IEC 62951-3:2018

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging

IEC 62951-3:2018(E) specifies the method for evaluating thin film transistor characteristics on flexible substrates under bulging. The thin film transistor is fabricated on flexible substrates, including polyethylene terephthalate (PET), polyimide (PI), elastomer and others. The stress is applied by applying a uniformly-distributed pressure to the flexible substrate using the equipment.

General Information

• Status: Published
• Publication Date: 06-Nov-2018
• ICS: 01 - GENERALITIES. TERMINOLOGY. STANDARDIZATION. DOCUMENTATION
• ICS: 17.220.20 - Measurement of electrical and magnetic quantities
• ICS: 31.080.99 - Other semiconductor devices
• Technical Committee: TC 47 - Semiconductor devices
• Drafting Committee: WG 6 - TC 47/WG 6
• Current Stage: PPUB - Publication issued
• Start Date: 12-Oct-2018
• Completion Date: 07-Nov-2018

Standards Content (Sample)

IEC 62951-3 ®
Edition 1.0 2018-11
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Flexible and strechable semiconductor devices –
Part 3: Evaluation of thin film transistor characteristics on flexible substrates
under bulging
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IEC 62951-3 ®
Edition 1.0 2018-11
INTERNATIONAL
STANDARD
colour
inside
Semiconductor devices – Flexible and strechable semiconductor devices –

Part 3: Evaluation of thin film transistor characteristics on flexible substrates

under bulging
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
ICS 31.080.99 ISBN 978-2-8322-6161-3

– 2 – IEC 62951-3:2018 © IEC 2018
CONTENTS
FOREWORD . 3
INTRODUCTION . 5
1 Scope . 6
2 Normative references . 6
3 Terms and definitions . 6
4 Test piece . 6
4.1 General . 6
4.2 Size of a test piece . 7
4.3 Measurement of dimensions . 7
4.4 Storage prior to testing . 7
5 Test apparatus and procedure . 7
5.1 General . 7
5.2 Test apparatus . 7
5.2.1 General . 7
5.2.2 Apparatus . 8
5.3 Test procedure and analysis . 12
5.3.1 Test procedure . 12
5.3.2 Data analysis . 14
6 Test report . 17
Annex A (informative) Other types of electrical and mechanical test equipments . 18
A.1 Absorption type electrical and mechanical test equipment with heating
system . 18
A.2 Bulging-type electrical and mechanical test equipment with halogen lamp
heating system . 18
Annex B (informative) Failure pressure estimation . 20
Bibliography . 22

Figure 1 – Pressure chamber open window shapes . 9
Figure 2 – Typical example of bulging-type mechanical and electrical measurement
test apparatus with heating system . 11
Figure 3 – Exemplary schematics of pressure chamber, pressure chamber open
window . 11
Figure 4 – Exemplary schematic of wire bonding. 12
Figure 5 – Exemplary DC characteristics for determining (a) μ (b) μ and (c) SS . 16
lin sat
Figure 6 – Representative bulge test data showing pressure-deflection relation for Ag-
Pd/SiN . 17
x
Figure A.1 – Exemplary schematic of absorption-type electrical and mechanical test
equipment with heating system . 18
Figure A.2 – Exemplary schematic of bulging-type electrical and mechanical test
equipment with halogen lamp heating system . 19
Figure B.1 – Schematic for failure pressure estimation for 100 μm-thick polyimide
assuming yield and tensile strength of 69 MPa and 231 MPa . 20

Table B.1 – Flexible substrate information (polyimide) . 20
Table B.2 – Pressure calculation results . 21

INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
SEMICONDUCTOR DEVICES –
FLEXIBLE AND STRECHABLE SEMICONDUCTOR DEVICES –

Part 3: Evaluation of thin film transistor characteristics
on flexible substrates under bulging

FOREWORD
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International Standard IEC 62951-3 has been prepared by IEC technical committee 47:
Semiconductor devices.
The text of this International Standard is based on the following documents:
FDIS Report on voting
47/2492/FDIS 47/2511/RVD
Full information on the voting for the approval of this International Standard can be found in
the report on voting indicated in the above table.
This document has been drafted in accordance with the ISO/IEC Directives, Part 2.
A list of all parts in the IEC 62951 series, published under the general title Semiconductor
devices – Flexible and stretchable semiconductor devices, can be found on the IEC website.

– 4 – IEC 62951-3:2018 © IEC 2018
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INTRODUCTION
The International Electrotechnical Commission (IEC) draws attention to the fact that it is
claimed that compliance with this document may involve the use of a patent concerning the
method and apparatus for testing flexible elements.
IEC takes no position concerning the evidence, validity and scope of this patent right.
The holder of this patent right has assured the IEC that he/she is willing to negotiate licences
under reasonable and non-discriminatory terms and conditions with applicants throughout the
world. In this respect, the statement of the holder of this patent right is registered with IEC.
Information may be obtained from:
Industry Academy Cooperation Foundation of Sejong University,
Korea Institute of Machinery and Materials,
Electronics and Telecommunications Research Institute
1002 GwangGaeTo B/D
209, Neungdong-ro, Gwangjin-gu, Seoul, 05006,
KOREA
Attention is drawn to the possibility that some of the elements of this document may be the
subject of patent rights other than those identified above. IEC shall not be held responsible for
identifying any or all such patent rights.
ISO (www.iso.org/patents) and IEC (http://patents.iec.ch) maintain on-line data bases of
patents relevant to their standards. Users ar
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