Format for LSI-Package-Board Interoperable design

IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.

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IEC 63055:2023 - Format for LSI-Package-Board Interoperable design Released:11. 10. 2023
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IEC 63055
Edition 2.0 2023-10

IEEE Std 2401
Format for LSI-Package-Board Interoperable design
IEC 63055:2023-10(en)  IEEE Std 2401-2019

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IEC 63055
Edition 2.0 2023-10
IEEE Std 2401™
Format for LSI-Package-Board Interoperable design
ICS 31.180, 31.200, 35.060 ISBN 978-2-8322-7515-3
 Warning! Make sure that you obtained this publication from an authorized distributor.
® Registered trademark of the International Electrotechnical Commission

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IEC 63055:2023 © IEC 2023
– i – IEEE Std 2401™-2019
1. Overview .11
1.1 Scope .11
1.2 Purpose .11
1.3 Key characteristics of the LSI-Package-Board Format .11
1.4 Contents of this standard .12
1.5 Word usage .13
2. Normative references .13
3. Definitions, acronyms, and abbreviations .13
3.1 Definitions .13
3.2 Acronyms and abbreviations .16
4. Concept of the LPB Format .

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