Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan

IEC 62239-1:2018 defines the requirements for developing an electronic components management plan (ECMP) to guarantee to customers that all of the electronic components in the equipment of the plan owner are selected and applied in controlled processes compatible with the end application and that the technical requirements detailed in Clause 4 are accomplished. In general, the plan owner of a complete electronic components management plan (ECMP) is the avionics original equipment manufacturer (OEM).
This first edition cancels and replaces IEC TS 62239-1 published in 2015. This edition includes the following significant technical changes with respect to the previous edition:
a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008;
b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference table to SAE EIASTD4899 rev C clauses/ subclauses for guidance purposes only;
c) added the analysis of component technical erratum
d) updated Bibliography and reference documents

Gestion des processus pour l'avionique - Plan de gestion - Partie 1: Préparation et maintenance d'un plan de gestion des composants électroniques

l’IEC 62239-1:2018 définit les exigences pour la mise au point d'un plan de gestion des composants électroniques (ECMP) permettant de garantir que tous les composants électroniques de l'équipement du propriétaire du plan sont choisis et appliqués dans le cadre de processus contrôlés, compatibles avec l'application finale, et que les exigences techniques détaillées à l'Article 4 sont satisfaites. En général, le propriétaire d’un plan de gestion des composants électroniques (ECMP) complet est le fabricant d'équipements avioniques d'origine (OEM).
Cette première édition annule et remplace la première édition de l’IEC TS 62239-1 parue en 2015. Cette édition inclut les modifications techniques majeures suivantes par rapport à l'édition précédente:
a) ajout de références aux spécifications SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR 62240-2, schémas de composants IECQ, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA STD 0008;
b) remplacement de l’Annexe C (transférée dans l'IEC TR 62240-2) par une table de références croisées avec les articles/paragraphes de la SAE EIASTD4899 rév. C, à titre de recommandation uniquement;
c) ajout d’un erratum technique relatif à l’analyse des composants
d) mise à jour de la Bibliographie et documents de référence

General Information

Status
Published
Publication Date
23-Sep-2018
Current Stage
PPUB - Publication issued
Completion Date
24-Sep-2018
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IEC 62239-1
Edition 1.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
Gestion des processus pour l'avionique – Plan de gestion –
Partie 1: Préparation et maintenance d'un plan de gestion des composants
électroniques
IEC 62239-1:2018-09(en-fr)
---------------------- Page: 1 ----------------------
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---------------------- Page: 2 ----------------------
IEC 62239-1
Edition 1.0 2018-09
INTERNATIONAL
STANDARD
NORME
INTERNATIONALE
colour
inside
Process management for avionics – Management plan –
Part 1: Preparation and maintenance of an electronic components management
plan
Gestion des processus pour l'avionique – Plan de gestion –
Partie 1: Préparation et maintenance d'un plan de gestion des composants
électroniques
INTERNATIONAL
ELECTROTECHNICAL
COMMISSION
COMMISSION
ELECTROTECHNIQUE
INTERNATIONALE
ICS 03.100.50; 31.020; 49.060 ISBN 978-2-8322-6033-3

Warning! Make sure that you obtained this publication from an authorized distributor.

Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agréé.

® Registered trademark of the International Electrotechnical Commission
Marque déposée de la Commission Electrotechnique Internationale
---------------------- Page: 3 ----------------------
– 2 – IEC 62239-1:2018 © IEC 2018
CONTENTS

FOREWORD ........................................................................................................................... 4

INTRODUCTION ..................................................................................................................... 6

1 Scope .............................................................................................................................. 7

2 Normative references ...................................................................................................... 7

3 Terms, definitions and abbreviated terms ........................................................................ 8

3.1 Terms and definitions .............................................................................................. 8

3.2 Abbreviated terms ................................................................................................. 12

4 Technical requirements ................................................................................................. 14

4.1 General ................................................................................................................. 14

