IEC 61967-6:2002

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Specifies a method for evaluating RF currents on the pins of an integrated circuit (IC) by means of non-contact current measurement using a miniature magnetic probe. This method is capable of measuring the RF currents generated by the IC over a frequency range of 0,15 MHz to 1 000 MHz. The contents of the corrigendum of August 2010 have been included in this copy.

Circuits intégrés - Mesure des émissions électromagnétiques, 150 kHz à 1 GHz - Partie 6: Mesure des émissions conduites - Méthode de la sonde magnétique

Spécifie une méthode pour l'évaluation des courants RF sur les broches d'un circuit intégré par la mesure du courant sans contact en utilisant une sonde magnétique miniature. Cette méthode permet de mesurer les courants RF générés par le circuit intégré (CI) dans une plage de fréquences allant de 0,15 MHz à 1 000 MHz. Le contenu du corrigendum d'août 2010 a été pris en considération dans cet exemplaire.

General Information

• Status: Published
• Publication Date: 24-Jun-2002
• ICS: 31.200 - Integrated circuits. Microelectronics
• Technical Committee: SC 47A - Integrated circuits
• Drafting Committee: WG 9 - TC 47/SC 47A/WG 9
• Current Stage: PPUB - Publication issued
• Start Date: 25-Jun-2002
• Completion Date: 31-Jul-2002

Relations

• Amended By: IEC 61967-6:2002/AMD1:2008 - Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
• Effective Date: 05-Sep-2023
• Corrected By: IEC 61967-6:2002/COR1:2010 - Corrigendum 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
• Effective Date: 05-Sep-2023

Standards Content (Sample)

NORME CEI
INTERNATIONALE IEC
61967-6
INTERNATIONAL
Première édition
STANDARD
First edition
2002-06
Circuits intégrés –
Mesure des émissions électromagnétiques,
150 kHz à 1 GHz –
Partie 6:
Mesure des émissions conduites –
Méthode de la sonde magnétique
Integrated circuits –
Measurement of electromagnetic emissions,
150 kHz to 1 GHz –
Part 6:
Measurement of conducted emissions –
Magnetic probe method
Numéro de référence
Reference number
CEI/IEC 61967-6:2002
Numérotation des publications Publication numbering
Depuis le 1er janvier 1997, les publications de la CEI As from 1 January 1997 all IEC publications are
sont numérotées à partir de 60000. Ainsi, la CEI 34-1 issued with a designation in the 60000 series. For
devient la CEI 60034-1. example, IEC 34-1 is now referred to as IEC 60034-1.
Editions consolidées Consolidated editions
Les versions consolidées de certaines publications de la The IEC is now publishing consolidated versions of its
CEI incorporant les amendements sont disponibles. Par publications. For example, edition numbers 1.0, 1.1
exemple, les numéros d’édition 1.0, 1.1 et 1.2 indiquent and 1.2 refer, respectively, to the base publication,
respectivement la publication de base, la publication de the base publication incorporating amendment 1 and
base incorporant l’amendement 1, et la publication de the base publication incorporating amendments 1
base incorporant les amendements 1 et 2. and 2.
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nibles dans le Catalogue des publications de la CEI available in the IEC Catalogue of publications
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NORME CEI
INTERNATIONALE IEC
61967-6
INTERNATIONAL
Première édition
STANDARD
First edition
2002-06
Circuits intégrés –
Mesure des émissions électromagnétiques,
150 kHz à 1 GHz –
Partie 6:
Mesure des émissions conduites –
Méthode de la sonde magnétique
Integrated circuits –
Measurement of electromagnetic emissions,
150 kHz to 1 GHz –
Part 6:
Measurement of conducted emissions –
Magnetic probe method
 IEC 2002 Droits de reproduction réservés  Copyright - all rights reserved
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Pour prix, voir catalogue en vigueur
For price, see current catalogue

– 2 – 61967-6  CEI:2002
SOMMAIRE
AVANT-PROPOS .6
1 Domaine d’application.10
2 Références normatives .10
3 Définitions .10
4 Généralités.10
4.1 Philosophie de la mesure.10
4.2 Principe de mesure.12
5 Conditions d'essai.12
5.1 Généralités.12
5.2 Gamme de fréquences .12
6 Equipement d’essai.12
6.1 Généralités.12
6.2 Sonde magnétique.12
6.3 Fixation et placement de la sonde.12
7 Montage d’essai.18
7.1 Généralités.18
7.2 Etalonnage de la sonde .18
7.3 Modifications de la carte d’essai CI normalisée .18
7.3.1 Disposition des couches .18
7.3.2 Epaisseur de couche.18
7.3.3 Condensateurs de découplage .18
7.3.4 Charge de broche d’E/S .20
8 Procédure d’essai .28
8.1 Généralités.28
8.2 Technique d’essai.28
9 Rapport d'essai.28
9.1 Généralités.28
9.2 Documentation .28
Annexe A (normative) Procédure d’étalonnage de la sonde –
Méthode de la ligne microruban.32
Annexe B (informative) Principe de mesure et facteur d’étalonnage .38
Annexe C (informative) Résolution spatiale de la sonde magnétique.46
Annexe D (informative) Structure d’angle pour placement de la sonde .48
Bibliographie .50
Figure 1 – Sonde magnétique.14
Figure 2 – Première et troisième couches de la sonde magnétique .14
Figure 3 – Deuxième couche de la sonde magnétique .16
Figure 4 – Sonde magnétique – Construction des couches .16
Figure 5 – Carte d’essai CI normalisée (vue en coupe 1) .20
Figure 6 – Carte d’essai CI normalisée (vue en coupe 2 – ligne de mesure).20

61967-6  IEC:2002 – 3 –
CONTENTS
FOREWORD.7
1 Scope.11
2 Normative references .11
3 Definitions .11
4 General .11
4.1 Measurement philosophy.11
4.2 Measurement principle .13
5 Test conditions .13
5.1 General .13
5.2 Frequency range .13
6 Test equipment.13
6.1 General .13
6.2 Magnetic probe .13
6.3 Probe spacing fixture and placement.13
7 Test set-up .19
7.1 General .19
7.2 Probe calibration .19
7.3 Modifications to standardized IC test board .19
7.3.1 Layer arrangement .19
7.3.2 Layer thickness .19
7.3.3 Decoupling capacitors .19
7.3.4 I/O pin loading .21
8 Test procedure .29
8.1 General .29
8.2 Test technique.29
9 Test report.29
9.1 General .29
9.2 Documentation .29
Annex A (normative) Probe calibration procedure – Microstrip line method .33
Annex B (informative) Measurement principle and calibration factor.39
Annex C (informative) Spatial resolution of magnetic probe .47
Annex D (informative) Angle pattern of probe placement.49
Bibliography.51
Figure 1 – Magnetic probe .15
Figure 2 – Magnetic probe 1st and 3rd layers .15
Figure 3 – Magnetic probe 2nd layer.17
Figure 4 – Magnetic probe – layer construction.17
Figure 5 – Standardized IC test board (sectional view 1).21
Figure 6 – Standardized IC test board (sectional view 2 – measurement line) .21

