IEC TS 62564-1:2016

Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors

IEC TS 62564-1:2016(E) defines the minimum requirements for integrated circuits and semiconductors which are designated as an "aerospace qualified electronic component (AQEC)". This new edition includes the following significant technical changes with respect to the previous edition:
- refers to the latest editions of IEC TS 62239-1 and IEC TS 62686-1, and of other publications;
- adds information regarding components' life expectancy.

General Information

• Status: Published
• Publication Date: 12-Jul-2016
• ICS: 03.100.50 - Production. Production management
• ICS: 17.140.50 - Electroacoustics
• ICS: 31.020 - Electronic components in general
• ICS: 49.060 - Aerospace electric equipment and systems
• Technical Committee: TC 107 - Process management for avionics
• Current Stage: PPUB - Publication issued
• Completion Date: 13-Jul-2016

Standards Content (sample)

IEC TS 62564-1
Edition 3.0 2016-07
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace qualified electronic components
(AQEC) –
Part 1: Integrated circuits and discrete semiconductors
IEC TS 62564-1:2016-07(en)
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IEC TS 62564-1
Edition 3.0 2016-07
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace qualified electronic components
(AQEC) –
Part 1: Integrated circuits and discrete semiconductors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-3513-3

Warning! Make sure that you obtained this publication from an authorized distributor.

® Registered trademark of the International Electrotechnical Commission
---------------------- Page: 3 ----------------------
– 2 – IEC TS 62564-1:2016 © IEC 2016
CONTENTS

FOREWORD ......................................................................................................................... 3

INTRODUCTION ................................................................................................................... 5

1 Scope ............................................................................................................................ 6

2 Normative references..................................................................................................... 6

3 Terms, definitions and abbreviations .............................................................................. 7

3.1 Terms and definitions ............................................................................................ 7

3.2 Abbreviations ........................................................................................................ 9

4 Technical requirements .................................................................................................. 9

4.1 AQEC plan ............................................................................................................ 9

4.2 AQEC documentation .......................................................................................... 10

4.2.1 General ....................................................................................................... 10

4.2.2 AQEC data sheet ......................................................................................... 10

4.2.3 Material content ........................................................................................... 10

4.2.4 AQEC visibility ............................................................................................. 10

4.2.5 AQEC life expectancy .................................................................................. 10

4.2.6 Device technology ........................................................................................ 11

4.2.7 SEE data ..................................................................................................... 11

4.2.8 Termination finish ........................................................................................ 11

4.2.9 Third party part numbers .............................................................................. 11

4.3 AQEC performance ............................................................................................. 12

4.3.1 Performance ................................................................................................ 12

4.3.2 Functional parameters .................................................................................. 13

4.3.3 Known limitations ......................................................................................... 13

4.4 Quality system certification .................................................................................. 13

4.5 Component qualification and re-qualification ........................................................ 13

4.6 AQEC quality assurance and reliability monitoring ............................................... 13

4.7 Product change notification (PCN) ....................................................................... 14

4.8 Last time buy (LTB) notification ........................................................................... 14

4.9 Obsolescence management ................................................................................. 14

4.10 Counterfeit prevention ......................................................................................... 14

4.11 User or customer guide ....................................................................................... 14

Annex A (informative) AQEC material content and construction table .................................. 15

Annex B (informative) Additional desired data .................................................................... 17

Bibliography ....................................................................................................................... 18

Table A.1 – AQEC material content and construction ........................................................... 15

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IEC TS 62564-1:2016 © IEC 2016 – 3 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –
Part 1: Integrated circuits and discrete semiconductors
FOREWORD

1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

all national electrotechnical committees (IEC National Committees). The object of IEC is to promote

international co-operation on all questions concerning standardization in the electrical and electronic fields. To

this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,

Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC

Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested

in the subject dealt with may participate in this preparatory work. International, governmental and non-

governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely

with the International Organization for Standardization (ISO) in accordance with conditions determined by

agreement between the two organizations.

2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international

consensus of opinion on the relevant subjects since each technical committee has representation from all

interested IEC National Committees.

3) IEC Publications have the form of recommendations for international use and are accepted by IEC National

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4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications

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between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in

the latter.

5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity

assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any

services carried out by independent certification bodies.

6) All users should ensure that they have the latest edition of this publication.

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expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC

Publications.

8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is

indispensable for the correct application of this publication.

9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of

patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

The main task of IEC technical committees is to prepare International Standards. In

exceptional circumstances, a technical committee may propose the publication of a technical

specification when

• the required support cannot be obtained for the publication of an International Standard,

despite repeated efforts, or

• the subject is still under technical development or where, for any other reason, there is the

future but no immediate possibility of an agreement on an International Standard.

