IEC 61249-2-51:2023

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad

IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.

Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués - Matériaux de base pour bande support de carte à circuit intégré, non plaqués

L’IEC 61249-2-51:2023 spécifie les exigences relatives à la construction, aux matériaux et aux propriétés, ainsi qu’à l’assurance qualité, à l’emballage, au marquage et au stockage des matériaux de base pour bande support de carte à circuit intégré, non plaqués (ici désignés par matériaux de base pour bande support de CI).
Le présent document s’applique aux matériaux de base pour bande support de CI ; il s’agit d’un matériau recouvert de colle, un côté étant composé d’une sous-couche époxy renforcée en tissu de verre de type E, l’autre côté étant recouvert d’un adhésif et protégé par une pellicule antiadhésive.

General Information

• Status: Published
• Publication Date: 10-May-2023
• ICS: 31.180 - Printed circuits and boards
• Technical Committee: TC 91 - Electronics assembly technology
• Drafting Committee: WG 4 - TC 91/WG 4
• Current Stage: PPUB - Publication issued
• Start Date: 11-May-2023
• Completion Date: 09-Jun-2023

Overview

IEC 61249-2-51:2023 is an important international standard published by the International Electrotechnical Commission (IEC) that specifies the construction, material properties, quality assurance, packaging, marking, and storage requirements for base materials used in integrated circuit (IC) card carrier tapes. This standard focuses specifically on unclad reinforced base materials for IC carrier tapes, which consist of a glue-coated substrate with a woven E-glass reinforced epoxy underlayer on one side and an adhesive layer protected with release film on the other.

The purpose of IEC 61249-2-51:2023 is to ensure consistent quality and reliable performance of IC carrier tape base materials used in electronic assembly and packaging applications. It addresses both electrical and non-electrical characteristics that affect the functional integrity of these materials for safeguarding integrated circuits during manufacturing and transport.

Key Topics

• Material Construction
  Defines the specific layers of IC carrier tape base materials:

  • Woven E-glass reinforced epoxy underlayer providing mechanical strength
  • Adhesive coating on the opposite side
  • Protective release film coverage

• Electrical Properties
  Specifies electrical performance metrics vital for compatibility with electronic components, such as dielectric properties and insulation resistance.

• Mechanical and Physical Properties
  Includes requirements for tensile strength, elongation at break, peel strength, water absorption, and dimensional stability to ensure durability during handling and processing.

• Quality Assurance and Inspection
  Outlines rigorous testing protocols, including qualification and conformance inspections, to verify compliance with standards on a batch-by-batch basis. It also details the responsibilities of manufacturers for inspection and certification.

• Packaging and Storage
  Provides guidance on appropriate packaging, labeling, and storage conditions to protect materials from contamination or damage before use, ensuring material longevity and performance retention.

• Safety and Regulatory Compliance
  Covers safety data sheet (SDS) requirements for safe handling and environmental considerations aligned with global regulatory frameworks.

Applications

IEC 61249-2-51:2023 applies specifically to the manufacture and use of base materials for integrated circuit card carrier tape, which plays a crucial role in:

• IC packaging and handling
  Helps protect delicate integrated circuits during assembly lines by providing a stable carrier medium that can withstand mechanical stresses.

• Electronics manufacturing automation
  Serves as the substrate for tape-and-reel processes, facilitating automated placement of IC components with precision.

• Quality control in semiconductor production
  Standardizes material properties, reducing failures related to tape carrier defects, thus enhancing yield and reliability of semiconductor devices.

• Interconnect technology
  Integral in the production of printed circuit boards (PCBs) and related electronic interconnect structures requiring reinforced base materials.

Related Standards

IEC 61249-2-51:2023 is part of the broader IEC 61249 series focusing on Materials for printed boards and other interconnecting structures. Related standards address various types of reinforced base materials, clad and unclad, used in different PCB and interconnection applications, including:

• IEC 61249-2-41 - Reinforced base materials for printed boards (clad)
• IEC 61249-2-25 - Base materials for flexible printed boards
• IEC 61249-2-31 - Unclad base materials for rigid printed boards

Additionally, this standard complements other IEC guidelines on electronics assembly technology and quality assurance, supporting the global harmonization of protocols for electronic component carrier materials.