– 4 – 61967-6  CEI:2002
Figure 7 – Structure de ligne de puissance sur la carte d’essai CI normalisée –
Couche inférieure.22
Figure 8 – Impression de ligne de signal E/S sur la carte
d’essai CI normalisée – Couche inférieure.24
Figure 9 – Lignes multiples de puissance sur carte d’essai CI normalisée –
Couche inférieure.24
Figure 10 – Montage de mesure .26
Figure 11 – Schéma de circuit de mesure.26
Figure 12 – Constante de transfert pour le calcul du courant en fonction de l’épaisseur
de l’isolant de la carte à microruban .30
Figure A.1 – Vue en coupe de la ligne à microruban pour étalonnage .32
Figure A.2 – Montage de mesure pour l’étalonnage de la sonde.36
Figure B.1 – Vue en coupe de la ligne à microruban .38
Figure B.2 – Mesure de la sortie de la sonde magnétique .42
Figure B.3 – Exemple de facteur d’étalonnage pour la sonde magnétique
spécifiée aux figures 1, 2, 3 et 4.44
Figure C.1 – Schéma pour la mesure d’une distribution de champ magnétique .46
Figure C.2 – Distribution de champ magnétique à travers la ligne à microruban (800 MHz) .46
Figure D.1 – Schéma de mesure d’une structure d’angle de placement de sonde.48
Figure D.2 – Sortie de sonde par rapport à l’angle ϕ .48

61967-6  IEC:2002 – 5 –
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer .23
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer .25
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer .25
Figure 10 – Measurement set-up .27
Figure 11 – Measurement circuit schematic .27
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board. .31
Figure A.1 – Cross-sectional view of a microstrip line for calibration .33
Figure A.2 – Measurement set-up for probe calibration .37
Figure B.1 – Cross-sectional view of a microstrip line .39
Figure B.2 – Measurement of magnetic probe output .43
Figure B.3 – Example of calibration factor for the magnetic probe
specified in figures 1, 2, 3, and 4 .45
Figure C.1 – Diagram for measuring a magnetic field distribution.47
Figure C.2 – Magnetic field distribution across the microstrip line (800 MHz) .47
Figure D.1 – Diagram for measuring an angle pattern of probe placement .49
Figure D.2 – Probe output to angle ϕ .49

– 6 – 61967-6  CEI:2002
COMMISSION ÉLECTROTECHNIQUE INTERNATIONALE
____________
CIRCUITS INTÉGRÉS –
MESURE DES ÉMISSIONS ÉLECTROMAGNÉTIQUES, 150 kHz À 1 GHz –
Partie 6: Mesure des émissions conduites –
Méthode de la sonde magnétique
AVANT-PROPOS
1) La CEI (Commission Électrotechnique Internationale) est une organisation mondiale de normalisation composée
de l'ensemble des comités électrotechniques nationaux (Comités nationaux de la CEI). La CEI a pour objet de
favoriser la coopération internationale pour toutes les questions de normalisation dans les domaines de
l'électricité et de l'électronique. A cet effet, la CEI, entre autres activités, publie des Normes internationales.
Leur élaboration est confiée à des comités d'études, aux travaux desquels tout Comité national intéressé par le
sujet traité peut participer. Les organisations internationales, gouvernementales et non gouvernementales, en
liaison avec la CEI, participent également aux travaux. La CEI collabore étroitement avec l'Organisation
Internationale de Normalisation (ISO), selon des conditions fixées par accord entre les deux organisations.
2) Les décisions ou accords officiels de la CEI concernant les questions techniques représentent, dans la mesure
du possible, un accord international sur les sujets étudiés, étant donné que les Comités nationaux intéressés
sont représentés dans chaque comité d’études.
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façon transparente, dans toute la mesure possible, les Normes internationales de la CEI dans leurs normes
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correspondante doit être indiquée en termes clairs dans cette dernière.
5) La CEI n’a fixé aucune procédure concernant le marquage comme indication d’approbation et sa responsabilité
n’est pas engagée quand un matériel est déclaré conforme à l’une de ses normes.
6) L’attention est attirée sur le fait que certains des éléments de la présente Norme internationale peuvent faire
l’objet de droits de propriété intellectuelle ou de droits analogues. La CEI ne saurait être tenue pour
responsable de ne pas avoir identifié de tels droits de propriété et de ne pas avoir signalé leur existence.
La Norme internationale CEI 61967-6 a été établie par le sous-comité 47A: Circuits intégrés,
du comité d’études 47 de la CEI: Dispositifs à semiconducteurs.
Le texte de cette norme est issu des documents suivants:
FDIS Rapport de vote
47A/645/FDIS 47A/653/RVD
Le rapport de vote indiqué dans le tableau ci-dessus donne toute information sur le vote ayant
abouti à l'approbation de cette norme.
Cette publication a été rédigée selon les Directives ISO/CEI, Partie 3.
L’annexe A fait partie intégrante de cette norme.
Les annexes B, C et D sont données uniquement à titre d'information.
La présente norme doit être lue conjointement à la CEI 61967-1.

61967-6  IEC:2002 – 7 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
FOREWORD
1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising
all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote
international co-operation on all questions concerning standardization in the electrical and electronic fields. To
this end and in addition to other activities, the IEC publishes International Standards. Their preparation is
entrusted to technical committees; any IEC National Committee interested in the subject dealt with may
participate in this preparatory work. International, governmental and non-governmental organizations liaising
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Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
two organizations.
2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an
international consensus of opinion on the relevant subjects since each technical committee has representation
from all interested National Committees.
3) The documents produced have the form of recommendations for international use and are published in the form
of standards, technical specifications, technical reports or guides and they are accepted by the National
Committees in that sense.
4) In order to promote international unification, IEC National Committees undertake to apply IEC International
Standards transparently to the maximum extent possible in their national and regional standards. Any
divergence between the IEC Standard and the corresponding national or regional standard shall be clearly
indicated in the latter.
5) The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any
equipment declared to be in conformity with one of its standards.
6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject
of patent rights. The IEC shall not be held responsible for identifying any or all such patent rights.
International Standard IEC 61967-6 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.
The text of this standard is based on the following documents:
FDIS Report on voting
47A/645/FDIS 47A/653/RVD
Full information on the voting for the approval of this standard can be found in the report on
voting indicated in the above table.
This publication has been drafted in accordance with the ISO/IEC Directives, Part 3.
Annex A forms an integral part of this standard.
Annexes B, C and D are for information only.
This standard should be read in conjunction with IEC 61967-1.

– 8 – 61967-6 © CEI:2002
La CEI 61967 comprend les parties suivantes, regroupées sous le titre général
Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz:
Partie 1: Conditions générales et définitions
Partie 2: Mesure des émissions rayonnées – Méthode de cellule TEM
Partie 3: Mesure des émissions rayonnées – Méthode de scrutation surfacique
(spécification technique)
Partie 4: Mesure des émissions conduites – Méthode par couplage direct 1 Ω/150 Ω
Partie 5: Mesure des émissions conduites – Méthode de la cage de Faraday sur banc de travail
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique

Le comité a décidé que le contenu de cette publication ne sera pas modifié avant 2008. A cette
date, la publication sera
• reconduite;
• supprimée;
• remplacée par une édition révisée, ou
• amendée.
Le contenu du corrigendum d’août 2010 a été pris en considération dans cet exemplaire.
___________
A l'étude.
A publier.
61967-6 © IEC:2002 – 9 –
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
Part 2: Measurement of radiated emissions – TEM-cell method
Part 3: Measurement of radiated emissions – Surface scan method (technical specification)
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
Part 5: Measurement of conducted emissions – Workbench Faraday cage method
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of this publication will remain unchanged until 2008.
At this date, the publication will be
• reconfirmed;
• withdrawn;
• replaced by a revised edition, or
• amended.
The contents of the corrigendum of August 2010 have been included in this copy.

