IEC 62707-1:2013/AMD1:2018
(Amendment)Amendment 1 - LED-binning - Part 1: General requirements and white colour grid intended for automotive applications intended for automotive applications
Amendment 1 - LED-binning - Part 1: General requirements and white colour grid intended for automotive applications intended for automotive applications
Amendement 1 - Tri des LED - Partie 1: Exigences générales et matrice de couleur blanche destinées aux applications automobiles
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IEC 62707-1 ®
Edition 1.0 2018-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AM ENDMENT 1
AM ENDEMENT 1
LED-binning –
Part 1: General requirements and white colour grid intended for automotive
applications
Tri des LED –
Partie 1: Exigences générales et matrice de couleur blanche destinées aux
applications automobiles
IEC 62707-1:2013-12/AMD1:2018-08(en-fr)
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IEC 62707-1 ®
Edition 1.0 2018-08
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
AM ENDMENT 1
AM ENDEMENT 1
LED-binning –
Part 1: General requirements and white colour grid intended for automotive
applications
Tri des LED –
Partie 1: Exigences générales et matrice de couleur blanche destinées aux
applications automobiles
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 29.140.99 ISBN 978-2-8322-5944-3
– 2 – IEC 62707-1:2013/AMD1:2018
© IEC 2018
FOREWORD
This amendment has been prepared by subcommittee 34A: Lamps, of IEC technical
committee 34: Lamps and related equipment.
The text of this amendment is based on the following documents:
FDIS Report on voting
34A/2098/FDIS 34A/2107/RVD
Full information on the voting for the approval of this amendment can be found in the report
on voting indicated in the above table.
The committee has decided that the contents of this amendment and the base publication will
remain unchanged until the stability date indicated on the IEC website under
"http://webstore.iec.ch" in the data related to the specific publication. At this date, the
publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
_____________
Title
Replace the part title as follows:
Part 1: General requirements and white colour grid intended for
automotive applications
1 Scope
Replace, in the first paragraph, the last sentence with the following new text:
“It applies to LED packages intended for automotive applications.”
Add, at the end of Clause 4, the following new Clause 5:
5 Binning test procedure
5.1 General
For LED packages producing visible radiation the following binning test procedure shall be
applied. Annex C gives information on the recommended measurement accuracy.
© IEC 2018
5.2 Temperature pre-conditioning
Before starting the binning test procedure, the LED package temperatures shall be stabilized
as follows:
Each of T , T , T , T shall be 23 °C ± 5 °C
a s c j
where
T is the ambient temperature of the air surrounding the LED package;
a
T is the solder temperature of the LED package;
s
T is the temperature at the T point of the LED package;
c c
T is the junction temperature of the LED package.
j
5.3 Pulse definition and measurement intervals
During the binning test procedure, the following times and time-intervals (in millisecond, ms)
shall be applied, see Table 5 and Figure 5.
Where a certain range is given, the LED package manufacturer shall choose an appropriate
value.
This choice of the LED package manufacturer shall be made taking into account the following
parameters:
• measurement equipment capability,
• typical input power of the LED package,
• typical heat capacity of the LED package,
• typical thermal conductivity of the LED package,
• typical thermal time-constant of the LED package,
• typical increase of T during the measurement e.g. by monitoring changes in forward
j
voltage.
NOTE In this context, “typical” means: representative for the product family.
The integrating times for the measurements shall be chosen by the LED package
manufacturer to ensure stabilization of the measurement and to avoid an excessive increase
of the junction temperature (T ) of the LED package during the integration time.
j
It is recommended that the increase of junction temperature (T ) during the integration time
j
should not be greater than 5 K.
– 4 – IEC 62707-1:2013/AMD1:2018
© IEC 2018
Table 5 – Times and time-intervals for the binning test procedure
Step Time (ms) Action
1 t = 0 LED package is switched ON at the binning current I . See Note 1.
f,bin
2 t = 1 to 5 End of stabilization time.
3 t = 1 to 10: Start of the electrical measurement (e.g. V ), using a 4-wire technique, with an
f
integration time of 1 ms (minimum) to 5 ms (maximum).