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Keywords: IEC 61249-2-51, IC carrier tape base materials, reinforced base materials, woven E-glass epoxy, adhesive layer, printed boards materials, integrated circuit packaging, electronics assembly standards, quality assurance electronics materials, international electrotechnical standards.

Standards Content (Sample)

IEC 61249-2-51 ®
Edition 1.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Materials for printed boards and other interconnecting structures –
Part 2-51: Reinforced base materials, clad and unclad – Base materials for
integrated circuit card carrier tape, unclad

Matériaux pour circuits imprimés et autres structures d’interconnexion –
Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués – Matériaux de
base pour bande support de carte à circuit intégré, non plaqués

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IEC 61249-2-51 ®
Edition 1.0 2023-05
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
Materials for printed boards and other interconnecting structures –

Part 2-51: Reinforced base materials, clad and unclad – Base materials for

integrated circuit card carrier tape, unclad

Matériaux pour circuits imprimés et autres structures d’interconnexion –

Partie 2-51: Matériaux de base renforcés, plaqués et non plaqués – Matériaux de

base pour bande support de carte à circuit intégré, non plaqués

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.180 ISBN 978-2-8322-6969-5

– 2 – IEC 61249-2-51:2023 © IEC 2023
CONTENTS
FOREWORD . 4
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Construction and materials . 7
4.1 Construction . 7
4.2 Epoxide woven E-glass underlayer . 7
4.3 Adhesive . 7
4.4 Release film . 7
5 Electrical properties . 7
6 Non-electrical properties . 8
6.1 Appearance of the IC carrier tape base materials . 8
6.1.1 Delamination . 8
6.1.2 Colloidal particles and metallic particles in underlayer . 8
6.1.3 Colloidal particles in adhesive layer . 8
6.1.4 Scratches of adhesive . 8
6.1.5 Bubbles in underlayer . 8
6.1.6 Breakages and exposures of reinforcement fibre in underlayer . 8
6.2 Dimensional of IC carrier tape base materials . 8
6.2.1 Length and width . 8
6.2.2 Thickness of underlayer . 8
6.2.3 Thickness of adhesive layer . 8
6.3 Splices . 8
6.4 Glass transition temperature . 9
6.5 Surface properties of the underlayer side . 9
6.6 Tensile strength and elongation at break . 9
6.7 Water absorption . 9
6.8 Peel strength . 10
6.9 Resin flow . 10
7 Quality assurance . 10
7.1 Quality system . 10
7.2 Responsibility for inspection . 10
7.3 Positions of specimens on the sample . 10
7.4 Qualification inspection . 11
7.4.1 General . 11
7.4.2 Samples . 11
7.4.3 Frequency . 11
7.4.4 Criterion rule . 11
7.5 Quality conformance inspection . 12
7.5.1 General . 12
7.5.2 Inspection lot . 12
7.5.3 Group A inspection . 12
7.5.4 Group B inspection . 12
7.5.5 Group C inspection . 12
7.5.6 Criterion rule . 12
7.5.7 Rejected lots . 12

7.6 Certificate of conformance . 12
7.7 Safety data sheet . 12
8 Packaging, marking and storage . 13
8.1 Packaging, marking . 13
8.2 Storage, storage condition and shelf life . 13
Annex A (normative) Requirements for the preparation of samples of some
performance items . 14
A.1 Ordering information . 14
Annex B (informative) Engineering information . 15
B.1 General . 15
B.2 Chemical properties . 15
B.3 Electrical properties . 15
B.4 Mechanical properties . 15
B.5 Physical properties . 15
B.6 Thermal properties . 15
Bibliography . 16

Figure 1 – Construction of IC carrier tape base materials . 7

Table 1 – Electrical properties . 7
Table 2 – Glass transition temperature of underlayer . 9
Table 3 – roughness, glossiness(60°) and surface energy. 9
Table 4 – Tensile strength and elongation at break . 9
Table 5 – Water absorption . 9
Table 6 – Peel strength . 10
Table 7 – Resin flow . 10
Table 8 – Qualification and conformance inspection . 11
Table A.1 – Requirements for the preparation of samples of some performance items . 14

– 4 – IEC 61249-2-51:2023 © IEC 2023
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
MATERIALS FOR PRINTED BOARDS AND
OTHER INTERCONNECTING STRUCTURES –

Part 2-51: Reinforced base materials clad and unclad – Base
materials for integrated circuit card carrier tape, unclad

FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international
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8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.
9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent
rights. IEC shall not be held responsible for identifying any or all such patent rights.
IEC 61249-2-51 has been prepared by IEC technical committee 91, Electronics assembly
technology. It is an International Standard.
The text of this International Standard is based on the following documents:
Draft Report on voting
91/1847/FDIS 91/1865/RVD
Full information on the voting for its approval can be found in the report on voting indicated in
the above table.
The language used for the development of this International Standard is English.