___________
Under consideration.
To be published.
– 10 – 61967-6  CEI:2002
CIRCUITS INTÉGRÉS –
MESURE DES ÉMISSIONS ÉLECTROMAGNÉTIQUES, 150 kHz À 1 GHz –
Partie 6: Mesure des émissions conduites –
Méthode de la sonde magnétique
1 Domaine d’application
La présente partie de la CEI 61967 spécifie une méthode pour l’évaluation des courants RF sur
les broches d’un circuit intégré par la mesure du courant sans contact en utilisant une sonde
magnétique miniature. Cette méthode permet de mesurer les courants RF générés par le
circuit intégré (CI) dans une plage de fréquences allant de 0,15 MHz à 1 000 MHz. Cette
méthode est applicable aux mesures sur un seul CI ou sur un ensemble de puces de CI
sur la carte d’essai normalisée afin de fournir les caractéristiques et de permettre les
comparaisons. Elle est également utilisable pour l’évaluation des caractéristiques électro-
magnétiques d’un CI ou d’un groupe de CI sur une carte de circuit imprimé d’application
réelle afin de réduire les émissions. Cette méthode est désignée sous le terme «Méthode
de la sonde magnétique».
2 Références normatives
Les documents de référence suivants sont indispensables pour l'application du présent
document. Pour les références datées, seule l'édition citée s'applique. Pour les références non
datées, la dernière édition du document de référence s'applique (y compris les éventuels
amendements).
CEI 61967-1, Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz
– Partie 1: Conditions générales et définitions
CEI 61967-4, Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz
– Partie 4: Mesure des émissions conduites – Méthode par couplage direct 1 Ω/150 Ω
3 Définitions
Pour les besoins de la présente partie de la CEI 61967, les définitions de la CEI 61967-1
s'appliquent.
4 Généralités
4.1 Philosophie de la mesure
Les émissions rayonnées provenant d’une carte à circuit imprimé (PCB) sont dues, partiel-
lement, au courant RF généré par le CI qui excite les pistes, la masse et les plans
d’alimentation de la carte ainsi que les câbles connectés à celle-ci. Tous ces éléments peuvent
agir comme des antennes RF pour produire des émissions rayonnées. Le niveau d’émission
est proportionnel au courant RF d'excitation et il est également affecté de manière importante
par la conception de la carte, l’efficacité de rayonnement des pseudo-antennes et les coeffi-
cients de chemin de couplage de bruit allant du CI aux pseudo-antennes.
Pour ce mécanisme d’émission, le niveau d’émission du CI peut être un paramètre important à
la fois pour les utilisateurs et les fabricants pour estimer et prévoir les caractéristiques
électromagnétiques d’une carte à circuit imprimé, d’un module ou d’un réseau. On peut obtenir
une mesure du niveau d’émission en mesurant les courants RF générés par le CI en essai.
Ainsi, le courant de bruit RF mesuré peut être considéré comme un indicateur du niveau
d’émission électromagnétique indésirable généré par le CI.
___________
A publier.
61967-6  IEC:2002 – 11 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
1 Scope
This part of the IEC 61967 specifies a method for evaluating RF currents on the pins of an
integrated circuit (IC) by means of non-contact current measurement using a miniature
magnetic probe. This method is capable of measuring the RF currents generated by the IC
over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the
measurement of a single IC or a chip set of ICs on the standardized test board for
characterization and comparison purposes. It is also usable to evaluate the electromagnetic
characteristics of an IC or group of ICs on an actual application PCB for emission reduction
purposes. This method is called the "magnetic probe method".
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
3 Definitions
For the purposes of this part of IEC 61967 the definitions found in IEC 61967-1 apply.
4 General
4.1 Measurement philosophy
The emissions radiated from a PCB are, in part, caused by RF current generated by the
onboard IC which drives PCB traces, PCB ground and supply planes, and cables connected to
the PCB. All of these can act as RF antennas to radiate the emissions. The emission level is
proportional to the driving RF current, and is also affected significantly by PCB design,
radiation effectiveness of the pseudo-antennas, and noise coupling path coefficients from the
IC to the pseudo-antennas.
For this emission mechanism, the driving force of the IC can be a significant parameter for
both users and manufacturers to estimate and predict the electromagnetic characteristics of a
PCB, module, or system. A measure of the emission driving force can be obtained by
measuring the RF currents generated by the IC under test. Thus, the measured RF noise
current can be regarded as an indicator of the undesirable electromagnetic emission driving
force generated by the IC.
___________
To be published.
– 12 – 61967-6  CEI:2002
4.2 Principe de mesure
Avec cette méthode, le courant RF sur les broches d’alimentation en énergie et les broches
d’E/S d’un CI en essai peut être mesuré avec une sonde magnétique miniature triplaque. Cette
sonde mesure le champ magnétique à une hauteur spécifiée au-dessus d’un ruban conducteur
d’alimentation ou d’E/S sur la carte d’essai normalisée d’une manière contrôlée. Le courant RF
est calculé à partir du champ magnétique mesuré en utilisant la formule décrite en 8.2. Avec
un placement mécanique précis de la sonde magnétique, cette méthode offre un degré élevé
de répétabilité. De plus, la plage de fréquences de cette méthode peut être étendue aux
limites données en 5.2. Des fréquences plus élevées peuvent être obtenues sans influence
significative sur la précision. L’estimation du courant RF sur le ruban conducteur
d’alimentation ou d’E/S fournit un moyen facile et pratique pour donner les caractéristiques
des CI et les comparer.
5 Conditions d'essai
5.1 Généralités
Les conditions générales d'essai sont présentées dans la CEI 61967-1.
5.2 Gamme de fréquences
La gamme de fréquences efficace de cette méthode de mesure s’étend de 0,15 MHz à
1 000 MHz. La fréquence maximale peut être accrue, si on le souhaite, sous réserve des
limites du montage d’essai. La limite supérieure de la gamme de fréquences est directement
liée aux caractéristiques haute fréquence de la sonde magnétique et à sa distance par rapport
à la ligne en essai comme décrit à l’annexe B. Pour une zone basse fréquence entre 0,15 MHz
et 10 MHz, il peut être cependant judicieux d’utiliser un pré-amplificateur à faible bruit pour
améliorer la gamme dynamique de la mesure.
6 Equipement d’essai
6.1 Généralités
Pour les informations générales concernant l'équipement d'essai, voir la CEI 61967-1.
6.2 Sonde magnétique
La sonde magnétique doit être constituée d’une ligne triplaque composée d’une carte à trois
couches. Les détails pour la construction recommandée de la sonde sont donnés aux figures 1,
2, 3 et 4.
Un connecteur SMA est fixé au bord de la carte à l’opposé de la portion de boucle rectan-
gulaire de la sonde comme cela est représenté dans les figures. Les pastilles de fixation pour
le connecteur SMA sont placées sur les couches 1 et 3, qui sont connectées les unes aux
autres par l’intermédiaire de quatre trous de liaison. Le réseau de lignes conductrices se trouve
sur la couche 2, qui est connectée à la broche centrale du connecteur SMA.
6.3 Fixation et placement de la sonde
La tension de sortie de la sonde dépend de la distance entre l’extrémité de la sonde et la
bande conductrice mesurée. Cela rend très critique le fait de maintenir un espace de 1 mm
entre la ligne conductrice et l’extrémité de la sonde magnétique au cours de cette mesure.
C’est pourquoi une fixation pour l’espacement de la sonde doit être utilisée pour maintenir un
espace de 1,0 mm ± 0,1 mm entre la partie inférieure de la portion de boucle rectangulaire et
la bande conductrice sur la carte d’essai de CI sinon toute la sonde peut être moulée dans un
seul bloc de fixation abritant la sonde de manière à maintenir l’espace spécifié de façon
précise comme indiqué à la figure 10.

