IEC PAS 62184:2000

Lead integrity test method

Provides various tests for determining the integrity lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for reassembly.

General Information

• Status: Replaced
• Publication Date: 21-Aug-2000
• ICS: 31.080.01 - Semiconductor devices in general
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 2 - TC 47/WG 2
• Current Stage: DELPUB - Deleted Publication
• Completion Date: 07-Aug-2003

Relations

• Replaced By: IEC 60749-14:2003 - Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
• Effective Date: 05-Sep-2023

Standards Content (Sample)

,(&�3$6������
Edition 1.0
2000-08
Lead integrity test method
38%/,&/<�$9$,/$%/(�63(&,),&$7,21
IN TER N A TION AL Reference number
E L E C T R OT E CHNI CA L
IEC/PAS 62184
C O MMI S S I O N
EIA/JEDEC
STANDARD
Test Method B105-B
EIA/JESD22-B105-B
Lead Integrity
(Revision of Test Method B105-A)

JEDEC Solid State Technology Association

ELECTRONIC INDUSTRIES ALLIANCE
JANUARY 1999
EIA/JESD22-B105-B
Copyright © 1999, JEDEC; 2000, IEC

INTERNATIONAL ELECTROTECHNICAL COMMISSION

____________
LEAD INTEGRITY TEST METHOD
FOREWORD
A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the
public and established in an organization operating under given procedures.
IEC-PAS 62184 was submitted by JEDEC and has been processed by IEC technical committee 47: Semiconductor
devices.
The text of this PAS is based on the This PAS was approved for
following document: publication by the P-members of the
committee concerned as indicated in
the following document:
Draft PAS Report on voting
47/1457/PAS 47/1490/RVD
Following publication of this PAS, the technical committee or subcommittee concerned will investigate the
possibility of transforming the PAS into an International Standard.
An IEC-PAS licence of copyright and assignment of copyright has been signed by the IEC and JEDEC and is
recorded at the Central Office.
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all
national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-
operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition
to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees;
any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International,
governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC
collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions
determined by agreement between the two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all interested
National Committees.
3) The documents produced have the form of recommendations for international use and are published in the fo rm of
standards, technical specifications, technical reports or guides and they are accepted by the National Committees in
that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International Standards
transparently to the maximum extent possible in their national and regional standards. Any divergence between the
IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this PAS may be the subject of patent rights. The
IEC shall not be held responsible for identifying any or all such patent rights.
Page i
Copyright © 1999, JEDEC; 2000, IEC

NOTICE
EIA/JEDEC standards and publications contain material that has been prepared, reviewed, and

approved through the JEDEC Council level and subsequently reviewed and approved by the EIA

EIA/JEDEC standards and publications are designed to serve the public interest through

eliminating misunderstandings between manufacturers and purchasers, facilitating

interchangeability and improvement of products, and assisting the purchaser in selecting and
obtaining with minimum delay the proper product for use by those other than JEDEC members,
EIA/JEDEC standards and publications are adopted without regard to whether or not their
adoption may involve patents or articles, materials, or processes. By such action JEDEC does not
assume any liability to any patent owner, nor does it assume any obligation whatever to parties
The information included in EIA/JEDEC standards and publications represents a sound approach
to product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby an EIA/JEDEC
No claims to be in conformance with this standard may be made unless all requirements stated in
Inquiries, comments, and suggestions relative to the content of this EIA/JEDEC standard or
publication should be addressed to JEDEC Solid State Technology Association, 2500 Wilson
©
JEDEC Publication 21 "Manual of Organization and Procedure".
free to duplicate this document in accordance with the latest revision of
"Copyright" does not apply to JEDEC member companies as they are
Arlington, VA 22201-3834
2500 Wilson Boulevard
Engineering Department
ELECTRONIC INDUSTRIES ALLIANCE 1999
Published by
Boulevard, Arlington, VA 22201-3834, [phone]/7559 or www.jedec.org
the standard are met.
standard or publication may be further processed and ultimately become an ANSI/EIA standard.
adopting the EIA/JEDEC standards or publications.
whether the standard is to be used either domestically or internationally.
General Counsel.
Copyright © 1999, JEDEC; 2000, IEC