This document was drafted in accordance with ISO/IEC Directives, Part 2, and developed in
accordance with ISO/IEC Directives, Part 1 and ISO/IEC Directives, IEC Supplement, available
at www.iec.ch/members_experts/refdocs. The main document types developed by IEC are
described in greater detail at www.iec.ch/publications.
A list of all parts in the IEC 61249 series, published under the general title Materials for printed
boards and other interconnecting structures, can be found on the IEC website.
The committee has decided that the contents of this document will remain unchanged until the
stability date indicated on the IEC website under webstore.iec.ch in the data related to the
specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
– 6 – IEC 61249-2-51:2023 © IEC 2023
MATERIALS FOR PRINTED BOARDS AND
OTHER INTERCONNECTING STRUCTURES –

Part 2-51: Reinforced base materials clad and unclad – Base
materials for integrated circuit card carrier tape, unclad

1 Scope
This part of IEC 61249 specifies the construction, materials, property requirements, quality
assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape,
unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material,
one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with
adhesive and protected by release film.
2 Normative references
The following documents are referred to in the text in such a way that some or all of their content
constitutes requirements of this document. For dated references, only the edition cited applies.
For undated references, the latest edition of the referenced document (including any
amendments) applies.
IEC 61189-2:2006, Test methods for electrical materials, printed boards and other
interconnection structures and assemblies – Part 2: Test methods for materials and other
interconnection structures
IEC PAS 61249-6-3, Specification for finished fabric woven from "E" glass for printed boards
ISO 2813, Paints and varnishes – Determination of gloss value at 20°, 60° and 85°
ISO 8296, Plastics – Film and sheeting – Determination of wetting tension
ISO 11014:2009, Safety data sheet for chemical products – Content and order of sections
ISO 21920-2, Geometrical product specifications (GPS) – Surface texture: Profile – Part 2:
Terms, definitions and surface texture parameters
ASTM D882, Standard Test Method for Tensile Properties of Thin Plastic Sheeting
3 Terms and definitions
For the purposes of this document, the following terms and definitions apply.
ISO and IEC maintain terminology databases for use in standardization at the following
addresses:
• IEC Electropedia: available at https://www.electropedia.org/
• ISO Online browsing platform: available at https://www.iso.org/obp

3.1
IC carrier tape base materials
base materials to manufacture the integrated circuit card carrier tape
4 Construction and materials
4.1 Construction
The construction of IC carrier tape base materials is as follows:

Figure 1 – Construction of IC carrier tape base materials
4.2 Epoxide woven E-glass underlayer
The epoxide woven E-glass underlayer (hereinafter referred to as underlayer) is E-glass
reinforcement. The underlayer is fully cured, and the glass transition temperature of the
underlayer shall be 150 °C minimum.
The woven E-glass used in underlayer shall meet the requirements specified in
IEC PAS 61249-6-3.
4.3 Adhesive
Adhesive can be epoxy adhesive or acrylic adhesive, epoxy is preferred. The peel strength
should meet the requirements in 6.8.
4.4 Release film
Release film is used to protect the adhesive, it can be released easily before use, and does not
destroy the adhesive.
5 Electrical properties
The electrical properties requirements are shown in Table 1. The requirements for the
preparation of samples shall be in accordance with Annex A.
Table 1 – Electrical properties
Performance items Units Test method Requirement
Surface resistivity after damp heat while in the humidity
MΩ IEC 61189-2 2E04
≥10
chamber
Volume resistivity after damp heat while in the humidity
MΩ·m IEC 61189-2 2E04
≥10
chamber
Surface resistivity after E-24/125 while in the chamber MΩ IEC 61189-2 2E04
≥10
Volume resistivity after E-24/125 while in the chamber MΩ·m IEC 61189-2 2E04 ≥10
Electric strength kV/mm IEC 61189-2 2E02 ≥20