61967-6  IEC:2002 – 13 –
4.2 Measurement principle
Using this test method, the RF current on the power supply pins and I/O pins of an IC under
test can be measured using a miniature triplate-structured magnetic probe. This probe
measures the magnetic field at a specified height over a power supply or I/O strip conductor
on the standardized test board in a controlled manner. The RF current is calculated from the
measured magnetic field using the formula described in 8.2. With accurate mechanical
placement of the magnetic probe, this method provides a high degree of repeatability. In
addition, the frequency range of this method can be extended subject to the limitations
described in 5.2. Higher frequencies can be obtained without a substantial influence on
accuracy. The estimation of the RF current over the power supply or I/O strip conductor is an
easy and handy way of characterizing and comparing the ICs.
5 Test conditions
5.1 General
General test conditions are described in IEC 61967-1.
5.2 Frequency range
The effective frequency range of this measurement method is 0,15 MHz to 1 000 MHz. The
maximum frequency can be extended, if desired, subject to the limitations of the test set-up.
The upper limit of the frequency range is directly related to high frequency characteristics of
the magnetic probe and its distance from the line under test as described in annex B. At a low
frequency region of 0,15 MHz to 10 MHz, however, it may be advisable to use a low noise
pre-amplifier to improve dynamic range of the measurement.
6 Test equipment
6.1 General
For general information on test equipment see IEC 61967-1.
6.2 Magnetic probe
The magnetic probe shall be a triplate-structured strip line composed of a three-layer PCB.
Recommended probe construction details are shown in figures 1, 2, 3 and 4.
An SMA connector is attached at the edge of the PCB opposite to the rectangular loop portion
of the probe as shown in the figures . Attachment pads for the SMA connector are on layers 1
and 3, which are connected to each other through four vias. The strip conductor pattern is on
layer 2, which is connected to the centre pin of the SMA connector.
6.3 Probe spacing fixture and placement
The probe output voltage depends on the distance between the probe tip and the strip
conductor under measurement. This makes it very critical to maintain a 1 mm space between
the strip conductor and the magnetic probe tip during this measurement. Therefore, a probe
spacing fixture shall be used to maintain 1,0 mm ± 0,1 mm spacing between the bottom of the
rectangular loop portion of the probe and strip line on the IC test board, or the entire probe
can be molded into a piece of fixing block which houses the probe so as to maintain the
specified space precisely as shown in figure 10.

– 14 – 61967-6  CEI:2002
De plus, la tension de sortie de la sonde dépend de l’angle de placement de la sonde (ϕ) par
rapport à la direction de la ligne à microruban qui est mesurée. Conformément à une mesure
expérimentale sur les structures d’angle du placement directionnel de la sonde, l’angle doit
être inférieur à 15° pour que l’erreur d’amplitude soit inférieure à –2 dB. Se reporter à l’annexe
D pour les détails.
Trou de liaison pour connecteur
SMA à travers les couches 1, 2 et 3
Trou de liaison pour connecteur
SMA à travers les couches 1, 2 et 3
Pastilles pour connecteur SMA
sur les couches 1 et 3
Structure de ligne de signal
30 mm
sur la couche 2
Ligne ruban de 50 Ω
Structure de plan de masse
sur la couche 1 et la couche 3
Portion de boucle rectangulaire
pour la détection
10 mm
Trous de liaison à travers
les couches 1, 2
IEC  1468/02
Figure 1 – Sonde magnétique
Trou de liaison
Axe
Trou de liaison
10 mm
30 mm 0,8 mm
1,8 mm 0,2 mm
Trou de liaison: 0,25 mm
de diamètre
8,4 mm
0,1 mm
10 mm
IEC  1469/02
Figure 2 – Première et troisième couche de la sonde magnétique

61967-6  IEC:2002 – 15 –
In addition, the probe output voltage depends on probe placement angle (ϕ) to direction of
microstrip line under measurement. According to an experimental measurement on angle
patterns of probe directional placement, the angle shall be less than 15° for amplitude error to
be less than –2 dB. See annex D for details.
Via for SMA connector
through layers 1, 2, and 3
Via for SMA connector
through layers 1, 2, and 3
Pads for SMA connector
on layer 1 and 3
Signal line pattern on layer 2
30 mm
50 Ω strip line
Ground plane patterns
on layer 1 and layer 3
Rectangular loop portion
for detection
10 mm
Via through layers 1, 2, and 3
IEC  1468/02
Figure 1 – Magnetic probe
Via
Center line
Via
10 mm
30 mm
0,8 mm
1,8 mm 0,2 mm
Via: 0,25 mm diameter
8,4 mm
0,1 mm
10 mm
IEC  1469/02
Figure 2 – Magnetic probe – First and third layers

– 16 – 61967-6 © CEI:2002
Trou de liaison
Axe
30 mm
0,1 mm
1,0 mm
5,2 mm
0,4 mm Trou de liaison: 0,25 mm
de diamètre
10 mm
IEC  2078/10
Figure 3 – Deuxième couche de la sonde magnétique
Couche 1
Isolant
Couche 2
Isolant
Couche 3
Isolants
(verre epoxy)
Isolants pour renforcement
(recommandé)
Epaisseur des feuilles de cuivre:
couche 1: 0,035 mm
couche 2: 0,035 mm
couche 3: 0,035 mm
0,2 mm* 0,2 mm*
* Epaisseur de l’isolant
Axe
IEC  1471/02
Figure 4 – Sonde magnétique – Construction des couches

61967-6 © IEC:2002 – 17 –
Via
Center line
30 mm
0,1 mm
1,0 mm
5,2 mm
Via: 0,25 mm diameter
0,4 mm
10 mm
IEC  2078/10
Figure 3 – Magnetic probe – Second layer
Layer 1
Insulator
Layer 2
Insulator
Layer 3
Insulators
(glass epoxy)
Insulators for reinforcement
(recommended)
Thickness of copper foils:
Layer 1: 0,035 mm
Layer 2: 0,035 mm
Layer 3: 0,035 mm
0,2 mm* 0,2 mm*
* Thickness of insulator
Center line
IEC  1471/02
Figure 4 – Magnetic probe – Layer construction