TEST METHOD B105-B
This test method provides various tests for determining the integrity lead/package interface and
the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the
part for reassembly. For hermetic packages, it is recommended that this test be followed by
hermeticity tests in accordance with Test Method A109 to determine if there are any adverse
its test conditions, is considered destructive and is only recommended for qualification testing.
This test is applicable to all through-hole devices and surface-mount devices requiring lead
1.1 Test Condition A - Tension
1.2 Test Condition B - Bending Stress
This test condition provides for the application of bending stresses to determine the integrity of
This test condition provides for the application of bending stresses primarily to determine the

1.4 Test Condition D - Lead Torque
This test condition provides for the application of stresses to the leads to determine the resistance
1.5 Test Condition E - Stud Torque
This test condition provides for the application of stresses on a threaded mounting stud caused by
Test Method B105-B
(Revision of Test Method B105-A)
tightening the device during mounting.
of seals and leads to twisting motions.
resistance of the leads to metal fatigue under repeated bending.
1.3 Test Condition C - Lead Fatigue
leads, seals and lead plating.
This test condition provides for the application of straight tensile loading.
forming by the user.
effects from the stresses applied to the seals as well as to the leads. These tests, including each of
1 Purpose
Committee on Reliability Test Methods for Packaged Devices.)
(From JEDEC Council Ballot JCB-98-79 formulated under the cognizance of JC-14.1
LEAD INTEGRITY
Page
JESD22-B105-B
Copyright © 1999, JEDEC; 2000, IEC

2 Apparatus
The device shall be subjected to the stress described in the specified test condition and the
specified end point measurements and inspections shall be made except for initial conditioning
unless otherwise specified. When possible, the stress shall be applied to randomly selected leads
The following details, and those required by the specific test condition, shall be specified in the
5 Test Condition A - Tension
This test is designed to check the capabilities of the device, leads, welds, and seals to withstand a

5.2 Apparatus
The tension test requires suitable clamps and fixtures for securing the device and attaching the
+ 0.5 oz (227 + 14 gram) shall be applied without shock to each lead to be tested
Test Method B105-B
(Revision of Test Method B105-A)
seconds minimum. The tension shall be applied as close to the end of the lead as practicable.
in a direction parallel to the axis of the lead or terminal and the tension shall be maintained for 30
A tension of 8.0
5.3 Procedure
specified weight without lead restriction. Equivalent linear pull test equipment may be used.
straight pull.
5.1 Purpose
quality level.
Sample size (combinations of number of leads per device and number of devices) and (b)
Test Condition Letter (a)
applicable procurement document:
4 General Summary
from each device.  The same leads shall not be used for more than one test condition.
3 General Procedure Applicable to all Test Conditions
See applicable test condition.
Page
JESD22-B105-B
Copyright © 1999, JEDEC; 2000, IEC

Hermeticity test on hermetically sealed packages, visual examination and electrical

measurements, that consist of parametric and functional tests, shall be taken, as specified in the

After the removal of the stress, examine the device using a magnification between 10X and 20X.
Any evidence of breakage, loosening, or relative motion between the lead and the device body
shall be considered a device failure. When hermeticity tests are conducted (in accordance with
Test Method A109) as a post measurement, meniscus cracks shall not be a cause for rejection of
the devices which have passed the tests. Failure of any specified post electrical measurement
.0 0.5 oz (227
6 Test Condition B - Bending Stress