Technical specifications are subject to review within three years of publication to decide

whether they can be transformed into International Standards.

IEC TS 62564-1, which is a technical specification, has been prepared by IEC technical

committee 107: Process management for avionics.
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– 4 – IEC TS 62564-1:2016 © IEC 2016

This third edition cancels and replaces the second edition, published in 2011. This edition

constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) IEC TS 62239 changed to IEC TS 62239-1, and IEC PAS 62686-1 changed to
IEC TS 62686-1;
b) JESD48 changed to J-STD-048 and added to the Bibliography;

c) AEC-Q100 revision G changed to AEC-Q100:2014 in 4.5 (which is now revision H);

d) revision of AEC-Q101 removed in Bibliography;
e) J-STD-609 for “Marking and labelling” added to the Bibliography;
f) information added regarding components' life expectancy in 4.2.5.
GEIA-STD-0002-001 (June 2006), Aerospace Qualified Electronic Component (AQEC)

Requirements, Volume 1 – Integrated Circuits and Semiconductors, has served as a basis for

the elaboration of this technical specification.
The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/276/DTS 107/283/RVC

Full information on the voting for the approval of this technical specification can be found in

the report on voting indicated in the above table.

This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all parts in the IEC 62564 series, under the general title Process management for

avionics – Aerospace qualified electronic components (AQEC), can be found on the IEC

website.

The committee has decided that the contents of this publication will remain unchanged until

the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data

related to the specific publication. At this date, the publication will be
• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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IEC TS 62564-1:2016 © IEC 2016 – 5 –
INTRODUCTION

Aerospace qualified electronic components (AQEC) plans are developed by manufacturers in

order to document compliance with AQEC requirements. For AQEC designated components,

the intention is to
a) provide AQEC users access to information from the AQEC manufacturers that is
necessary for using commercial-off-the-shelf (COTS) products;

b) better enable AQEC users to assess whether these parts are capable of operating reliably

in their applications;
c) minimize deviations from the AQEC manufacturers’ COTS products;
d) have minimal impact on the AQEC manufacturers’ standard operating or business
procedures;
e) promote communication between the AQEC manufacturers and users.
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PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –
Part 1: Integrated circuits and discrete semiconductors
1 Scope

This part of IEC 62564, which is a Technical Specification, defines the minimum requirements

for integrated circuits and semiconductors which are designated as an “aerospace qualified

electronic component (AQEC)”. It applies to integrated circuits and semiconductors exhibiting

the following attributes:

a) a minimum set of requirements, or information provided by the part manufacturer, which

will allow a standard COTS component to be designated AQEC by the manufacturer;
b) as a minimum, each COTS component (designated AQEC) will have been designed,

fabricated, assembled, and tested in accordance with the component manufacturer’s

requirements for standard data book components;

c) qualification of, and quality systems for, the COTS components to be designated as AQEC

should include the manufacturer’s standards, operating procedures, and technical
specifications. This information should be available when requested;

d) components manufactured before the manufacturer has addressed AQEC requirements,

but utilizing the same processes, are also considered AQEC compliant;

e) additional desired attributes of a device designated AQEC (that will support AQEC users)

are found in Annex B of this technical specification.

NOTE Parts qualified to military specifications (except those identified as being for “logistic support” purposes

only) are considered AQEC; the remainder of this technical specification only addresses non-military specification

parts.

Parts qualified to AEC-Q100, grade 0 through to grade 3 are considered AQEC. For those

applications where a 0 °C to +70 °C temperature range is appropriate, grade 4 is also

considered to be AQEC. The users should document that the grade category used is

compatible with the application in accordance with their IEC TS 62239-1 electronic

components management plan (ECMP).
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC TS 62239-1, Process management for avionics – Management plan – Part 1: Preparation

and maintenance of an electronic components management plan

IEC 62396-1, Process management for avionics – Atmospheric radiation effects – Part 1:

Accommodation of atmospheric radiation effects via single event effects within avionics

electronic equipment

IEC TS 62668-1, Process management for avionics – Counterfeit prevention − Part 1:

Avoiding the use of counterfeit, fraudulent and recycled electronic components
ISO 9001, Quality management systems – Requirements
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IEC TS 62564-1:2016 © IEC 2016 – 7 –
J-STD-048, Notification Standard for Product Discontinuance
3 Terms, definitions and abbreviations

For the purposes of this document, the following terms, definitions and abbreviations apply.