– 18 – 61967-6  CEI:2002
7 Montage d’essai
7.1 Généralités
Les prescriptions générales relatives au montage d'essai sont décrites dans la CEI 61967-1.
Le montage de mesure et le schéma de circuit de la méthode de mesure à la sonde
magnétique sont représentés respectivement aux figures 10 et 11.
7.2 Etalonnage de la sonde
La sonde magnétique utilisée doit être étalonnée pour obtenir une corrélation précise entre
l’intensité du champ magnétique mesurée et le courant RF estimé. L’étalonnage de la sonde
doit être conforme à la méthode décrite à l’annexe A (méthode de la ligne à microruban).
7.3 Modifications de la carte d’essai CI normalisée
La carte d’essai CI normalisée décrite dans la CEI 61967-1 doit être utilisée. Cependant, elle
doit être adaptée comme cela est indiqué aux figures 5, 6, 7, 8, et 9.
7.3.1 Disposition des couches
La carte d’essai de CI doit posséder au minimum quatre couches. Il est recommandé d’utiliser
une carte d’essai de CI à quatre couches comme indiqué aux figures 5 et 6. Si nécessaire, des
couches supplémentaires peuvent être insérées entre la couche supérieure et la couche de
masse à microruban pour assurer le routage complémentaire de signal et/ou d’énergie. La
construction de la carte d’essai de CI doit être telle que spécifié dans la CEI 61967-1 sauf
comme indiqué ci-dessous dans le cas de n couches en général.
1) Couche supérieure (couche 1): Le CI en essai doit être placé sur la couche 1. Voir la
CEI 61967-1
2) Couche suivant immédiatement la couche inférieure (couche n−1): Une zone de plan de
masse doit être constituée sur la couche n−1 pour fournir une référence pour les structures
de microrubans sur la couche inférieure. Le plan de masse peut couvrir l’ensemble de la
couche ou peut être limité à la zone sous les structures de microruban comme représenté
dans la zone délimitée par les pointillés des figures 7 et 8. Cette zone de plan de masse
doit avoir une largeur minimale de 11 mm et une longueur minimale de 14 mm
...

IEC 61967-6 ®
Edition 1.1 2008-06
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz
to 1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –
Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique

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IEC 61967-6 ®
Edition 1.1 2008-06
CONSOLIDATED VERSION
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Integrated circuits – Measurement of electromagnetic emissions, 150 kHz

to 1 GHz –
Part 6: Measurement of conducted emissions – Magnetic probe method

Circuits intégrés – Mesure des émissions électromagnétiques, 150 kHz à 1 GHz –

Partie 6: Mesure des émissions conduites – Méthode de la sonde magnétique

INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 31.200 ISBN 2-8318-9726-2
– 2 – 61967-6 © IEC:2002+A1:2008
CONTENTS
FOREWORD.5
1 Scope.7
2 Normative references.7
3 Definitions.7
4 General.7
4.1 Measurement philosophy.7
4.2 Measurement principle.8
5 Test conditions.8
5.1 General.8
5.2 Frequency range.8
6 Test equipment.8
6.1 General.8
6.2 Magnetic probe .8
6.3 Probe spacing fixture and placement.8
7 Test set-up.11
7.1 General.11
7.2 Probe calibration.11
7.3 Modifications to standardized IC test board .11
7.3.1 Layer arrangement.11
7.3.2 Layer thickness.11
7.3.3 Decoupling capacitors.11
7.3.4 I/O pin loading.12
8 Test procedure.16
8.1 General.16
8.2 Test technique.16
9 Test report.16
9.1 General.16
9.2 Documentation.16

Annex A (normative) Probe calibration procedure – Microstrip line method .18
Annex B (informative) Measurement principle and calibration factor.21
Annex C (informative) Spatial resolution of magnetic probe .25
Annex D (informative) Angle pattern of probe placement.26
Annex E (informative) Advanced magnetic probe .27

Bibliography.44

Figure 1 – Magnetic probe .9
Figure 2 – Magnetic probe 1st and 3rd layers .9
Figure 3 – Magnetic probe 2nd layer.10
Figure 4 – Magnetic probe – layer construction.10
Figure 5 – Standardized IC test board (sectional view 1).12
Figure 6 – Standardized IC test board (sectional view 2 – measurement line) .12

61967-6 © IEC:2002+A1:2008 – 3 –
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer .13
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer .14
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer .14
Figure 10 – Measurement set-up .15
Figure 11 – Measurement circuit schematic .15
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board. .17
Figure A.1 – Cross-sectional view of a microstrip line for calibration .18
Figure A.2 – Measurement set-up for probe calibration .20
Figure B.1 – Cross-sectional view of a microstrip line .21
Figure B.2 – Measurement of magnetic probe output .23
Figure B.3 – Example of calibration factor for the magnetic probe
specified in figures 1, 2, 3, and 4 .24
Figure C.1 – Diagram for measuring a magnetic field distribution.25
Figure C.2 – Magnetic field distribution across the microstrip line (800 MHz) .25
Figure D.1 – Diagram for measuring an angle pattern of probe placement .26
Figure D.2 – Probe output to angle ϕ .26
Figure 1 – Magnetic probe .9
Figure 2 – Magnetic probe – First and third layers .9
Figure 3 – Magnetic probe – Second layer .10
Figure 4 – Magnetic probe – Layer construction.10
Figure 5 – Standardized IC test board – Sectional view 1 .12
Figure 6 – Standardized IC test board – Sectional view 2 – Measurement line .12
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer.13
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer.14
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer.14
Figure 10 – Measurement set-up .15
Figure 11 – Measurement circuit schematic .15
Figure 12 – Transfer constant for current calculation as a function of insulator
thickness of microstrip board .17
Figure A.1 – Cross-sectional view of a microstrip line for calibration .18
Figure A.2 – Measurement set-up for probe calibration .20
Figure B.1 – Cross-sectional view of a microstrip line .21
Figure B.2 – Measurement of magnetic probe output .23
Figure B.3 – Example of calibration factor for the magnetic probe specified in figures 1,
2, 3, and 4 .24
Figure C.1 – Diagram for measuring a magnetic field distribution.25
Figure C.2 – Magnetic field distribution across the microstrip line (at 800 MHz) .25
Figure D.1 – Diagram for measuring an angle pattern of probe placement .26
Figure D.2 – Probe output to angle ϕ .26
Figure E.1 – Illustration of the assembled advanced magnetic probe .29
Figure E.2 – Enlarged view of part A of Figure E.1
(an example of connection construction) .29

