IEC TS 62564-1:2016
(Main)Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: Integrated circuits and discrete semiconductors
IEC TS 62564-1:2016(E) defines the minimum requirements for integrated circuits and semiconductors which are designated as an "aerospace qualified electronic component (AQEC)". This new edition includes the following significant technical changes with respect to the previous edition:
- refers to the latest editions of IEC TS 62239-1 and IEC TS 62686-1, and of other publications;
- adds information regarding components' life expectancy.
General Information
Standards Content (sample)
IEC TS 62564-1
Edition 3.0 2016-07
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace qualified electronic components
(AQEC) –
Part 1: Integrated circuits and discrete semiconductors
IEC TS 62564-1:2016-07(en)
---------------------- Page: 1 ----------------------
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IEC TS 62564-1
Edition 3.0 2016-07
TECHNICAL
SPECIFICATION
Process management for avionics – Aerospace qualified electronic components
(AQEC) –
Part 1: Integrated circuits and discrete semiconductors
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-3513-3
Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission---------------------- Page: 3 ----------------------
– 2 – IEC TS 62564-1:2016 © IEC 2016
CONTENTS
FOREWORD ......................................................................................................................... 3
INTRODUCTION ................................................................................................................... 5
1 Scope ............................................................................................................................ 6
2 Normative references..................................................................................................... 6
3 Terms, definitions and abbreviations .............................................................................. 7
3.1 Terms and definitions ............................................................................................ 7
3.2 Abbreviations ........................................................................................................ 9
4 Technical requirements .................................................................................................. 9
4.1 AQEC plan ............................................................................................................ 9
4.2 AQEC documentation .......................................................................................... 10
4.2.1 General ....................................................................................................... 10
4.2.2 AQEC data sheet ......................................................................................... 10
4.2.3 Material content ........................................................................................... 10
4.2.4 AQEC visibility ............................................................................................. 10
4.2.5 AQEC life expectancy .................................................................................. 10
4.2.6 Device technology ........................................................................................ 11
4.2.7 SEE data ..................................................................................................... 11
4.2.8 Termination finish ........................................................................................ 11
4.2.9 Third party part numbers .............................................................................. 11
4.3 AQEC performance ............................................................................................. 12
4.3.1 Performance ................................................................................................ 12
4.3.2 Functional parameters .................................................................................. 13
4.3.3 Known limitations ......................................................................................... 13
4.4 Quality system certification .................................................................................. 13
4.5 Component qualification and re-qualification ........................................................ 13
4.6 AQEC quality assurance and reliability monitoring ............................................... 13
4.7 Product change notification (PCN) ....................................................................... 14
4.8 Last time buy (LTB) notification ........................................................................... 14
4.9 Obsolescence management ................................................................................. 14
4.10 Counterfeit prevention ......................................................................................... 14
4.11 User or customer guide ....................................................................................... 14
Annex A (informative) AQEC material content and construction table .................................. 15
Annex B (informative) Additional desired data .................................................................... 17
Bibliography ....................................................................................................................... 18
Table A.1 – AQEC material content and construction ........................................................... 15
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INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –
Part 1: Integrated circuits and discrete semiconductors
FOREWORD
1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, IEC publishes International Standards, Technical Specifications,
Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC
Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested
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with the International Organization for Standardization (ISO) in accordance with conditions determined by
agreement between the two organizations.2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international
consensus of opinion on the relevant subjects since each technical committee has representation from all
interested IEC National Committees.3) IEC Publications have the form of recommendations for international use and are accepted by IEC National
Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC
Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any
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transparently to the maximum extent possible in their national and regional publications. Any divergence
between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in
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assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any
services carried out by independent certification bodies.6) All users should ensure that they have the latest edition of this publication.
7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and
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other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and
expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC
Publications.8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is
indispensable for the correct application of this publication.9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of
patent rights. IEC shall not be held responsible for identifying any or all such patent rights.
The main task of IEC technical committees is to prepare International Standards. In
exceptional circumstances, a technical committee may propose the publication of a technical
specification when• the required support cannot be obtained for the publication of an International Standard,
despite repeated efforts, or• the subject is still under technical development or where, for any other reason, there is the
future but no immediate possibility of an agreement on an International Standard.
Technical specifications are subject to review within three years of publication to decide
whether they can be transformed into International Standards.IEC TS 62564-1, which is a technical specification, has been prepared by IEC technical
committee 107: Process management for avionics.---------------------- Page: 5 ----------------------
– 4 – IEC TS 62564-1:2016 © IEC 2016
This third edition cancels and replaces the second edition, published in 2011. This edition
constitutes a technical revision.This edition includes the following significant technical changes with respect to the previous
edition:a) IEC TS 62239 changed to IEC TS 62239-1, and IEC PAS 62686-1 changed to
IEC TS 62686-1;
b) JESD48 changed to J-STD-048 and added to the Bibliography;
c) AEC-Q100 revision G changed to AEC-Q100:2014 in 4.5 (which is now revision H);
d) revision of AEC-Q101 removed in Bibliography;e) J-STD-609 for “Marking and labelling” added to the Bibliography;
f) information added regarding components' life expectancy in 4.2.5.