3.1 Terms and definitions
3.1.1
AQEC specification
document prepared by or for the manufacturer to describe an AQEC product

Note 1 to entry: It includes a data sheet and may include other documents, such as material descriptions,

environmental test procedures, quality monitoring processes, etc. It may be a stand-alone document or a clearly

denoted item within a larger documentation system. There may be additional data associated with specific

applications which may be requested separately.
3.1.2
AQEC plan
instrument prepared by the plan owner (see 3.1.10) that clearly, concisely, and

unambiguously documents the processes used by the plan owner to satisfy the requirements

of this technical specification
Note 1 to entry: The plan contains auditable content.
3.1.3
assessment

evaluation of a plan owner’s AQEC plan to determine if it is compliant with this technical

specification

Note 1 to entry: It may be conducted by IECQ, the customer, the customer’s designee, or by a third party

designated by the customer community.
3.1.4
microcircuit
integrated circuit

microcircuit (device with a high circuit-element density) in which all or some of the circuit

elements are inseparably associated and electrically interconnected (on one or more

substrates, in a unique indivisible package) so that the microcircuit is considered to be

indivisible for the purpose of construction and commerce
3.1.5
semiconductor
discrete semiconductor device

semiconductor device that is specified to perform an elementary function and that is not

divisible into separate components functional in themselves (for example diodes, transistors,

optocouplers, LEDs and related products)
3.1.6
component
part

microcircuit, integrated circuit, semiconductor or discrete semiconductor for the purpose of

this specification
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3.1.7
customer
user
designer
original equipment manufacturer (OEM) that procures integrated circuits and/or

semiconductor devices compliant with this technical specification and uses them to design,

produce, and maintain systems
3.1.8
customer community

body of customers that may act together to address issues related to this technical

specification
3.1.9
data sheet

document prepared by the manufacturer that describes the electrical, mechanical, and

environmental characteristics of the component
3.1.10
manufacturer
plan owner

producer of integrated circuits, microcircuits, or other semiconductor devices that may be

designated AQEC

Note 1 to entry: A manufacturer may produce the components directly or may oversee subcontracted

manufacturing according to their own processes. The manufacturer is also the plan owner.

3.1.11
supplier
distributor of components

Note 1 to entry: A plan for controlling AQEC inventory is in place in order to supply AQECs. A manufacturer can

be a supplier in the case where no distributor is involved.
3.1.12
third party
party designated to act on the behalf of the customer community
3.1.13
termination

element of a component that connects it electrically and mechanically to the next level of

assembly

Note 1 to entry: A termination includes base materials and coatings (including underplates).

3.1.14
form

shape, size, arrangement of parts, visible aspect, mode in which a part exists or manifests

itself, or the material an item is constructed from
3.1.15
fit
qualified and competent
3.1.16
function

work to a specification that an item is designed for without degrading reliability

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IEC TS 62564-1:2016 © IEC 2016 – 9 –
3.2 Abbreviations
AQEC Aerospace qualified electronic component
Bi-CMOS Bipolar CMOS
BPSG Borophosphosilicate glass
COTS Commercial off the shelf
CMOS Complementary metal oxide semiconductor
DDR Double data rate
DRAM Dynamic random access memory
DSCC Defence supply centre Columbus (see http://www.dscc.dla.mil/)
DSIAC Defense systems information analysis center
ECMP Electronic component management plan
FFF Form, fit and function
FIT Failures in time
FPGA Field programmable gate array
GIDEP Government industry data exchange program
HAST Highly accelerated stress test
HCI Hot carrier injection
HTOL High temperature operating life
LED Light emitting diode
LTB Last time buy
MCU Multiple cell upset
MRAM Magnetoresistive random access memory
NAND Negation AND
NBTI Negative bias temperature Instability
NOR Negation OR
PBTI Positive bias temperature instability
PCN Product change notification
SDRAM Synchronous dynamic random access memory
SEE Single event effect
SEU Single event upset
SER Soft error rate
SEL Single event latch
SEFI Single event functional interrupt
SRAM Static random access memory
SOS Silicon on sapphire
TDDB Time dependant dielectric breakdown
THB Temperature humidity bias
VID Vendor item drawing (controlled and released by DSCC)
4 Technical requirements
4.1 AQEC plan
The processes used to ensure compliance with the following requirements shall be

documented by the AQEC manufacturer and included in their AQEC plan. These requirements

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– 10 – IEC TS 62564-1:2016 © IEC 2016

identify the additional processes, documentation and procedures required to supply a

manufacturer's COTS part as an AQEC. The plan includes, but is not limited to, identifying

data sheet parameters and/or conditions that are different for the AQEC versus the COTS

part. These differences shall be identified and the data made available upon request.

4.2 AQEC documentation
4.2.1 General

For an avionics customer, the information supplied by the AQEC manufacturer will be

normally utilised and retained in accordance with the customer electronic component

management plan (see IEC TS 62239-1).
4.2.2 AQEC data sheet

The AQEC manufacturer shall provide and maintain under revision control a data sheet that

includes operating characteristics, as well as physical characteristics. Any known

environmental limitations applicable to the application being addressed (see 4.3.1.2) shall be

identified. This documentation shall specify the form, fit and function for a given part number.