– 4 – 61967-6 © IEC:2002+A1:2008
Figure E.3 – Main pattern (layer 2 to 4) of advanced magnetic probe.30
Figure E.4 – Layer 1 (ground pattern) of advanced magnetic probe .30
Figure E.5 – Layer 2 and 4 (ground pattern) of advanced magnetic probe.31
Figure E.6 – Layer 3 (signal pattern) of advanced magnetic probe .31
Figure E.7 – Layer 5 (ground pattern) of advanced magnetic probe .32
Figure E.8 – Construction of advanced magnetic probe .32
Figure E.9 – Measurement set-up .33
Figure E.10 – Definition of loop center .33
Figure E.11 – Error graph of the measured voltage versus measurement distance.34
Figure E.12 – Set-up for measuring magnetic field distribution.34
Figure E.13 – Magnetic field distribution across microstrip line (1 GHz) .35
Figure E.14 – Set-up for measuring an angle pattern of probe placement .35
Figure E.15 – Probe output amplitude as function of angle ϕ (D is 0,47 mm) .36
m
Figure E.16 – Current models of strip conductor of microstrip line.38
Figure E.17 – Calibration factor for different board parameters .39
Figure E.18 – Example of measured (C – C ) at microstrip line under
f_dB h-distributed_dB
the same condition (W=1,0 mm, h=0,6 mm) as shown in Figure E.9.39
Figure E.19 – Cross-sectional view of a microstrip line for calibration (example).41
Figure E.20 – Measurement set-up for probe calibration .42
Figure E.21 – Example of IC test board – Bottom layer .43
Figure E.22 – Example of measurement pattern of V .43
DD1
61967-6 © IEC:2002+A1:2008 – 5 –
INTERNATIONAL ELECTROTECHNICAL COMMISSION
___________
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
FOREWORD
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This consolidated version of the official IEC Standard and its amendment has been
prepared for user convenience.
IEC 61967-6 edition 1.1 contains the first edition (2002) [documents 47A/645/FDIS and
47A/653/RVD], its amendment 1 (2008) [documents 47A/781/FDIS and 47A/784/RVD] and
its corrigendum 1 of August 2010.
A vertical line in the margin shows where the base publication has been modified by
amendment 1.
International Standard IEC 61967-6 has been prepared by subcommittee 47A: Integrated
circuits, of IEC technical committee 47: Semiconductor devices.

– 6 – 61967-6 © IEC:2002+A1:2008
Annex A forms an integral part of this standard.
Annexes B, C, D and E are for information only.
This standard should be read in conjunction with IEC 61967-1.
IEC 61967 consists of the following parts, under the general title Integrated circuits –
Measurement of electromagnetic emissions, 150 kHz to 1 GHz:
Part 1: General conditions and definitions
Part 2: Measurement of radiated emissions – TEM-cell method
Part 3: Measurement of radiated emissions – Surface scan method (technical specification)
Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
Part 5: Measurement of conducted emissions – Workbench Faraday cage method
Part 6: Measurement of conducted emissions – Magnetic probe method
The committee has decided that the contents of the base publication and its amendments will
remain unchanged until the maintenance result date indicated on the IEC web site under
"http://webstore.iec.ch" in the data related to the specific publication. At this date,
the publication will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.
IMPORTANT – The “colour inside” logo on the cover page of this publication indicates
that it contains colours which are considered to be useful for the correct understanding
of its contents. Users should therefore print this publication using a colour printer.

___________
Under consideration.
To be published.
61967-6 © IEC:2002+A1:2008 – 7 –
INTEGRATED CIRCUITS –
MEASUREMENT OF ELECTROMAGNETIC EMISSIONS,
150 kHz TO 1 GHz –
Part 6: Measurement of conducted emissions –
Magnetic probe method
1 Scope
This part of the IEC 61967 specifies a method for evaluating RF currents on the pins of an
integrated circuit (IC) by means of non-contact current measurement using a miniature
magnetic probe. This method is capable of measuring the RF currents generated by the IC
over a frequency range of 0,15 MHz to 1 000 MHz. This method is applicable to the
measurement of a single IC or a chip set of ICs on the standardized test board for
characterization and comparison purposes. It is also usable to evaluate the electromagnetic
characteristics of an IC or group of ICs on an actual application PCB for emission reduction
purposes. This method is called the "magnetic probe method".
2 Normative references
The following referenced documents are indispensable for the application of this document.
For dated references, only the edition cited applies. For undated references, the latest edition
of the referenced document (including any amendments) applies.
IEC 61967-1, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 1: General conditions and definitions
IEC 61967-4, Integrated circuits – Measurement of electromagnetic emissions, 150 kHz to
1 GHz – Part 4: Measurement of conducted emissions – 1 Ω/150 Ω direct coupling method
3 Definitions
For the purposes of this part of IEC 61967 the definitions found in IEC 61967-1 apply.
4 General
4.1 Measurement philosophy
The emissions radiated from a PCB are, in part, caused by RF current generated by the
onboard IC which drives PCB traces, PCB ground and supply planes, and cables connected to
the PCB. All of these can act as RF antennas to radiate the emissions. The emission level is
proportional to the driving RF current, and is also affected significantly by PCB design,
radiation effectiveness of the pseudo-antennas, and noise coupling path coefficients from the
IC to the pseudo-antennas.
For this emission mechanism, the driving force of the IC can be a significant parameter for
both users and manufacturers to estimate and predict the electromagnetic characteristics of a
PCB, module, or system. A measure of the emission driving force can be obtained by
measuring the RF currents generated by the IC under test. Thus, the measured RF noise
current can be regarded as an indicator of the undesirable electromagnetic emission driving
force generated by the IC.
___________
To be published.
– 8 – 61967-6 © IEC:2002+A1:2008
4.2 Measurement principle
Using this test method, the RF current on the power supply pins and I/O pins of an IC under
test can be measured using a miniature triplate-structured magnetic probe. This probe
measures the magnetic field at a specified height over a power supply or I/O strip conductor
on the standardized test board in a controlled manner. The RF current is calculated from the
measured magnetic field using the formula described in 8.2. With accurate mechanical
placement of the magnetic probe, this method provides a high degree of repeatability. In
addition, the frequency range of this method can be extended subject to the limitations
described in 5.2. Higher frequencies can be obtained without a substantial influence on
accuracy. The estimation of the RF current over the power supply or I/O strip conductor is an
easy and handy way of characterizing and comparing the ICs.
5 Test conditions
5.1 General
General test conditions are described in IEC 61967-1.
5.2 Frequency range
The effective frequency range of this measurement method is 0,15 MHz to 1 000 MHz. The
maximum frequency can be extended, if desired, subject to the limitations of the test set-up.
The upper limit of the frequency range is directly related to high frequency characteristics of
the magnetic probe and its distance from the line under test as described in annex B. At a low
frequency region of 0,15 MHz to 10 MHz, however, it may be advisable to use a low noise
pre-amplifier to improve dynamic range of the measurement.
6 Test equipment
6.1 General
For general information on test equipment see IEC 61967-1.
6.2 Magnetic probe
The magnetic probe shall be a triplate-structured strip line composed of a three-layer PCB.
Recommended probe construction details are shown in figures 1, 2, 3 and 4.
An SMA connector is attached at the edge of the PCB opposite to the rectangular loop portion
of the probe as shown in the figures . Attachment pads for the SMA connector are on layers 1
and 3, which are connected to each other through four vias. The strip conductor pattern is on
layer 2, which is connected to the centre pin of the SMA connector.
6.3 Probe spacing fixture and placement
The probe output voltage depends on the distance between the probe tip and the strip
conductor under measurement. This makes it very critical to maintain a 1 mm space between
the strip conductor and the magnetic probe tip during this measurement. Therefore, a probe
spacing fixture shall be used to maintain 1,0 mm ± 0,1 mm spacing between the bottom of the
rectangular loop portion of the probe and strip line on the IC test board, or the entire probe
can be molded into a piece of fixing block which houses the probe so as to maintain the
specified space precisely as shown in figure 10.