GEIA-STD-0002-001 (June 2006), Aerospace Qualified Electronic Component (AQEC)
Requirements, Volume 1 – Integrated Circuits and Semiconductors, has served as a basis for
the elaboration of this technical specification.The text of this technical specification is based on the following documents:
Enquiry draft Report on voting
107/276/DTS 107/283/RVC
Full information on the voting for the approval of this technical specification can be found in
the report on voting indicated in the above table.This publication has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62564 series, under the general title Process management for
avionics – Aerospace qualified electronic components (AQEC), can be found on the IEC
website.The committee has decided that the contents of this publication will remain unchanged until
the stability date indicated on the IEC website under "http://webstore.iec.ch" in the data
related to the specific publication. At this date, the publication will be• transformed into an International standard,
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
A bilingual version of this publication may be issued at a later date.
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IEC TS 62564-1:2016 © IEC 2016 – 5 –
INTRODUCTION
Aerospace qualified electronic components (AQEC) plans are developed by manufacturers in
order to document compliance with AQEC requirements. For AQEC designated components,
the intention is toa) provide AQEC users access to information from the AQEC manufacturers that is
necessary for using commercial-off-the-shelf (COTS) products;
b) better enable AQEC users to assess whether these parts are capable of operating reliably
in their applications;c) minimize deviations from the AQEC manufacturers’ COTS products;
d) have minimal impact on the AQEC manufacturers’ standard operating or business
procedures;
e) promote communication between the AQEC manufacturers and users.
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PROCESS MANAGEMENT FOR AVIONICS –
AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) –
Part 1: Integrated circuits and discrete semiconductors
1 Scope
This part of IEC 62564, which is a Technical Specification, defines the minimum requirements
for integrated circuits and semiconductors which are designated as an “aerospace qualified
electronic component (AQEC)”. It applies to integrated circuits and semiconductors exhibiting
the following attributes:a) a minimum set of requirements, or information provided by the part manufacturer, which
will allow a standard COTS component to be designated AQEC by the manufacturer;b) as a minimum, each COTS component (designated AQEC) will have been designed,
fabricated, assembled, and tested in accordance with the component manufacturer’s
requirements for standard data book components;c) qualification of, and quality systems for, the COTS components to be designated as AQEC
should include the manufacturer’s standards, operating procedures, and technicalspecifications. This information should be available when requested;
d) components manufactured before the manufacturer has addressed AQEC requirements,
but utilizing the same processes, are also considered AQEC compliant;e) additional desired attributes of a device designated AQEC (that will support AQEC users)
are found in Annex B of this technical specification.NOTE Parts qualified to military specifications (except those identified as being for “logistic support” purposes
only) are considered AQEC; the remainder of this technical specification only addresses non-military specification
parts.Parts qualified to AEC-Q100, grade 0 through to grade 3 are considered AQEC. For those
applications where a 0 °C to +70 °C temperature range is appropriate, grade 4 is also
considered to be AQEC. The users should document that the grade category used iscompatible with the application in accordance with their IEC TS 62239-1 electronic
components management plan (ECMP).2 Normative references
The following documents are referred to in the text in such a way that some or all of their
content constitutes requirements of this document. For dated references, only the edition
cited applies. For undated references, the latest edition of the referenced document (including
any amendments) applies.IEC TS 62239-1, Process management for avionics – Management plan – Part 1: Preparation
and maintenance of an electronic components management planIEC 62396-1, Process management for avionics – Atmospheric radiation effects – Part 1:
Accommodation of atmospheric radiation effects via single event effects within avionics
electronic equipmentIEC TS 62668-1, Process management for avionics – Counterfeit prevention − Part 1:
Avoiding the use of counterfeit, fraudulent and recycled electronic componentsISO 9001, Quality management systems – Requirements
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IEC TS 62564-1:2016 © IEC 2016 – 7 –
J-STD-048, Notification Standard for Product Discontinuance
3 Terms, definitions and abbreviations
For the purposes of this document, the following terms, definitions and abbreviations apply.
