IEC TS 62153-4-1:2014
(Main)Metallic communication cable test methods - Part 4-1: Electromagnetic compatibility (EMC) - Introduction to electromagnetic screening measurements
Metallic communication cable test methods - Part 4-1: Electromagnetic compatibility (EMC) - Introduction to electromagnetic screening measurements
IEC TS 62153-4-1:2014(E) deals with screening measurements. Screening (or shielding) is one basic way of achieving electromagnetic compatibility (EMC). However, a confusingly large number of methods and concepts is available to test for the screening quality of cables and related components, and for defining their quality. This technical specification gives a brief introduction to basic concepts and terms trying to reveal the common features of apparently different test methods. It is intended to assist in correct interpretation of test data, and in the better understanding of screening (or shielding) and related specifications and standards. This technical specification cancels and replaces the second edition of the technical report IEC/TR 62153-4-1 published in 2010.
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IEC TS 62153-4-1
®
Edition 1.0 2014-01
TECHNICAL
SPECIFICATION
colour
inside
Metallic communication cable test methods –
Part 4-1: Electromagnetic compatibility (EMC) – Introduction to electromagnetic
screening measurements
IEC TS 62153-4-1:2014-01(EN)
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IEC TS 62153-4-1
®
Edition 1.0 2014-01
TECHNICAL
SPECIFICATION
colour
inside
Metallic communication cable test methods –
Part 4-1: Electromagnetic compatibility (EMC) – Introduction to electromagnetic
screening measurements
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
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XD
ICS 33.100 ISBN 978-2-8322-1311-7
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission
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– 2 – TS 62153-4-1 © IEC:2014(E)
CONTENTS
FOREWORD . 7
1 Scope . 9
2 Normative references . 9
3 Symbols interpretation . 10
4 Electromagnetic phenomena. 12
5 The intrinsic screening parameters of short cables . 14
5.1 General . 14
5.2 Surface transfer impedance, Z . 14
T
5.3 Capacitive coupling admittance, Y . 14
C
5.4 Injecting
...
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