– 8 – IEC 61249-2-51:2023 © IEC 2023
6 Non-electrical properties
6.1 Appearance of the IC carrier tape base materials
6.1.1 Delamination
The adhesive should not be separated from the underlayer.
6.1.2 Colloidal particles and metallic particles in underlayer
The plan view size of colloidal particles in underlayer shall be not greater than 2,0 mm. The
plan view size greater than 0,5 mm and less than or equal to 2,0 mm shall be no more than
4 per 30 cm roll length. The plan view size less than or equal to 0,5 mm shall not be counted.
Encapsulated metallic particles are not allowed.
6.1.3 Colloidal particles in adhesive layer
The plan view size of colloidal particles in adhesive layer shall not greater than 2,0 mm, the
plan view size greater than 0,5 mm and less than or equal to 2,0 mm shall no more than 4 per
30 cm roll length, the plan view size less than or equal to 0,5 mm shall not be counted.
6.1.4 Scratches of adhesive
The adhesive layer should not be scratched.
6.1.5 Bubbles in underlayer
The bubbles in underlayer shall be less than or equal to 200 µm in length and shall not occur
in bubble clusters any more than three bubbles in a 3,2 mm diameter circle.
6.1.6 Breakages and exposures of reinforcement fibre in underlayer
There are no breakages and exposures of reinforcement fibre in underlayer.
6.2 Dimensional of IC carrier tape base materials
6.2.1 Length and width
The length and the width of the sheet shall be as agreed between user and supplier (AABUS).
+5
The tolerance of length shall be within m and the tolerance of width shall be within ±0,1 mm.
6.2.2 Thickness of underlayer
The nominal thickness of underlayer shall be AABUS, the tolerance shall be within ±10 % of
the value specified.
6.2.3 Thickness of adhesive layer
The nominal thickness of adhesive layer shall be AABUS, the tolerance shall be within ±10 %
of the value specified.
6.3 Splices
The number of splices (including splicing tape and marking, the same below) is less than or
equal to 2 per 160 m, and the splices gap is less than or equal to 50 µm.
Splicing tape should be evenly pasted on both sides of the IC carrier tape base materials, and
should be pasted extend to the edge of the IC carrier tape base materials and ensure that the
edge is orderliness, and should not be folded.

6.4 Glass transition temperature
The requirements of glass transition temperature for the underlayer of the IC carrier tape base
materials shall be as shown in Table 2.
Table 2 – Glass transition temperature of underlayer
Performance items Units Test method Requirement
Glass transition temperature (Tg) °C IEC 61189-2 2M10 ≥150

6.5 Surface properties of the underlayer side
The surface properties of the underlayer side include roughness, glossiness (60°) and surface
energy, and the requirements shall be as shown in Table 3.
Table 3 – roughness, glossiness(60°) and surface energy
Performance items Test methods Requirements
Roughness ISO 21920-2 3 µm ≤ Rz ≤ 15 µm
Glossiness(60°) ISO 2813 < 5,0 GU
Surface energy ISO 8296 72 mN/m Ink tested qualified

6.6 Tensile strength and elongation at break
When the IC carrier tape base materials are tested in accordance with test method ASTM D882,
the requirements of tensile strength and elongation at break shall be as shown in Table 4,
applicable to underlayer of IC carrier tape base materials with a thickness greater than or equal
to 90 µm. The requirements for the preparation of samples shall be in accordance with Annex A.
Table 4 – Tensile strength and elongation at break
Performance items Units Test method Requirement
≥200 (Length)
Tensile strength Mpa ASTM D882
≥150 (Cross)
≥1,5 (Length)
Elongation at break % ASTM D882
≥1,0 (Cross)
6.7 Water absorption
When the IC carrier tape base materials is tested in accordance with test method 2N02 of
IEC 61189-2, the maximum water absorption shall be as shown in Table 5. The requirements
for the preparation of samples shall be in accordance with Annex A.
Table 5 – Water absorption
Performance items Units Test method Requirement
Water absorption % IEC 61189-2 2N02 ≤1,0

