Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC TR 61191-7:2020(E) serves as a Technical Report and provides information, how technical cleanliness can be assessed within the electronics assembly industry. Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

General Information

Status
Published
Publication Date
10-Mar-2020
Drafting Committee
Current Stage
PPUB - Publication issued
Start Date
17-Feb-2020
Completion Date
11-Mar-2020
Ref Project

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IEC TR 61191-7
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Edition 1.0 2020-03
TECHNICAL
REPORT

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inside


Printed board assemblies –
Part 7: Technical cleanliness of components and printed board assemblies
IEC TR 61191-7:2020-03(en)

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IEC TR 61191-7

®


Edition 1.0 2020-03




TECHNICAL



REPORT








colour

inside










Printed board assemblies –

Part 7: Technical cleanliness of components and printed board assemblies



























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ELECTROTECHNICAL


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ICS 31.180; 31.190 ISBN 978-2-8322-7901-4




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– 2 – IEC TR 61191-7:2020 © IEC 2020
CONTENTS
FOREWORD . 8
INTRODUCTION . 10
1 Scope . 11
2 Normative references . 11
3 Terms and definitions . 11
4 Technical cleanliness . 11
4.1 What is technical cleanliness? . 11
4.2 History – standardisation of technical cleanliness . 12
4.3 Technical cleanliness in the electronics industry . 12
4.4 Potential particle-related malfunctions . 12
5 Technical cleanliness as a challenge for the supply chain . 13
5.1 General . 13
5.2 Contamination .
...

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