This baseline shall not be changed without proper notification (see 4.7). Use of a unique

published or posted AQEC data sheet is encouraged. As a minimum, the AQEC manufacturer

shall document, individually or by family,
a) the functional operating temperature range;

b) the defined performance (mechanical and electrical) at the operating temperature range;

c) the maximum storage temperature;
d) the maximum operating junction temperature or operating case temperature;
e) the defined lead material, underplate, and termination finish;
f) a package outline drawing;
g) the designation of applicable COTS data sheet (or AQEC unique data sheet, as
applicable) and reference to additional data, if applicable.
NOTE For further guidance, see Annex B.
4.2.3 Material content

For each AQEC covered by this technical specification, the manufacturer shall make

available, upon request, information that describes the material content of the part. Annex A

describes typical material content for an AQEC. Materials that are considered proprietary by

the AQEC manufacturer and are not designated hazardous, may be excluded from public

disclosure.
4.2.4 AQEC visibility

Each data sheet shall either state that the parts meet AQEC requirements (preferred) or

optionally, the component manufacturer may list on its website all the part numbers that are

AQEC or include an AQEC reference in a description of another compliant class of parts.

4.2.5 AQEC life expectancy

The AQEC manufacturer shall identify the limiting wear-out failure mechanisms for a given

AQEC in a given application environment (see 4.3.1.2) for highly complex silicon based

technology components of feature size 90 nm and below including SRAMs, DRAMs
(SDRAMSs, DDR series), flash memories (NOR logic gate, NAND logic gate, MRAMS,

microprocessors, FPGAs). The AQEC manufacturer shall use acceleration models and failure

rate estimating and reporting methods vetted through peer reviewed publications or described

in industry standards and publications. This information shall be available on a website, data

sheet, alternative database, or provided on an as requested basis.
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IEC TS 62564-1:2016 © IEC 2016 – 11 –

NOTE 1 Examples of die related reliability wear-out failure mechanisms include electromigration, gate oxide

breakdown (TDDB), positive (PBTI) and negative bias temperature instability (NBTI), hot carrier injection (HCI),

etc.

NOTE 2 Examples of package reliability wear-out include mechanisms such as delamination, wire bond inter-

metallic formation, etc.

NOTE 3 Industry standards and publications which can assist include: JESD94, JEP122, JP001, JESD47,

JESD91, DSIAC (formerly RIAC) publication (”Physics of failure based handbook of microelectronics systems”).

The AQEC manufacturer should have reliability models for the lifetime limiting wear-out failure

modes that can predict the failure rate of that AQEC for a given end of lifetime frame and use

environment.
4.2.6 Device technology

Different technologies (e.g. bipolar and bi-CMOS; bulk CMOS and CMOS/SOS) shall not be

furnished under the same part number.
4.2.7 SEE data

Avionics equipment is subjected to ionising radiation that increases with altitude. At an

altitude of 40 000 feet (12,2 km) the radiation flux is approximately 300 times the atmospheric

radiation flux at sea level. The principal causes of atmospheric radiation single event effects

(SEE) on devices with geometric feature sizes below a micron are high energy neutrons and

thermal neutrons (see IEC 62396-1).

The following information is required, where available, for designers to assess the impact of

component SEE when using small geometric feature size devices, typically below 1 micron.

a) High energy neutron (>10 MeV) measured single event upset (SEU) cross section or the

terrestrially measured soft error rate (SER).

b) High energy neutron (>10 MeV) or terrestrially measured multiple cell upset (MCU) cross

section.

c) For memory devices, the way in which the bits in an individual word are stored within the

device, i.e. contiguously or non-contiguously.

d) The cross sections of any hard SEE, for example single event latch (SEL), single event

functional interrupt (SEFI) or stuck bits.

e) Thermal neutron sensitivity and the thermal neutron SEE cross sections. Where the

manufacturer uses Borophosphosilicate glass (BPSG) as a passivation and it contains

boron 10 or natural boron (20 % boron 10), this is to be declared.
4.2.8 Termination finish

Only one type of termination finish may be furnished on an individual part number supplied as

part of the AQEC program. As a minimum, a change to a different single lead finish or ball

alloy requires a PCN that includes the date and lot code of implementation. A new assigned

part number is preferred.
4.2.9 Third party part numbers

Where applicable, the data sheet shall state the third party part number (e.g. DSCC VID) for

the AQEC manufacturer’s part number (preferred). Optionally, the AQEC manufacturer may

list this data on their website or provide a link to the third party information.

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