– 10 – IEC 61249-2-51:2023 © IEC 2023
6.8 Peel strength
The samples are prepared as follows: Sticking the matte side of 35 µm electrodeposited copper
foil on the adhesive side of IC carrier tape base materials after release film removal. Then totally
cured by heating (laminate 5 s ± 1 s at 180 °C ± 2 °C temperature and 0,5 MPa pressure, then
baking 60 min ± 1 min at 160 °C ± 2 °C in oven), After removal from the oven, the samples shall
be cooled to room temperature in a desiccator or a drying cabinet before making specimens,
then prepare specimens in accordance with IEC 61189-2 2M13. The requirements of peel
strength shall be as shown in Table 6.
Table 6 – Peel strength
Performance items Test methods Requirements
Peel strength as received IEC 61189-2 2M13 ≥ 1 N/mm
Peel strength after 103,4 kPa
IEC 61189-2 2M13
≥ 20% of Peel strength as received
pressure vessel conditioning, 24 h

6.9 Resin flow
The requirements of Resin flow shall be as shown in Table 7.
Table 7 – Resin flow
Performance items Test methods Requirements
a
Resin flow Laminate method < 0,2 mm
a
Laminate method to measure resin flow procedure is as follows:
– punch several holes (one hole of a diameter of 6,4 mm and two holes of a diameter of 4,8 mm, 3,2 mm and
1,6 mm) on the IC carrier tape base materials;
– remove the release film;
– laminate the adhesive side with cathode side of copper foil (pre-laminate 10 s ± 2 s and laminate 60 s ± 5 s
at 180 °C ± 2 °C temperature and 9,8 MPa ± 0,2 MPa pressure);
– cool the specimens to room temperature;
– measure the length of squeeze-out on the holes.
One specimen 50 mm × 25 mm is needed.

7 Quality assurance
7.1 Quality system
The supplier shall operate a quality system, ISO 9000 or similar, to support quality conformance
inspection.
The supplier shall operate a Management System for Environmental Control, ISO 14001 or
similar, to support environmental considerations.
7.2 Responsibility for inspection
The supplier is responsible for all inspections of the manufactured material. The purchaser or
an appointed third party may audit this inspection.
7.3 Positions of specimens on the sample
All the positions of specimens on the sample are randomly.

7.4 Qualification inspection
7.4.1 General
IC carrier tape base materials furnished under this document shall be qualified. Qualification
testing shall be performed to demonstrate the manufacturer’s ability to meet the requirements
of this document. Qualification testing shall be conducted at a laboratory compliant with IEC
laboratory requirements. A list of the normal qualification tests can be found in Table 8. The
manufacturer shall retain a data file which supports that the materials meet this document and
shall be readily available for review upon request.
7.4.2 Samples
Sample shall be selected from normal production for each manufacturer’s brand type for which
qualification is sought.
7.4.3 Frequency
Each manufacturer’s brand type product shall undergo qualification once. Property items for the
qualification inspection shall be in accordance with Table 8 or the relevant product document.
Any major changes to the product raw material, production process shall be requalified.
7.4.4 Criterion rule
If there is a failure item, it is judged to be unqualified.
Table 8 – Qualification and conformance inspection
Conformance testing
Qualification
Property Test method
Conformance
testing
Group
frequency
Appearance IEC 61189-2 Visual YES A All
test method
Roughness ISO 21920-2 YES B Lot
Glossiness ISO 2813 YES B Lot
Surface energy ISO 8296 YES B Lot
Resin flow Laminate method YES B Lot
Peel strength as received IEC 61189-2 2M13 YES B Lot
Peel strength after 103,4 kPa IEC 61189-2 2M13 YES C Quarterly
pressure vessel conditioning, 24 h
Glass transition temperature (Tg) IEC 61189-2 2M10 YES C Quarterly
Tensile strength ASTM D882 YES C Annually
Elongation at break ASTM D882 YES C Annually
Surface resistivity after damp heat YES C Annually
IEC 61189-2 2E04
while in the humidity chamber
Volume resistivity after damp heat YES C Annually
IEC 61189-2 2E04
while in the humidity chamber
Surface resistivity after E‑24/125 YES C Annually
IEC 61189-2 2E04
while in the chamber
Volume resistivity after E‑24/125 YES C Annually
IEC 61189-2 2E04
while in the chamber
Electric Strength IEC 61189-2 2E02 YES C Annually
Water absorption IEC 61189-2 2N02 YES C Semiannually