4.2 Component selection ............................................................................................ 14

4.2.1 General........................................................................................................ 14

4.2.2 Application conditions for use ...................................................................... 15

4.2.3 Availability and durability ............................................................................. 15

4.2.4 Additional performance ................................................................................ 15

4.2.5 Component identification ............................................................................. 15

4.3 Component application ......................................................................................... 16

4.3.1 General........................................................................................................ 16

4.3.2 Electromagnetic compatibility (EMC) ............................................................ 16

4.3.3 Derating and stress analysis ........................................................................ 16

4.3.4 Thermal analysis .......................................................................................... 18

4.3.5 Mechanical analysis ..................................................................................... 18

4.3.6 Testing, testability, and maintainability ......................................................... 19

4.3.7 Avionics radiation environment .................................................................... 19

4.3.8 Management of lead-free termination finish and soldering ............................ 19

4.3.9 Counterfeited, fraudulent and recycled component avoidance ...................... 20

4.3.10 Moisture and corrosion ................................................................................ 20

4.3.11 Additional customer related application requirements .................................. 20

4.4 Component qualification ........................................................................................ 20

4.4.1 General........................................................................................................ 20

4.4.2 Minimum component qualification requirements ........................................... 21

4.4.3 Original component manufacturer quality management ................................ 21

4.4.4 Original component manufacturer process management approval ................ 21

4.4.5 Demonstration of component qualification .................................................... 22

4.4.6 Qualification of components from a supplier that is not qualified .................. 23

4.4.7 Distributor process management approval ................................................... 24

4.4.8 Subcontractor assembly facility quality and process management

approval ........................................................................................................ 24

4.5 Continuous component quality assurance ............................................................. 25

4.5.1 General quality assurance requirements ...................................................... 25

4.5.2 Ongoing component quality assurance ......................................................... 25

4.5.3 Plan owner in-house continuous monitoring ................................................. 25

4.5.4 Component design and manufacturing process change monitoring .............. 26

4.6 Component dependability ...................................................................................... 26

4.6.1 General........................................................................................................ 26

4.6.2 Component availability and associated risk assessment .............................. 26

4.6.3 Component obsolescence ............................................................................ 27

4.6.4 Proactive measures ..................................................................................... 27

---------------------- Page: 4 ----------------------
IEC 62239-1:2018 © IEC 2018 – 3 –

4.6.5 Component obsolescence awareness .......................................................... 27

4.6.6 Reporting ..................................................................................................... 27

4.6.7 Semiconductor reliability, wear out and lifetime ............................................ 28

4.6.8 Reliability assessment ................................................................................. 28

4.7 Component compatibility with the equipment manufacturing process .................... 28

4.8 Component data ................................................................................................... 29

4.8.1 General........................................................................................................ 29

4.8.2 Minimum component data requirements ....................................................... 30

4.9 Configuration control ............................................................................................. 30

4.9.1 General........................................................................................................ 30

4.9.2 Alternative components................................................................................ 30

4.9.3 Alternative sources ...................................................................................... 30

4.9.4 Equipment change documentation ............................................................... 31

4.9.5 Customer notifications and approvals .......................................................... 31

4.9.6 Focal organization ....................................................................................... 31

5 Plan administration requirements ................................................................................... 31

5.1 Plan organization .................................................................................................. 31

5.2 Plan terms and definitions ..................................................................................... 31

5.3 Plan focal point ..................................................................................................... 31

5.3.1 Primary interface ......................................................................................... 31

5.3.2 Plan focal point responsibilities .................................................................... 32

5.4 Plan references..................................................................................................... 32

5.5 Plan applicability ................................................................................................... 32

5.6 Plan implementation ............................................................................................. 32

5.6.1 ECMP compliance ........................................................................................ 32

5.6.2 Plan objectives ............................................................................................ 32

5.6.3 Plan owner's subcontracted activities ........................................................... 33

5.7 Plan acceptance ................................................................................................... 33

5.8 Plan maintenance ................................................................................................. 33

Annex A (informative) Requirement matrix for IEC 62239-1 ................................................. 34

Annex B (informative) Typical qualification requirements and typical component

minimum qualification requirements ...................................................................................... 50

Annex C (informative) IEC 62239-1 cross-references to SAE EIA-STD-4899 for

guidance ............................................................................................................................... 53