This test is designed to check the capability of the leads, lead finish, lead welds and seals of the
devices to withstand stresses to the leads and seals which might reasonably be expected to occur
6.2 Apparatus
The bending test requires attaching devices, clamps, supports or other suitable hardware,
Test Method B105-B
(Revision of Test Method B105-A)
necessary to apply the bending stress through the specified bend angle.
from actual handling and assembly of the devices in application.
6.1 Purpose
Failure criteria, if other than specified. (c)
Length of time weight is to be attached, if other than 30 seconds. (b)
14 gram). + + Weight to be attached to lead, if other than 8 (a)
The following details shall be specified in the applicable procurement documents:
5.4 Summary
shall be considered a cause for failure.
5.3.2 Failure Criteria
applicable procurement document.
5.3.1 Measurements
cont’d) 5.3 Procedure (
Page
JESD22-B105-B
Copyright © 1999, JEDEC; 2000, IEC

6 Test Condition B - Bending Stress (

Each lead of the sample shall be subjected to a force sufficient to bend the lead as specified in

paragraphs 6.3.1 through 6.3.6, as applicable. Any number, or all of the leads of the test device,

may be bent simultaneously. Rows of leads may be bent one row at a time. Each lead shall be
Bend through the specified arc in one direction and return to the original position. All arcs shall
6.3.1 Direction of Bends
Test leads shall be bent in the least rigid direction. If there is no least rigid direction, the leads
may be bent in any direction. No lead shall be bent so as to interfere with another lead. If
interference is unavoidable, the test lead shall be bent in the opposite direction to the angle
6.3.2 Procedure for Initial Conditioning for Environmental Test
When normally straight leads are supplied in a formed condition (including the staggered lead
dual-in-line configuration), the lead forming operation shall be considered acceptable initial
conditioning in place of that specified, providing the lead forming has been performed after lead
plating and the forming is at least as severe in permanent lead deformation as the specified
6.3.3 Procedure for Flat-Packs and Axial Lead Metal-Can Devices (e.g., Flexible and Semi-

A lead shall be considered flexible if its section modulus (in the least rigid direction) is less than
or equal to that of a rectangular lead with a cross section of 0.006 x 0.020 inch (0.15 x 0.51 mm).
Round leads < 0.020 inch (0.51 mm) in diameter shall be considered flexible. Flexible leads
o
shall be bent through an arc of at least 45 , measured at a distance 0.12 + 0.03 inch
+
Semi-flexible leads are those leads with a section modulus (in the least rigid direction) greater
than that of a rectangular lead with a cross section of 0.006 x 0.020 inch (0.15 x 0.51 mm) which
are intended to be bent during insertion or other application. Round leads greater than 0.020 inch
(0.51 mm) in diameter shall be considered semi-flexible. Semi-flexible leads shall be bent
o
Test Method B105-B
(Revision of Test Method B105-A)
, measured at the lead extremities, unless otherwise specified. through an arc of a least 30
6.3.3.2 Semi-Flexible Leads
0.76 mm) along the lead from the seal unless otherwise specified. (3.05
6.3.3.1 Flexible Leads
Flexible Leads)
bending.
specified and returned to its normal position.
be made in the same plane, without lead restriction.
bent through one cycle as follows:
6.3 Procedure
cont’d)
Page
JESD22-B105-B
Copyright © 1999, JEDEC; 2000, IEC

Dual-in-line package leads are leads with more than one section modulus, and with leads

o
normally aligned in parallel at 90 angle from the bottom of the package during insertion. Dual-
in-line package leads shall be bent inward through an angle sufficient to cause the lead to retain a
o
permanent bend (i.e., after stress removal) of at least 15 , measured at the lead extremities about
the first bend. For packages that have the shoulder restrained (see Configuration 3 of Figure 1),
the angle of the bend shall be measured from the seating plane to the lead extremities. At the

Test Method B105-B
(Revision of Test Method B105-A)
Figure 1 — Package Configurations
completion of the initial bend, the leads shall be returned to their approximate original position.
6.3.4 Procedure for Dual-In-Line Package Leads
cont’d) 6.3 Procedure (
Page
JESD22-B105-B
Copyright © 1999, JEDEC; 2000, IEC

o
Small Outline (SO) Packages, Configuration 4 of Figure 1, shall have leads bent outward
...