– 12 – IEC 61249-2-51:2023 © IEC 2023
7.5 Quality conformance inspection
7.5.1 General
Conformance inspection shall be conducted in accordance with Table 8, unless otherwise
specified. Additional tests requested by the customer must be stated in the purchase order.
7.5.2 Inspection lot
An inspection lot consists of all IC carrier tape base materials delivered at one time from the
same material (same lot or equivalent), same production process under the same conditions
substantially.
7.5.3 Group A inspection
Group A inspection item is the properties indicated as “All” in Table 8.
7.5.4 Group B inspection
Group B inspection item is the properties indicated as “Lot” in Table 8. The sample of Group B
shall be randomly selected about 300 mm long from the lot that has passed the Group A
inspection.
7.5.5 Group C inspection
Group C inspection item is the properties indicated as “Quarterly” or longer in Table 8, the
inspection frequency shall be in accordance with Table 8 or quality system. The sample of
Group C shall be randomly selected from the lot that has passed the Group B inspection, about
300 mm long samples needed in an inspection period.
7.5.6 Criterion rule
The acceptance number for the Group A, Group B and Group C tests will be zero(0), No failure
shall be allowed for any specimen tested.
7.5.7 Rejected lots
If an inspection lot is rejected, the supplier may rework it to correct the defects or screen out
the defective units and resubmit for reinspection. Resubmitted lots shall be inspected using
tightened inspection. Such lots shall be separate from new lots and shall be clearly identified
as reinspected lots. If the defect cannot be screened out, the supplier shall sample additional
lots and make processing corrections as necessary. If the additional lots inspected show the
same defect, it shall be the supplier’s responsibility to contact the user(s) regarding the problem.
7.6 Certificate of conformance
The supplier shall issue a certificate on request from the purchaser of conformance to this
standard in electronic or paper format.
7.7 Safety data sheet
A safety data sheet in accordance with ISO 11014 shall be available for products manufactured
and delivered in compliance with this document.

8 Packaging, marking and storage
8.1 Packaging, marking
IC carrier tape base materials shall be packaged in a manner which will provide adequate
protection against corrosion, deterioration and physical damage during shipment and storage.
Unless otherwise specified in the purchase order, IC carrier tape base materials shall be marked
with the manufacturer's designation and lot number. Marking shall remain legible during normal
handling but be readily removable prior to use of the material. Packages shall be marked in a
manner to clearly identify the contents.
8.2 Storage, storage condition and shelf life
Unless otherwise specified, the IC carrier tape base materials provided in accordance with this
specification shall be stored in the original package. IC carrier tape base materials shall be able
and certified to meet all the requirements specified in this document within the shelf life.
The storage condition can be either Condition 1 or Condition 2 as below, and the minimum shelf
life is as follows:
• Shelf life is 180 days minimum when stored at Condition 1: >-10 °C and ≤0 °C.
• Shelf life is 90 days minimum when stored at Condition 2: >0 °C and ≤10 °C.
The shelf life starts from the date of coating.

– 14 – IEC 61249-2-51:2023 © IEC 2023
Annex A
(normative)
Requirements for the preparation of samples of some performance items
This normative Annex A describes the requirements applying to the preparation of samples of
some performance items presented in this document. It also provides additional explanations
in this regard.
Table A.1 – Requirements for the preparation of samples of some performance items
Performance items Preparation of samples
Surface resistivity after damp heat while The samples shall be cured at 160 °C ± 2 °C for 60 min ± 1 min in
oven after removal of the release film of the IC carrier tape base
in the humidity chamber
materials, then take out the samples from the oven and cooled to
Volume resistivity after damp heat while
room temperature in a desiccator or a drying cabinet.
in the humidity chamber
Surface resistivity after E‑24/125 while
in the chamber
Volume resistivity after E‑24/125 while
in the chamber
Electric Strength
Water absorption
Tensile strength Applicable to underlayer of IC carrier tape base materials with a
thickness ≥ 90 µm.
Elongation at break
The samples shall be cured at 160 °C ± 2 °C for 60 min ± 1 min in
oven after removal of the release film of the IC carrier tape base
materials, then take out the samples from the oven and cooled to
room temperature in a desiccator or a drying cabinet.
Glass transition temperature (Tg) The requirements of glass transition temperature is for the
underlayer of the IC carrier tape base materials only.
The preparation of samples can be as follows: remove the release
film, then wipe away the adhesive by using alcohol or other solvent.
Peel strength as received Sticking the matte side of 35 µm electrodeposited copper foil on the
adhesive side of IC carrier tape base materials after release film
Peel strength after 103,4 kPa pressure
removal. Then totally cured by heating (laminate 5 s ± 1 s at
vessel conditioning, 24 h
180 °C ± 2 °C temperature and 0,5 MPa pressure, then baking
60 min ± 1 min at 160 °C ± 2 °C in oven), After removal from the
oven, the samples shall be cooled to room temperature in desiccator
or drying cabinet before making specimens.