4 t = 1 to 10 Start of optical measurement (e.g. luminous flux, luminous intensity, colour,
a
λ ) , with an integration time of 1 ms (minimum) to 40 ms (maximum) (see Note
dom
2 and Note 3)
5 t = 50 Latest time at which optical measurement ends and LED package is switched off.
NOTE 1 The method of selecting the binning current I is described in 5.4.
f,bin
NOTE 2 A typical integration time for optical measurements is 20 ms.
NOTE 3 For LED packages with intensity values below 50 mcd, higher integration times can be used.
a
If luminous intensity binning is used, information should be provided for correlation of a luminous intensity
value to its corresponding luminous flux value. This correlation factor should be based on a representative
value for the product family.
Pulse length: LED is switched on at t = 0 at the binning current I bin
f
and switched off no later than at t = 51 ms
Optical measurement: Integration time 1 ms to 51 ms
(Note: some manufacturers can start the optical measurement only after the end of the
electrical measurement)
Stabilization time: 1 ms to 5 ms
Electrical
Integration time: 1 ms to 5 ms after stabilization
Measurement
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51
time in ms
IEC
Figure 5 – Times and time-intervals for binning tests
5.4 Binning currents
5.4.1 High-power (rated power ≥ 250 mW) InGaN-based LED packages
For LED packages with a rated input power equal or greater than 250 mW, based on InGaN
technology, the appropriate binning current shall be selected from the list of binning currents
given in Table 6, in order to be within the range of 65 % to 75 % of the maximum rated value
as given in the LED package datasheet, i.e. 0,65 x I ≤ I ≤ 0,75 x I where I is
f,max f,bin f,max f,bin
chosen from the values given in Table 6 (rule No.1)
where
I is the binning current;
f,bin
I is the maximum drive current specified on the data sheet.
f,max
© IEC 2018
If more than one value of Table 6 meet this criteria, then the value closest to one of the two
border values shall be chosen (rule No.1a).
In case of doubt, the higher value shall be chosen (rule No.1b).
NOTE The input power of an LED package and its material-technology are given by the LED package
manufacturer on the data sheet.
If no value from Table 6 fulfils the above requirements (“unlisted values, holes”), the next
higher binning current from Table 6, which lies above 75 % of the maximum rated current, but
below the maximum rated current, shall be used i.e. 0,75 x I < I ≤ I (rule No.2a).
f,max f,bin f,max
If no value from Table 6 fulfils this requirement, the next smallest value from Table 6 shall be
used, i.e. I < 0,65 x I (rule No.2b).
f,bin f,max
5.4.2 Low- and mid power (rated power < 250 mW) InGaN-based LED packages and all
AlInGaP-based LED packages
For LED packages with a rated input power less than 250 mW based on InGaN technology
and all LED packages based on AlInGaP technology, the binning current shall be chosen from
those listed in Table 6, based on the most common application for this LED package (rule
No.3).
Rule No.1 and rule No.2 do not apply for these LED packages, because for these LED
packages the currents in the application are often much lower than the maximum rated values
from the datasheet.
Table 6 – Binning currents
Number Binning current I
f,bin
mA
1 2
2 5
3 10
4 20
5 30
6 50
7 70
8 100
9 150
10 200
11 350
12 500
13 700
14 850
15 1 000
16 1 500
17 2 000
18 3 000
19 5 000
20 6 000
Add, at the end of Annex B, the following new Annex C:
– 6 – IEC 62707-1:2013/AMD1:2018
© IEC 2018
Annex C
(informative)
Measurement accuracy
C.1 General
For the electrical and optical measurements described in 5.3, the values for the internal
reproducibility tolerance and absolute uncertainty should be determined in accordance with
ISO/IEC Guide 98-3:2008.
C.2 Luminous flux and luminous intensity
The internal reproducibility tolerance for luminous flux and luminous intensity measurements
should be no greater than ± 8 %, and the absolute uncertainty (traceable to national
calibration standards) should be no greater than ± 11 % (both with a coverage factor of k = 3).
C.3 Single-die forward voltage (in volts)
The internal reproducibility should not be worse
...
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