Annex D (informative) Guidelines for environmental protection techniques and for

comparison of components specifications ............................................................................. 56

Bibliography .......................................................................................................................... 70

Figure 1 – Suspect components perimeter ............................................................................ 20

Table A.1 – Requirements matrix .......................................................................................... 34

Table B.1 – Typical qualification requirements and typical component minimum

qualification requirements ..................................................................................................... 50

Table C.1 – Cross-reference overview between IEC 62239-1 and SAE EIA-STD-4899,

for guidance .......................................................................................................................... 53

Table D.1 – Environmental protection techniques to be considered during the avionics

design process ..................................................................................................................... 56

Table D.2 – Guidelines for the comparison of internationally available component

specifications – Microcircuits .............................................................................................. 61

---------------------- Page: 5 ----------------------
– 4 – IEC 62239-1:2018 © IEC 2018
INTERNATIONAL ELECTROTECHNICAL COMMISSION
____________
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of
an electronic components management plan
FOREWORD

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patent rights. IEC shall not be held responsible for identifying any or all such patent rights.

International Standard IEC 62239-1 has been prepared by IEC technical committee 107:

Process management for avionics.
IEC 62239-1 cancels and replaces IEC TS 62239-1 published in 2015.

This first edition cancels and replaces the first edition of IEC TS 62239-1 published in2015.

This edition constitutes a technical revision.

This edition includes the following significant technical changes with respect to the previous

edition:
a) added references to SAE EIA-STD-4899, IECQ OD 3702, IECQ OD 3407-1, IEC TR
62240-2, IECQ component schemes, SAE AS6081, SAE AS6171. GEIA-STD-0005-1 GEIA
STD 0008;
---------------------- Page: 6 ----------------------
IEC 62239-1:2018 © IEC 2018 – 5 –

b) replaced Annex C (which was transferred into IEC TR 62240-2) with a cross-reference

table to SAE EIASTD4899 rev C clauses/subclauses for guidance purposes only;
c) added the analysis of component technical erratum in 4.8.2;
d) updated Bibliography and reference documents.
The text of this international standard is based on the following documents:
CDV Report on voting
107/320/CDV 107/333/RVC

Full information on the voting for the approval of this International Standard can be found in

the report on voting indicated in the above table.

This document has been drafted in accordance with the ISO/IEC Directives, Part 2.

A list of all the parts in the IEC 62239 series under the general title Process management for

avionics – Management plan, can be found on the IEC website.

The committee has decided that the contents of this document will remain unchanged until the

stability date indicated on the IEC website under "http://webstore.iec.ch" in the data related to

the specific document. At this date, the document will be
• reconfirmed,
• withdrawn,
• replaced by a revised edition, or
• amended.

IMPORTANT – The 'colour inside' logo on the cover page of this publication indicates

that it contains colours which are considered to be useful for the correct

understanding of its contents. Users should therefore print this document using a

colour printer.
---------------------- Page: 7 ----------------------
– 6 – IEC 62239-1:2018 © IEC 2018
INTRODUCTION

This document provides the structure for avionics equipment manufacturers, subcontractors,

maintenance facilities, and other aerospace component users to develop their own electronic

component management plan (ECMP), hereinafter also referred to as ‘plan’. This document

states objectives to be accomplished. The plan does not describe specific requirements and

those who prepare plans in compliance with this document will document processes that are

the most effective and efficient for them in accomplishing the objectives of this document. In

order to allow flexibility in implementing and updating the documented processes, plan owners

are encouraged to refer to their own internal process documents instead of including detailed

process documentation within their plans.

NOTE The equipment manufacturer, often called in the industry the original equipment manufacturer (OEM) is in

general considered as the plan owner.
This component management document is intended for aerospace users of electronic

components. This document is not intended for use by the manufacturers of electronic

components. Components selected and managed according to the requirements of a plan

compliant with this document may be approved by the concerned parties for the proposed

application, and for other applications with equal or less severe requirements.