3.1 Terms and definitions3.1.1
AQEC specification
document prepared by or for the manufacturer to describe an AQEC product
Note 1 to entry: It includes a data sheet and may include other documents, such as material descriptions,
environmental test procedures, quality monitoring processes, etc. It may be a stand-alone document or a clearly
denoted item within a larger documentation system. There may be additional data associated with specific
applications which may be requested separately.3.1.2
AQEC plan
instrument prepared by the plan owner (see 3.1.10) that clearly, concisely, and
unambiguously documents the processes used by the plan owner to satisfy the requirements
of this technical specificationNote 1 to entry: The plan contains auditable content.
3.1.3
assessment
evaluation of a plan owner’s AQEC plan to determine if it is compliant with this technical
specificationNote 1 to entry: It may be conducted by IECQ, the customer, the customer’s designee, or by a third party
designated by the customer community.3.1.4
microcircuit
integrated circuit
microcircuit (device with a high circuit-element density) in which all or some of the circuit
elements are inseparably associated and electrically interconnected (on one or more
substrates, in a unique indivisible package) so that the microcircuit is considered to be
indivisible for the purpose of construction and commerce3.1.5
semiconductor
discrete semiconductor device
semiconductor device that is specified to perform an elementary function and that is not
divisible into separate components functional in themselves (for example diodes, transistors,
optocouplers, LEDs and related products)3.1.6
component
part
microcircuit, integrated circuit, semiconductor or discrete semiconductor for the purpose of
this specification---------------------- Page: 9 ----------------------
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3.1.7
customer
user
designer
original equipment manufacturer (OEM) that procures integrated circuits and/or
semiconductor devices compliant with this technical specification and uses them to design,
produce, and maintain systems3.1.8
customer community
body of customers that may act together to address issues related to this technical
specification3.1.9
data sheet
document prepared by the manufacturer that describes the electrical, mechanical, and
environmental characteristics of the component3.1.10
manufacturer
plan owner
producer of integrated circuits, microcircuits, or other semiconductor devices that may be
designated AQECNote 1 to entry: A manufacturer may produce the components directly or may oversee subcontracted
manufacturing according to their own processes. The manufacturer is also the plan owner.
3.1.11supplier
distributor of components
Note 1 to entry: A plan for controlling AQEC inventory is in place in order to supply AQECs. A manufacturer can
be a supplier in the case where no distributor is involved.3.1.12
third party
party designated to act on the behalf of the customer community
3.1.13
termination
element of a component that connects it electrically and mechanically to the next level of
assemblyNote 1 to entry: A termination includes base materials and coatings (including underplates).
3.1.14form
shape, size, arrangement of parts, visible aspect, mode in which a part exists or manifests
itself, or the material an item is constructed from3.1.15
fit
qualified and competent
3.1.16
function
work to a specification that an item is designed for without degrading reliability
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3.2 Abbreviations
AQEC Aerospace qualified electronic component
Bi-CMOS Bipolar CMOS
BPSG Borophosphosilicate glass
COTS Commercial off the shelf
CMOS Complementary metal oxide semiconductor
DDR Double data rate
DRAM Dynamic random access memory
DSCC Defence supply centre Columbus (see http://www.dscc.dla.mil/)
DSIAC Defense systems information analysis center
ECMP Electronic component management plan
FFF Form, fit and function
FIT Failures in time
FPGA Field programmable gate array
GIDEP Government industry data exchange program
HAST Highly accelerated stress test
HCI Hot carrier injection
HTOL High temperature operating life
LED Light emitting diode
LTB Last time buy
MCU Multiple cell upset
MRAM Magnetoresistive random access memory
NAND Negation AND
NBTI Negative bias temperature Instability
NOR Negation OR
PBTI Positive bias temperature instability
PCN Product change notification
SDRAM Synchronous dynamic random access memory
SEE Single event effect
SEU Single event upset
SER Soft error rate
SEL Single event latch
SEFI Single event functional interrupt
SRAM Static random access memory
SOS Silicon on sapphire
TDDB Time dependant dielectric breakdown
THB Temperature humidity bias
VID Vendor item drawing (controlled and released by DSCC)
4 Technical requirements
4.1 AQEC plan
The processes used to ensure compliance with the following requirements shall be
documented by the AQEC manufacturer and included in their AQEC plan. These requirements
---------------------- Page: 11 ----------------------– 10 – IEC TS 62564-1:2016 © IEC 2016
identify the additional processes, documentation and procedures required to supply a
manufacturer's COTS part as an AQEC. The plan includes, but is not limited to, identifying
data sheet parameters and/or conditions that are different for the AQEC versus the COTS
part. These differences shall be identified and the data made available upon request.
4.2 AQEC documentation4.2.1 General
For an avionics customer, the information supplied by the AQEC manufacturer will be
normally utilised and retained in accordance with the customer electronic component
management plan (see IEC TS 62239-1).4.2.2 AQEC data sheet
The AQEC manufacturer shall provide and maintain under revision control a data sheet that
includes operating characteristics, as well as physical characteristics. Any known
environmental limitations applicable to the application being addressed (see 4.3.1.2) shall be
identified. This documentation shall specify the form, fit and function for a given part number.
