methods for
solderability, resistance to dissolution of metallization and to soldering heat of surface
mounting devices (SMD)
IEC 60068-2-78, Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady
state
IEC 60112, Method for the determination of the proof and the comparative tracking indices of
solid insulating materials
IEC 60216-1, Electrical insulating materials – Thermal endurance properties – Part 1: Ageing
procedures and evaluation of test results
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IEC 60216-2, Electrical insulating materials – Thermal endurance properties – Part 2:
Determination of thermal endurance properties of electrical insulating materials – Choice of
test criteria
IEC 60664-1:2007, Insulation coordination for equipment within low-voltage systems – Part 1:
Principles, requirements and tests
IEC 60672-2, Ceramic and glass insulating materials – Part 2: Methods of test
IEC 60695-11-5, Fire hazard testing – Part 11-5: Test flames – Needle-flame test method –
Apparatus, confirmatory test arrangement and guidance
IEC 61000-4-5, Electromagnetic compatibility (EMC) – Part 4-5: Testing and measurement
techniques – Surge immunity test
IEC 62368-1:2018, Audio/video, information and communication technology equipment –
Part 1: Safety requirements
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminological databases for use in standardization at the following
addresses: ISO and IEC maintain terminological databases for use in standardization at the
following addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp
3.1
photocoupler
optoelectronic device designed for the transfer of electrical signals by utilizing optical
radiation to provide coupling with electrical isolation between the input and the output
Note 1 to entry: Different types of photocouplers include ambient-rated or case-rated photocouplers, for
signal-isolation applications.
3.1.1
DC input photocoupler
photocoupler consisting at the input of a photoemitter to which DC current is applied
3.1.2
AC input photocoupler
photocoupler consisting at the input of antiparallel photoemitters to which AC current is
applied
3.1.3
phototransistor output photocoupler
photocoupler whose photosensitive element is a phototransistor
Note 1 to entry: Phototransistor is a transistor in which the current produced by the photoelectric effect in the
neighbourhood of the emitter-base junction acts as base current, which is amplified.
3.1.4
photothyristor photocoupler
photocoupler whose photosensitive element is a photothyristor
Note 1 to entry: Photothyristor is a thyristor that is designed to be triggered by optical radiation.
Note 2 to entry: Gate terminal may or may not be provided.
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IEC 60747-5-5:2020 © IEC 2020 – 9 –
3.1.5
phototriac output photocoupler
photocoupler whose photosensitive element is a phototriac and photocoupler whose
photosensitive element is a phototriac and output is triac
Note 1 to entry: A phototriac is a triac that is designed to be triggered by optical radiation.
3.1.6
IC photocoupler
photocoupler whose photosensitive element is a photodiode/phototransistor and an integrated
circuit
3.1.7
FET photocoupler
photocoupler with one or more field-effect transistors (FETs) in the output stage
Note 1 to entry: A FET is activated by photoemitter by direct optical radiation from a photoemitter.
3.1.8
photodiode photocoupler
photocoupler whose photosensitive element is a photodiode or photodiode array
3.1.9
IC input photocoupler
photocoupler whose input element consists of an integrated circuit and a photoemitter
3.1.10
solid state opto-relay
photocoupler whose output switches digitally without requiring a supply voltage
Note 1 to entry: The term "solid state opto-relay" includes photorelay, photothyristor photocoupler, phototriac
photocoupler and FET/IGBT photocoupler.
3.1.11
current transfer ratio
H
f(ctr)
ratio of the DC output current to the DC input current, the output voltage being held constant
Note 1 to entry: The abbreviated term CTR (DC) is sometimes used instead of a symbol.
3.1.12
small-signal short-circuit forward current transfer ratio
h
f(ctr)
ratio of the AC output current to the AC input current, the output being short-circuited to AC
Note 1 to entry: The abbreviated term CTR (AC) is sometimes used instead of a symbol.
3.2
cut-off frequency
f
co
frequency at which the modulus of the small-signal current transfer ratio has decreased to
1 2 of its low-frequency value
3.3
input-to-output capacitance
C
IO
total capacitance between all input terminals or pins connected together and all output
terminals or pins connected together
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3.4
isolation resistance
R
IO
resistance between all input terminals or pins connected together and all output terminals or
pins connected together
3.4.1
repetitive peak off-state voltage for phototriac output and/or solid state opto-relay with
triac output
V
DRM
maximum applicable repetitive peak reverse voltage between anode and cathode in off-state
under specified gate conditions
3.4.2
peak off-state current
I
DRM
forward leakage current between the off-state output terminals under specified conditions
3.4.3
peak on-state voltage
V
TM
peak forward voltage between on-state output terminals under specified conditions
3.4.4
DC off-state current
I
BD
forward leakage current between off-state output terminals under specified conditions
3.4.5
DC on-state voltage
V
T
DC forward voltage between on-state output terminals under specified conditions, when the
specified forward current is applied between on-state output terminals
3.4.6
...
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