Organizations that prepare such plans may prepare a single plan and use it for all relevant

products supplied by the organization or may prepare a separate plan for each relevant

product or customer.
---------------------- Page: 8 ----------------------
IEC 62239-1:2018 © IEC 2018 – 7 –
PROCESS MANAGEMENT FOR AVIONICS –
MANAGEMENT PLAN –
Part 1: Preparation and maintenance of
an electronic components management plan
1 Scope

This part of IEC 62239 defines the requirements for developing an electronic components

management plan (ECMP) to guarantee to customers that all of the electronic components in

the equipment of the plan owner are selected and applied in controlled processes compatible

with the end application and that the technical requirements detailed in Clause 4 are

accomplished.

In general, the plan owner of a complete electronic components management plan (ECMP) is

the avionics original equipment manufacturer (OEM).

NOTE SAE EIA-STD-4899 can be used to comply with the requirements of IEC 62239-1 where applicable (see

Annex C), to enable the plan owner to harmonise its plan for both documents.
This document provides an aid in the aerospace certification process.

Although developed for the avionics industry, this process can be applied by other industrial

sectors.
2 Normative references

The following documents are referred to in the text in such a way that some or all of their

content constitutes requirements of this document. For dated references, only the edition

cited applies. For undated references, the latest edition of the referenced document (including

any amendments) applies.

IEC 62396 (all parts), Process management for avionics – Atmospheric radiation effects

IEC 62396-1:2016, Process management for avionics – Atmospheric radiation effects –

Part 1: Accommodation of atmospheric radiation effects via single event effects within

avionics electronic equipment

IEC TS 62647-1, Process management for avionics – Aerospace and defence electronic

systems containing lead-free solder – Part 1: Preparation for a lead-free control plan

GEIA-STD-0005-1, Performance Standard for Aerospace and High Performance Electronic

Systems Containing Lead-Free Solder

IPC/JEDEC J-STD-20, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State

Surface Mount Devices
---------------------- Page: 9 ----------------------
– 8 – IEC 62239-1:2018 © IEC 2018
3 Terms, definitions and abbreviated terms

For the purposes of this document, the following terms, definitions and abbreviated terms

apply.

ISO and IEC maintain terminological databases for use in standardization at the following

addresses:
• IEC Electropedia: available at http://www.electropedia.org/
• ISO Online browsing platform: available at http://www.iso.org/obp

NOTE In their plan, plan owners can use alternative definitions consistent with convention in their company.

3.1 Terms and definitions
3.1.1
environment

applicable environmental conditions (as described in the equipment specification) that the

equipment is able to withstand without loss or degradation in equipment performance

throughout its manufacturing cycle and maintenance life (the length of which is defined by the

plan owner in conjunction with customers)
3.1.2
purchased
bought outside the plan owner's organization, from an independent supplier

Note 1 to entry: This indicates that the plan owner does not manufacture this in-house.

3.1.3
capable
capacity of a component to be used successfully in the intended application
3.1.4
certified
assessed to and compliant with an applicable certification body
3.1.5
characterization

process of testing a sample of components to determine the key electrical parameter values

that can be expected of all produced components of the type tested
3.1.6
component application
domain of use where the component meets the design requirements
3.1.7
component manufacturer
organization responsible for the component specification and its production
3.1.8
component obsolescence

absence of availability of a component which is not procurable due to the manufacturer(s)

ceasing production

Note 1 to entry: Component obsolescence management is considered an element of component dependability.

---------------------- Page: 10 ----------------------
IEC 62239-1:2018 © IEC 2018 – 9 –
3.1.9
component qualification

process used to demonstrate that the component is capable of meeting its specification for all

the required conditions and environments
3.1.10
component quality assurance

activities and processes to provide adequate confidence that each individual component

meets the performance and environmental requirements
3.1.11
component selection
process of choosing a specific component for a specific application
3.1.12
component standardization

process of developing and agreeing by consensus on uniform engineering criteria for products

and methods for achieving compatibility, interoperability, interchangeability, or commonality of

material

Note 1 to entry: Standardization is used to reduce proliferation of components into inventory.

3.1.13
...

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