A.1 Ordering information
Orders shall include but are not limited to the following details:
a) a reference to this document;
b) type of material (see Scope);
c) request for certification, if applicable;
d) safety data sheet;
e) coating date.
Annex B
(informative)
Engineering information
B.1 General
Information in this Annex B does not detail material property requirements. The information is
intended as a guideline for design and engineering purposes. Users of this document are
encouraged to supply the information included below.
Materials according to this document show the properties and data as listed in Clause B.2 to
Clause B.6.
B.2 Chemical properties
Resistance against chemicals
B.3 Electrical properties
Comparative tracking index 175 V to 250 V (typical values)
B.4 Mechanical properties
4 2
– modulus of elasticity, tensile (warp) 1,4 × 10 N/mm (typical values);
4 2
– modulus of elasticity, tensile (weft) 1,2 × 10 N/mm (typical values).
B.5 Physical properties
Density 1,84 g/cm (typical values)
B.6 Thermal properties
– specific heat capacity 1,1 kJ/kg · °C (typical values);
– thermal conductivity 0,5 W/m · °C (typical values).

– 16 – IEC 61249-2-51:2023 © IEC 2023
Bibliography
IEC 60194-1:2021, Printed boards design, manufacture and assembly – Vocabulary – Part 1:
Common usage in printed board and electronic assembly technologies
IEC 60194-2:2017, Printed boards design, manufacture and assembly – Vocabulary – Part 2:
Common usage in electronic technologies as well as printed board and electronic assembly
technologies
ISO 9000, Quality management systems – Fundamentals and vocabulary
ISO 14001, Environmental management systems – Requirements with guidance for use

___________
– 18 – IEC 61249-2-51:2023 © IEC 2023
SOMMAIRE
AVANT-PROPOS . 20
1 Domaine d’application . 22
2 Références normatives . 22
3 Termes et définitions . 23
4 Construction et matériaux . 23
4.1 Construction . 23
4.2 Sous-couche en tissu de verre de type E époxyde . 23
4.3 Adhésif . 23
4.4 Pellicule antiadhésive . 23
5 Propriétés électriques . 23
6 Propriétés non électriques . 24
6.1 Aspect des matériaux de base pour bande support de CI . 24
6.1.1 Décollement interlaminaire . 24
6.1.2 Particules colloïdales et particules métalliques dans la sous-couche . 24
6.1.3 Particules colloïdales dans la couche adhésive . 24
6.1.4 Rayures de l’adhésif . 24
6.1.5 Bulles dans la sous-couche . 24
6.1.6 Ruptures et expositions de la fibre de renfort dans la sous-couche . 24
6.2 Dimensionnement des matériaux de base pour bande de support de CI . 24
6.2.1 Longueur et largeur . 24
6.2.2 Épaisseur de la sous-couche . 25
6.2.3 Épaisseur de la couche adhésive . 25
6.3 Épissures . 25
6.4 Température de transition vitreuse . 25
6.5 Propriétés de surface du côté de la sous-couche . 25
6.6 Résistance à la traction et allongement à la rupture . 25
6.7 Absorption d'eau . 26
6.8 Force d'adhérence . 26
6.9 Écoulement de résine . 27
7 Assurance qualité . 27
7.1 Système qualité . 27
7.2 Responsabilité du contrôle . 27
7.3 Positions des éprouvettes sur l’échantillon .
...