61967-6 © IEC:2002+A1:2008 – 9 –
In addition, the probe output voltage depends on probe placement angle (ϕ) to direction of
microstrip line under measurement. According to an experimental measurement on angle
patterns of probe directional placement, the angle shall be less than 15° for amplitude error to
be less than –2 dB. See annex D for details.

Via for SMA connector
through layers 1, 2, and 3
Via for SMA connector
through layers 1, 2, and 3
Pads for SMA connector
on layer 1 and 3
Signal line pattern on layer 2
30 mm
50 Ω strip line
Ground plane patterns
on layer 1 and layer 3
Rectangular loop portion
for detection
10 mm
Via through layers 1, 2, and 3
IEC  1468/02
Figure 1 – Magnetic probe
Via
Center line
Via
10 mm
30 mm 0,8 mm
1,8 mm 0,2 mm
Via: 0,25 mm diameter
8,4 mm
0,1 mm
10 mm
IEC  1469/02
Figure 2 – Magnetic probe – First and third layers

– 10 – 61967-6 © IEC:2002+A1:2008

Via
Center line
30 mm
0,1 mm
1,0 mm
5,2 mm
Via: 0,25 mm diameter
0,4 mm
10 mm
IEC  2078/10
Figure 3 – Magnetic probe – Second layer
Layer 1
Insulator
Layer 2
Insulator
Layer 3
Insulators
(glass epoxy)
Insulators for reinforcement
(recommended)
Thickness of copper foils:
Layer 1: 0,035 mm
Layer 2: 0,035 mm
Layer 3: 0,035 mm
0,2 mm* 0,2 mm*
* Thickness of insulator
Center line
IEC  1471/02
Figure 4 – Magnetic probe – Layer construction

61967-6 © IEC:2002+A1:2008 – 11 –
7 Test set-up
7.1 General
General test set-up requirements are described in IEC 61967-1.
The measurement set-up and circuit schematic of the magnetic probe measurement method
are shown in figures 10 and 11, respectively.
7.2 Probe calibration
The magnetic probe used shall be calibrated to obtain accurate correlation between the
measured magnetic field intensity and the estimated RF current. The probe calibration shall
be in accordance with the method described in annex A (microstrip line method).
7.3 Modifications to standardized IC test board
The standardized IC test board described in IEC 61967-1 shall be used. However, it shall be
adapted as shown in figures 5, 6, 7, 8, and 9.
7.3.1 Layer arrangement
The IC test board shall have a minimum of four layers. It is recommended to use a four-layer
IC test board as shown in figures 5 and 6. If necessary, additional layers may be inserted
between the top layer and the microstrip ground layer to accommodate additional signal
and/or power routing. The construction of the IC test board shall be as specified in
IEC 61967-1, except as noted below in the case of n layers in general.
1) Top layer (layer 1): The IC under test shall be put on layer 1. See IEC 61967-1.
2) Layer next to the bottom layer (layer n−1): A ground plane area shall be formed on layer
n−1 to provide a reference for the microstrip structures on the bottom layer. The ground
plane can cover the entire layer or can be limited to the area under the microstrip
structures as shown in the dotted line area of figures 7 and 8. This ground plane area shall
have a minimum width of 11 mm and a minimum length of 14 mm.
3) Bottom layer (layer n): The microstrip conductor lines for measurement and peripheral
ground planes shall be on layer n. The microstrip conductor lines shall be in accordance
with figures 7 and 8 for power lines and I/O lines, respectively. The width of the strip
conductor line shall be 1,0 mm at maximum to achieve a high spatial resolution. See
annex C for details. The length of the microstrip conductor lines should be between 14 mm
and 25 mm in length to avoid standing waves.
7.3.2 Layer thickness
The PCB insulator thickness of 0,6 mm between layer n−1 and layer n is strongly
recommended. The coplanar gap between the measurement line and coplanar ground planes
shall be at least 2,0 mm and shall be at least three times the insulator thickness.
7.3.3 Decoupling capacitors
Decoupling capacitors (C1, C2) shall be used between the power supply lines and ground
planes on the test board as shown in figure 11. The capacitor (C2) shall be placed as close as
possible to the measurement area of the power supply line to provide low RF impedance. The
distance between C2 and the via to the V land shall be no more than 25 mm as shown in
DD
land and the IC ground as
figure 7. The capacitor (C1) shall be placed between the IC V
DD
shown in figure 9.
– 12 – 61967-6 © IEC:2002+A1:2008
7.3.4 I/O pin loading
This measurement can be used to measure the RF current of a single I/O pin. The I/O pin
current shall be measured pin by pin. The layout of the pin loading shall be in accordance with
figures 8 and 9. This pin should be loaded with an impedance matching network with a
resistance of 150 Ω as shown in figure 11. The impedance matching network should be
loaded by a 50 Ω resistor (R3) or a 50 Ω input impedance of normal measurement equipment
(receiver).
DUT
A B
Layer 1
0,4 mm Ground Ground Ground -Ground/signal
Layer 2
Signal Signal
0,4 mm V 1
DD -Power/signal
Layer 3
-Power/ground/signal
Ground and signal Ground and signal
0,6 mm V 2
DD
Layer 4
V and ground and signal V V V and ground and signal
DD DD DD DD
-Power/ground/signal
V (IC ground)
SS
Decoupling capacitor C1 for DUT
Layer thickness
Layer 1 : 0,035 mm (Recommended)
Insulator (Layer 1 to Layer 2) : 0,40 mm  (Recommended)
Layer 2 : 0,035 mm (Recommended)
Insulator (Layer 2 to Layer 3) : 0,40 mm (Recommended)
Layer 3 : 0,035mm (Recommended)
Insulator (Layer 3 to Layer 4) : 0,60mm (Strongly recommended)
Layer 4 : 0,035mm (Recommended)
IEC  1472/02
Figure 5 – Standardized IC test board – Sectional view 1

DUT
C D
Layer 1
-Ground/signal
Ground Ground Ground
0,4 mm
Layer 2
-Power/signal
0,4 mm Signal V 1 Signal
DD
Layer 3
-Power/ground/signal
V 2
0,6 mm Ground and signal DD Ground and signal
Ground V and ground and Layer 4
DD
signal -Power/ground/signal
Power supply
V (IC ground)
SS
pattern
Measurement power supply line
Decoupling capacitor C2
IEC  1473/02
Figure 6 – Standardized IC test board – Sectional view 2 – Measurement line

1,54 mm
1,54 mm
61967-6 © IEC:2002+A1:2008 – 13 –

Via to V land: 0,8 mm diameter
DD
11 mm min.
Power supply strip width:
1,0 mm max.
Coplanar gap: 2,0 mm min.
Overlapped plane width between layer 3 and
layer 4 ground planes: 3,0 mm min.
Via: 0,8 mm diameter
Layer 3 (microstrip ground plane pattern)
Decoupling capacitors
(example: 0,1 μF each)
C2
Decoupling capacitor
(example: 10 μF)
Power supply line pattern
Peripheral ground plane
IEC  1474/02
Figure 7 – Power line pattern on the standardized IC test board – Bottom layer