This baseline shall not be changed without proper notification (see 4.7). Use of a unique
published or posted AQEC data sheet is encouraged. As a minimum, the AQEC manufacturer
shall document, individually or by family,a) the functional operating temperature range;
b) the defined performance (mechanical and electrical) at the operating temperature range;
c) the maximum storage temperature;d) the maximum operating junction temperature or operating case temperature;
e) the defined lead material, underplate, and termination finish;
f) a package outline drawing;
g) the designation of applicable COTS data sheet (or AQEC unique data sheet, as
applicable) and reference to additional data, if applicable.
NOTE For further guidance, see Annex B.
4.2.3 Material content
For each AQEC covered by this technical specification, the manufacturer shall make
available, upon request, information that describes the material content of the part. Annex A
describes typical material content for an AQEC. Materials that are considered proprietary by
the AQEC manufacturer and are not designated hazardous, may be excluded from public
disclosure.4.2.4 AQEC visibility
Each data sheet shall either state that the parts meet AQEC requirements (preferred) or
optionally, the component manufacturer may list on its website all the part numbers that are
AQEC or include an AQEC reference in a description of another compliant class of parts.
4.2.5 AQEC life expectancyThe AQEC manufacturer shall identify the limiting wear-out failure mechanisms for a given
AQEC in a given application environment (see 4.3.1.2) for highly complex silicon based
technology components of feature size 90 nm and below including SRAMs, DRAMs(SDRAMSs, DDR series), flash memories (NOR logic gate, NAND logic gate, MRAMS,
microprocessors, FPGAs). The AQEC manufacturer shall use acceleration models and failure
rate estimating and reporting methods vetted through peer reviewed publications or described
in industry standards and publications. This information shall be available on a website, data
sheet, alternative database, or provided on an as requested basis.---------------------- Page: 12 ----------------------
IEC TS 62564-1:2016 © IEC 2016 – 11 –
NOTE 1 Examples of die related reliability wear-out failure mechanisms include electromigration, gate oxide
breakdown (TDDB), positive (PBTI) and negative bias temperature instability (NBTI), hot carrier injection (HCI),
etc.NOTE 2 Examples of package reliability wear-out include mechanisms such as delamination, wire bond inter-
metallic formation, etc.NOTE 3 Industry standards and publications which can assist include: JESD94, JEP122, JP001, JESD47,
JESD91, DSIAC (formerly RIAC) publication (”Physics of failure based handbook of microelectronics systems”).
The AQEC manufacturer should have reliability models for the lifetime limiting wear-out failure
modes that can predict the failure rate of that AQEC for a given end of lifetime frame and use
environment.4.2.6 Device technology
Different technologies (e.g. bipolar and bi-CMOS; bulk CMOS and CMOS/SOS) shall not be
furnished under the same part number.4.2.7 SEE data
Avionics equipment is subjected to ionising radiation that increases with altitude. At an
altitude of 40 000 feet (12,2 km) the radiation flux is approximately 300 times the atmospheric
radiation flux at sea level. The principal causes of atmospheric radiation single event effects
(SEE) on devices with geometric feature sizes below a micron are high energy neutrons and
thermal neutrons (see IEC 62396-1).The following information is required, where available, for designers to assess the impact of
component SEE when using small geometric feature size devices, typically below 1 micron.
a) High energy neutron (>10 MeV) measured single event upset (SEU) cross section or the
terrestrially measured soft error rate (SER).b) High energy neutron (>10 MeV) or terrestrially measured multiple cell upset (MCU) cross
section.c) For memory devices, the way in which the bits in an individual word are stored within the
device, i.e. contiguously or non-contiguously.d) The cross sections of any hard SEE, for example single event latch (SEL), single event
functional interrupt (SEFI) or stuck bits.e) Thermal neutron sensitivity and the thermal neutron SEE cross sections. Where the
manufacturer uses Borophosphosilicate glass (BPSG) as a passivation and it contains
boron 10 or natural boron (20 % boron 10), this is to be declared.4.2.8 Termination finish
Only one type of termination finish may be furnished on an individual part number supplied as
part of the AQEC program. As a minimum, a change to a different single lead finish or ball
alloy requires a PCN that includes the date and lot code of implementation. A new assigned
part number is preferred.4.2.9 Third party part numbers
Where applicable, the data sheet shall state the third party part number (e.g. DSCC VID) for
the AQEC manufacturer’s part number (preferred). Optionally, the AQEC manufacturer may
list this data on their website or provide a link to the third party information.
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