25 mm max.
14 mm min.
– 14 – 61967-6 © IEC:2002+A1:2008

Via: 0,3 mm diameter
11 mm min.
Via: 0,8 mm diameter
I/O signal strip width: 0,3 mm
Coplanar gap: 2,0 mm min.
Layer 3 (microstrip ground plane pattern)
Overlapped plane width between
layer 3 and layer 4 ground planes:
3,0 mm min.
R1 = 120 Ω
C3 = 6,8 nF
R2 = 51 Ω
SMA connector
IEC  1475/02
Figure 8 – I/O signal line pattern on the standardized IC test board – Bottom layer
IC ground plane
Power supply line pattern
to V 1 (see figure 7)
DD
A D
Peripheral ground plane
Example of I/O signal line pattern
C2
SMA connector
C1
* The RF current probe defined in
IEC 61967-4 may be used for
measurement of ground current,
C1
or this pattern shall be short-circuited
C2
if not used.
Power supply line
pattern to V 2
DD
(see figure 7)
C B
101,6 mm
IEC  1476/02
Figure 9 – Multi-power lines on the standardized IC test board – Bottom layer

101,6 mm
25 mm max.
14 mm min.
61967-6 © IEC:2002+A1:2008 – 15 –

Magnetic probe
Molded fixing block of
magnetic probe
Space between the
microstrip line and
magnetic probe tip:
Measurement microstrip line
1,0 ± 0,1 mm
Bottom layer
(layer n)
C2
Top layer
(layer 1) Ground layer for microstrip
IC
(layer n–1)
Standardized IC test board
(PCB)
IEC  1477/02
Figure 10 – Measurement set-up

Magnetic probe
Magnetic probe
Power supply 1
+
Power supply 2
I 1
DD
C2 C3 = 6,8 nF
C1 C1
SMA
V 2 V 1
DD DD
connector
I/O
IC
R1 = 120 Ω
I
I/O
R3 = 50 Ω
Ground
R2 = 51 Ω
Ground IC ground
Receiver
Impedance matching
network
IEC  1478/02
Figure 11 – Measurement circuit schematic

– 16 – 61967-6 © IEC:2002+A1:2008
8 Test procedure
8.1 General
The general requirements for the test procedure are described in IEC 61967-1.
8.2 Test technique
The magnetic probe shall be placed at a distance above the surface of the line under test on
the test board as described in 6.3. The output voltage (V ) of the magnetic probe is measured
p
by a spectrum analyzer or measuring receiver as described in IEC 61967-1. The magnetic
) is calculated from the measured value of the V as corrected by C (calibration
field (H
x_dB p f
factor of magnetic probe, see annexes A and B) with the following equation (B.12) taken from
annex B:
H = C + V (dB A/m) (B.12)
x_dB f_dB p_dB
RF current (I ) is then obtained using the following equation (B.13) with a transfer constant
_dB
(C ) for a typical example of the test board as described in annex B:
h
= V + C – C (dB A) (B.13)
I
dB p_dB f_dB h_dB
_
where
V = V value in dB (dB V);
p_dB p
C = C value in dB (dB S/m);
f_dB f
C = C value in dB (dB 1/m).
h_dB h
The C value depends on the insulator thickness of the microstrip board as shown in
h_dB
figure 12. The insulator thickness between layer n – 1 and layer n should be between 0,1 mm
and 1,6 mm. For the recommended insulator thickness (h = 0,6 mm), the C value
h_dB
is 30 (dB 1/m). For the microstrip board with a different insulator thickness, the RF current
is calculated according to equation (B.13), using an appropriate C value as shown in
h_dB
figure 12.
9 Test report
9.1 General
The test report shall be as described in IEC 61967-1.
The test report shall contain all specific requirements.
9.2 Documentation
The measurement data and parameters shall be documented in the test report, which shall
include the following information:
– test board material and its specification,
– thickness of insulator between layer n – 1 and layer n,
– microstrip line conductor width, coplanar gap, and characteristic impedance,
– decoupling capacitors (capacitance values, physical dimensions, number of pieces used,
and locations placed).
61967-6 © IEC:2002+A1:2008 – 17 –
Also description of the IC test board used (schematic, parts list, picture or copy of artwork,
etc.) shall accompany the test report. The measured data of RF currents shall be added.
Data shall be presented as a matrix of the frequency and the corresponding measured
amplitude data at each measurement point and/or as a plot of this matrix.
A description of any data processing used shall be a part of the test report.
0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6
Insulator thickness h [mm]
IEC  1479/02
Figure 12 – Transfer constant for current calculation as
a function of insulator thickness of microstrip board

Transfer constant C [dB 1/m]
h_dB
– 18 – 61967-6 © IEC:2002+A1:2008
Annex A
(normative)
Probe calibration procedure – Microstrip line method

The magnetic probe used for the measurement shall be calibrated in accordance with the
procedure described below. The calibration factor of the magnetic probe can be obtained by
using the microstrip line method, which has the advantage in that the probe can be calibrated
under the normal operating conditions for the magnetic probe method. The probe calibration
on a reference microstrip line on a PCB is shown in figure A.2. This calibration can be
performed with the same measurement set-up as the normal IC emission measurement on a
test board. This requires an accurate space placement of the probe that definitely minimizes
measuring errors and assures a highly repeatable emission measurement.
NOTE The microstrip line method is further described in [5] .
A.1 Pre-amplifier
Use a pre-amplifier as specified in IEC 61967-1, if necessary.
A.2 Spectrum analyzer set-up
Use manufacturer's recommended procedures for calibration of the spectrum analyzer. Set
attenuation at an appropriate level and video bandwidth at a minimum of three times the
resolution bandwidth to prevent video averaging of the signal.
A.3 Microstrip line
Use a microstrip line structure shown in figure A.1. The insulator thickness (h) of the
microstrip board used shall be 0,6 mm, and the characteristic impedance shall be 50 Ω ± 5 Ω.
In the case of dielectric constant ε = 4,7, the strip conductor width (W) is 1,0 mm. The ground
r
plane width (W ) of the microstrip line should be at least 50 mm. The microstrip line should
g
be long enough (for example, 101,6 mm) and should have a sufficiently high frequency
performance.
In order to check the characteristic impedance, RF measurement equipment such as a network
analyzer or a TDR oscilloscope should be used.
NOTE Power required to obtain a sufficient signal to noise (S/N) ratio may be determined in advance over
frequency range of interest.
Strip
W (1,0 mm)
(metal)
Dielectric
(ε = 4,7)
r
h = 0,6 mm
Ground
(metal)
W
g
IEC  1480/02
Figure A.1 – Cross-sectional view of a microstrip line for calibration
___________
Numbers in square brackets refer to the bibliography.

61967-6 © IEC:2002+A1:2008 – 19 –
A.4 Calibration
a) Measure the gain or loss of the test set-up. Include the pre-amplifier in this measurement,
if used.
b) Place the probe over the microstrip line so that the plane of the loop is perpendicular to
the ground plane and parallel to the longitudinal axis of the microstrip line. The centre of
the probe shall be located within ±0,4 mm distance from the centre of the microstrip line.
The face angle of the probe shall be within a 5° deviation from the axis of the microstrip
line. The distance from the microstrip line surface to the probe tip shall be maintained
within 1,0 mm ± 0,1 mm. These restrictions on the probe placement shall be maintained to
obtain calibration factors as accurately as possible. The maximum error for calibration
factors under th
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